RL7520WT(2W)

DOCUMENT : SR890000NH
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2W, 7520, Low Resistance Chip Resistor (Lead free / Halogen Free)
1. Scope
This specification applies to 7.5mm x 2.0mm size 2W, fixed metal film low resistance value chip
resistors rectangular type.
2. Type Designation
RL7520WT
– □□□□
(1)
(2)
Where
(1) Type and size
□
(3)
(2) Nominal Resistance value:
Four digits of number
Refer to paragraph 4-1
The“ R ”shall be used as a decimal point.
(3) Resistance tolerance:
Refer to paragraph 4-1
3. Construction and Physical Dimensions
L
a
a
W
Code
Letter
Dimensions (mm)
L
2.0 ± 0.2
W
7.5 ± 0.3
t
0.8 ± 0.2
a
0.40 ± 0.2
d
0.40 ± 0.2
7520
① Resistive element : Metal film
(Under protection film)
d
t
② Electrode : Solder Sn (on Cu)
③ Protection film : Epoxy resin
Figure 1. Construction and Dimensions
④ Substrate : Alumina
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4. Ratings
4-1 Nominal Resistance Value and Temperature Coefficient of Resistance
Power Rating*
2W
Resistance Value
0.001Ω ~ 0.005Ω
± 1%(F) , ± 2%(G) , ± 5%(J)
Resistance Tolerance
Temperature Coefficient of Resistance
±100ppm/℃
4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P×R
Where V:Rated voltage (V)
R:Nominal resistance value (Ω)
P:Rated dissipation (W)
4-3 Operating and Storage Temperature Range
-55 to +125℃
5. Marking
Resistance value mark on a top surface use four or three digits by JIS.
White bars are Cyntec internal use only.
Example
0.001Ω
0.002Ω
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6. Characteristics
Test Item
Condition of Test
Requirements
Short Time Overload
2.5 * Rated voltage for 5 seconds
Refer to JIS C 5201-1 4.13
∆R : ± (0.5%+0.0005Ω)
Without significant damage by
flashover ( spark, arching ), burning
or breakdown etc.
Insulation Resistance
The resistor shall be cramped in the
metal block and tested , as shown below.
Test voltage : 100 ± 15VDC for 1 minute
Refer to JIS C 5201-1 4.6 Mounting
condition G.
Between Electrode and Protection
Film 100MΩ or over
Between Electrode and Substrate
1,000MΩ or over
Voltage Proof
The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fire
or breakdown, as shown below.
Thermal Shock
-55 ~125℃ 5 cycles, 15 min at each
extreme condition
Refer to JIS C 5201-1 4.19
∆R : ± (0.5%+0.0005Ω)
Without distinct damage in
appearance
Low Temperature Storage
Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
High Temperature Exposure
Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Solderability
Temperature of Solder : 245 ± 5℃
Immersion Duration : 3 ± 0.5 second
Refer to JIS C 5201-1 4.17
Uniform coating of solder cover
minimum of 95% surface being
immersed
Resistance to Soldering Heat
Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18
∆R : ± (0.5%+0.0005Ω)
Without distinct deformation in
appearance
DOCUMENT : SR890000NH
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Test Item
Condition of Test
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Requirements
Load Life
Rated voltage for 1.5 hours followed by a
pause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Damp Heat with Load
40 ± 2℃ with relative humidity 90% to
95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Mechanical Shock
100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21
∆R : ± (0.5%+0.0005Ω)
Without mechanical damage such
as break
Bending Test
Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33
∆R : ±(0.5%+0.0005Ω)
Without mechanical damage such
as break
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7. Recommended Solder Pad Dimensions
D
7520
W
L
D
7.9
4.0
1.4
Unit : mm
W
Cu Trace
Note : We recommend there is no circuit design
between pads to avoid circuit short
Sensing Trace
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Mounting of the test sample onto the test board shall be either of following methods.
(1) Mounting by solder dipping
Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor
shall be mounted in such a way that the electrodes of resistors will be evenly placed in the
land area and then adhesive resin shall be cured. After applying the Resin Flux with 25
weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath
with 260 ± 5℃ for 3 to 5 seconds
(2) Mounting by reflow soldering
Solder paste with approximate 300μm thickness shall be applied to the land of test board.
The resistor shall be mounted in such way that the electrodes of resistors will be evenly
placed in the land area and then shall be soldered under the circumstance that the surface
temperature of the board shall be raised 240 ±5℃(peak) for 3 to 5 seconds in an
upper-heater oven.
Test Board
Material : Glass Fabric Epoxy Resin
Board thickness : 1.6mm
Copper foil thickness : 0.035mm
Solder Resist Coating
4 27
1.2
7.9
1.32
58.5
Solder Resist
Unit : mm
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8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
P0
P2
D0
E
T
F
B0
B
W
K
A
A0
P1
A
2.6 ± 0.2
D0
φ1.55 ± 0.05
A0
2.3 ± 0.1
K
1.4 ± 0.1
B
8.2 ± 0.2
T
0.3 ± 0.05
B0
8.0 ± 0.2
P0
4.0 ± 0.1
E
1.75 ± 0.1
P1
4.0 ± 0.1
F
7.5 ± 0.1
P2
2.0 ± 0.2
W
16.0 ± 0.3
Unit : mm
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8-1-2 Reel Dimensions
±0
.5
2.0 ± 0.2
2.5
20.5 ± 0.2
180.0 ± 1.0
62.0 ± 0.5
16.4 ± 1
13.0 ± 0.5
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8-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.7 N
Top Cover Tape
165 ~ 180°
0.1 ~ 0.7N
Carrier tape
8-3 Numbers of taping
2,000 pieces/reel
8-4 Making
The following items shall be marked on the reel.
(1)
(2)
(3)
(4)
(5)
Type designation.
Quantity
Manufacturing date code
Manufacturer’s name
The country of origin