Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC459 v01.1007 LINEAR & POWER AMPLIFIERS - CHIP 3 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Typical Applications Features The HMC459 wideband driver is ideal for: P1dB Output Power: +25 dBm • Telecom Infrastructure Gain: 17 dB • Microwave Radio & VSAT Output IP3: +31.5 dBm • Military & Space Supply Voltage: +8V @ 290 mA • Test Instrumentation 50 Ohm Matched Input/Output Die Size: 3.12 x 1.63 x 0.1 mm Functional Diagram General Description The HMC459 is a GaAs MMIC PHEMT Distributed Power Amplifier die which operates between DC and 18 GHz. The amplifier provides 17 dB of gain, +31.5 dBm output IP3 and +25 dBm of output power at 1 dB gain compression while requiring 290 mA from a +8V supply. Gain flatness is good making the HMC459 ideal for EW, ECM and radar driver amplifier applications. The HMC459 amplifier I/O’s are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). Electrical Specifi cations, TA = +25° C, Vdd= 8V, Vgg2= 3V, Idd= 290 mA* Parameter Min. Frequency Range Gain Typ. Max. Min. DC - 2.0 16.5 18.5 Gain Flatness ±0.5 Gain Variation Over Temperature 0.02 Typ. Max. Min. DC - 6.0 15 18 14 ±0.75 0.03 0.02 Typ. Max. Min DC - 10.0 17 9 Typ Max GHz 12 dB ±0.75 0.03 0.03 dB 0.04 0.035 0.045 dB/ °C Input Return Loss 22 19.5 19 10 dB Output Return Loss 27 15 14 14 dB 17 dBm Output Power for 1 dB Compression (P1dB) Saturated Output Power (Psat) 21 24 20.5 24.5 22 25 14 26.5 26.5 26.5 21 dBm Output Third Order Intercept (IP3) 40 34 31.5 26 dBm Noise Figure 4.0 4.0 3.0 6.5 dB Supply Current (Idd) (Vdd= 8V, Vgg1= -0.5V Typ.) 290 290 290 290 mA * Adjust Vgg1 between -2 to 0V to achieve Idd= 290 mA typical. 3 - 28 Units DC - 18.0 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Gain & Return Loss Gain vs. Temperature 22 25 20 20 3 18 5 S21 S11 S22 0 -5 16 14 -10 12 -15 -20 +25 C +85 C -55 C 10 -25 8 -30 0 2 4 6 8 10 12 14 16 18 0 20 2 4 0 -5 -5 RETURN LOSS (dB) RETURN LOSS (dB) 0 +25 C +85 C -55 C -15 -20 -25 10 12 14 16 18 20 -10 -15 -20 -25 +25 C +85 C -55 C -30 -30 -35 0 4 8 12 16 20 0 4 FREQUENCY (GHz) 8 12 16 20 16 20 FREQUENCY (GHz) Low Frequency Gain & Return Loss Noise Figure vs. Temperature 10 30 20 +25 C +85 C -55 C 8 10 NOISE FIGURE (dB) RESPONSE (dB) 8 Output Return Loss vs. Temperature Input Return Loss vs. Temperature -10 6 FREQUENCY (GHz) FREQUENCY (GHz) S21 S11 S22 0 -10 -20 -30 LINEAR & POWER AMPLIFIERS - CHIP 10 GAIN (dB) RESPONSE (dB) 15 6 4 2 -40 -50 0.00001 0 0.0001 0.001 0.01 0.1 FREQUENCY (GHz) 1 10 0 4 8 12 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 29 HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Output Psat vs. Temperature 30 26 26 Psat (dBm) 30 22 +25 C +85 C -55 C 18 14 22 +25 C +85 C -55 C 18 14 10 10 0 4 8 12 16 20 0 4 8 FREQUENCY (GHz) GAIN (dB), P1dB (dBm), PSAT (dBm), IP3 (dBm) 40 36 32 28 +25 C +85 C -55 C 20 4 8 12 16 20 FREQUENCY (GHz) 32 GAIN (dB) P1dB (dBm) PSAT (dBm) IP3 (dBm) 28 24 20 16 7.5 8 Vdd SUPPLY VOLTAGE (V) Reverse Isolation vs. Temperature -10 +25 C +85 C -55 C -20 -30 -40 -50 -60 -70 0 4 8 12 16 20 FREQUENCY (GHz) 3 - 30 20 36 0 REVERSE ISOLATION (dB) 0 16 Gain, Power & Output IP3 vs. Supply Voltage @ 5 GHz, Fixed Vgg 44 24 12 FREQUENCY (GHz) Output IP3 vs. Temperature IP3 (dBm) LINEAR & POWER AMPLIFIERS - CHIP 3 P1dB (dBm) Output P1dB vs. Temperature For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 8.5 HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Typical Supply Current vs. Vdd Absolute Maximum Ratings Drain Bias Voltage (Vdd) +9 Vdc Gate Bias Voltage (Vgg1) -2 to 0 Vdc Vdd (V) Idd (mA) +7.5 292 (Vdd -8) Vdc to Vdd +8.0 290 RF Input Power (RFIN)(Vdd = +8 Vdc) +16 dBm +8.5 288 Channel Temperature 175 °C Continuous Pdiss (T= 85 °C) (derate 51.5 mW/°C above 85 °C) 4.64 W Thermal Resistance (channel to die bottom) 19.4 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] Standard Alternate GP-1 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3 LINEAR & POWER AMPLIFIERS - CHIP Gate Bias Voltage (Vgg2) NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 31 HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Pad Descriptions LINEAR & POWER AMPLIFIERS - CHIP 3 3 - 32 Pad Number Function Description 1 RFIN This pad is DC coupled and matched to 50 Ohms. 2 Vgg2 Gate Control 2 for amplifier. +3V should be applied to Vgg2 for nominal operation. Vgg2 may be adjusted between 0 to +5V to temperature compensate gain. 4 RFOUT & Vdd RF output for amplifier. Connect the DC bias (Vdd) network to provide drain current (Idd). See application circuit herein. 5 Vgg1 Gate Control 1 for amplifier. Adjust between -2 to 0V to achieve Idd= 290 mA. 3 ACG1 Low frequency termination. Attach bypass capacitor per application circuit here in. 6 ACG2 Low frequency termination. Attach bypass capacitor per application circuit here in. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Assembly Diagram Application Circuit LINEAR & POWER AMPLIFIERS - CHIP 3 NOTE 1: Drain Bias (Vdd) must be applied through a broadband bias tee or external bias network. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 33 HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). LINEAR & POWER AMPLIFIERS - CHIP 3 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Follow ESD precautions to protect against ESD Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). 3 - 34 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC459 v01.1007 GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz Notes: LINEAR & POWER AMPLIFIERS - CHIP 3 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 35