PCN20081110

Product Change Notices
PCN No.:20081110
Date: 11/19/2008
This is to inform you that a molding compound change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact AME, Inc.
within 30 days of receiving of this notification.
If we do not receive any response from you within 30 calendar days from the
date of this notification, we will consider that you have accepted this PCN.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Bill Chou
Email: [email protected]
Effective Year/Work Week of Changed Product: 0901
Description of Change (From):
Molding compound with halogen ingredient for AME products.
Description of Change (To):
Molding compound without halogen ingredient for AME products,
It will be labelled as HF (Halogen Free).
Reason for Change: Comply with environmental policy.
Qual/REL Report:
Please see attached
SOT-89
Green compound series
SOT-223
Green compound series
SOT-2x
Green compound series
SOP-8
Green compound series
SC-70
Green compound series
TO-92
Green compound series
TO-220
Green compound series
TO-252
Green compound series
TO-263
Green compound series
QPM018A-C
REL - Green package- GP-A
Reliability Report
for
Green Compound Series Product
Approved by
Prepared by
Amy Shen
Quality & Reliability Dept.
Manager
Eric Chen
Quality & Reliability Dept.
Engineer
Conclusion:
The green compound series product has successfully met AME’s reliability standard that is required
on all AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all series
product will still meet AME’s reliability standard in the future.
Table of Contents:
Ⅰ、Package Reliability Test Result
Ⅱ、IR-reflow Test Result
Ⅰ、Package Reliability Test Result:
For SOT-89, SOT-223, SOT-2x, SOP-8, SC-70, TO-92, TO-220, TO-252, TO-263 Green compound series
Test Item
Test Condition
Sample Size(each) / Failures
Result
MSL
TCT -65℃~150℃ 5Cycle
22 pcs / 0 pcs
Level 3
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
125℃,24hrs
30/60 192 hours
IR-reflow 3 cycles
Peak Temp.= 260℃ (lead-free)
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 1
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
1000 hours
HAST
Precondition NOTE 1
Temp.=130℃, R.H.=85%
Duration=168 hours
Unbiased, Read at
168 hours
PCT
Precondition NOTE 1
Temp.=121℃, R.H.=100%
2atm, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 1
-65℃ ~ 150℃
200 cycles
Unbiased, Read at
200 cycles
NOTE 1: TCT -65℃~150℃ 5Cycle, 125℃,24hrs, 30/60 192 hours + IR-reflow 3 cycles with Peak Temp.=
260℃ (lead-free).
Ⅱ、IR-reflow Test Result:
For SOT-89, SOT-223, SOT-2x, SOP-8, SC-70, TO-92, TO-220, TO-252, TO-263 Green compound series
Test Item
Test Condition
Sample Size(each) / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
-
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3℃/second max.
3℃/second max.
100℃
150℃
60~120 seconds
150℃
200℃
60~180 seconds
183℃
60~150 seconds
217℃
60~150 seconds
245℃
260℃
10~30 seconds
20~40 seconds
6℃/second max.
6 minutes max.
6℃/second max.
8 minutes max.