Component Modifications Lead Attach to LCC’s • Thermocompression Weld Lead Attachment Process • High Temp Solder Lead Attachment Process -J-Form -Gullwing Form -Spider Gullwing Form • Replace & Reform Leads on Components Trim & Form Components • Trim, Form & Solder Dip ‘J’ Leaded, SOIC, SOJ Packages; Other Packages Not Limited to DIP, PSOP, TSOP, FP’s & QFP’s. Robotic Hot Solder Dip • Lead Tinning/Solder Dip • Terminal Finish Conversion • Solder Exchange From RoHS to SnPb BGA Modifications • BGA Reballing For Conversion to Tin-Lead (SnPb) • Ball Attach Tape & Reel High Performance Epoxy Preforms • Individual Preforms are Mounted to Ceramic, Glass or Metal Caps & Lids Test • X-Ray Fluorescence Analysis (XRF) • Solderability Testing • Particle Impact Noise Detection Test (PIND) AS9100 Certified www. m ic r o s s . c o m