HMC499


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
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supply formats:
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storage systems for secure long
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[email protected]
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HMC499
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HMC499
v03.0908
LINEAR & POWER AMPLIFIERS - CHIP
3
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Typical Applications
Features
The HMC499 is ideal for use as a power amplifier for:
Output IP3: +33 dBm
• Point-to-Point Radios
P1dB: +24 dBm
• Point-to-Multi-Point Radios
Gain: 16 dB
• VSAT
Supply Voltage: +5V
• Military & Space
50 Ohm Matched Input/Output
Die Size: 2.04 x 1.09 x 0.1 mm
General Description
Functional Diagram
The HMC499 is a high dynamic range GaAs PHEMT
MMIC Medium Power Amplifier which operates
between 21 and 32 GHz. The HMC499 provides
16 dB of gain, and an output power of +24 dBm at
1 dB compression from a +5V supply voltage. The
HMC499 amplifier can easily be integrated into MultiChip-Modules (MCMs) due to its small size. All data
is with the chip in a 50 Ohm test fixture connected
via 0.025mm (1 mil) diameter wire bonds of minimal
length 0.31mm (12 mils).
Electrical Specifi cations, TA = +25° C, Vdd = 5V, Idd = 200 mA*
Parameter
Min.
Frequency Range
Gain
13
Gain Variation Over Temperature
Max.
Min.
12.5
0.04
23
Min.
12
0.04
24
Max.
dB
0.04
8
21
dB/ °C
dB
12
dB
24.5
dBm
Saturated Output Power (Psat)
24
24.5
25
dBm
Output Third Order Intercept (IP3)
30
33
33.5
dBm
Noise Figure
6.5
5.0
4.5
dB
Supply Current (Idd)(Vdd = 5V, Vgg = -0.8V Typ.)
200
200
200
mA
* Adjust Vgg between -2 to 0V to achieve Idd = 200 mA typical.
3 - 56
Units
GHz
15
0.03
12
20
Typ.
28.0 - 32.0
5
13
20
Max.
15.5
0.03
10
Output Return Loss
Typ.
24.0 - 28.0
16
0.03
Input Return Loss
Output Power for 1 dB Compression (P1dB)
Typ.
21.0 - 24.0
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Broadband Gain & Return Loss
Gain vs. Temperature
24
20
20
10
S21
S11
S22
0
-5
3
16
12
+25 C
+85 C
-55 C
8
-10
4
-15
0
-20
18
20
22
24
26
28
30
32
34
20
36
21 22 23
0
-4
-4
-8
-12
+25 C
+85 C
-55 C
28 29 30
31 32
33
+25 C
+85 C
-55 C
-8
-12
-16
-20
-20
20
21 22 23
24 25 26
27
28 29 30
31 32
33
20
21 22 23
FREQUENCY (GHz)
27
28 29 30
31 32
33
31 32
33
Psat vs. Temperature
30
26
26
Psat (dBm)
30
22
+25 C
+85 C
-55 C
18
24 25 26
FREQUENCY (GHz)
Output P1dB vs. Temperature
P1dB (dBm)
27
Output Return Loss vs. Temperature
0
RETURN LOSS (dB)
RETURN LOSS (dB)
Input Return Loss vs. Temperature
-16
24 25 26
FREQUENCY (GHz)
FREQUENCY (GHz)
14
LINEAR & POWER AMPLIFIERS - CHIP
5
GAIN (dB)
RESPONSE (dB)
15
22
+25 C
+85 C
-55 C
18
14
10
10
20
21 22 23
24 25 26
27
28 29 30
FREQUENCY (GHz)
31 32
33
20
21 22 23
24 25 26
27
28 29 30
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 57
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Output IP3 vs. Temperature
Noise Figure vs. Temperature
40
12
10
28
+25 C
+85 C
-55 C
+25 C
+85 C
-55 C
8
6
4
2
20
0
20
21 22 23
24 25 26
27
28 29 30
31 32
33
20
21 22 23
24 25 26
FREQUENCY (GHz)
28 29 30
31 32
33
Reverse Isolation vs. Temperature
0
26
-10
22
ISOLATION (dB)
GAIN (dB), P1dB (dBm), Psat (dBm)
27
FREQUENCY (GHz)
Gain & Power vs.
Supply [email protected] 30 GHz, Idd= 200 mA
18
Gain
P1dB
Psat
14
-20
+25 C
+85 C
-55 C
-30
-40
-50
-60
10
3
3.5
4
4.5
5
20
5.5
21 22 23
24 25 26
27
28 29 30
31 32
33
FREQUENCY (GHz)
Vdd (V)
Power Compression @ 22 GHz
Power Compression @ 30 GHz
28
24
Pout (dBm), GAIN (dB), PAE (%)
28
Pout (dBm)
Gain (dB)
PAE (%)
20
16
12
8
4
0
-10
-8
-6
-4
-2
0
2
4
6
INPUT POWER (dBm)
3 - 58
NOISE FIGURE (dB)
32
24
Pout (dBm), GAIN (dB), PAE (%)
LINEAR & POWER AMPLIFIERS - CHIP
3
IP3 (dBm)
36
8
10
12
14
24
Pout (dBm)
Gain (dB)
PAE (%)
20
16
12
8
4
0
-10
-8
-6
-4
-2
0
2
4
6
8
INPUT POWER (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
10
12
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Typical Supply Current vs. Vdd
Vdd (Vdc)
Idd (mA)
Drain Bias Voltage (Vdd1, Vdd2, Vdd3)
+5.5 Vdc
Gate Bias Voltage (Vgg)
-4 to 0 Vdc
+4.5
193
RF Input Power (RFIN)(Vdd = +5Vdc)
+20 dBm
+5.0
200
Channel Temperature
175 °C
+5.5
207
Continuous Pdiss (T= 85 °C)
(derate 16.7 mW/°C above 85 °C)
1.50 W
Thermal Resistance
(channel to die bottom)
60 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
+3.0
191
+3.5
200
+4.0
208
Note: Amplifi er will operate over full voltage ranges shown above.
Vgg adjusted to achieve Idd= 200 mA at +5V and +3.5V.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
3
LINEAR & POWER AMPLIFIERS - CHIP
Absolute Maximum Ratings
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 59
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Pad Descriptions
Pad Number
Function
Description
1
RFIN
This pad is AC coupled
and matched to 50 Ohms
2-4
Vdd1, 2, 3
Power Supply Voltage for the amplifier. External bypass
capacitors of 100 pF and 0.01 μF are required.
5
RFOUT
This pad is AC coupled
and matched to 50 Ohms.
6
Vgg
Gate control for amplifier. Adjust to achieve Idd of 200 mA.
Please follow “MMIC Amplifier Biasing Procedure”
Application Note. External bypass capacitors of 100 pF
and 0.01 μF are required.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
LINEAR & POWER AMPLIFIERS - CHIP
3
3 - 60
Interface Schematic
Assembly Diagram
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 21 - 32 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should brought as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity:
strikes.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Follow ESD precautions to protect against ESD
Transients: Suppress instrument and bias supply transients while bias
is applied. Use shielded signal and bias cables to minimize inductive
pick-up.
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
3
LINEAR & POWER AMPLIFIERS - CHIP
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 61