VJ....W1BC Soldering and Footprint Design www.vishay.com Vishay Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications RECOMMENDED SOLDERING CONDITIONS Lead (Pb)-free terminated MLCCs are not only used on SMT with lead (Pb)-free solder paste, but also suitable to be used with lead-containing solder paste. In case the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within the oven are recommended. SOLDERING PROFILES Temperature in °C Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste 280 260 240 220 200 180 160 140 120 100 80 60 40 20 Max. temp. 4 °C/s 4 °C/s SnAgCu solder paste 3 °C/s Min. temp. Peak temperature: 280 °C max. Duration time: > 260 °C,10 s max. > 215 °C, 60 s to 90 s Time 60 s to 90 s 120 s 120 s 120 s Recommended wave soldering profile for SMT process with SnAgCu series solder 260 °C Temperature in °C 250 200 150 °C/s max. 4 °C/s max. 150 120 °C 100 50 0 < 100 s 3 s to 5s Time Total contact time Over 60 s at least by natural cooling Revision: 13-Aug-15 Document Number: 45017 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ....W1BC Soldering and Footprint Design www.vishay.com Vishay FOOTPRINT DESIGN Circuit board design first steps are to consider how the surface mount board will be manufactured. The manufacturing process determines the necessary dimensions of the solder land, the minimum spacing between components, the area underneath the SMD where tracks may be laid down and the required component orientation during wave soldering. Therefore a footprint related to the manufacturing process with all this information is an essential tool for SMD circuit board design. Footprint details depend on following parameters: • Component dimensions and tolerance as given in the component data • Board dimensional accuracy • Placement accuracy of the component with respect to the solder lands on the board • Solder paste position tolerances with respect to the solder lands (for reflow soldering only) • The soldering parameters • Solder resist position tolerances with respect to the solder lands • Solder joint parameters for reliable joints TYPICAL SMD FOOTPRINT E Occupied area G D Solder land/Solder paste pattern Solder resist pattern C B A F Tracks or Dummy tracks (for wave soldering only) REFLOW SOLDERING SIZE 0201 0402 0603 0805 1206 1210 A 0.65 1.50 2.30 2.80 4.00 4.00 B 0.23 0.40 0.70 1.00 2.20 2.20 FOOTPRINT DIMENSIONS IN mm C D E 0.21 0.30 n/a 0.50 0.50 0.10 0.80 0.80 0.20 0.90 1.30 0.40 0.90 1.60 1.60 0.90 2.50 1.60 F 0.90 1.75 2.55 3.05 4.25 4.25 G 0.60 0.95 1.40 1.85 2.25 3.15 PROCESSING REMARKS PLACEMENT ACCURACY Reflow or hot plate soldering ± 0.05 ± 0.15 ± 0.25 ± 0.25 ± 0.25 ± 0.25 PLACEMENT ACCURACY ± 0.10 ± 0.15 ± 0.25 ± 0.25 WAVE SOLDERING A B C D E F G PROPOSED NUMBER AND DIMENSIONS OF DUMMY TRACKS 2.40 3.20 4.80 5.30 1.00 1.40 2.30 2.30 0.70 0.90 1.25 1.50 0.80 1.30 1.70 2.60 0.20 0.36 1.25 1.25 3.10 4.10 5.90 6.30 1.90 2.50 3.20 4.20 1 x (0.20 x 0.80) 1 x (0.30 x 1.30) 3 x (0.25 x 1.70) 3 x (0.25 x 2.60) FOOTPRINT DIMENSIONS IN mm SIZE 0603 0805 1206 1210 DIMENSIONS IN mm A 2.85 + 0.10 / - 0.05 B 0.45 ± 0.05 D 0.80 ± 0.10 P 0.80 F 3.10 ± 0.30 Revision: 13-Aug-15 D SIZE P F FOOTPRINT FOR MLCC CHIP ARRAY B A Document Number: 45017 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000