Product Overview

V I S H AY I N T E R T E C H N O L O G Y, I N C .
Multilayer Ceramic Chip Capacitors
Road Map
Multilayer Ceramic Chip Capacitors
Road Map
FEATURED PRODUCTS
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Chip Capacitors in PME/NME Technology
Chip Capacitors in BME Technology
Automotive Grade Capacitors, AEC-Q200 Qualified
Medical Grade Capacitors
High Reliability, Military, DSCC, and Aerospace
RF and High Q/Low ESR Series
Non-Magnetic Series
Ultra-Small Size 0201 and Chip Array
Silver Palladium (AgPd) Termination for Hybrid Applications
Board Flex Sensitive, Including Polymer Termination
Surface Arc-Over Prevention for High Voltage
Speciality Capacitors (e.g. Controlled Discharge Capacitor)
Surface-Mount Ceramic Chip Antennae
RESOURCES
• For more information, visit:
http://www.vishay.com/capacitors/ceramic/ceramic-multilayer-smd/
A WORLD OF
SOLUTIONS
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VMN-PL0380-1505
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V I S H AY I N T E R T E C H N O L O G Y, I N C .
Multilayer Ceramic Chip Capacitors
Road Map
Surface-Mount Products
• Vishay Vitramon Chip Capacitor – VJ series
surface-mount product, a reliable replacement
for leaded capacitors
3rd edition with X1/Y2 and X2 classification for 250 VAC
applications
• VJ...W1BC – Basic commodity series with base metal
electrode (BME) for X7R/X5R/Y5V and noble metal
electrodes (NME) for NP0 dielectric
• RF Multilayer Ceramic Chip Capacitors – Offering
high self-resonance, a high Q factor of ≥ 2000, and a
low dissipation factor of ≤ 0.05 % for operation in highfrequency commercial applications. 0402, 0603, and
0805 case sizes with broad working voltages from 25 VDC
to 250 VDC
• Chip Arrays – Chip arrays for space-constrained
applications and filtering in data communication lines.
Four capacitors in one package, built on NP0, X7R, or Y5V
dielectric
• Quad RF Capacitors - High Q (> 2000) MLCCs for highfrequency applications in 0505, 1111, 2525, and 3838 body
sizes, and application voltages up to 7200 VDC
• High-Q Series – C0G (NP0) ultra-stable, high-frequency
capacitors
• Ultra-Small 0201 – Ultra-small series - Built with NP0,
X5R, X7R, and Y5V dielectric for miniaturization in portable
applications
• 0402 High-Q – Excellent Q-factor and low ESR
enable miniaturization in wireless data communication
applications
• Medical Grade Capacitors – For implantable
cardiovascular control applications
• Tunable Surface-Mount Ceramic Chip Antennas – With
ultra-small outline, omni-directional, linear polarization and
complete UHF band coverage (470 MHz to 860 MHz) up
to 1.1 GHz for mobile devices
• Automotive Grade Capacitors – Qualified to AEC-Q200
guidelines for reliable automotive electronics
• MIL-PRF-55681 – Complies with Department of Defense
specification requirements for CDR military grade series
• Fixed-Frequency Surface-Mount Ceramic Chip
Antennas – Small form-factor, high-performance, chip
antennas designed for operation at 868 MHz , 915 MHz,
1.5 GHz, 2.4 GHz, and 5 GHz
• X8R Dielectric – Stable capacitance with reliable
performance up to +150 ºC
• Cassette Packaging – Bulk case package increases
pick and place productivity, reduces storage area and
packaging materials
Termination
• Open Mode Design Capacitors (OMD-Cap) – Reduce
risk of shorts and low insulation resistance from capacitor
cracks due to board flex, with high voltage breakdown
compared to standard designs
• Silver/Palladium (Ag/Pd) Terminations – Used for
conductive epoxy assembly
• Flexible Polymer Terminations – Enhance the
robustness of the terminations to resist board
flexure failures
• High-Reliability Series – A broad product range
manufactured with a combination of design,
materials, and tight process controls to achieve
high field reliability
• CDR Solder Coat Termination – Base metallizationbarrier metal-solder-coated tin/lead alloy (Sn/Pb), with a
minimum of 4 % lead. Solder has a melting point +200 ºC
or less. Solder coat thickness is a minimum of 60 µin
• DSCC Part Numbers – 03029 (0402 case size), 03028
(0603 case size), 05006 (0805 case size), 05007 (1206
case size)
• Tin/Lead (Sn/Pb) Termination Finish for CDR, DSCC,
High-Reliability Series – Base metallization 100 %
tin plate barrier with tin/lead plate matte finish with a
minimum 4 % lead
• High-Frequency DSCC – 05001 (0805 case size), 05002
(0603 case size), 05003 (0402 case size)
• Non-Magnetic Copper Terminations (C) – Copper
barrier 100 % tin plate matte finish for reflow soldering
• HVArc Guard® Capacitor Series – Higher capacitance,
surface-mountable, high-voltage, multilayer ceramic
capacitors designed to prevent surface arc-over
• Non-Magnetic Termination (N) – For Epoxy gluing
assembly
• X8R Dielectric Extension – Size 0402 (25 V/50 V/100 V)
and 0603/0805 with 100 V range for stable capacitance
with reliable performance up to +150 °C
• Safety Certified Capacitors – Size 2008, 2012, and
2225 in C0G(NP0) and X7R. Approved IEC 60384-14-2005
Brochure Type
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VMN-PL0380-1505
www.vishay.com
V I S H AY I N T E R T E C H N O L O G Y, I N C .
Multilayer Ceramic Chip Capacitors
Road Map
Surface-Mount Products
1948
Vishay Porcelain Caps
1967
Vishay Vitramon Chip Capacitor / Ag/Pd Termination
1985
Medical Grade Capacitors / High-Q Series
1989
Automotive Grade Capacitors / MIL-PRF-55681 CDR Series
1993
X8R Dielectric Capacitors Series / Tip ‘N Ring® Series until 2009
1994
High-Voltage Series / VTOP Series until 2009
1996
Low-Inductance Series (0612/0508) until 2009
2000
Cer-F (Y5E Dielectric) Series until 2009
2003
2004
2005
2006
2008
2009
2010
Basic Commodity Series (VJ…W1BC)
RuGGed Chip Series until 2009
Open Mode Design (OMD) Series / High-Reliability Series
Chip Array, Ultra-Small 0201 and 0402 High Q for Basic Commodity Series VJ…W1BC
DSCC Series (03028,03029,05006,05007) / Tin/Lead Finish for CDR, DSCC, and HiRel Series
HVArc Guard® Series / Hot Solder Finish for CDR / Flexible Polymer Termination
Controlled Discharge Cap (CDC)
N term = Non-Magnetic for Conductive Epoxy Assembly
Surface-Mount Ceramic Chip Antenna
Ultra High Q, Low ESR for Basic Commodity Series VJ…W1BC
Flexible Polymer Terminations for Automotive
DSCC High Frequency (05001, 05002, 05003)
2012
Fixed Frequency Surface-Mount Ceramic Chip Antennas
RF Multilayer Ceramic Chip Capacitors (Commercial)
QUAD HIFREQ Series 0505 and 1111 Body Size Ceramic Chip Capacitors
X8R Capacitors Extension (0402 and 0603 / 0805 with 100 V)
2013
Surface-Mount Safety Capacitors (X1/Y2 and X2)
Surface-Mount Ceramic Chip Antennas (1.575 GHz / 2.4 GHz / 5 GHz)
Source Energy Capacitor
QUAD HIFREQ Series 2525 and 3838 Body Size Ceramic Chip Capacitors
2014
C term = Improved Non-Magnetic for Reflow Assembly
RF Multilayer Ceramic Chip Capacitors < 1 pF
VJ 31X RoHS Automotive MLCC Series
High-Voltage Surface-Mount Capacitors 3 kV - 5 kV
2015
High-Temperature Capacitors
MIL-PRF-123 CKS Series Chip Capacitors
RF Microstrip Capacitors
Brochure Type
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VMN-PL0380-1505
www.vishay.com