CS2100-CP Fractional-N Clock Multiplier Features General Description Clock Multiplier / Jitter Reduction The CS2100-CP is an extremely versatile system clocking device that utilizes a programmable phase lock loop. The CS2100-CP is based on a hybrid analog-digital PLL architecture comprised of a unique combination of a Delta-Sigma Fractional-N Frequency Synthesizer and a Digital PLL. This architecture allows for generation of a low-jitter clock relative to an external noisy synchronization clock at frequencies as low as 50 Hz. The CS2100-CP supports both I²C and SPI for full software control. – Generates a Low Jitter 6 - 75 MHz Clock from a Jittery or Intermittent 50 Hz to 30 MHz Clock Source Highly Accurate PLL Multiplication Factor – Maximum Error Less Than 1 PPM in HighResolution Mode I²C / SPI™ Control Port Configurable Auxiliary Output Flexible Sourcing of Reference Clock – External Oscillator or Clock Source – Supports Inexpensive Local Crystal Minimal Board Space Required – No External Analog Loop-filter Components The CS2100-CP is available in a 10-pin MSOP package in Commercial (-10°C to +70°C) and AutomotiveD (-40°C to +85°C) and Automotive-E (-40°C to +105°C) grades. Customer development kits are also available for device evaluation. Please see “Ordering Information” on page 32 for complete details. 3.3 V I²C/SPI Software Control Timing Reference Frequency Reference PLL Output Lock Indicator I²C / SPI 8 MHz to 75 MHz Low-Jitter Timing Reference Fractional-N Frequency Synthesizer Auxiliary Output 6 to 75 MHz PLL Output N 50 Hz to 30 MHz Frequency Reference Digital PLL & Fractional N Logic Output to Input Clock Ratio Cirrus Logic Confidential http://www.cirrus.com Copyright Cirrus Logic, Inc. 2009–2015 (All Rights Reserved) OCT '15 DS840F3 CS2100-CP TABLE OF CONTENTS 1. PIN DESCRIPTION ................................................................................................................................. 5 2. TYPICAL CONNECTION DIAGRAM ..................................................................................................... 6 3. CHARACTERISTICS AND SPECIFICATIONS ...................................................................................... 7 RECOMMENDED OPERATING CONDITIONS .................................................................................... 7 ABSOLUTE MAXIMUM RATINGS ........................................................................................................ 7 DC ELECTRICAL CHARACTERISTICS ................................................................................................ 7 AC ELECTRICAL CHARACTERISTICS ................................................................................................ 8 PLL PERFORMANCE PLOTS ............................................................................................................... 9 CONTROL PORT SWITCHING CHARACTERISTICS- I²C FORMAT ................................................. 10 CONTROL PORT SWITCHING CHARACTERISTICS - SPI FORMAT ............................................... 11 4. ARCHITECTURE OVERVIEW ............................................................................................................. 12 4.1 Delta-Sigma Fractional-N Frequency Synthesizer ......................................................................... 12 4.2 Hybrid Analog-Digital Phase Locked Loop .................................................................................... 12 5. APPLICATIONS ................................................................................................................................... 14 5.1 Timing Reference Clock Input ........................................................................................................ 14 5.1.1 Internal Timing Reference Clock Divider ............................................................................... 14 5.1.2 Crystal Connections (XTI and XTO) ...................................................................................... 15 5.1.3 External Reference Clock (REF_CLK) .................................................................................. 15 5.2 Frequency Reference Clock Input, CLK_IN ................................................................................... 15 5.2.1 CLK_IN Skipping Mode ......................................................................................................... 15 5.2.2 Adjusting the Minimum Loop Bandwidth for CLK_IN ............................................................ 17 5.3 Output to Input Frequency Ratio Configuration ............................................................................. 18 5.3.1 User Defined Ratio (RUD) ..................................................................................................... 18 5.3.2 Ratio Modifier (R-Mod) .......................................................................................................... 19 5.3.3 Effective Ratio (REFF) .......................................................................................................... 20 5.3.4 Ratio Configuration Summary ............................................................................................... 20 5.4 PLL Clock Output ........................................................................................................................... 21 5.5 Auxiliary Output .............................................................................................................................. 21 5.6 Clock Output Stability Considerations ............................................................................................ 22 5.6.1 Output Switching ................................................................................................................... 22 5.6.2 PLL Unlock Conditions .......................................................................................................... 22 5.7 Required Power Up Sequencing .................................................................................................... 22 6. SPI / I²C CONTROL PORT ................................................................................................................... 22 6.1 SPI Control ..................................................................................................................................... 23 6.2 I²C Control ...................................................................................................................................... 23 6.3 Memory Address Pointer ............................................................................................................... 25 6.3.1 Map Auto Increment .............................................................................................................. 25 7. REGISTER QUICK REFERENCE ........................................................................................................ 25 8. REGISTER DESCRIPTIONS ................................................................................................................ 26 8.1 Device I.D. and Revision (Address 01h) ....................................................................................... 26 8.1.1 Device Identification (Device[4:0]) - Read Only ..................................................................... 26 8.1.2 Device Revision (Revision[2:0]) - Read Only ........................................................................ 26 8.2 Device Control (Address 02h) ........................................................................................................ 26 8.2.1 Unlock Indicator (Unlock) - Read Only .................................................................................. 26 8.2.2 Auxiliary Output Disable (AuxOutDis) ................................................................................... 26 8.2.3 PLL Clock Output Disable (ClkOutDis) .................................................................................. 27 8.3 Device Configuration 1 (Address 03h) ........................................................................................... 27 8.3.1 R-Mod Selection (RModSel[2:0]) ........................................................................................... 27 8.3.2 Auxiliary Output Source Selection (AuxOutSrc[1:0]) ............................................................. 27 8.3.3 Enable Device Configuration Registers 1 (EnDevCfg1) ........................................................ 28 8.4 Global Configuration (Address 05h) ............................................................................................... 28 8.4.1 Device Configuration Freeze (Freeze) ................................................................................ 28 2 DS840F3 CS2100-CP 8.4.2 Enable Device Configuration Registers 2 (EnDevCfg2) ....................................................... 28 8.5 Ratio (Address 06h - 09h) .............................................................................................................. 28 8.6 Function Configuration 1 (Address 16h) ........................................................................................ 29 8.6.1 Clock Skip Enable (ClkSkipEn) ............................................................................................. 29 8.6.2 AUX PLL Lock Output Configuration (AuxLockCfg) .............................................................. 29 8.6.3 Reference Clock Input Divider (RefClkDiv[1:0]) .................................................................... 29 8.7 Function Configuration 2 (Address 17h) ........................................................................................ 30 8.7.1 Enable PLL Clock Output on Unlock (ClkOutUnl) ................................................................. 30 8.7.2 Low-Frequency Ratio Configuration (LFRatioCfg) ................................................................ 30 8.8 Function Configuration 3 (Address 1Eh) ........................................................................................ 30 8.8.1 Clock Input Bandwidth (ClkIn_BW[2:0]) ................................................................................ 30 9. CALCULATING THE USER DEFINED RATIO .................................................................................... 31 9.1 High Resolution 12.20 Format ....................................................................................................... 31 9.2 High Multiplication 20.12 Format ................................................................................................... 31 10. PACKAGE DIMENSIONS .................................................................................................................. 32 THERMAL CHARACTERISTICS ......................................................................................................... 32 11. ORDERING INFORMATION .............................................................................................................. 33 12. REFERENCES .................................................................................................................................... 33 13. REVISION HISTORY .......................................................................................................................... 34 LIST OF FIGURES Figure 1. Typical Connection Diagram ........................................................................................................ 6 Figure 2. CLK_IN Sinusoidal Jitter Tolerance ............................................................................................. 9 Figure 3. CLK_IN Sinusoidal Jitter Transfer ................................................................................................ 9 Figure 4. CLK_IN Random Jitter Rejection and Tolerance ......................................................................... 9 Figure 5. Control Port Timing - I²C Format ................................................................................................ 10 Figure 6. Control Port Timing - SPI Format (Write Only) .......................................................................... 11 Figure 7. Delta-Sigma Fractional-N Frequency Synthesizer ..................................................................... 12 Figure 8. Hybrid Analog-Digital PLL .......................................................................................................... 13 Figure 9. Internal Timing Reference Clock Divider ................................................................................... 14 Figure 10. REF_CLK Frequency vs. a Fixed CLK_OUT ........................................................................... 14 Figure 11. External Component Requirements for Crystal Circuit ............................................................ 15 Figure 12. CLK_IN removed for > 223 SysClk cycles ................................................................................ 16 Figure 13. CLK_IN removed for < 223 SysClk cycles but > tCS .................................................................................. 16 Figure 14. CLK_IN removed for < tCS .................................................................................................................................. 17 Figure 15. Low bandwidth and new clock domain .................................................................................... 18 Figure 16. High bandwidth with CLK_IN domain re-use ........................................................................... 18 Figure 17. Ratio Feature Summary ........................................................................................................... 20 Figure 18. PLL Clock Output Options ....................................................................................................... 21 Figure 19. Auxiliary Output Selection ........................................................................................................ 21 Figure 20. Control Port Timing in SPI Mode ............................................................................................. 23 Figure 21. Control Port Timing, I²C Write .................................................................................................. 24 Figure 22. Control Port Timing, I²C Aborted Write + Read ....................................................................... 24 LIST OF TABLES Table 1. Ratio Modifier .............................................................................................................................. 19 Table 2. Example 12.20 R-Values ............................................................................................................ 31 Table 3. Example 20.12 R-Values ............................................................................................................ 31 DS840F3 3 CS2100-CP 1. PIN DESCRIPTION VD 1 10 SDA/CDIN GND 2 9 SCL/CCLK CLK_OUT 3 8 AD0/CS AUX_OUT 4 7 XTI/REF_CLK CLK_IN 5 6 XTO Pin Name # Pin Description VD 1 Digital Power (Input) - Positive power supply for the digital and analog sections. GND 2 Ground (Input) - Ground reference. CLK_OUT 3 PLL Clock Output (Output) - PLL clock output. 4 Auxiliary Output (Output) - This pin outputs a buffered version of one of the input or output clocks, or a status signal, depending on register configuration. 5 Frequency Reference Clock Input (Input) - Clock input for the Digital PLL frequency reference. 6 7 Crystal Connections (XTI/XTO) / Timing Reference Clock Input (REF_CLK) (Input/Output) XTI/XTO are I/O pins for an external crystal which may be used to generate the low-jitter PLL input clock. REF_CLK is an input for an externally generated low-jitter reference clock. 8 Address Bit 0 (I²C) / Control Port Chip Select (SPI) (Input) - AD0 is a chip address pin in I²C Mode. CS is the chip select signal in SPI Mode. 9 Control Port Clock (Input) - SCL/CCLK is the serial clock for the serial control port in I²C and SPI mode. AUX_OUT CLK_IN XTO XTI/REF_CLK AD0/CS SCL/CCLK SDA/CDIN 4 10 Serial Control Data (Input/Output) - SDA is the data I/O line in I²C Mode. CDIN is the input data line for the control port interface in SPI Mode. DS840F3 CS2100-CP 2. TYPICAL CONNECTION DIAGRAM Note1 Notes: 1. Resistors required for I2C operation. 0.1 µF 2 k 1 µF +3.3 V 2 k VD SCL/CCLK System MicroController SDA/CDIN AD0/CS CS2100-CP Frequency Reference CLK_IN 1 or 2 XTI/REF_CLK CLK_OUT To circuitry which requires a low-jitter clock AUX_OUT To other circuitry or Microcontroller XTO GND Low-Jitter Timing Reference 1 N.C. x REF_CLK XTO or Crystal 2 40 pF XTI XTO 40 pF Figure 1. Typical Connection Diagram DS840F3 5 CS2100-CP 3. CHARACTERISTICS AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS GND = 0 V; all voltages with respect to ground. (Note 1) Parameters DC Power Supply Symbol Min Typ Max Units VD 3.1 3.3 3.5 V TAC TAD TAE -10 -40 -40 - +70 +85 +105 °C °C °C Ambient Operating Temperature (Power Applied) Commercial Grade Automotive-D Grade Automotive-E Grade Notes: 1. Device functionality is not guaranteed or implied outside of these limits. Operation outside of these limits may adversely affect device reliability. ABSOLUTE MAXIMUM RATINGS GND = 0 V; all voltages with respect to ground. Parameters DC Power Supply Symbol Min Max Units VD -0.3 6.0 V Input Current IIN - ±10 mA Digital Input Voltage (Note 2) VIN -0.3 VD + 0.4 V Ambient Operating Temperature (Power Applied) TA -55 125 °C Storage Temperature Tstg -65 150 °C WARNING: Operation at or beyond these limits may result in permanent damage to the device. Notes: 2. The maximum over/under voltage is limited by the input current except on the power supply pin. DC ELECTRICAL CHARACTERISTICS Test Conditions (unless otherwise specified): VD = 3.1 V to 3.5 V; TA = -10°C to +70°C (Commercial Grade); TA = -40°C to +85°C (Automotive-D Grade); TA = -40°C to +105°C (Automotive-E Grade). Parameters Symbol Min Typ Max Units Power Supply Current - Unloaded (Note 3) ID - 12 18 mA Power Dissipation - Unloaded (Note 3) PD - 40 60 mW Input Leakage Current IIN - - ±10 µA Input Capacitance IC - 8 - pF High-Level Input Voltage VIH 70% - - VD Low-Level Input Voltage VIL - - 30% VD High-Level Output Voltage (IOH = -1.2 mA) VOH 80% - - VD Low-Level Output Voltage (IOH = 1.2 mA) VOL - - 20% VD Notes: 3. To calculate the additional current consumption due to loading (per output pin), multiply clock output frequency by load capacitance and power supply voltage. For example, fCLK_OUT (49.152 MHz) * CL (15 pF) * VD (3.3 V) = 2.4 mA of additional current due to these loading conditions on CLK_OUT. 6 DS840F3 CS2100-CP AC ELECTRICAL CHARACTERISTICS Test Conditions (unless otherwise specified): VD = 3.1 V to 3.5 V; TA = -10°C to +70°C (Commercial Grade); TA = -40°C to +85°C (Automotive-D Grade); TA = -40°C to +105°C (Automotive-E Grade); CL = 15 pF. Parameters Crystal Frequency Fundamental Mode XTAL Symbol Conditions Min Typ Max Units fXTAL RefClkDiv[1:0] = 10 RefClkDiv[1:0] = 01 RefClkDiv[1:0] = 00 RefClkDiv[1:0] = 10 RefClkDiv[1:0] = 01 RefClkDiv[1:0] = 00 8 16 32 - 18.75 37.5 50 MHz MHz MHz 8 16 32 - 18.75 37.5 75 MHz MHz MHz 45 - 55 % Reference Clock Input Frequency fREF_CLK Reference Clock Input Duty Cycle DREF_CLK Internal System Clock Frequency fSYS_CLK 8 18.75 MHz fCLK_IN 50 Hz - 30 MHz 2 10 - - UI ns Clock Input Frequency Clock Input Pulse Width (Note 4) Clock Skipping Timeout pwCLK_IN fCLK_IN < fSYS_CLK/96 fCLK_IN > fSYS_CLK/96 tCS (Notes 5, 6) 20 - - ms Clock Skipping Input Frequency fCLK_SKIP (Note 6) 50 Hz - 80 kHz PLL Clock Output Frequency fCLK_OUT (Note 7) 6 - 75 MHz PLL Clock Output Duty Cycle tOD Measured at VD/2 45 50 55 % Clock Output Rise Time tOR 20% to 80% of VD - 1.7 3.0 ns Clock Output Fall Time tOF 80% to 20% of VD - 1.7 3.0 ns Period Jitter tJIT Base Band Jitter (100 Hz to 40 kHz) Wide Band JItter (100 Hz Corner) (Note 8) - 70 - ps rms (Notes 8, 9) - 50 - ps rms (Notes 8, 10) - 175 - ps rms PLL Lock Time - CLK_IN (Note 11) tLC fCLK_IN < 200 kHz fCLK_IN > 200 kHz - 100 1 200 3 UI ms PLL Lock Time - REF_CLK tLR fREF_CLK = 8 to 75 MHz - 1 3 ms Output Frequency Synthesis Resolution (Note 12) ferr High Resolution High Multiplication 0 0 - ±0.5 ±112 ppm ppm Notes: 4. 1 UI (unit interval) corresponds to tSYS_CLK or 1/fSYS_CLK. 5. tCS represents the time from the removal of CLK_IN by which CLK_IN must be re-applied to ensure that PLL_OUT continues while the PLL re-acquires lock. This timeout is based on the internal VCO frequency, with the minimum timeout occurring at the maximum VCO frequency. Lower VCO frequencies will result in larger values of tCS. 6. Only valid in clock skipping mode; See “CLK_IN Skipping Mode” on page 14 for more information. 7. fCLK_OUT is ratio-limited when fCLK_IN is below 72 Hz. 8. fCLK_OUT = 24.576 MHz; Sample size = 10,000 points; AuxOutSrc[1:0] = 11. 9. In accordance with AES-12id-2006 section 3.4.2. Measurements are Time Interval Error taken with 3rd order 100 Hz to 40 kHz bandpass filter. 10. In accordance with AES-12id-2006 section 3.4.1. Measurements are Time Interval Error taken with 3rd order 100 Hz Highpass filter. 11. 1 UI (unit interval) corresponds to tCLK_IN or 1/fCLK_IN. 12. The frequency accuracy of the PLL clock output is directly proportional to the frequency accuracy of the reference clock. DS840F3 7 CS2100-CP PLL PERFORMANCE PLOTS Test Conditions (unless otherwise specified): VD = 3.3 V; TA = 25 °C; CL = 15 pF; fCLK_OUT = 12.288 MHz; fCLK_IN = 12.288 MHz; Sample size = 10,000 points; Base Band Jitter (100 Hz to 40 kHz); AuxOutSrc[1:0] = 11. 10,000 10 1 Hz Bandwidth 128 Hz Bandwidth 1 Hz Bandwidth 128 Hz Bandwidth 0 -10 Jitter Transfer (dB) Max Input Jitter Level (usec) 1,000 100 10 -20 -30 -40 1 -50 0.1 1 10 100 1,000 -60 10,000 1 10 Input Jitter Frequency (Hz) 100 1000 10000 Input Jitter Frequency (Hz) Figure 2. CLK_IN Sinusoidal Jitter Tolerance Figure 3. CLK_IN Sinusoidal Jitter Transfer Samples size = 2.5M points; Base Band Jitter (100Hz to 40kHz). Samples size = 2.5M points; Base Band Jitter (100Hz to 40kHz). 1000 1 Hz Bandwidth 128 Hz Bandwidth Output Jitter Level (nsec) 100 Unlock 10 1 Unlock 0.1 0.01 0.01 0.1 1 10 100 1000 Input Jitter Level (nsec) Figure 4. CLK_IN Random Jitter Rejection and Tolerance 8 DS840F3 CS2100-CP CONTROL PORT SWITCHING CHARACTERISTICS- I²C FORMAT Inputs: Logic 0 = GND; Logic 1 = VD; CL = 20 pF. Parameter Symbol Min Max Unit SCL Clock Frequency fscl - 100 kHz Bus Free-Time Between Transmissions tbuf 4.7 - µs Start Condition Hold Time (prior to first clock pulse) thdst 4.0 - µs Clock Low Time tlow 4.7 - µs Clock High Time thigh 4.0 - µs Setup Time for Repeated Start Condition tsust 4.7 - µs SDA Hold Time from SCL Falling (Note 13) thdd 0 - µs tsud 250 - ns Rise Time of SCL and SDA tr - 1 µs Fall Time SCL and SDA tf - 300 ns SDA Setup Time to SCL Rising Setup Time for Stop Condition tsusp 4.7 - µs Acknowledge Delay from SCL Falling tack 300 1000 ns Delay from Supply Voltage Stable to Control Port Ready tdpor 100 - µs Notes: 13. Data must be held for sufficient time to bridge the transition time, tf, of SCL. VD t dpor Repeated Start Stop SDA t buf t t high t hdst tf hdst t susp SCL Stop Start t low t hdd t sud t sust tr Figure 5. Control Port Timing - I²C Format DS840F3 9 CS2100-CP CONTROL PORT SWITCHING CHARACTERISTICS - SPI FORMAT Inputs: Logic 0 = GND; Logic 1 = VD; CL = 20 pF. Parameter Symbol Min Max Unit fccllk - 6 MHz tspi 500 - ns CS High Time Between Transmissions tcsh 1.0 - µs CS Falling to CCLK Edge tcss 20 - ns CCLK Low Time tscl 66 - ns CCLK High Time tsch 66 - ns CDIN to CCLK Rising Setup Time tdsu 40 - ns CCLK Clock Frequency CCLK Edge to CS Falling (Note 14) CCLK Rising to DATA Hold Time (Note 15) tdh 15 - ns Rise Time of CCLK and CDIN (Note 16) tr2 - 100 ns Fall Time of CCLK and CDIN (Note 16) tf2 - 100 ns tdpor 100 - µs Delay from Supply Voltage Stable to Control Port Ready Notes: 14. tspi is only needed before first falling edge of CS after power is applied. tspi = 0 at all other times. 15. Data must be held for sufficient time to bridge the transition time of CCLK. 16. For fcclk < 1 MHz. VD tdpor CS t spi t css t scl t sch t csh CCLK t r2 t f2 CDIN t dsu tdh Figure 6. Control Port Timing - SPI Format (Write Only) 10 DS840F3 CS2100-CP 4. ARCHITECTURE OVERVIEW 4.1 Delta-Sigma Fractional-N Frequency Synthesizer The core of the CS2100 is a Delta-Sigma Fractional-N Frequency Synthesizer which has very high-resolution for Input/Output clock ratios, low phase noise, very wide range of output frequencies and the ability to quickly tune to a new frequency. In very simplistic terms, the Fractional-N Frequency Synthesizer multiplies the Timing Reference Clock by the value of N to generate the PLL output clock. The desired output to input clock ratio is the value of N that is applied to the delta-sigma modulator (see Figure 7). The analog PLL based frequency synthesizer uses a low-jitter timing reference clock as a time and phase reference for the internal voltage controlled oscillator (VCO). The phase comparator compares the fractional-N divided clock with the original timing reference and generates a control signal. The control signal is filtered by the internal loop filter to generate the VCO’s control voltage which sets its output frequency. The delta-sigma modulator modulates the loop integer divide ratio to get the desired fractional ratio between the reference clock and the VCO output (thus the one’s density of the modulator sets the fractional value). This allows the design to be optimized for very fast lock times for a wide range of output frequencies without the need for external filter components. As with any Fractional-N Frequency Synthesizer the timing reference clock should be stable and jitter-free. Timing Reference Clock Phase Comparator Internal Loop Filter Voltage Controlled Oscillator PLL Output Fractional-N Divider Delta-Sigma Modulator N Figure 7. Delta-Sigma Fractional-N Frequency Synthesizer 4.2 Hybrid Analog-Digital Phase Locked Loop The addition of the Digital PLL and Fractional-N Logic (shown in Figure 8) to the Fractional-N Frequency Synthesizer creates the Hybrid Analog-Digital Phase Locked Loop with many advantages over classical analog PLL techniques. These advantages include the ability to operate over extremely wide frequency ranges without the need to change external loop filter components while maintaining impressive jitter reduction performance. In the Hybrid architecture, the Digital PLL calculates the ratio of the PLL output clock to the frequency reference and compares that to the desired ratio. The digital logic generates a value of N which is then applied to the Fractional-N frequency synthesizer to generate the desired PLL output frequency. Notice that the frequency and phase of the timing reference signal do not affect the output of the PLL since the digital control loop will correct for the PLL output. A major advantage of the Digital PLL is the ease with which the loop filter bandwidth can be altered. The PLL bandwidth is automatically set to a wide-bandwidth mode to quickly achieve lock and then reduced for optimal jitter rejection. DS840F3 11 CS2100-CP Delta-Sigma Fractional-N Frequency Synthesizer Timing Reference Clock Phase Comparator Internal Loop Filter Voltage Controlled Oscillator PLL Output Fractional-N Divider Delta-Sigma Modulator Digital PLL and Fractional-N Logic N Digital Filter Frequency Reference Clock Frequency Comparator for Frac-N Generation Output to Input Ratio for Hybrid mode Figure 8. Hybrid Analog-Digital PLL 12 DS840F3 CS2100-CP 5. APPLICATIONS 5.1 Timing Reference Clock Input The low jitter timing reference clock (RefClk) can be provided by either an external reference clock or an external crystal in conjunction with the internal oscillator. In order to maintain a stable and low-jitter PLL output the timing reference clock must also be stable and low-jitter; the quality of the timing reference clock directly affects the performance of the PLL and hence the quality of the PLL output. 5.1.1 Internal Timing Reference Clock Divider The Internal Timing Reference Clock (SysClk) has a smaller maximum frequency than what is allowed on the XTI/REF_CLK pin. The CS2100 supports the wider external frequency range by offering an internal divider for RefClk. The RefClkDiv[1:0] bits should be set such that SysClk, the divided RefClk, then falls within the valid range as indicated in “AC Electrical Characteristics” on page 7. XTI/REF_CLK Timing Reference Clock 8 MHz < RefClk < 50 MHz (XTI) 75 MHz (REF_CLK) Timing Reference Clock Divider 1 2 4 Internal Timing Reference Clock Fractional-N Frequency Synthesizer 8 MHz < SysClk < 18.75 MHz PLL Output N RefClkDiv[1:0] Figure 9. Internal Timing Reference Clock Divider It should be noted that the maximum allowable input frequency of the XTI/REF_CLK pin is dependent upon its configuration as either a crystal connection or external clock input. See the “AC Electrical Characteristics” on page 7 for more details. For the lowest possible output jitter, attention should be paid to the absolute frequency of the Timing Reference Clock relative to the PLL Output frequency (CLK_OUT). To minimize output jitter, the Timing Reference Clock frequency should be chosen such that fRefClk is at least +/-15 kHz from fCLK_OUT*N/32 where N is an integer. Figure 10 shows the effect of varying the RefClk frequency around fCLK_OUT*N/32. It should be noted that there will be a jitter null at the zero point when N = 32 (not shown in Figure 10). An example of how to determine the range of RefClk frequencies around 12 MHz to be used in order to achieve the lowest jitter PLL output at a frequency of 12.288 MHz is as follows: f L f RefClk f H where: CLK__OUT Jitter 180 = 12.288MHz 0.96875 + 15kHz = 11.919MHz and f H = f CLK_OUT 32 ------ – 15kHz 32 = 12.288MHz 1 + 15kHz Typical Base Band Jitter (psec) f CLK__OUT f L = f CLK_OUT 31 ------ + 15kHz 32 160 140 120 100 -15 kHz 80 +15 kHz 60 40 20 -80 = 12.273MHz *32/N -60 -40 -20 0 20 40 60 80 Normalized REF__CLK Frequency (kHz) Figure 10. REF_CLK Frequency vs. a Fixed CLK_OUT Referenced Control Register Location RefClkDiv[1:0] .......................“Reference Clock Input Divider (RefClkDiv[1:0])” on page 28 DS840F3 13 CS2100-CP 5.1.2 Crystal Connections (XTI and XTO) An external crystal may be used to generate RefClk. To accomplish this, a 20 pF fundamental mode parallel resonant crystal must be connected between the XTI and XTO pins as shown in Figure 11. As shown, nothing other than the crystal and its load capacitors should be connected to XTI and XTO. Please refer to the “AC Electrical Characteristics” on page 7 for the allowed crystal frequency range. XTI 40 pF XTO 40 pF Figure 11. External Component Requirements for Crystal Circuit 5.1.3 External Reference Clock (REF_CLK) For operation with an externally generated REF_CLK signal, XTI/REF_CLK should be connected to the reference clock source and XTO should be left unconnected or pulled low through a 47 k resistor to GND. 5.2 Frequency Reference Clock Input, CLK_IN The frequency reference clock input (CLK_IN) is used by the Digital PLL and Fractional-N Logic block to dynamically generate a fractional-N value for the Frequency Synthesizer (see “Hybrid Analog-Digital PLL” on page 12). The Digital PLL first compares the CLK_IN frequency to the PLL output. The Fractional-N logic block then translates the desired ratio based off of CLK_IN to one based off of the internal timing reference clock (SysClk). This allows the low-jitter timing reference clock to be used as the clock which the Frequency Synthesizer multiplies while maintaining synchronicity with the frequency reference clock through the Digital PLL. The allowable frequency range for CLK_IN is found in the “AC Electrical Characteristics” on page 7. 5.2.1 CLK_IN Skipping Mode CLK_IN skipping mode allows the PLL to maintain lock even when the CLK_IN signal has missing pulses for up to 20 ms (tCS) at a time (see “AC Electrical Characteristics” on page 7 for specifications). CLK_IN skipping mode can only be used when the CLK_IN frequency is below 80 kHz and CLK_IN is reapplied within 20 ms of being removed. The ClkSkipEn bit enables this function. Regardless of the setting of the ClkSkipEn bit the PLL output will continue for 223 SysClk cycles (466 ms to 1048 ms) after CLK_IN is removed (see Figure 12). This is true as long as CLK_IN does not glitch or have an effective change in period as the clock source is removed, otherwise the PLL will interpret this as a change in frequency causing clock skipping and the 223 SysClk cycle time-out to be bypassed and the PLL to immediately unlock. If the prior conditions are met while CLK_IN is removed and 223 SysClk cycles pass, the PLL will unlock and the PLL_OUT state will be determined by the ClkOutUnl bit; See “PLL Clock Output” on page 20. If CLK_IN is re-applied after such time, the PLL will remain unlocked for the specified time listed in the “AC Electrical Characteristics” on page 7 after which lock will be acquired and the PLL 14 DS840F3 CS2100-CP output will resume. 223 SysClk cycles 223 SysClk cycles Lock Time Lock Time CLK_IN ClkSkipEn=0 or 1 ClkOutUnl=0 CLK_IN ClkSkipEn=0 or 1 ClkOutUnl=1 PLL_OUT UNLOCK PLL_OUT UNLOCK = invalid clocks Figure 12. CLK_IN removed for > 223 SysClk cycles If it is expected that CLK_IN will be removed and then reapplied within 223 SysClk cycles but later than tCS, the ClkSkipEn bit should be disabled. If it is not disabled, the device will behave as shown in Figure 13; note that the lower figure shows that the PLL output frequency may change and be incorrect without an indication of an unlock condition. 223 SysClk cycles tCS 223 SysClk cycles tCS Lock Time Lock Time CLK_IN ClkSkipEn=0 or 1 ClkOutUnl=0 CLK_IN ClkSkipEn=0 or 1 ClkOutUnl=1 PLL_OUT UNLOCK PLL_OUT UNLOCK = invalid clocks tCS 223 SysClk cycles Lock Time CLK_IN ClkSkipEn= 1 ClkOutUnl= 0 or 1 PLL_OUT UNLOCK = invalid clocks Figure 13. CLK_IN removed for < 223 SysClk cycles but > tCS DS840F3 15 CS2100-CP If CLK_IN is removed and then re-applied within tCS, the ClkSkipEn bit determines whether PLL_OUT continues while the PLL re-acquires lock (see Figure 14). When ClkSkipEn is disabled and CLK_IN is removed the PLL output will continue until CLK_IN is re-applied at which point the PLL will go unlocked only for the time it takes to acquire lock; the PLL_OUT state will be determined by the ClkOutUnl bit during this time. When ClkSkipEn is enabled and CLK_IN is removed the PLL output clock will remain continuous throughout the missing CLK_IN period including the time while the PLL re-acquires lock. tCS tCS Lock Time CLK_IN ClkSkipEn=1 ClkOutUnl=0 or 1 CLK_IN ClkSkipEn=0 ClkOutUnl=1 PLL_OUT UNLOCK PLL_OUT UNLOCK = invalid clocks Lock Time tCS CLK_IN ClkSkipEn=0 ClkOutUnl=0 PLL_OUT UNLOCK Figure 14. CLK_IN removed for < tCS Referenced Control Register Location ClkSkipEn..............................“Clock Skip Enable (ClkSkipEn)” on page 28 ClkOutUnl..............................“Enable PLL Clock Output on Unlock (ClkOutUnl)” on page 29 5.2.2 Adjusting the Minimum Loop Bandwidth for CLK_IN The CS2100 allows the minimum loop bandwidth of the Digital PLL to be adjusted between 1 Hz and 128 Hz using the ClkIn_BW[2:0] bits. The minimum loop bandwidth of the Digital PLL directly affects the jitter transfer function; specifically, jitter frequencies below the loop bandwidth corner are passed from the PLL input directly to the PLL output without attenuation. In some applications it is desirable to have a very low minimum loop bandwidth to reject very low jitter frequencies, commonly referred to as wander. In others it may be preferable to remove only higher frequency jitter, allowing the input wander to pass through the PLL without attenuation. Typically, applications in which the PLL_OUT signal creates a new clock domain from which all other system clocks and associated data are derived will benefit from the maximum jitter and wander rejection of 16 DS840F3 CS2100-CP the lowest PLL bandwidth setting. See Figure 15. PLL BW = 1 Hz CLK_IN Wander > 1 Hz PLL_OUT MCLK Jitter MCLK Wander and Jitter > 1 Hz Rejected Subclocks generated from new clock domain. or LRCK LRCK SCLK SCLK D0 SDATA D1 SDATA D0 D1 Figure 15. Low bandwidth and new clock domain Systems in which some clocks and data are derived from the PLL_OUT signal while other clocks and data are derived from the CLK_IN signal will often require phase alignment of all the clocks and data in the system. See Figure 16. If there is substantial wander on the CLK_IN signal in these applications, it may be necessary to increase the minimum loop bandwidth allowing this wander to pass through to the CLK_OUT signal in order to maintain phase alignment. For these applications, it is advised to experiment with the loop bandwidth settings and choose the lowest bandwidth setting that does not produce system timing errors due to wandering between the clocks and data synchronous to the CLK_IN domain and those synchronous to the PLL_OUT domain. PLL BW = 128 Hz CLK_IN Wander < 128 Hz PLL_OUT Jitter MCLK or Jitter > 128 Hz Rejected Wander < 128 Hz Passed to Output MCLK Subclocks and data re-used from previous clock domain. LRCK LRCK SCLK SCLK SDATA D0 D1 SDATA D0 D1 Figure 16. High bandwidth with CLK_IN domain re-use It should be noted that manual adjustment of the minimum loop bandwidth is not necessary to acquire lock; this adjustment is made automatically by the Digital PLL. While acquiring lock, the digital loop bandwidth is automatically set to a large value. Once lock is achieved, the digital loop bandwidth will settle to the minimum value selected by the ClkIn_BW[2:0] bits. Referenced Control Register Location ClkIn_BW[2:0] .......................“Clock Input Bandwidth (ClkIn_BW[2:0])” on page 29 5.3 Output to Input Frequency Ratio Configuration 5.3.1 User Defined Ratio (RUD) The User Defined Ratio, RUD, is a 32-bit un-signed fixed-point number, stored in the Ratio register set, which determines the basis for the desired input to output clock ratio. The 32-bit RUD can be expressed DS840F3 17 CS2100-CP in either a high resolution (12.20) or high multiplication (20.12) format selectable by the LFRatioCfg bit, with 20.12 being the default. The RUD for high resolution (12.20) format is encoded with 12 MSBs representing the integer binary portion with the remaining 20 LSBs representing the fractional binary portion. The maximum multiplication factor is approximately 4096 with a resolution of 0.954 PPM in this configuration. See “Calculating the User Defined Ratio” on page 30 for more information. The RUD for high multiplication (20.12) format is encoded with 20 MSBs representing the integer binary portion with the remaining 12 LSBs representing the fractional binary portion. In this configuration, the maximum multiplication factor is approximately 1,048,575 with a resolution of 244 PPM. It is recommended that the 12.20 High-Resolution format be utilized whenever the desired ratio is less than 4096 since the output frequency accuracy of the PLL is directly proportional to the accuracy of the timing reference clock and the resolution of the RUD. The status of internal dividers, such as the internal timing reference clock divider, are automatically taken into account. Therefore RUD is simply the desired ratio of the output to input clock frequencies. Referenced Control Register Location Ratio......................................“Ratio (Address 06h - 09h)” on page 27 LFRatioCfg ............................“Low-Frequency Ratio Configuration (LFRatioCfg)” on page 29 5.3.2 Ratio Modifier (R-Mod) The Ratio Modifier is used to internally multiply/divide the RUD (the Ratio stored in the register space remains unchanged). The available options for RMOD are summarized in Table 1 on page 18. The R-Mod value selected by RModSel[2:0] is always used in the calculation for the Effective Ratio (REFF), see “Effective Ratio (REFF)” on page 19. If R-Mod is not desired, RModSel[2:0] should be left at its default value of ‘000’, which corresponds to an R-Mod value of 1, thereby effectively disabling the ratio modifier. RModSel[2:0] Ratio Modifier 000 1 001 2 010 4 011 8 100 0.5 101 0.25 110 0.125 111 0.0625 Table 1. Ratio Modifier Referenced Control Register Location Ratio......................................“Ratio (Address 06h - 09h)” on page 27 RModSel[2:0] ........................“R-Mod Selection (RModSel[2:0])” section on page 26 18 DS840F3 CS2100-CP 5.3.3 Effective Ratio (REFF) The Effective Ratio (REFF) is an internal calculation comprised of RUD and the appropriate modifiers, as previously described. REFF is calculated as follows: REFF = RUD RMOD To simplify operation the device handles some of the ratio calculation functions automatically (such as when the internal timing reference clock divider is set). For this reason, the Effective Ratio does not need to be altered to account for internal dividers. Ratio modifiers which would produce an overflow or truncation of REFF should not be used; For example if RUD is 1024 an RMOD of 8 would produce an REFF value of 8192 which exceeds the 4096 limit of the 12.20 format. In all cases, the maximum and minimum allowable values for REFF are dictated by the frequency limits for both the input and output clocks as shown in the “AC Electrical Characteristics” on page 7. 5.3.4 Ratio Configuration Summary The RUD is the user defined ratio stored in the register space. The resolution for the RUD is selectable by setting LFRatioCfg. R-Mod is applied if selected. The user defined ratio, and ratio modifier make up the effective ratio REFF, the final calculation used to determine the output to input clock ratio. The effective ratio is then corrected for the internal dividers. The conceptual diagram in Figure 17 summarizes the features involved in the calculation of the ratio values used to generate the fractional-N value which controls the Frequency Synthesizer. RefClkDiv[1:0] Timing Reference Clock (XTI/REF_CLK) Divide SysClk Frequency Synthesizer PLL Output Effective Ratio REFF User Defined Ratio RUD Ratio Ratio Format 12.20 20.12 RModSel[2:0] RefClkDiv[1:0] Ratio Modifier R Correction LFRatioCfg N Digital PLL & Fractional N Logic Frequency Reference Clock (CLK_IN) Figure 17. Ratio Feature Summary Referenced Control Register Location Ratio......................................“Ratio (Address 06h - 09h)” on page 27 LFRatioCfg ............................“Low-Frequency Ratio Configuration (LFRatioCfg)” on page 29 RModSel[2:0] ........................“R-Mod Selection (RModSel[2:0])” section on page 26 RefClkDiv[1:0] .......................“Reference Clock Input Divider (RefClkDiv[1:0])” on page 28 DS840F3 19 CS2100-CP 5.4 PLL Clock Output The PLL clock output pin (CLK_OUT) provides a buffered version of the output of the frequency synthesizer. The driver can be set to high-impedance with the ClkOutDis bit. The output from the PLL automatically drives a static low condition while the PLL is un-locked (when the clock may be unreliable). This feature can be disabled by setting the ClkOutUnl bit, however the state CLK_OUT may then be unreliable during an unlock condition. ClkOutUnl PLL Locked/Unlocked 0 0 2:1 Mux ClkOutDis 0 1 2:1 Mux PLL Clock Output PLL Clock Output Pin (CLK_OUT) PLLClkOut 1 PLL Output Figure 18. PLL Clock Output Options Referenced Control Register Location ClkOutUnl..............................“Enable PLL Clock Output on Unlock (ClkOutUnl)” on page 29 ClkOutDis ..............................“PLL Clock Output Disable (ClkOutDis)” on page 26 5.5 Auxiliary Output The auxiliary output pin (AUX_OUT) can be mapped, as shown in Figure 19, to one of four signals: reference clock (RefClk), input clock (CLK_IN), additional PLL clock output (CLK_OUT), or a PLL lock indicator (Lock). The mux is controlled via the AuxOutSrc[1:0] bits. If AUX_OUT is set to Lock, the AuxLockCfg bit is then used to control the output driver type and polarity of the LOCK signal (see section 8.6.2 on page 28). In order to indicate an unlock condition, REF_CLK must be present. If AUX_OUT is set to CLK_OUT the phase of the PLL Clock Output signal on AUX_OUT may differ from the CLK_OUT pin. The driver for the pin can be set to high-impedance using the AuxOutDis bit. AuxOutSrc[1:0] Timing Reference Clock (RefClk) AuxOutDis Frequency Reference Clock (CLK_IN) Auxiliary Output Pin (AUX_OUT) 4:1 Mux PLL Clock Output (PLLClkOut) AuxLockCfg PLL Lock/Unlock Indication (Lock) Figure 19. Auxiliary Output Selection Referenced Control Register Location AuxOutSrc[1:0]......................“Auxiliary Output Source Selection (AuxOutSrc[1:0])” on page 26 AuxOutDis .............................“Auxiliary Output Disable (AuxOutDis)” on page 25 AuxLockCfg...........................“AUX PLL Lock Output Configuration (AuxLockCfg)” section on page 28 20 DS840F3 CS2100-CP 5.6 Clock Output Stability Considerations 5.6.1 Output Switching CS2100 is designed such that re-configuration of the clock routing functions do not result in a partial clock period on any of the active outputs (CLK_OUT and/or AUX_OUT). In particular, enabling or disabling an output, changing the auxiliary output source between REF_CLK and CLK_OUT, and the automatic disabling of the output(s) during unlock will not cause a runt or partial clock period. The following exceptions/limitations exist: • Enabling/disabling AUX_OUT when AuxOutSrc[1:0] = 11 (unlock indicator). • Switching AuxOutSrc[1:0] to or from 01 (PLL clock input) and to or from 11 (unlock indicator) (Transitions between AuxOutSrc[1:0] = [00,10] will not produce a glitch). • Changing the ClkOutUnl bit while the PLL is in operation. When any of these exceptions occur, a partial clock period on the output may result. 5.6.2 PLL Unlock Conditions Certain changes to the clock inputs and registers can cause the PLL to lose lock which will affect the presence the clock signal on CLK_OUT. The following outlines which conditions cause the PLL to go unlocked: 5.7 • Changes made to the registers which affect the Fraction-N value that is used by the Frequency Synthesizer. This includes all the bits shown in Figure 17 on page 19. • Any discontinuities on the Timing Reference Clock, REF_CLK. • Discontinuities on the Frequency Reference Clock, CLK_IN, except when the Clock Skipping feature is enabled and the requirements of Clock Skipping are satisfied (see “CLK_IN Skipping Mode” on page 14). • Gradual changes in CLK_IN frequency greater than ±30% from the starting frequency. • Step changes in CLK_IN frequency. Required Power Up Sequencing • Apply power to the device. The output pins will remain low until the device is configured with a valid ratio via the control port. • Write the desired operational configurations. The EnDevCfg1 and EnDevCfg2 bits must be set to 1 during the initialization register writes; the order does not matter. – The Freeze bit may be set prior to this step and cleared afterward to ensure all settings take effect at the same time. 6. SPI / I²C CONTROL PORT The control port is used to access the registers and allows the device to be configured for the desired operational modes and formats. The operation of the control port may be completely asynchronous with respect to device inputs and outputs. However, to avoid potential interference problems, the control port pins should remain static if no operation is required. DS840F3 21 CS2100-CP The control port operates with either the SPI or I²C interface, with the CS2100 acting as a slave device. SPI Mode is selected if there is a high-to-low transition on the AD0/CS pin after power-up. I²C Mode is selected by connecting the AD0/CS pin through a resistor to VD or GND, thereby permanently selecting the desired AD0 bit address state. In both modes the EnDevCfg1 and EnDevCfg2 bits must be set to 1 for normal operation. WARNING: All “Reserved” registers must maintain their default state to ensure proper functional operation. Referenced Control Register Location EnDevCfg1 ............................“Enable Device Configuration Registers 1 (EnDevCfg1)” on page 27 EnDevCfg2 ............................“Enable Device Configuration Registers 2 (EnDevCfg2)” section on page 27 6.1 SPI Control In SPI Mode, CS is the chip select signal; CCLK is the control port bit clock (sourced from a microcontroller), and CDIN is the input data line from the microcontroller. Data is clocked in on the rising edge of CCLK. The device only supports write operations. Figure 20 shows the operation of the control port in SPI Mode. To write to a register, bring CS low. The first eight bits on CDIN form the chip address and must be 10011110. The next eight bits form the Memory Address Pointer (MAP), which is set to the address of the register that is to be updated. The next eight bits are the data which will be placed into the register designated by the MAP. There is MAP auto increment capability, enabled by the INCR bit in the MAP register. If INCR is a zero, the MAP will stay constant for successive read or writes. If INCR is set to a 1, the MAP will automatically increment after each byte is read or written, allowing block writes of successive registers. CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CCLK CHIP ADDRESS CDIN 1 0 0 1 1 1 MAP BYTE 1 0 INCR 6 5 4 3 2 DATA +n DATA 1 0 7 6 1 0 7 6 1 0 Figure 20. Control Port Timing in SPI Mode 6.2 I²C Control In I²C Mode, SDA is a bidirectional data line. Data is clocked into and out of the device by the clock, SCL. There is no CS pin. The AD0 pin forms the least-significant bit of the chip address and should be connected to VD or GND as appropriate. The state of the AD0 pin should be maintained throughout operation of the device. The signal timings for a read and write cycle are shown in Figure 21 and Figure 22. A Start condition is defined as a falling transition of SDA while the clock is high. A Stop condition is a rising transition while the clock is high. All other transitions of SDA occur while the clock is low. The first byte sent to the CS2100 after a Start condition consists of the 7-bit chip address field and a R/W bit (high for a read, low for a write). The upper 6 bits of the 7-bit address field are fixed at 100111 followed by the logic state of the AD0 pin. The eighth bit of the address is the R/W bit. If the operation is a write, the next byte is the Memory Address Pointer (MAP) which selects the register to be read or written. If the operation is a read, the contents of the register pointed to by the MAP will be output. Setting the auto increment bit in MAP allows successive reads or writes of consecutive registers. Each byte is separated by an acknowledge bit. The ACK bit is output from the CS2100 after each input byte is read and is input from the microcontroller after each transmitted byte. 22 DS840F3 CS2100-CP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 24 25 26 27 28 SCL CHIP ADDRESS (WRITE) 1 SDA 0 0 1 1 1 AD0 MAP BYTE 0 INCR 6 5 4 3 2 1 0 ACK 7 6 DATA +n DATA +1 DATA 1 0 ACK 7 6 1 0 7 6 1 0 ACK ACK STOP START Figure 21. Control Port Timing, I²C Write 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 SCL CHIP ADDRESS (WRITE) SDA 1 0 0 1 STOP MAP BYTE 1 1 AD0 0 INCR 6 5 4 3 2 1 ACK START CHIP ADDRESS (READ) 1 0 0 ACK 0 1 1 DATA 1 AD0 1 7 ACK START DATA +1 0 7 ACK 0 DATA + n 7 0 NO ACK STOP Figure 22. Control Port Timing, I²C Aborted Write + Read Since the read operation cannot set the MAP, an aborted write operation is used as a preamble. As shown in Figure 21, the write operation is aborted after the acknowledge for the MAP byte by sending a stop condition. The following pseudocode illustrates an aborted write operation followed by a read operation. Send start condition. Send 100111x0 (chip address & write operation). Receive acknowledge bit. Send MAP byte, auto increment off. Receive acknowledge bit. Send stop condition, aborting write. Send start condition. Send 100111x1(chip address & read operation). Receive acknowledge bit. Receive byte, contents of selected register. Send acknowledge bit. Send stop condition. Setting the auto increment bit in the MAP allows successive reads or writes of consecutive registers. Each byte is separated by an acknowledge bit. DS840F3 23 CS2100-CP 6.3 Memory Address Pointer The Memory Address Pointer (MAP) byte comes after the address byte and selects the register to be read or written. Refer to the pseudocode above for implementation details. 6.3.1 Map Auto Increment The device has MAP auto increment capability enabled by the INCR bit (the MSB) of the MAP. If INCR is set to 0, MAP will stay constant for successive I²C writes or reads and SPI writes. If INCR is set to 1, MAP will auto increment after each byte is read or written, allowing block reads or writes of successive registers. 7. REGISTER QUICK REFERENCE This table shows the register and bit names with their associated default values. EnDevCfg1 and EnDevCfg2 bits must be set to 1 for normal operation. WARNING: All “Reserved” registers must maintain their default state to ensure proper functional operation. Adr Name 01h Device ID p 25 02h Device Ctrl p 25 03h Device Cfg 1 p 26 05h Global Cfg p 27 06h - 32-Bit Ratio 09h 16h Funct Cfg 1 p 28 17h Funct Cfg 2 p 29 1Eh Funct Cfg 3 p 29 24 7 6 5 4 3 2 1 Device4 Device3 Device2 Device1 Device0 Revision2 Revision1 0 0 0 0 0 x x Unlock Reserved Reserved Reserved Reserved Reserved AuxOutDis x x x 0 0 0 0 RModSel2 RModSel1 RModSel0 Reserved Reserved AuxOutSrc1 AuxOutSrc0 0 0 0 0 0 0 0 Reserved Reserved Reserved Reserved Freeze Reserved Reserved 0 0 0 0 0 0 0 MSB ........................................................................................................................... MSB-8 ........................................................................................................................... LSB+15 ........................................................................................................................... LSB+7 ........................................................................................................................... ClkSkipEn AuxLockCfg Reserved RefClkDiv1 RefClkDiv0 Reserved Reserved 0 0 0 0 0 0 0 Reserved Reserved Reserved ClkOutUnl LFRatioCfg Reserved Reserved 0 0 0 0 0 0 0 Reserved ClkIn_BW2 ClkIn_BW1 ClkIn_BW0 Reserved Reserved Reserved 0 0 0 0 0 0 0 0 Revision0 x ClkOutDis 0 EnDevCfg1 0 EnDevCfg2 0 MSB-7 MSB-15 LSB+8 LSB Reserved 0 Reserved 0 Reserved 0 DS840F3 CS2100-CP 8. REGISTER DESCRIPTIONS In I²C Mode all registers are read/write unless otherwise stated. In SPI mode all registers are write only. All “Reserved” registers must maintain their default state to ensure proper functional operation. The default state of each bit after a power-up sequence or reset is indicated by the shaded row in the bit decode table and in the “Register Quick Reference” on page 24. Control port mode is entered when the device recognizes a valid chip address input on its I²C/SPI serial control pins and the EnDevCfg1 and EnDevCfg2 bits are set to 1. 8.1 Device I.D. and Revision (Address 01h) 7 Device4 8.1.1 6 Device3 5 Device2 4 Device1 3 Device0 2 Revision2 1 Revision1 0 Revision0 2 Reserved 1 AuxOutDis 0 ClkOutDis Device Identification (Device[4:0]) - Read Only I.D. code for the CS2100. 8.1.2 Device[4:0] Device 00000 CS2100. Device Revision (Revision[2:0]) - Read Only CS2100 revision level. REVID[2:0] 8.2 Revision Level 100 B2 and B3 110 C1 Device Control (Address 02h) 7 Unlock 8.2.1 6 Reserved 5 Reserved 4 Reserved 3 Reserved Unlock Indicator (Unlock) - Read Only Indicates the lock state of the PLL. Note: Unlock PLL Lock State 0 PLL is Locked. 1 PLL is Unlocked. Bit 7 is sticky until read. 8.2.2 Auxiliary Output Disable (AuxOutDis) This bit controls the output driver for the AUX_OUT pin. AuxOutDis DS840F3 Output Driver State 0 AUX_OUT output driver enabled. 1 AUX_OUT output driver set to high-impedance. Application: “Auxiliary Output” on page 20 25 CS2100-CP 8.2.3 PLL Clock Output Disable (ClkOutDis) This bit controls the output driver for the CLK_OUT pin. 8.3 ClkOutDis Output Driver State 0 CLK_OUT output driver enabled. 1 CLK_OUT output driver set to high-impedance. Application: “PLL Clock Output” on page 20 Device Configuration 1 (Address 03h) 7 RModSel2 8.3.1 6 RModSel1 5 RModSel0 4 Reserved 3 Reserved 2 AuxOutSrc1 1 AuxOutSrc0 0 EnDevCfg1 R-Mod Selection (RModSel[2:0]) Selects the R-Mod value, which is used as a factor in determining the PLL’s Fractional N. 8.3.2 RModSel[2:0] R-Mod Selection 000 Left-shift R-value by 0 (x 1). 001 Left-shift R-value by 1 (x 2). 010 Left-shift R-value by 2 (x 4). 011 Left-shift R-value by 3 (x 8). 100 Right-shift R-value by 1 (÷ 2). 101 Right-shift R-value by 2 (÷ 4). 110 Right-shift R-value by 3 (÷ 8). 111 Right-shift R-value by 4 (÷ 16). Application: “Ratio Modifier (R-Mod)” on page 18 Auxiliary Output Source Selection (AuxOutSrc[1:0]) Selects the source of the AUX_OUT signal. AuxOutSrc[1:0] Auxiliary Output Source 00 RefClk. 01 CLK_IN. 10 CLK_OUT. 11 PLL Lock Status Indicator. Application: “Auxiliary Output” on page 20 Note: When set to 11, AuxLckCfg sets the polarity and driver type. See “AUX PLL Lock Output Configuration (AuxLockCfg)” on page 28. 26 DS840F3 CS2100-CP 8.3.3 Enable Device Configuration Registers 1 (EnDevCfg1) This bit, in conjunction with EnDevCfg2, configures the device for control port mode. These EnDevCfg bits can be set in any order and at any time during the control port access sequence, however they must both be set before normal operation can occur. EnDevCfg1 Register State 0 Disabled. 1 Enabled. Application: “SPI / I²C Control Port” on page 21 Note: EnDevCfg2 must also be set to enable control port mode. See “SPI / I²C Control Port” on page 21. 8.4 Global Configuration (Address 05h) 7 Reserved 8.4.1 6 Reserved 5 Reserved 4 Reserved 3 Freeze 2 Reserved 1 Reserved 0 EnDevCfg2 Device Configuration Freeze (Freeze) Setting this bit allows writes to the Device Control and Device Configuration registers (address 02h - 04h) but keeps them from taking effect until this bit is cleared. 8.4.2 FREEZE Device Control and Configuration Registers 0 Register changes take effect immediately. 1 Modifications may be made to Device Control and Device Configuration registers (registers 02h-04h) without the changes taking effect until after the FREEZE bit is cleared. Enable Device Configuration Registers 2 (EnDevCfg2) This bit, in conjunction with EnDevCfg1, configures the device for control port mode. These EnDevCfg bits can be set in any order and at any time during the control port access sequence, however they must both be set before normal operation can occur. EnDevCfg2 Register State 0 Disabled. 1 Enabled. Application: “SPI / I²C Control Port” on page 21 Note: EnDevCfg1 must also be set to enable control port mode. See “SPI / I²C Control Port” on page 21. 8.5 Ratio (Address 06h - 09h) 7 MSB MSB-8 LSB+15 LSB+7 6 5 4 3 2 ............................................................................................................................ ............................................................................................................................ ............................................................................................................................ ............................................................................................................................ 1 0 MSB-7 MSB-15 LSB+8 LSB These registers contain the User Defined Ratio as shown in the “Register Quick Reference” section on page 24. These 4 registers form a single 32-bit ratio value as shown above. See “Output to Input Frequency Ratio Configuration” on page 17 and “Calculating the User Defined Ratio” on page 30 for more details. DS840F3 27 CS2100-CP 8.6 Function Configuration 1 (Address 16h) 7 ClkSkipEn 8.6.1 6 AuxLockCfg 5 Reserved 4 RefClkDiv1 3 RefClkDiv0 2 Reserved 1 Reserved 0 Reserved Clock Skip Enable (ClkSkipEn) This bit enables clock skipping mode for the PLL and allows the PLL to maintain lock even when the CLK_IN has missing pulses. ClkSkipEn PLL Clock Skipping Mode 0 Disabled. 1 Enabled. Application: “CLK_IN Skipping Mode” on page 14 Note: 8.6.2 fCLK_IN must be < 80 kHz and re-applied within 20 ms to use this feature. AUX PLL Lock Output Configuration (AuxLockCfg) When the AUX_OUT pin is configured as a lock indicator (AuxOutSrc[1:0] = 11), this bit configures the AUX_OUT driver to either push-pull or open drain. It also determines the polarity of the lock signal. If AUX_OUT is configured as a clock output, the state of this bit is disregarded. AuxLockCfg AUX_OUT Driver Configuration 0 Push-Pull, Active High (output ‘high’ for unlocked condition, ‘low’ for locked condition). 1 Open Drain, Active Low (output ‘low’ for unlocked condition, high-Z for locked condition). Application: “Auxiliary Output” on page 20 Note: AUX_OUT is an unlock indicator, signalling an error condition when the PLL is unlocked. Therefore, the pin polarity is defined relative to the unlock condition. 8.6.3 Reference Clock Input Divider (RefClkDiv[1:0]) Selects the input divider for the timing reference clock. 28 RefClkDiv[1:0] Reference Clock Input Divider REF_CLK Frequency Range 00 ÷ 4. 32 MHz to 75 MHz (50 MHz with XTI) 01 ÷ 2. 16 MHz to 37.5 MHz 10 ÷ 1. 8 MHz to 18.75 MHz 11 Reserved. Application: “Internal Timing Reference Clock Divider” on page 13 DS840F3 CS2100-CP 8.7 Function Configuration 2 (Address 17h) 7 Reserved 8.7.1 6 Reserved 5 Reserved 4 ClkOutUnl 3 LFRatioCfg 2 Reserved 1 Reserved 0 Reserved Enable PLL Clock Output on Unlock (ClkOutUnl) Defines the state of the PLL output during the PLL unlock condition. 8.7.2 ClkOutUnl Clock Output Enable Status 0 Clock outputs are driven ‘low’ when PLL is unlocked. 1 Clock outputs are always enabled (results in unpredictable output when PLL is unlocked). Application: “PLL Clock Output” on page 20 Low-Frequency Ratio Configuration (LFRatioCfg) Determines how to interpret the 32-bit User Defined Ratio. 8.8 LFRatioCfg Ratio Bit Encoding Interpretation 0 20.12 - High Multiplier. 1 12.20 - High Accuracy. Application: “User Defined Ratio (RUD)” on page 17 Function Configuration 3 (Address 1Eh) 7 Reserved 8.8.1 6 ClkIn_BW2 5 ClkIn_BW1 4 ClkIn_BW0 3 Reserved 2 Reserved 1 Reserved 0 Reserved Clock Input Bandwidth (ClkIn_BW[2:0]) Sets the minimum loop bandwidth when locked to CLK_IN. ClkIn_BW[2:0] Minimum Loop Bandwidth 000 1 Hz 001 2 Hz 010 4 Hz 011 8 Hz 100 16 Hz 101 32 Hz 110 64 Hz 111 128 Hz Application: “Adjusting the Minimum Loop Bandwidth for CLK_IN” on page 16 Note: In order to guarantee that a change in minimum bandwidth takes effect, these bits must be set prior to acquiring lock (removing and re-applying CLK_IN can provide the unlock condition necessary to initiate the setting change). In production systems these bits should be configured with the desired values prior to setting the EnDevCfg bits; this guarantees that the setting takes effect prior to acquiring lock. DS840F3 29 CS2100-CP 9. CALCULATING THE USER DEFINED RATIO Note: The software for use with the evaluation kit has built in tools to aid in calculating and converting the User Defined Ratio. This section is for those who are not interested in the software or who are developing their systems without the aid of the evaluation kit. Most calculators do not interpret the fixed point binary representation which the CS2100 uses to define the output to input clock ratio (see Section 5.3.1 on page 17); However, with a simple conversion we can use these tools to generate a binary or hex value which can be written to the Ratio register. 9.1 High Resolution 12.20 Format To calculate the User Defined Ratio (RUD) to store in the register(s), divide the desired output clock frequency by the given input clock (CLK_IN). Then multiply the desired ratio by the scaling factor of 220 to get the scaled decimal representation; then use the decimal to binary/hex conversion function on a calculator and write to the register. A few examples have been provided in Table 2. Scaled Decimal Representation = (output clock/input clock) 220 Hex Representation of Binary RUD 12.288 MHz/10 MHz=1.2288 1288490 00 13 A9 2A 11.2896 MHz/44.1 kHz=256 268435456 10 00 00 00 Desired Output to Input Clock Ratio (output clock/input clock) Table 2. Example 12.20 R-Values 9.2 High Multiplication 20.12 Format To calculate the User Defined Ratio (RUD) to store in the register(s), divide the desired output clock frequency by the given input clock (CLK_IN). Then multiply the desired ratio by the scaling factor of 212 to get the scaled decimal representation; then use the decimal to binary/hex conversion function on a calculator and write to the register. A few examples have been provided in Table 3. Desired Output to Input Clock Ratio (output clock/input clock) Scaled Decimal Representation = (output clock/input clock) 212 Hex Representation of Binary RUD 12.288 MHz/60 Hz=204,800 838860800 32 00 00 00 11.2896 MHz/59.97 Hz =188254.127... 771088904 2D F5 E2 08 Table 3. Example 20.12 R-Values 30 DS840F3 CS2100-CP 10.PACKAGE DIMENSIONS 10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1) N D E11 c E A2 A e b A1 SIDE VIEW 1 2 3 END VIEW L SEATING PLANE L1 TOP VIEW DIM MIN INCHES NOM A A1 A2 b c D E E1 e L L1 -0 0.0295 0.0059 0.0031 ----0.0157 -- -----0.1181 BSC 0.1929 BSC 0.1181 BSC 0.0197 BSC 0.0236 0.0374 REF MAX 0.0433 0.0059 0.0374 0.0118 0.0091 ----0.0315 -- MIN MILLIMETERS NOM NOTE MAX -0 0.75 0.15 0.08 ----0.40 -- -----3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 0.60 0.95 REF 1.10 0.15 0.95 0.30 0.23 ----0.80 -- 4, 5 2 3 Notes: 1. Reference document: JEDEC MO-187 2. D does not include mold flash or protrusions which is 0.15 mm max. per side. 3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side. 4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max. 5. Exceptions to JEDEC dimension. THERMAL CHARACTERISTICS Parameter Symbol Min Typ Max Units JA JA - 170 100 - °C/W °C/W Junction to Case Thermal Impedance JC - 30.2 - °C/W Junction to Top Thermal Characteristic (Center of Package) ΨJT - 6 - °C/W Junction to Ambient Thermal Impedance DS840F3 JEDEC 2-Layer JEDEC 4-Layer 31 CS2100-CP 11.ORDERING INFORMATION Product Description CS2100-CP Clocking Device 10L-MSOP Package Pb-Free Yes CS2100-CP Clocking Device 10L-MSOP Yes CS2100-CP Clocking Device 10L-MSOP Yes CS2100-CP Clocking Device 10L-MSOP Yes CS2100-CP Clocking Device 10L-MSOP Yes CS2100-CP Clocking Device 10L-MSOP Yes - Yes CDK2000 Evaluation Platform Grade Commercial Automotive-D Automotive-E - Temp Range Container Order# -10° to +70°C Rail CS2100CP-CZZ -10° to +70°C Tape and Reel CS2100CP-CZZR -40° to +85°C Rail CS2100CP-DZZ -40° to +85°C Tape and Reel CS2100CP-DZZR -40° to +105°C Rail CS2100CP-EZZ -40° to +105°C Tape and Reel CS2100CP-EZZR - - CDK2000-CLK 12.REVISION HISTORY Release Changes F1 AUG ‘09 Updated Period Jitter specification in “AC Electrical Characteristics” on page 7. Updated Crystal and Ref Clock Frequency specifications in “AC Electrical Characteristics” on page 7. Added “PLL Performance Plots” section on page 8. Updated “Internal Timing Reference Clock Divider” on page 13 and added Figure 10 on page 13. Updated use conditions for “CLK_IN Skipping Mode” section on page 14 and page 28. Updated Figure 12 on page 15. Removed FsDetect and Auto R-Mod features per ER758rev2. F2 MAY ‘10 Updated to add Automotive Grade temperature ranges and ordering options. F3 OCT ‘15 Updated to add Automotive-E grade temperature ranges and ordering options. Added Note 7 regarding ratio-limited fCLK_OUT in “AC Electrical Characteristics” on page 7. Updated frequency ranges in Figure 2 on page 8 and Figure 3 on page 8. Added unlock conditions to “Auxiliary Output” on page 20. Added note regarding Bit 7 in “Device Control (Address 02h)” on page 25. Added two thermal characteristics in “Thermal Characteristics” on page 31. Updated legal verbiage. Important: Please check www.Cirrus.com to confirm that you are using the latest revision of this document and to determine whether there are errata associated with this device. 32 DS840F3 CS2100-CP Contacting Cirrus Logic Support For all product questions and inquiries, contact a Cirrus Logic Sales Representative. To find one nearest you, go to www.cirrus.com IMPORTANT NOTICE The products and services of Cirrus Logic International (UK) Limited; Cirrus Logic, Inc.; and other companies in the Cirrus Logic group (collectively either “Cirrus Logic” or “Cirrus”) are sold subject to Cirrus’s terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. Software is provided pursuant to applicable license terms. Cirrus reserves the right to make changes to its products and specifications or to discontinue any product or service without notice. Customers should therefore obtain the latest version of relevant information from Cirrus to verify that the information is current and complete. Testing and other quality control techniques are utilized to the extent Cirrus deems necessary. Specific testing of all parameters of each device is not necessarily performed. In order to minimize risks associated with customer applications, the customer must use adequate design and operating safeguards to minimize inherent or procedural hazards. Cirrus is not liable for applications assistance or customer product design. The customer is solely responsible for its selection and use of Cirrus products. Use of Cirrus products may entail a choice between many different modes of operation, some or all of which may require action by the user, and some or all of which may be optional. Nothing in these materials should be interpreted as instructions or suggestions to choose one mode over another. Likewise, description of a single mode should not be interpreted as a suggestion that other modes should not be used or that they would not be suitable for operation. Features and operations described herein are for illustrative purposes only. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, NUCLEAR SYSTEMS, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. 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Cirrus Logic, Cirrus, the Cirrus Logic logo design, and SoundClear are among the trademarks of Cirrus. Other brand and product names may be trademarks or service marks of their respective owners. Copyright © 2009–2015 Cirrus Logic, Inc. All rights reserved. SPI is a trademark of Motorola. DS840F3 33