Etron Technology, Inc.

EtronTech
EM639325TS
4M x 32 bit Synchronous DRAM (SDRAM)
Preliminary (Rev. 1.4, Mar. /2013)
Features
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Clock rate: 166/143 MHz
Fully synchronous operation
Internal pipelined architecture
1M word x 32-bit x 4-bank
Programmable Mode
- CAS Latency: 2, or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: Sequential & Interleave
- Burst-Read-Single-Write
- Burst stop function
Individual byte controlled by DQM0-3
Auto Refresh and Self Refresh
4096 refresh cycles/64ms
Single 3.3V power supply
Operating Temperature: TA = 0~70°C
Interface: LVTTL
86-pin 400 mil plastic TSOP II package
- Pb free and Halogen free
Overview
The EM639325 SDRAM is a high-speed CMOS
synchronous DRAM containing 128 Mbits. It is
internally configured as a quad 1M x 32 DRAM with a
synchronous interface (all signals are registered on
the positive edge of the clock signal, CLK). Each of
the 1M x 32 bit banks is organized as 4096 rows by
256 columns by 32 bits. Read and write accesses to
the SDRAM are burst oriented; accesses start at a
selected location and continue for a programmed
number of locations in a programmed sequence.
Accesses begin with the registration of a
BankActivate command which is then followed by a
Read or Write command.
The EM639325 provides for programmable Read
or Write burst lengths of 1, 2, 4, 8, or full page, with a
burst termination option. An auto precharge function
may be enabled to provide a self-timed row precharge
that is initiated at the end of the burst sequence. The
refresh functions, either Auto or Self Refresh are easy
to use.
By having a programmable mode register, the
system can choose the most suitable modes to
maximize its performance. These devices are well
suited for applications requiring high memory
bandwidth.
Table 1. Key Specifications
EM639325
-6/7
tCK3 Clock Cycle time(min.)
tAC3 Access time from CLK (max.)
5.5/6
tRAS Row Active time(min.)
42/49 ns
tRC
6/7 ns
Row Cycle time(min.)
ns
60/70 ns
Table 2. Ordering Information
Part Number
Frequency
Package
EM639325TS-6G
166MHz
TSOP II
EM639325TS-7G
143MHz
TSOP II
TS : indicates TSOP II package
G: indicates Pb and Halogen Free for TSOPII Package
Figure 1. Pin Assignment (Top View)
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDD
DQM0
WE#
CAS#
RAS#
CS#
A11
BS0
BS1
A10/AP
A0
A1
A2
DQM2
VDD
NC
DQ16
VSSQ
DQ17
DQ18
VDDQ
DQ19
DQ20
VSSQ
DQ21
DQ22
VDDQ
DQ23
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
VSS
NC
DQ31
VDDQ
DQ30
DQ29
VSSQ
DQ28
DQ27
VDDQ
DQ26
DQ25
VSSQ
DQ24
VSS
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345
FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.
EtronTech
EM639325TS
CLOCK
BUFFER
Column Decoder
CKE
A10/AP
DQ0
DQ Buffer
COMMAND
DECODER
DQ31
CONTROL
SIGNAL
GENERATOR
DQM0~3
Row
Decoder
CS#
RAS#
CAS#
WE#
4096 x 256 x 32
CELL ARRAY
(BANK #0)
COLUMN
COUNTER
~
CLK
Row
Decoder
Figure 2. Block Diagram
4096 x 256 x 32
CELL ARRAY
(BANK #1)
Column Decoder
MODE
REGISTER
4096 x256 x 32
CELL ARRAY
(BANK #2)
Column Decoder
REFRESH
COUNTER
Row
Decoder
A9
A11
BA0
BA1
ADDRESS
BUFFER
Row
Decoder
~
A0
4096 x 256 x 32
CELL ARRAY
(BANK #3)
Column Decoder
Rev.1.4
2
Mar. /2013
EtronTech
EM639325TS
Pin Descriptions
Table 3. Pin Details of EM639325
Symbol Type Description
CLK
Input Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the
positive edge of CLK. CLK also increments the internal burst counter and controls the
output registers.
CKE
Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. If CKE goes
low synchronously with clock (set-up and hold time same as other inputs), the internal clock
is suspended from the next clock cycle and the state of output and burst address is frozen
as long as the CKE remains low. When all banks are in the idle state, deactivating the clock
controls the entry to the Power Down and Self Refresh modes. CKE is synchronous except
after the device enters Power Down and Self Refresh modes, where CKE becomes
asynchronous until exiting the same mode. The input buffers, including CLK, are disabled
during Power Down and Self Refresh modes, providing low standby power.
BA0,
BA1
Input Bank Activate: BA0 and BA1 define to which bank the BankActivate, Read, Write, or
BankPrecharge command is being applied. The bank address BA0 and BA1 is used
latched in mode register set.
A0-A11 Input Address Inputs: A0-A11 are sampled during the BankActivate command (row address A0A11) and Read/Write command (column address A0-A7 with A10 defining Auto Precharge)
to select one location out of the 1M available in the respective bank. During a Precharge
command, A10 is sampled to determine if all banks are to be precharged (A10 = HIGH).
The address inputs also provide the op-code during a Mode Register Set or Special Mode
Register Set command.
CS#
Input Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the command
decoder. All commands are masked when CS# is sampled HIGH. CS# provides for external
bank selection on systems with multiple banks. It is considered part of the command code.
RAS#
Input Row Address Strobe: The RAS# signal defines the operation commands in conjunction
with the CAS# and WE# signals and is latched at the positive edges of CLK. When RAS#
and CS# are asserted "LOW" and CAS# is asserted "HIGH," either the BankActivate
command or the Precharge command is selected by the WE# signal. When the WE# is
asserted "HIGH," the BankActivate command is selected and the bank designated by BA is
turned on to the active state. When the WE# is asserted "LOW," the Precharge command is
selected and the bank designated by BA is switched to the idle state after the precharge
operation.
CAS#
Input Column Address Strobe: The CAS# signal
conjunction with the RAS# and WE# signals and
When RAS# is held "HIGH" and CS# is asserted
asserting CAS# "LOW." Then, the Read or Write
"LOW" or "HIGH."
WE#
Input Write Enable: The WE# signal defines the operation commands in conjunction with the
RAS# and CAS# signals and is latched at the positive edges of CLK. The WE# input is
used to select the BankActivate or Precharge command and Read or Write command.
defines the operation commands in
is latched at the positive edges of CLK.
"LOW," the column access is started by
command is selected by asserting WE#
DQM0 - Input Data Input/Output Mask: Data Input Mask: DQM0-DQM3 are byte specific. Input data is
DQM3
masked when DQM is sampled HIGH during a write cycle. DQM3 masks DQ31-DQ24,
DQM2 masks DQ23-DQ16, DQM1 masks DQ15-DQ8, and DQM0 masks DQ7-DQ0.
DQ0- Input/ Data I/O: The DQ0-31 input and output data are synchronized with the positive edges of
DQ31 Output CLK. The I/Os are byte-maskable during Reads and Writes.
NC
-
No Connect: These pins should be left unconnected.
VDDQ
Supply DQ Power: Provide isolated power to DQs for improved noise immunity.
VSSQ
Supply DQ Ground: Provide isolated ground to DQs for improved noise immunity.
Rev.1.4
3
Mar. /2013
EtronTech
VDD
Supply Power Supply: +3.3V±0.3V
VSS
Supply Ground
Rev.1.4
EM639325TS
4
Mar. /2013
EtronTech
EM639325TS
Operation Mode
Fully synchronous operations are performed to latch the commands at the positive edges of CLK. Table 4
shows the truth table for the operation commands.
Table 4. Truth Table (Note (1), (2))
Command
BankActivate
State
CKEn-1 CKEn DQM(6) BA0,1 A10 A11, A9-0 CS# RAS# CAS# WE#
Idle(3)
H
X
X
V
Row address
L
L
H
H
BankPrecharge
Any
H
X
X
V
L
X
L
L
H
L
PrechargeAll
Any
H
X
X
X
H
X
L
L
H
L
Write
Active(3)
H
X
V
V
L
L
H
L
L
Write and AutoPrecharge
Active(3)
H
X
V
V
H
Column
address
(A0 ~ A7)
L
H
L
L
Read
Active(3)
H
X
V
V
L
L
H
L
H
Read and Autoprecharge
Active(3)
H
X
V
V
H
Column
address
(A0 ~ A7)
L
H
L
H
Mode Register Set
Idle
H
X
X
L
L
L
L
No-Operation
Any
H
X
X
X
X
X
L
H
H
H
Active(4)
H
X
X
X
X
X
L
H
H
L
Device Deselect
Any
H
X
X
X
X
X
H
X
X
X
AutoRefresh
Idle
H
H
X
X
X
X
L
L
L
H
SelfRefresh Entry
Idle
H
L
X
X
X
X
L
L
L
H
Idle
L
H
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
H
X
X
X
L
H
H
H
Burst Stop
SelfRefresh Exit
OP code
(SelfRefresh)
Clock Suspend Mode Entry
Power Down Mode Entry
Clock Suspend Mode Exit
Active
Any(5)
H
H
L
L
X
X
X
X
X
X
X
X
Active
L
H
X
X
X
X
X
X
X
X
Any
L
H
X
X
X
X
H
X
X
X
L
H
H
H
X
X
X
X
Active
H
X
H
X
X
X
X
X
X
Note: 1. V = Valid, X = Don't care, L = Logic low, H = Logic high
2. CKEn signal is input level when commands are provided.
CKEn-1 signal is input level one clock cycle before the commands are provided.
3. These are states of bank designated by BA signal.
4. Device state is 1, 2, 4, 8, and full page burst operation.
5. Power Down Mode can not enter in the burst operation.
When this command is asserted in the burst cycle, device state is clock suspend mode.
6. DQM0-3
X
Power Down Mode Exit
(PowerDown)
Data Write/Output Enable
Active
H
X
L
Data Mask/Output Disable
Rev.1.4
5
X
X
X
Mar. /2013
EtronTech
EM639325TS
Commands
1
BankActivate
(RAS# = "L", CAS# = "H", WE# = "H", BA 0,1= Bank, A0-A11 = Row Address)
The BankActivate command activates the idle bank designated by the BA0,1 (Bank Activate) signal.
By latching the row address on A0 to A11 at the time of this command, the selected row access is
initiated. The read or write operation in the same bank can occur after a time delay of tRCD(min.) from the
time of bank activation. A subsequent BankActivate command to a different row in the same bank can
only be issued after the previous active row has been precharged (refer to the following figure). The
minimum time interval between successive BankActivate commands to the same bank is defined by
tRC(min.). The SDRAM has four internal banks on the same chip and shares part of the internal circuitry to
reduce chip area; therefore it restricts the back-to-back activation of the two banks. tRRD(min.) specifies
the minimum time required between activating different banks. After this command is used, the Write
command performs the no mask write operation.
T0
T1
T2
T3
Tn+3
Tn+4
Tn+5
Tn+6
CLK
ADDRESS
Bank A
Row Addr.
Bank A
Col Addr.
Bank B
Row Addr.
RAS# - CAS# delay(tRCD)
COMMAND
Bank A
Activate
NOP
NOP
Bank A
Row Addr.
RAS# - RAS# delay time(tRRD)
Bank B
Activate
R/W A with
AutoPrecharge
NOP
NOP
Bank A
Activate
RAS# - Cycle time(tRC)
AutoPrecharge
Begin
Don’t Care
Figure 3. BankActivate Command Cycle (Burst Length = n)
2
BankPrecharge command
(RAS# = "L", CAS# = "H", WE# = "L", BA0, 1 = Bank, A10 = "L", A0-A9, A11 = Don't care)
The BankPrecharge command precharges the bank designated by BA0,1 signal. The precharged
bank is switched from the active state to the idle state. This command can be asserted anytime after
tRAS(min.) is satisfied from the BankActivate command in the desired bank. The maximum time any bank
can be active is specified by tRAS(max.). Therefore, the precharge function must be performed in any
active bank within tRAS(max.). At the end of precharge, the precharged bank is still in the idle state and is
ready to be activated again.
3
PrechargeAll command
(RAS# = "L", CAS# = "H", WE# = "L", BA0, 1 = Don’t care, A10 = "H", A0-A9, A11 = Don't care)
The PrechargeAll command precharges all the four banks simultaneously and can be issued even if
all banks are not in the active state. All banks are then switched to the idle state.
4
Read command
(RAS# = "H", CAS# = "L", WE# = "H", BA0,1 = Bank, A10 = "L", A0-A7 = Column Address)
The Read command is used to read a burst of data on consecutive clock cycles from an active row in
an active bank. The bank must be active for at least tRCD(min.) before the Read command is issued.
During read bursts, the valid data-out element from the starting column address will be available following
the CAS latency after the issue of the Read command. Each subsequent data-out element will be valid by
the next positive clock edge (refer to the following figure). The DQs go into high-impedance at the end of
the burst unless other command is initiated. The burst length, burst sequence, and CAS latency are
determined by the mode register which is already programmed. A full-page burst will continue until
terminated (at the end of the page it will wrap to column 0 and continue).
Rev.1.4
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EtronTech
T0
EM639325TS
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
READ A
NOP
CAS# Latency=2
tCK2, DQ
NOP
DOUT A0
CAS# Latency=3
tCK3, DQ
NOP
NOP
NOP
NOP
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
NOP
NOP
DOUT A3
Figure 4. Burst Read Operation (Burst Length = 4, CAS# Latency = 2, 3)
The read data appears on the DQs subject to the values on the DQM inputs two clocks earlier (i.e.
DQM latency is two clocks for output buffers). A read burst without the auto precharge function may be
interrupted by a subsequent Read or Write command to the same bank or the other active bank before
the end of the burst length. It may be interrupted by a BankPrecharge/ PrechargeAll command to the
same bank too. The interrupt coming from the Read command can occur on any clock cycle following a
previous Read command (refer to the following figure).
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
READ A
READ B
NOP
CAS# Latency=2
tCK2, DQ
DOUT A0
CAS# Latency=3
tCK3, DQ
NOP
NOP
NOP
NOP
NOP
DOUT B0
DOUT B1
DOUT B2
DOUT B3
DOUT A0
DOUT B0
DOUT B1
DOUT B2
NOP
DOUT B3
Figure 5. Read Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3)
The DQM inputs are used to avoid I/O contention on the DQ pins when the interrupt comes from a
Write command. The DQMs must be asserted (HIGH) at least two clocks prior to the Write command to
suppress data-out on the DQ pins. To guarantee the DQ pins against I/O contention, a single cycle with
high-impedance on the DQ pins must occur between the last read data and the Write command (refer to
the following three figures). If the data output of the burst read occurs at the second clock of the burst
write, the DQMs must be asserted (HIGH) at least one clock prior to the Write command to avoid internal
bus contention.
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
CLK
DQM
COMMAND
NOP
NOP
Bank A
Activate
NOP
CAS# Latency=2
tCK2, DQ
NOP
READ A
WRITE A
NOP
NOP
NOP
DIN A0
DIN A1
DIN A2
DIN A3
Figure 6. Read to Write Interval (Burst Length ≥ 4, CAS# Latency = 2)
Rev.1.4
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Mar. /2013
EtronTech
T0
EM639325TS
T1
T2
T3
T4
T5
T6
T7
T8
CLK
DQM
COMMAND
NOP
NOP
READ A
NOP
NOP
CAS# Latency=2
tCK2, DQ
WRITE B
NOP
NOP
NOP
DIN B0
DIN B1
DIN B2
DIN B3
Must be Hi-Z before
the Write Command
Don’t Care
Figure 7. Read to Write Interval (Burst Length ≥ 4, CAS# Latency = 2)
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
DQM
COMMAND
NOP
READ A
NOP
NOP
CAS# Latency=3
tCK3, DQ
NOP
NOP
DOUT A0
WRITE B
NOP
NOP
DIN B0
DIN B1
DIN B2
Must be Hi-Z before
the Write Command
Don’t Care
Figure 8. Read to Write Interval (Burst Length ≧ 4, CAS# Latency = 3)
A read burst without the auto precharge function may be interrupted by a BankPrecharge/ PrechargeAll
command to the same bank. The following figure shows the optimum time that BankPrecharge/
PrechargeAll command is issued in different CAS latency.
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
ADDRESS
Bank,
Col A
Bank
Row
Bank (s)
tRP
COMMAND
CAS# Latency=2
tCK2, DQ
CAS# Latency=3
tCK3, DQ
READ A
NOP
NOP
DOUT A0
NOP
Precharge
NOP
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
NOP
Activate
NOP
DOUT A3
Figure 9. Read to Precharge (CAS# Latency = 2, 3)
5
Read and AutoPrecharge command
(RAS# = "H", CAS# = "L", WE# = "H", BA = Bank, A10 = "H", A0-A7 = Column Address)
The Read and AutoPrecharge command automatically performs the precharge operation after the
read operation. Once this command is given, any subsequent command cannot occur within a time delay
of {tRP(min.) + burst length}. At full-page burst, only the read operation is performed in this command and
the auto precharge function is ignored.
Rev.1.4
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6
EM639325TS
Write command
(RAS# = "H", CAS# = "L", WE# = "L", BA = Bank, A10 = "L", A0-A7 = Column Address)
The Write command is used to write a burst of data on consecutive clock cycles from an active row in
an active bank. The bank must be active for at least tRCD(min.) before the Write command is issued.
During write bursts, the first valid data-in element will be registered coincident with the Write command.
Subsequent data elements will be registered on each successive positive clock edge (refer to the
following figure). The DQs remain with high-impedance at the end of the burst unless another command
is initiated. The burst length and burst sequence are determined by the mode register, which is already
programmed. A full-page burst will continue until terminated (at the end of the page it will wrap to column
0 and continue).
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
DQ
WRITE A
NOP
NOP
NOP
NOP
DIN A0
DIN A1
DIN A2
DIN A3
don’t care
NOP
NOP
NOP
The first data element and the write
are registered on the same clock edge
Figure 10. Burst Write Operation (Burst Length = 4)
A write burst without the AutoPrecharge function may be interrupted by a subsequent Write,
BankPrecharge/PrechargeAll, or Read command before the end of the burst length. An interrupt coming
from Write command can occur on any clock cycle following the previous Write command (refer to the
following figure).
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
DQ
WRITE A
WRITE B
NOP
NOP
NOP
DIN A0
DIN B0
DIN B1
DIN B2
DIN B3
NOP
NOP
NOP
Figure 11. Write Interrupted by a Write (Burst Length = 4)
The Read command that interrupts a write burst without auto precharge function should be issued
one cycle after the clock edge in which the last data-in element is registered. In order to avoid data
contention, input data must be removed from the DQs at least one clock cycle before the first read data
appears on the outputs (refer to the following figure). Once the Read command is registered, the data
inputs will be ignored and writes will not be executed.
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
WRITE A
READ B
CAS# Latency=2
tCK2, DQ
DIN A0
don’t care
CAS# Latency=3
tCK3, DQ
DIN A0
don’t care
NOP
don’t care
NOP
NOP
NOP
NOP
DOUT B0
DOUT B1
DOUT B2
DOUT B3
DOUT B0
DOUT B1
DOUT B2
NOP
DOUT B3
Input data must be removed from the DQ at
least one clock cycle before the Read data
appears on the outputs to avoid data contention
Figure 12. Write Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3)
Rev.1.4
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EtronTech
EM639325TS
The BankPrecharge/PrechargeAll command that interrupts a write burst without the auto precharge
function should be issued m cycles after the clock edge in which the last data-in element is registered,
where m equals tWR/tCK rounded up to the next whole number. In addition, the DQM signals must be used
to mask input data, starting with the clock edge following the last data-in element and ending with the
clock edge on which the BankPrecharge/PrechargeAll command is entered (refer to the following figure).
T1
T0
T2
T3
T4
T5
T6
T7
CLK
DQM
tRP
COMMAND
WRITE
NOP
NOP
Bank
Col n
ADDRESS
Precharge
NOP
NOP
Activate
NOP
ROW
Bank (s)
tWR
DIN
n
DQ
DIN
N+1
Don’t Care
Note: The DQMs can remain low in this example if the length of the write burst is 1 or 2.
Figure 13. Write to Precharge
7 Write and AutoPrecharge command (RAS# = "H", CAS# = "L", WE# = "L", BA = Bank, A10 = "H", A0-A7 =
Column Address)
The Write and AutoPrecharge command performs the precharge operation automatically after the write
operation. Once this command is given, any subsequent command can not occur within a time delay of
{(burst length -1) + tWR + tRP(min.)}. At full-page burst, only the write operation is performed in this
command and the auto precharge function is ignored.
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
CLK
COMMAND
Bank A
Activate
NOP
NOP
WRITE A
Auto Precharge
NOP
NOP
NOP
NOP
NOP
Bank A
Activate
tDAL
DQ
DIN A0
tDAL=tWR+tRP
DIN A1
Begin AutoPrecharge
Bank can be reactivated at
completion of tDAL
Figure 14. Burst Write with Auto-Precharge (Burst Length = 2)
8
Mode Register Set command (RAS# = "L", CAS# = "L", WE# = "L", BA0, 1 and A11-A0 = Register Data)
The mode register stores the data for controlling the various operating modes of SDRAM. The Mode
Register Set command programs the values of CAS latency, Addressing Mode and Burst Length in the
Mode register to make SDRAM useful for a variety of different applications. The default values of the Mode
Register after power-up are undefined; therefore this command must be issued at the power-up sequence.
The state of pins BA0, 1 and A11~A0 in the same cycle is the data written to the mode register. Two clock
cycles are required to complete the write in the mode register (refer to the following figure). The contents
of the mode register can be changed using the same command and the clock cycle requirements during
operation as long as all banks are in the idle state.
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EM639325TS
Table 5. Mode Register Bitmap
BA1
0
BA0
0
A9
0
1
A6
0
0
0
0
1
A11
0
A10
0
A9
W.B.L
Write Burst Length
Burst
Single Bit
A8
A7
A6
TM
A8
0
1
0
A7
0
0
1
A5
A4
CAS Latency
Test Mode
Normal
Reserved
Reserved
A5
0
0
1
1
0
A3
0
1
A4
CAS Latency
A2
0
Reserved
0
1
Reserved
0
0
2 clocks
0
1
3 clocks
0
0
Reserved
1
All other Reserved
Note : Column address is repeated until terminated in Full Page Mode
T0
T1
T2
T3
A3
BT
T4
T5
T6
A1
0
0
1
1
1
T7
A2
A1
A0
Burst Length
Burst Type
Sequential
Interleave
A0
Burst Length
0
1
1
2
0
4
1
8
1
Full Page (Sequential)
All other Reserved
T8
T9
T10
CLK
CKE
tMRD
CS#
RAS#
CAS#
WE#
BA0,1
A10
Address Key
A0-A9,
A11
DQM
tRP
DQ
Hi-Z
PrechargeAll
Mode Register
Set Command
Any
Command
Don’t Care
Figure 15. Mode Register Set Cycle
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•Burst Definition, Addressing Sequence of Sequential and Interleave Mode
Table 6. Burst Definition
Burst Length
2
4
8
Full page
9
Start Address
A2
A1
A0
X
X
0
X
X
1
X
0
0
X
0
1
X
1
0
X
1
1
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
location = 0-255
Sequential
Interleave
0, 1
1, 0
0, 1, 2, 3
1, 2, 3, 0
2, 3, 0, 1
3, 0, 1, 2
0, 1, 2, 3, 4, 5, 6, 7
1, 2, 3, 4, 5, 6, 7, 0
2, 3, 4, 5, 6, 7, 0, 1
3, 4, 5, 6, 7, 0, 1, 2
4, 5, 6, 7, 0, 1, 2, 3
5, 6, 7, 0, 1, 2, 3, 4
6, 7, 0, 1, 2, 3, 4, 5
7, 0, 1, 2, 3, 4, 5, 6
n, n+1, n+2, n+3, …255, 0,
1, 2, … n-1, n, …
0, 1
1, 0
0, 1, 2, 3
1, 0, 3, 2
2, 3, 0, 1
3, 2, 1, 0
0, 1, 2, 3, 4, 5, 6, 7
1, 0, 3, 2, 5, 4, 7, 6
2, 3, 0, 1, 6, 7, 4, 5
3, 2, 1, 0, 7, 6, 5, 4
4, 5, 6, 7, 0, 1, 2, 3
5, 4, 7, 6, 1, 0, 3, 2
6, 7, 4, 5, 2, 3, 0, 1
7, 6, 5, 4, 3, 2, 1, 0
Not Support
No-Operation command (RAS# = "H", CAS# = "H", WE# = "H")
The No-Operation command is used to perform a NOP to the SDRAM which is selected (CS# is Low).
This prevents unwanted commands from being registered during idle or wait states.
10
Burst Stop command (RAS# = "H", CAS# = "H", WE# = "L")
The Burst Stop command is used to terminate either fixed-length or full-page bursts. This command is
only effective in a read/write burst without the auto precharge function. The terminated read burst ends
after a delay equal to the CAS latency (refer to the following figure). The termination of a write burst is
shown in the following figure.
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
READ A
NOP
NOP
NOP
Burst
Stop
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
NOP
NOP
NOP
NOP
The burst ends after a delay equal to the CAS# Latency
CAS# Latency=2
tCK2, DQ
DOUT A0
CAS# Latency=3
tCK3, DQ
DOUT A3
Figure 16. Termination of a Burst Read Operation (Burst Length＞4, CAS# Latency = 2, 3)
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T0
EM639325TS
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
DQ
WRITE A
NOP
NOP
Burst
Stop
DIN A0
DIN A1
DIN A2
don’t care
NOP
NOP
NOP
NOP
Figure 17. Termination of a Burst Write Operation (Burst Length = X)
11 Device Deselect command (CS# = "H")
The Device Deselect command disables the command decoder so that the RAS#, CAS#, WE# and
Address inputs are ignored, regardless of whether the CLK is enabled. This command is similar to the No
Operation command.
12
AutoRefresh command
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "H", BA0, 1 = “Don‘t care, A0-A11 = Don't care)
The AutoRefresh command is used during normal operation of the SDRAM and is analogous to
CAS#-before-RAS# (CBR) Refresh in conventional DRAMs. This command is non-persistent, so it must
be issued each time a refresh is required. The addressing is generated by the internal refresh controller.
This makes the address bits a "don't care" during an AutoRefresh command. The internal refresh counter
increments automatically on every auto refresh cycle to all of the rows. The refresh operation must be
performed 4096 times within 64ms. The time required to complete the auto refresh operation is specified
by tRC(min.). To provide the AutoRefresh command, all banks need to be in the idle state and the device
must not be in power down mode (CKE is high in the previous cycle). This command must be followed by
NOPs until the auto refresh operation is completed. The precharge time requirement, tRP(min), must be
met before successive auto refresh operations are performed.
13
SelfRefresh Entry command
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "L", A0-A11 = Don't care)
The SelfRefresh is another refresh mode available in the SDRAM. It is the preferred refresh mode for
data retention and low power operation. Once the SelfRefresh command is registered, all the inputs to the
SDRAM become "don't care" with the exception of CKE, which must remain LOW. The refresh addressing
and timing is internally generated to reduce power consumption. The SDRAM may remain in SelfRefresh
mode for an indefinite period. The SelfRefresh mode is exited by restarting the external clock and then
asserting HIGH on CKE (SelfRefresh Exit command).
14 SelfRefresh Exit command
(CKE = "H", CS# = "H" or CKE = "H", RAS# = "H", CAS# = "H", WE# = "H")
This command is used to exit from the SelfRefresh mode. Once this command is registered, NOP or
Device Deselect commands must be issued for tRC(min.) because time is required for the completion of
any bank currently being internally refreshed. If auto refresh cycles in bursts are performed during normal
operation, a burst of 4096 auto refresh cycles should be completed just prior to entering and just after
exiting the SelfRefresh mode.
15
Clock Suspend Mode Entry / PowerDown Mode Entry command (CKE = "L")
When the SDRAM is operating the burst cycle, the internal CLK is suspended (masked) from the
subsequent cycle by issuing this command (asserting CKE "LOW"). The device operation is held intact
while CLK is suspended. On the other hand, when all banks are in the idle state, this command performs
entry into the PowerDown mode. All input and output buffers (except the CKE buffer) are turned off in the
PowerDown mode. The device may not remain in the Clock Suspend or PowerDown state longer than the
refresh period (64ms) since the command does not perform any refresh operations.
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16
Clock Suspend Mode Exit / PowerDown Mode Exit command
When the internal CLK has been suspended, the operation of the internal CLK is reinitiated from the
subsequent cycle by providing this command (asserting CKE "HIGH", the command should be NOP or
deselect). When the device is in the PowerDown mode, the device exits this mode and all disabled
buffers are turned on to the active state. tXSR(min.) is required when the device exits from the PowerDown
mode. Any subsequent commands can be issued after one clock cycle from the end of this command.
17
Data Write / Output Enable, Data Mask / Output Disable command (DQM = "L", "H")
During a write cycle, the DQM signal functions as a Data Mask and can control every word of the
input data. During a read cycle, the DQM functions as the controller of output buffers. DQM is also used
for device selection, byte selection and bus control in a memory system.
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Table 7. Absolute Maximum Rating
Symbol
VIN, VOUT
VDD, VDDQ
TA
Item
Input, Output Voltage
Power Supply Voltage
Ambient Temperature
Rating
- 1.0 ~ +4.6
-1.0 ~ +4.6
0 ~ +70
Unit
V
V
°C
TSTG
Storage Temperature
- 55~ +150
TSOLDER
Soldering Temperature (10s)
260
PD
IOS
Power Dissipation
Short Circuit Output Current
1.0
50
°C
°C
W
mA
Note: Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device.
Table 8. Recommended D.C. Operating Conditions (TA = 0~70°C)
Parameter/ Condition
Symbol
Min.
Typ.
Max.
Unit
VDD
3.0
3.3
3.6
V
1
VDDQ
3.0
3.3
3.6
V
1
Input High (Logic 1) Voltage
VIH
2.0
-
VDDQ+0.3
V
1
Input Low (Logic 0) Voltage
VIL
-0.3
-
0.8
V
1
Data Output High (Logic 1) Voltage
VOH
2.4
-
-
V
1,2,4
Data Output High (Logic 1) Voltage
VOL
-
-
0.4
V
1,3,5
-1.5
-
1.5
DRAM Core Supply VOLTAGE
I/O Supply Voltage
Input Leakage Current
( 0V≦VIN≦VDD, All other pins not under test = 0V )
IIL
Note
µA
Note:
1
All voltages are referenced to VSS.
2
3
4
5
IOUT = - 2.0mA
IOUT = + 2.0mA
VIH (max) = 4.6V AC. The overshoot voltage duration is ≦ 3ns.
VIL (min) =-1.0V AC. The undershoot voltage duration is ≦ 3ns.
Table 9. Capacitance (VDD = 3.3V, f = 1MHz, TA = 25°C)
Symbol
CI
CI/O
Parameter
Min.
Max.
Unit
Input Capacitance
4
5
pF
Input/Output Capacitance
6
8
pF
Note: These parameters are periodically sampled and are not 100% tested.
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Table 10. D.C. Characteristics (VDD =3.3V ± 0.3V, TA = 0~70°)
Description/Test condition
Symbol
Operating Current
tRC ≥ tRC(min), Outputs Open, Input
1 bank operation
signal one transition per one cycle
Precharge Standby Current in power down mode
tCK = 15ns, CKE ≤ VIL(max)
Precharge Standby Current in power down mode
tCK = ∞, CKE ≤ VIL(max)
Precharge Standby Current in non-power down mode
tCK = 15ns, CS# ≥ VIH(min), CKE ≥ VIH
Input signals are changed every 2clks
Precharge Standby Current in non-power down mode
tCK = ∞, CLK ≤ VIL(max), CKE ≥ VIH
Active Standby Current in non-power down mode
tCK = 15ns, CKE ≥ VIH(min), CS# ≥ VIH(min)
Input signals are changed every 2clks
Active Standby Current in non-power down mode
CKE ≥ VIH(min), CLK ≤ VIL(max), tCK = ∞
Operating Current (Burst mode)
tCK =tCK(min), Outputs Open, Multi-bank interleave
Refresh Current
tRC ≥ tRC(min)
Self Refresh Current
CKE ≤ 0.2V ; for other inputs VIH≧VDD - 0.2V, VIL ≤ 0.2V
Rev.1.4
16
-6
-7
Max.
IDD1
160
140
IDD2P
3
3
IDD2PS
3
3
30
30
IDD2NS
12
12
IDD3N
60
55
IDD3NS
60
55
IDD4
240
220
IDD5
270
250
IDD6
5
5
IDD2N
Unit
mA
Mar. /2013
EtronTech
EM639325TS
Table 11. Electrical Characteristics and Recommended A.C. Operating Conditions
(VDD = 3.3V±0.3V, TA = 0~70°C) (Note: 1, 2, 3, and 4)
Symbol
-6
A.C. Parameter
-7
Min.
Max.
Min.
Max.
Unit Note
tRC
Row cycle time (same bank)
60
-
70
-
5
tRCD
RAS# to CAS# delay (same bank)
18
-
21
-
5
tRP
18
-
21
-
tRRD
Precharge to refresh / row activate command
(same bank)
Row activate to row active delay (different banks)
12
-
14
-
5
tRAS
Row activate to precharge time (same bank)
42
100k
49
100k
5
tRDL
Last data in to row precharge
3
-
3
-
Clock cycle time
CL* = 2
10
-
10
-
tCK
CL* = 3
6
-
7
-
tCH
Clock high time
2.5
-
3
-
tCL
Clock low time
2.5
-
3
-
CL* =2
-
7
-
7.5
CL* = 3
-
5.5
-
6
ns
tCK
5
5
ns
6
tAC
Access time from CLK (positive edge)
tCCD
CAS# to CAS# Delay time
1
-
1
-
tOH
Data output hold time
2
-
2
-
tLZ
Data output low impedance
1
-
1
-
tHZ
Data output high impedance
-
5.5
-
6
tIS
Data/Address/Control Input set-up time
2
-
2
-
tIH
Data/Address/Control Input hold time
1
-
1
-
ns
tPDE
PowerDown Exit Setup Time
tIS+tCK
-
tIS+tCK
-
ns
tREFI
Refresh Interval Time
-
15.6
-
15.6
µs
tXSR
Exit Self-Refresh to any Command
tRC+tIS
-
tRC+tIS
-
ns
tMRD
Mode Register Set Command Cycle Time
2
-
2
-
tCK
tCK
5
5
ns
5
6
6
*CL is CAS Latency.
Note:
1 Power-up sequence is described in Note 7.
2
A.C. Test Conditions
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Table 12. LVTTL Interface
Reference Level of Output Signals
1.4V/1.4V
Output Load
Reference to the Under Output Load (B)
Input Signal Levels (VIH/VIL)
2.4V/0.4V
Transition Time (Rise and Fall) of Input Signals
1ns
Reference Level of Input Signals
1.4V
1.4V
3.3V
3.3V
50 Ω
1.2kΩ
Z0= 50 Ω
Output
Output
30pF
30pF
870Ω
Figure 18.1 LVTTL D.C. Test Load (A)
Figure 18.2 LVTTL A.C. Test Load (B)
3. Transition times are measured between VIH and VIL. Transition (rise and fall) of input signals are in a fixed
slope (1 ns).
4. tHZ defines the time in which the outputs achieve the open circuit condition and are not at reference levels.
5. If clock rising time is longer than 1 ns, (tR / 2 -0.5) ns should be added to the parameter.
6. Assumed input rise and fall time tT (tR & tF) = 1 ns
If tR or tF is longer than 1 ns, transient time compensation should be considered, i.e., [(tr + tf)/2 - 1] ns should
be added to the parameter.
7. Power up Sequence
Power up must be performed in the following sequence.
1) Power must be applied to VDD and VDDQ (simultaneously) when CKE= “L”, DQM= “H” and all input signals
are held "NOP" state.
2) Start clock and maintain stable condition for minimum 200 µs, then bring CKE= “H” and, it is
recommended that DQM is held "HIGH" (VDD levels) to ensure DQ output is in high impedance.
3) All banks must be precharged.
4) Mode Register Set command must be asserted to initialize the Mode register.
5) A minimum of 2 Auto-Refresh dummy cycles must be required to stabilize the internal circuitry of the
device.
* The Auto Refresh command can be issue before or after Mode Register Set command.
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Timing Waveforms
Figure 19. AC Parameters for Write Timing (Burst Length=4)
T0
CLK
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCH
tCL
CKE
tIS
tIS
Begin Auto
Precharge Bank A
tIH
Begin Auto
Precharge Bank B
CS#
RAS#
CAS#
WE#
BA0,1
tIH
A10
RAx
RBx
RAy
tIS
A0-A9,
A11
RAx
CAx
RBx
CBx
RAy
CAy
DQM
tRCD
tDAL
tIS
tRC
DQ
Ax0
Activate
Command
Bank A
Ax1
Write with
Auto Precharge
Command
Bank A
Ax2
Activate
Command
Bank B
tWR
tIH
Hi-Z
Ax3
Bx0
Bx1
Write with
Auto Precharge
Command
Bank B
Bx2
Bx3
Ay0
Ay1
Activate
Command
Bank A
Write
Command
Bank A
Ay2
Ay3
Precharge
Command
Bank A
Don’t Care
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EM639325TS
Figure 20. AC Parameters for Read Timing (Burst Length=2, CAS# Latency=3)
T0
CLK
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16
tCH tCL
CKE
tIS
Begin Auto
Precharge Bank B
tIS
tIH
tIH
CS#
RAS#
CAS#
WE#
BA0,1
tIH
A10
RAx
RBx
RAy
tIS
A0-A9,
A11
RAx
CAx
RBx
CBx
RAy
tRRD
tRAS
DQM
tRC
tAC
tRCD
DQ
Hi-Z
tRP
tHZ
tLZ
Ax0
Ax1
Bx0
tHZ
tOH
Activate
Command
Bank A
Read
Command
Bank A
Bx1
Read with
Precharge
Auto Precharge Command
Command
Bank A
Bank B
Activate
Command
Bank B
Activate
Command
Bank A
Don’t Care
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EM639325TS
Figure 21. Auto Refresh (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
tRC
tRC
tRP
CAx
tRCD
DQM
DQ
Ax0
Precharge All
Command
Auto Refresh
Command
Auto Refresh
Command
Activate
Command
Bank A
Ax1
Read
Command
Bank A
Don’t Care
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EM639325TS
Figure 22. Power on Sequence and Auto Refresh
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High Level
Is reguired
Minimum for 2 Refresh Cycles are required
CS#
RAS#
CAS#
WE#
BA0,1
A10
Address Key
A0-A9,
A11
DQM
DQ
tRP
tMRD
Hi-Z
Precharge All
Command
Inputs must be
Stable for
200µs
1st Auto Refresh(*)
Command
2nd Auto Refresh(*)
Command
Mode Register
Set Command
Any
Command
Don’t Care
Note(*): The Auto Refresh command can be issue before or after Mode Register Set command
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EM639325TS
Figure 23. Self Refresh Entry & Exit Cycle
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19
CLK
*Note 2
CKE
tXSR
*Note 5
*Note 1
*Note 3,4
*Note 8
tPDE
tIS tIH
*Note 6
tIS
*Note 7
CS#
RAS#
*Note 9
CAS#
WE#
BA0,1
A10
A0-A9,
A11
DQM
DQ
Hi-Z
Hi-Z
Self Refresh Exit
Self Refresh Entry
Auto Refresh
Don’t Care
Note: To Enter SelfRefresh Mode
1. CS#, RAS# & CAS# with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don't care except for CKE.
3. The device remains in SelfRefresh mode as long as CKE stays "low".
4. Once the device enters SelfRefresh mode, minimum tRAS is required before exit from SelfRefresh.
5.
6.
7.
8.
9.
To Exit SelfRefresh Mode
System clock restart and be stable before returning CKE high.
Enable CKE and CKE should be set high for valid setup time and hold time.
CS# starts from high.
Minimum tXSR is required after CKE going high to complete SelfRefresh exit.
4096 cycles of burst AutoRefresh is required before SelfRefresh entry and after SelfRefresh exit if the
system uses burst refresh.
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EM639325TS
Figure 24.1. Clock Suspension During Burst Read (Using CKE)
(Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Clock Suspend
1 Cycle
Ax2
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
Don’t Care
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EM639325TS
Figure 24.2. Clock Suspension During Burst Read (Using CKE)
(Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Ax2
Clock Suspend
1 Cycle
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
Don’t Care
Rev.1.4
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EM639325TS
Figure 25. Clock Suspension During Burst Write (Using CKE)
(Burst Length=4)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
Hi-Z
DAx0
Activate
Command
Bank A
Rev.1.4
DAx1
Clock Suspend
1 Cycle
Write
Command
Bank A
DAx2
DAx3
Clock Suspend
3 Cycles
Clock Suspend
2 Cycles
Don’t Care
26
Mar. /2013
EtronTech
EM639325TS
Figure 26. Power Down Mode and Clock Suspension (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
CLK
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tIH tIS
tPDE
CKE
Valid
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
ACTIVE
Activate
Read
STANDBY
Command
Command
Bank A
Bank A
Power Down
Power Down
Mode Exit
Mode Entry
Rev.1.4
Ax1
Ax2
Clock Suspension
Start
Ax3
Clock Suspension
End
Precharge
Command
Bank A
Power Down
Mode Entry
27
PRECHARGE
STANDBY
Power Down
Mode Exit
Any
Command
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 27.1. Random Column Read (Page within same Bank)
(Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAw
A0-A9,
A11
RAw
RAz
CAw
CAx
CAy
RAz
CAz
DQM
DQ
Hi-Z
Aw0
Activate
Command
Bank A
Read
Command
Bank A
Aw1
Aw2
Aw3
Read
Command
Bank A
Ax0
Ax1
Read
Command
Bank A
Ay0
Ay1
Ay2
Ay3
Precharge
Command
Bank A
Az0
Activate
Command
Bank A
Read
Command
Bank A
Don’t Care
Rev.1.4
28
Mar. /2013
EtronTech
EM639325TS
Figure 27.2. Random Column Read (Page within same Bank)
(Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAw
A0-A9,
A11
RAw
RAz
CAw
CAx
CAy
RAz
CAz
DQM
DQ
Hi-Z
Aw0
Activate
Command
Bank A
Read
Command
Bank A
Aw1
Aw2
Read
Command
Bank A
Aw3
Ax0
Read
Command
Bank A
Ax1
Ay0
Ay1
Ay2
Precharge
Command
Bank A
Ay3
Activate
Command
Bank A
Read
Command
Bank A
Don’t Care
Rev.1.4
29
Mar. /2013
EtronTech
EM639325TS
Figure 28. Random Column Write (Page within same Bank)
(Burst Length=4)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBw
A0-A9,
A11
RBw
RBz
CBw
CBx
CBy
RBz
CBz
DQM
DQ
Hi-Z
DBw0 DBw1 DBw2 DBw3 DBx0
Activate
Command
Bank B
Write
Command
Bank B
DBx1
Write
Command
Bank B
DBy0 DBy1 DBy2
Write
Command
Bank B
DBy3
DBz0
Precharge
Command
Bank B
Activate
Command
Bank B
DBz1
Write
Command
Bank B
Don’t Care
Rev.1.4
30
Mar. /2013
EtronTech
EM639325TS
Figure 29.1. Random Row Read (Interleaving Banks)
(Burst Length=8, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBx
A0-A9,
A11
RBx
CBx
RBy
RAx
CAx
RBy
tAC
tRCD
DQM
DQ
RAx
CBy
tRP
Hi-Z
Bx0
Activate
Command
Bank B
Rev.1.4
Read
Command
Bank B
Bx1
Bx2
Bx3
Bx4
Bx5
Activate
Command
Bank A
31
Bx6
Bx7
Ax0
Read
Command
Bank A
Precharge
Command
Bank B
Ax1
Ax2
Ax3
Activate
Command
Bank B
Ax4
Ax5
Ax6
Ax7
Read
Command
Bank B
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 29.2. Random Row Read (Interleaving Banks)
(Burst Length=8, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBx
A0-A9,
A11
RBx
CBx
RBy
RAx
CAx
RBy
tAC
tRCD
DQM
DQ
RAx
CBy
tRP
Hi-Z
Bx0
Activate
Command
Bank B
Read
Command
Bank B
Bx1
Bx2
Bx3
Bx4
Activate
Command
Bank A
Bx5
Bx6
Read
Command
Bank A
Bx7
Ax0
Precharge
Command
Bank B
Ax1
Ax2
Ax3
Activate
Command
Bank B
Ax4
Ax5
Ax6
Read
Command
Bank B
Ax7
By0
Precharge
Command
Bank A
Don’t Care
Rev.1.4
32
Mar. /2013
EtronTech
EM639325TS
Figure 30. Random Row Write (Interleaving Banks)
(Burst Length=8)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0.1
A10
RAx
A0-A9,
A11
RAx
CAx
RAy
RBx
CBx
tRCD
DQM
DQ
RBx
RAy
tWR*
CAy
tRP
tWR*
Hi-Z
DAx0
Activate
Command
Bank A
DAx1
Write
Command
Bank A
DAx2 DAx3
DAx4
DAx5 DAx6
DAx7
Activate
Command
Bank B
DBx1 DBx2 DBx3
Write
Command
Bank B
Precharge
Command
Bank A
DBx4
DBx5 DBx6
Activate
Command
Bank A
DBx7
DAy0
DAy1 DAy2
Write
Command
Bank A
DAy3
Precharge
Command
Bank B
Don’t Care
*tWR>tWR (min.)
Rev.1.4
DBx0
33
Mar. /2013
EtronTech
EM639325TS
Figure 31.1. Read and Write Cycle (Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
DQM
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Ax1
Ax2
Ax3
Read
Command
Bank A
DAy0 DAy1
Write
Command
Bank A
DAy3
The Write Data
is Masked with a
Zero Clock
Latency
Az0
Read
Command
Bank A
Az1
Az3
The Read Data
is Masked with a
Two Clock
Latency
Don’t Care
Rev.1.4
34
Mar. /2013
EtronTech
EM639325TS
Figure 31.2. Read and Write Cycle (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
DQM
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev.1.4
Ax1
Ax2
Ax3
Read
Command
Bank A
DAy0 DAy1
Write
Command
Bank A
35
DAy3
The Write Data
is Masked with a
Zero Clock
Read
Latency
Command
Bank A
Az0
Az1
Az3
The Read Data
is Masked with a
Two Clock
Latency
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 32.1. Interleaving Column Read Cycle (Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
T5 T6
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAy
RBx
CBw
CBx
Ax3
Bw0
CBy
CAy
CBz
tRCD
DQM
tAC
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Activate
Command
Bank B
Ax2
Read
Command
Bank B
Bw1
Read
Command
Bank B
Bx0
Bx1
Read
Command
Bank B
By0
By1
Read
Command
Bank A
Ay0
Ay1
Read
Command
Bank B
Bz0
Bz1
Precharge
Command
Bank A
Bz2
Bz3
Precharge
Command
Bank B
Don’t Care
Rev.1.4
36
Mar. /2013
EtronTech
EM639325TS
Figure 32.2. Interleaved Column Read Cycle (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAx
RBx
CBx
CBy
CBz
CAy
tRCD
DQM
tAC
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev.1.4
Read
Command
Bank A
Activate
Command
Bank B
Ax1
Ax2
Read
Command
Bank B
Ax3
Bx0
Read
Command
Bank B
Bx1
By0
Read
Command
Bank B
By1
Bz0
Read
Command
Bank A
Bz1
Ay0
Precharge
Command
Bank B
Ay1
Ay2
Ay3
Precharge
Command
Bank A
Don’t Care
37
Mar. /2013
EtronTech
EM639325TS
Figure 33. Interleaved Column Write Cycle (Burst Length=4)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBw
CAx
RBw
CBw
CBx
CBy
CAy
CBz
tWR
tRCD
tWR
DQM
tRRD>tRRD (min)
DQ
Hi-Z
DAx0
Activate
Command
Bank A
Rev.1.4
DAx1
DAx2 DAx3 DBw0 DBw1 DBx0 DBx1 DBy0
Write
Command
Bank A
Activate
Command
Bank B
Write
Command
Bank B
Write
Command
Bank B
38
DBy1
Write
Command
Bank B
DAy0 DAy1 DBz0
Write
Command
Bank A
DBz1
DBz2
Write
Command
Bank B
Precharge
Command
Bank A
DBz3
Precharge
Command
Bank B
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 34.1. Auto Precharge after Read Burst (Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank B
High
Begin Auto
Precharge
Bank A
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAx
RBy
RBx
CBx
CAy
RBy
CBy
RAz
tRP
DQM
DQ
RAz
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Activate
Command
Bank B
Ax2
Ax3
Bx0
Read with
Auto Precharge
Command
Bank B
Bx1
Bx2
Bx3
Read with
Auto precharge
Command
Bank A
Ay0
Ay1
Ay2
Activate
Command
Bank B
Ay3
By0
By1
By2
Read with
Activate
Auto Precharge Command
Command
Bank A
Bank B
Don’t Care
Rev.1.4
39
Mar. /2013
EtronTech
EM639325TS
Figure 34.2. Auto Precharge after Read Burst (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
CAy
RBy
CBy
tRP
DQM
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev.1.4
Read
Command
Bank A
Activate
Command
Bank B
Ax1
Ax2
Ax3
Bx0
Read with
Auto Precharge
Command
Bank B
Bx1
Bx2
Read with
Auto Precharge
Command
Bank A
Bx3
Ay0
Ay1
Activate
Command
Bank B
Ay2
Ay3
By0
By1
By2
Read with
Auto Precharge
Command
Bank B
Don’t Care
40
Mar. /2013
EtronTech
EM639325TS
Figure 35. Auto Precharge after Write Burst (Burst Length=4)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
CAy
RBy
CBy
tDAL
DQM
DQ
Hi-Z
DAx0 DAx1
Activate
Command
Bank A
Rev.1.4
DAx2
Write
Command
Bank A
Activate
Command
Bank B
DAx3
DBx0 DBx1 DBx2
DBx3
Write with
Auto Precharge
Command
Bank B
DAy0 DAy1 DAy2
Write with
Auto Precharge
Command
Bank A
DAy3
DBy0 DBy1 DBy2
Activate
Command
Bank B
DBy3
Write with
Auto Precharge
Command
Bank B
Don’t Care
41
Mar. /2013
EtronTech
EM639325TS
Figure 36.1. Full Page Read Cycle (Burst Length=Full Page, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
tRP
DQM
DQ
Hi-Z
Ax
Activate
Command
Bank A
Read
Command
Bank A
Ax+1
Ax+2
Ax-2
Ax-1
Ax
Ax+1
Bx
Bx+1
Bx+2
Bx+3
The burst counter wraps
Activate
Read
Command from the highest order
Command
page address back to zero Bank B
Bank B
during this time interval
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
bursting beginning with the starting address
Rev.1.4
42
Bx+4
Bx+5
Bx+6
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 36.2. Full Page Read Cycle (Burst Length=Full Page, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
tRP
DQM
DQ
Hi-Z
Ax
Activate
Command
Bank A
Read
Command
Bank A
Activate
Command
Bank B
Ax+1
Ax+2
Ax-2
Ax-1
Ax
Ax+1
Bx
Bx+1
Bx+2
Read
Command
Bank B
The burst counter wraps
from the highest order
page address back to zero
during this time interval
Bx+3
Bx+4
Bx+5
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
bursting beginning with the starting address
Rev.1.4
43
Mar. /2013
EtronTech
EM639325TS
Figure 37. Full Page Write Cycle (Burst Length=Full Page)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
DQM
Data is ignored
DQ
Hi-Z
DAx
Activate
Command
Bank A
Rev.1.4
DAx+1
Write
Command
Bank A
DAx+2
DAx+3
DAx-1
DAx
DAx+1
Activate
Command
Bank B
The burst counter wraps
from the highest order
page address back to zero
during this time interval
DBx
DBx+1
DBx+2
DBx+3
DBx+4
DBx+5
Write
Command
Bank B
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
bursting beginning with the starting address
44
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 38. Byte Read and Write Operation (Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0, 1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
DQM m
DQM n
DQ M
Ax0
DQ N
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Ax2
Ax1
Ax2
Upper Byte
is masked
DAy1
Ax3
Lower Byte
is masked
DAy0
Day2
DAy1
Write
Command
Bank A
DAy3
Upper Byte
is masked
Az0
Read
Command
Bank A
Lower Byte
is masked
Az1
Az2
Az1
Az2
Az3
Lower Byte
is masked
Don’t Care
Note : M represent DQ in the byte m; N represent DQ in the byte n.
Rev.1.4
45
Mar. /2013
EtronTech
EM639325TS
Figure 39. Random Row Read (Interleaving Banks)
(Burst Length=4, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank B
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
Begin Auto
Precharge
Bank A
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBu
A0-A9,
A11
RBu
RAu
CBu
RAu
CAu
RBw
RAv
RBv
RBv
CBv
tRP
RAv
CAv
RBw
tRP
tRP
DQM
DQ
Bu0
Activate
Command
Bank B
Rev.1.4
Activate
Command
Read
Bank A
Bank B
with Auto
Precharge
Bu1
Bu2
Bu3
Read
Bank A
with Auto
Precharge
Au0
Au1
Au2
Activate
Command
Bank B
46
Au3
Bv0
Activate
Command
Bank A
Read
Bank B
with Auto
Precharge
Bv1
Bv2
Bv3
Read
Bank A
with Auto
Precharge
Av0
Av1
Av2
Av3
Activate
Command
Bank B
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 40. Full Page Random Column Read (Burst Length=Full Page, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
RBx
A0-A9,
A11
RAx
RBx
RBw
CAx
CBx
CBy
CAy
CAz
CBz
RBw
tRP
DQM
tRRD
DQ
tRCD
Hi-Z
Ax0
Activate
Command
Bank A
Rev.1.4
Ax1
Bx0
Activate
Read
Command
Command
Bank B
Bank B
Read
Read
Command
Command
Bank A
Bank A
Ay0
Ay1
Read
Command
Bank B
By0
By1
Read
Command
Bank A
Az0
Az1
Az2
Read
Command
Bank B
Bz0
Bz1
Bz2
Precharge
Activate
Command Bank B
Command
(Precharge Temination) Bank B
Don’t Care
47
Mar. /2013
EtronTech
EM639325TS
Figure 41. Full Page Random Column Write (Burst Length=Full Page)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
RBx
A0-A9,
A11
RAx
RBx
RBw
CAx
CBx
CBy
CAy
CAz
CBz
RBw
tWR
tRP
DQM
tRRD
DQ
tRCD
Hi-Z
DAx0 DAx1
Activate
Command
Bank A
Rev.1.4
Activate
Command
Bank B
Write
Command
Bank A
DBx0
DAy0
DAy1 DBy0 DBy1
Write
Command
Bank B
Write
Command
Bank A
Write
Command
Bank B
DAz0
DAz1
Write
Command
Bank A
DAz2
DBz0
DBz1
Write
Command
Bank B
DBz2
Precharge
Activate
Command Bank B
Command
(Precharge Temination) Bank B
Write Data
are masked
48
Don’t Care
Mar. /2013
EtronTech
EM639325TS
Figure 42. Precharge Termination of a Burst
(Burst Length=4, 8 or Full Page, CAS# Latency=3)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RAy
CAx
RAy
tWR
RAz
CAy
RAz
tRP
tRP
DQM
DQ
DAx0 DAx1
Activate
Command
Bank B
Rev.1.4
Precharge
Write
Command
Command
Bank A
Bank A
Precharge Termination
of a Write Burst
Write Data are masked
Ay0
Activate
Command
Bank A
Read
Command
Bank A
Ay1
Precharge
Command
Bank A
Ay2
Activate
Command
Bank A
Precharge Termination
of a Read Burst
Don’t Care
49
Mar. /2013
EtronTech
EM639325TS
Figure 43. 86 Pin TSOP II Package Outline Drawing Information
86
0.254
HE
E
44
θ°
L
L1
A1 A2
e
B
S
Symbol
A
A1
A2
B
C
D
E
e
HE
L
L1
S
y
θ
C
43
D
A
1
L
L1
y
Dimension in inch
Min
Normal
Max
0.047
－
－
0.002
0.004
0.008
0.035
0.039
0.043
0.007
0.009
0.011
0.005
－
－
0.87
0.875
0.88
0.395
0.400
0.405
0.0197
－
－
0.455
0.463
0.471
0.016
0.020
0.024
0.0315
－
－
0.024
－
－
0.004
－
－
－
0°
8°
Min
－
0.05
0.9
0.17
－
22.09
10.03
－
11.56
0.40
－
－
－
0°
Dimension in mm
Normal
－
0.10
1
0.22
0.127
22.22
10.16
0.50
11.76
0.50
0.80
0.61
－
－
Max
1.20
0.2
1.1
0.27
－
22.35
10.29
－
11.96
0.60
－
－
0.10
8°
Notes:
1. Dimension D&E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Dimension S includes end flash.
4. Controlling dimension: mm
Rev.1.4
50
Mar. /2013