96690

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
E
Added vendor cage 88379 for device types 01 through 05. Figure 1;
Added the pin reference numbers on the top view of case outline Y to
indicate the pin orientation. -sld
99-03-29
K. A. Cottongim
F
Added vendor cage 88379 for the case outlines U and T. Table I; VOL
test changed the test condition IOL from 12.0 mA to 8.0 mA. Redrew
entire document. -sld
00-09-19
Raymond Monnin
G
Added vendor cage 0EU86 for device types 01 through 05. Updated
drawing to reflect the latest requirements of MIL-PRF-38534. -sld
03-04-21
Raymond Monnin
H
Figure 1; Case outline Y, changed the dimension "D" min from 1.654
inches to 1.6 inches. Editorial changes troughout. -sld
05-02-07
Raymond Monnin
J
Updated drawing paragraphs. -sld
11-07-13
Charles F. Saffle
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PMIC N/A
PREPARED BY
Steve L. Duncan
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Michael C. Jones
APPROVED BY
Kendall A. Cottongim
http://www.landandmaritime.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL, FLASH
EPROM, 128K X 8-BIT, MONOLITHIC
SILICON
DRAWING APPROVAL DATE
95-12-12
REVISION LEVEL
J
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-96690
22
5962-E370-11
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
96690



RHA
designator
(see 1.2.1)
/
\/
Drawing number
01



Device
type
(see 1.2.2)
H



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
F128K8-150CQ5, F010-150/Q
F128K8-120CQ5, F010-120/Q
F128K8-90CQ5, F010-90/Q
F128K8-70CQ5, F010-70Q
F128K8-60CQ5, F010-60Q
Circuit function
FLASH EPROM, 128K x 8-bit
FLASH EPROM, 128K x 8-bit
FLASH EPROM, 128K x 8-bit
FLASH EPROM, 128K x 8-bit
FLASH EPROM, 128K x 8-bit
Access time
150 ns
120 ns
90 ns
70 ns
60 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
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1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
T
U
X
Y
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
Package style
32
32
32
32
Flatpack, ceramic, single cavity
Flatpack, ceramic, single cavity, lead formed
SOJ, ceramic, single cavity
DIP, ceramic, single cavity
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) 2/ ....................................................
Signal voltage range (any pin except A9) 2/ ..............................
Power dissipation (PD) ...............................................................
Storage temperature range ........................................................
Lead temperature (soldering, 10 seconds) ................................
Data retention ............................................................................
Endurance (write/erase cycles) ..................................................
A9 voltage for sector protect (VID) 3/ ..........................................
-2.0 V dc to +7.0 V dc
-2.0 V dc to +7.0 V dc
275 mW
-65C to +150C
+300C
10 years minimum
10,000 cycles minimum
-2.0 V dc to +14.0 V dc
1.4 Recommended operating conditions.
Supply voltage range (VCC) ........................................................
Input low voltage range (VIL) ......................................................
Input high voltage range (VIH) ....................................................
Case operating temperature range (TC) .....................................
A9 voltage for sector protect (VID) ..............................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to VCC + 0.3 V dc
-55 C to +125 C
+11.5 V dc to +12.5 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum DC voltage in input or I/O pins is -0.5 V dc. During voltage transitions, inputs may overshoot VSS to
-2.0 V dc for periods up to 20 ns. Maximum DC voltage on output and I/O pins is VCC +0.5 V dc. During voltage
transitions, outputs may overshoot to VCC +2.0 V dc for periods up to 20 ns.
3/ Minimum DC input voltage on A9 is -0.5 V dc. During voltage transitions, A9 may overshoot VSS to -2.0 V dc for
periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V dc which may overshoot to +14.0 V dc for periods
up to 20 ns.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
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DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4, 5, and 6.
3.2.5 Block diagram. The block diagram shall be as specified on figure 7.
3.3.6 Output load circuit. The output load circuit shall be as specified on figure 8.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
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REVISION LEVEL
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3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendors procedure shall be kept
under document control and shall be made available upon request of the acquiring or preparing activity.
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
DC parameters
Input leakage current
ILI
VCC = 5.5 V dc, VIN = GND
to VCC
1,2,3
All
10
A
Output leakage current
ILO
VCC = 5.5 V dc, VIN = GND
to VCC
1,2,3
All
10
A
VCC Active current for read
ICC1
CS = VIL, OE = VIH
1,2,3
All
35
mA
VCC Active current for
program or erase 3/
ICC2
CS = VIL, OE = VIH
1,2,3
All
50
mA
VCC standby current
ICC3
VCC = 5.5 V dc, CS = VIH,
f = 5 MHz
1,2,3
All
1.6
mA
Input low level 3/
VIL
1,2,3
All
0.8
V
Input high level 3/
VIH
1,2,3
All
Output low voltage
VOL
VCC = 4.5 V dc,
IOL = 8.0 mA
1,2,3
All
Output high voltage
VOH1
VCC = 4.5 V dc,
IOH = -2.5 mA
1,2,3
All
0.85 X
VCC
V
VOH2
VCC = 4.5 V dc,
IOH = -100 A
1,2,3
All
VCC 0.4 Vdc
V
OE capacitance 3/
COE
VIN = 0 V, f = 1.0 MHz,
TA = +25C
4
All
15
pF
A0-A16 capacitance 3/
CAD
VIN = 0 V, f = 1.0 MHz,
TA = +25C
4
All
15
pF
2.0
V
0.45
V
Dynamic characteristics
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
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SHEET
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
Dynamic characteristics - continued
CS capacitance 3/
CCS
VIN = 0 V dc, f = 1.0 MHz,
TA = +25C
4
All
15
pF
WE capacitance 3/
CWE
VIN = 0 V dc, f = 1.0 MHz,
TA = +25C
4
All
15
pF
I/O0-I/O7 capacitance 3/
CI/O
VIN = 0 V dc, f = 1.0 MHz,
TA = +25C
4
All
15
pF
7A,8A,8B
All
Functional testing
Functional tests
See 4.3.1c
Read cycle AC timing characteristics
Read cycle time 3/
tRC
See figure 4
9,10,11
01
02
03
04
05
Address access time
tACC
See figure 4
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Chip select access time
tCE
See figure 4
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Output enable to output valid
tOE
See figure 4
9,10,11
01
02
03
04
05
55
50
40
35
30
ns
150
120
90
70
60
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Group A
subgroups
Conditions
-55C  TA +125C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Read cycle AC timing characteristics - Continued
Chip select to output high Z
3/
tDF
See figure 4
9,10,11
01
02
03
04,05
35
30
25
20
ns
Output Enable to output high
Z 3/
tDF
See figure 4
9,10,11
01
02
03
04,05
35
30
25
20
ns
Output hold from address,
tOH
See figure 4
9,10,11
All
0
ns
CS or OE change, whichever
is first 3/
Write cycle AC timing - Write/Erase/Program operations WE controlled
Write cycle time 3/
tWC
See figure 5
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Chip select setup time
tCS
See figure 5
9,10,11
All
0
ns
Write enable pulse width
tWP
See figure 5
9,10,11
01,02
03
04
05
50
45
35
30
ns
Address setup time
tAS
See figure 5
9,10,11
All
0
ns
Data setup time
tDS
See figure 5
9,10,11
01,02
03
04,05
50
45
30
ns
Data hold time
tDH
See figure 5
9,10,11
All
0
ns
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
8
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Group A
subgroups
Conditions
-55C  TA +125C
unless otherwise specified
Device
type
Limits
Min
Unit
Max
Write cycle AC timing - Write/Erase/Program operations WE controlled - continued
Address hold time
tAH
See figure 5
9,10,11
01,02
03-05
50
45
ns
Write enable pulse width 3/
high
tWPH
See figure 5
9,10,11
All
20
ns
Read recovery before 3/
write
tGHWL
See figure 5
9,10,11
All
0
ns
Write cycle AC timing - Write/Erase/Program operations CS controlled
Write cycle time 3/
tWC
See figure 6
9,10,11
01
02
03
04
05
150
120
90
70
60
ns
Write Enable setup time
tWS
See figure 6
9,10,11
All
0
ns
Address setup time
tAS
See figure 6
9,10,11
All
0
ns
Data setup time
tDS
See figure 6
9,10,11
01,02
03
04,05
50
45
30
ns
Data hold time
tDH
See figure 6
9,10,11
All
0
ns
Address hold time
tAH
See figure 6
9,10,11
01,02
03-05
50
45
ns
Chip select pulse width
tCP
See figure 6
9,10,11
01,02
03
04
05
50
45
35
30
ns
Chip select pulse width 3/
high
tCPH
See figure 6
9,10,11
All
20
ns
Read recovery before 3/
write
tGHEL
See figure 6
9,10,11
All
0
ns
See footnotes at top of next page.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
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TABLE I. Electrical performance characteristics - Continued.
1/ Unless otherwise specified, 4.5 V  VCC  5.5 V and VSS = 0 V.
2/ Unless otherwise specified, the DC test conditions are as follows:
Input pulse levels: VIH = VCC - 0.3 V and VIL = 0.3 V.
Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels: VIL = 0 V and VIH = 3.0 V.
Input rise and fall times: 5 nanoseconds.
Input and output timing reference levels: 1.5 V.
3/ Parameters shall be tested as part of device characterization and after design and process changes. Parameters shall be
tested to the limits specified in table I for all lots not specifically tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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REVISION LEVEL
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Case outline T
Millimeters
Symbol
Min
Inches
Max
A
Min
Max
3.18
.125
b
0.38
0.48
.015
.019
C
0.10
0.18
.004
.007
D1
18.92
19.18
.745
.755
E
10.29
10.41
.405
.415
E1
7.75
8.00
.305
.315
E2
1.27 TYP
.050 TYP
e
1.27 TYP
.050 TYP
L
9.65
10.67
.380
.420
Q
0.56
0.71
.022
.028
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
3. Pin numbers are for reference only.
4. The case outline T is available in either a pedestal or non-pedestal package. The Q dimension only applies to the
pedestal version of case outline T.
FIGURE 1. Case outline.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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Case outline U
FIGURE 1. Case outline(s) - Continued
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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Case U outline - Continued
Symbol
Millimeters
Min
Inches
Max
A
Min
Max
3.35
.132
A1
2.41
3.18
.095
.125
A2
0.08
0.18
.003
.007
b
0.38
0.48
.015
.019
C
0.10
0.18
.004
.007
C2
0.76 TYP
D
20.57
D1
.030 TYP
21.08
.810
19.05 TYP
.830
.750 TYP
E
10.29
10.54
.405
.415
E1
13.34
13.59
.525
.535
E2
7.75
8.00
.305
.315
E3
1.27 TYP
.050 TYP
e
1.27 TYP
.050 TYP
eA
11.07 TYP
.436 TYP
L
1.52 TYP
.060 TYP
Q
0.56
R
0.71
.022
0.18 TYP
.028
.007 TYP
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
3. Pin numbers are for reference only.
4. The case outline U is available in either a pedestal or non-pedestal package. The Q dimension only applies to the
pedestal version of case outline U.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
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REVISION LEVEL
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Case Outline X
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
2.70
3.70
.106
.156
A1
1.02
1.52
.040
.060
b
0.38
0.48
.015
.019
C
0.15
0.25
.006
.010
D
20.83
21.34
.820
.840
D1
18.92
19.18
.745
.755
E
10.80
11.05
.425
.435
e
1.27 TYP
eA
9.30
R
.050 TYP
9.80
.366
0.89 TYP
.386
.035 TYP
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
14
Case outline Y
Symbol
Millimeters
Inches
Min
Max
Min
Max
A
3.56
5.13
.140
.202
A1
0.48
1.19
.019
.047
A2
3.18
4.90
.125
.193
B
0.23
0.30
.009
.012
B1
14.99
15.49
.590
.610
D
40.64
42.82
1.6
1.686
D1
14.73
15.34
.580
.604
D2
37.90
38.30
1.492
1.508
e
2.41
2.67
.095
.105
e1
0.41
0.51
.016
.020
NOTES:
1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. For solder lead finish, dimensions B and e1 will increase by +.003 inches (+0.08mm).
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
15
Device
types
All
Device
types
All
Case
outlines
All
Case
outlines
All
Terminal
number
Terminal
symbol
Terminal
number
Terminal
symbol
1
NC
17
I/O3
2
A16
18
I/O4
3
A15
19
I/O5
4
A12
20
I/O6
5
A7
21
I/O7
6
A6
22
CS
7
A5
23
A10
8
A4
24
OE
9
A3
25
A11
10
A2
26
A9
11
A1
27
A8
12
A0
28
A13
13
I/O0
29
A14
14
I/O1
30
NC
15
I/O2
31
WE
16
VSS
32
VCC
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
16
CS
OE
WE
Mode
Data I/O
Device
Current
H
X
X
Standby
High Z
Standby
L
L
H
Read
Data Out
Active
L
H
L
WrIte
Data In
Active
NOTES:
1. H = VIH = High Logic Level
2. L = VIL = Low Logic Level
3. X = Do not care (either high or low)
4. High Z = High impedance state
FIGURE 3. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
17
FIGURE 4. Read cycle timing diagram.
FIGURE 5. Write/Erase/Program operations, WE controlled.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
18
Notes:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to the device.
4. DOUT is the output of the data written to the device.
5. Figures indicate the last two bus cycles of a four bus cycle sequence.
FIGURE 6. Write/Erase operations, CS controlled.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
19
FIGURE 7. Block diagram.
FIGURE 8. Typical output test circuit.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
20
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A test
table)
Interim electrical parameters
1,4,7,9
Final electrical parameters
1*,2,3,4,7,8A,8B,9,10,11
Group A test requirements
1,2,3,4,7,8A,8B,9,10,11
Group C end-point electrical
parameters
1,2,3,4,7,8A,8B,9,10,11
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
21
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 shall be omitted.
c. Subgroups 7 and 8 shall include verification of the truth table on figure 3.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-96690
A
REVISION LEVEL
J
SHEET
22
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN
DATE: 11-07-13
Approved sources of supply for SMD 5962-96690 are listed below for immediate acquisition information only and shall be added
to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the
addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been
submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions
of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at
http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9669001HTA
5962-9669001HTA
5962-9669001HTA
5962-9669001HTC
5962-9669001HTC
5962-9669001HTC
5962-9669001HUA
5962-9669001HUA
5962-9669001HUA
5962-9669001HUC
5962-9669001HUC
5962-9669001HUC
5962-9669001HXA
5962-9669001HXC
5962-9669001HYA
5962-9669001HYA
5962-9669001HYA
5962-9669001HYC
5962-9669001HYC
5692-9669001HYC
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
54230
54230
0EU86
54230
88379
0EU86
54230
88379
AS29F010F-150/Q
WMF128K8-150FEQ5
ACT-F128K8N-150F6Q
AS29F010F-150/Q
WMF128K8-150FEQ5
ACT-F128K8N-150F6Q
AS29F010DCG-150/Q
WMF128K8-150FFQ5
ACT-F128K8N-150F7Q
AS29F010DCG-150/Q
WMF128K8-150FFQ5
ACT-F128K8N-150F7Q
WMF128K8-150DEQ5
WMF128K8-150DEQ5
AS29F010CW-150/Q
WMF128K8-150CQ5
ACT-F128K8N-150P4Q
AS29F010CW-150/Q
WMF128K8-150CQ5
ACT-F128K8N-150P4Q
5962-9669002HTA
5962-9669002HTA
5962-9669002HTA
5962-9669002HTC
5962-9669002HTC
5962-9669002HTC
5962-9669002HUA
5962-9669002HUA
5962-9669002HUA
5962-9669002HUC
5962-9669002HUC
5962-9669002HUC
5962-9669002HXA
5962-9669002HXC
5962-9669002HYA
5962-9669002HYA
5962-9669002HYA
5962-9669002HYC
5962-9669002HYC
5692-9669002HYC
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
54230
54230
0EU86
54230
88379
0EU86
54230
88379
AS29F010F-120/Q
WMF128K8-120FEQ5
ACT-F128K8N-120F6Q
AS29F010F-120/Q
WMF128K8-120FEQ5
ACT-F128K8N-120F6Q
AS29F010DCG-120/Q
WMF128K8-120FFQ5
ACT-F128K8N-120F7Q
AS29F010DCG-120/Q
WMF128K8-120FFQ5
ACT-F128K8N-120F7Q
WMF128K8-120DEQ5
WMF128K8-120DEQ5
AS29F010CW-120/Q
WMF128K8-120CQ5
ACT-F128K8N-120P4Q
AS29F010CW-120/Q
WMF128K8-120CQ5
ACT-F128K8N-120P4Q
Standard
microcircuit drawing
PIN 1/
1 of 3
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - CONTINUED
DATE: 11-07-13
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9669003HTA
5962-9669003HTA
5962-9669003HTA
5962-9669003HTC
5962-9669003HTC
5962-9669003HTC
5962-9669003HUA
5962-9669003HUA
5962-9669003HUA
5962-9669003HUC
5962-9669003HUC
5962-9669003HUC
5962-9669003HXA
5962-9669003HXC
5962-9669003HYA
5962-9669003HYA
5962-9669003HYA
5962-9669003HYC
5962-9669003HYC
5692-9669003HYC
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
54230
54230
0EU86
54230
88379
0EU86
54230
88379
AS29F010F-90/Q
WMF128K8-90FEQ5
ACT-F128K8N-090F6Q
AS29F010F-90/Q
WMF128K8-90FEQ5
ACT-F128K8N-090F6Q
AS29F010DCG-90/Q
WMF128K8-90FFQ5
ACT-F128K8N-090F7Q
AS29F010DCG-90/Q
WMF128K8-90FFQ5
ACT-F128K8N-090F7Q
WMF128K8-90DEQ5
WMF128K8-90DEQ5
AS29F010CW-90/Q
WMF128K8-90CQ5
ACT-F128K8N-090P4Q
AS29F010CW-90/Q
WMF128K8-90CQ5
ACT-F128K8N-090P4Q
5962-9669004HTA
5962-9669004HTA
5962-9669004HTA
5962-9669004HTC
5962-9669004HTC
5962-9669004HTC
5962-9669004HUA
5962-9669004HUA
5962-9669004HUA
5962-9669004HUC
5962-9669004HUC
5962-9669004HUC
5962-9669004HXA
5962-9669004HXC
5962-9669004HYA
5962-9669004HYA
5962-9669004HYA
5962-9669004HYC
5962-9669004HYC
5692-9669004HYC
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
54230
54230
0EU86
54230
88379
0EU86
54230
88379
AS29F010F-70/Q
WMF128K8-70FEQ5
ACT-F128K8N-070F6Q
AS29F010F-70/Q
WMF128K8-70FEQ5
ACT-F128K8N-070F6Q
AS29F010DCG-70/Q
WMF128K8-70FFQ5
ACT-F128K8N-070F7Q
AS29F010DCG-70/Q
WMF128K8-70FFQ5
ACT-F128K8N-070F7Q
WMF128K8-70DEQ5
WMF128K8-70DEQ5
AS29F010CW-70/Q
WMF128K8-70CQ5
ACT-F128K8N-070P4Q
AS29F010CW-70/Q
WMF128K8-70CQ5
ACT-F128K8N-070P4Q
2 of 3
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - CONTINUED
DATE: 11-07-13
Standard
microcircuit drawing
PIN 1/
5962-9669005HTA
5962-9669005HTA
5962-9669005HTA
5962-9669005HTC
5962-9669005HTC
5962-9669005HTC
5962-9669005HUA
5962-9669005HUA
5962-9669005HUA
5962-9669005HUC
5962-9669005HUC
5962-9669005HUC
5962-9669005HXA
5962-9669005HXC
5962-9669005HYA
5962-9669005HYA
5962-9669005HYA
5962-9669005HYC
5962-9669005HYC
5692-9669005HYC
Vendor
CAGE
number
Vendor
similar
PIN 2/
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
0EU86
54230
88379
54230
54230
0EU86
54230
88379
0EU86
54230
88379
AS29F010F-60/Q
WMF128K8-60FEQ5
ACT-F128K8N-060F6Q
AS29F010F-60/Q
WMF128K8-60FEQ5
ACT-F128K8N-060F6Q
AS29F010DCG-60/Q
WMF128K8-60FFQ5
ACT-F128K8N-060F7Q
AS29F010DCG-60/Q
WMF128K8-60FFQ5
ACT-F128K8N-060F7Q
WMF128K8-60DEQ5
WMF128K8-60DEQ5
AS29F010CW-60/Q
WMF128K8-60CQ5
ACT-F128K8N-060P4Q
AS29F010CW-60/Q
WMF128K8-60CQ5
ACT-F128K8N-060P4Q
1/ The lead finish shown for each PIN representing a hermetic
package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact
the vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
0EU86
Austin Semiconductor Incorporated
DBA Micross Components
8701 Cross Park Drive
Suite 105
Austin, TX 78754
54230
White Electronic Designs Corporation
Military Division
3601 East University Drive
Phoenix, AZ 85034
88379
Aeroflex Plainview Incorporated
DBA Comstron Division
35 South Service Road
Plainview, NY 11803
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
3 of 3