Polymer Guide www.vishay.com Vishay Guide for Tantalum Solid Electrolyte Chip Capacitors with Polymer Cathode INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum/tantalum oxide/manganese dioxide system make solid tantalum capacitors an appropriate choice for today's surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, and several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, and particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. THE BASICS OF TANTALUM CAPACITORS Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dense, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve“metals and include titanium, zirconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two conducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Revision: 18-May-16 Rating for rating, tantalum capacitors tend to have as much as three times better capacitance/volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance/volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited during the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. The capacitance of any capacitor is determined by the surface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC Air or vacuum Paper Plastic Mineral oil Silicone oil Quartz Glass Porcelain Mica Aluminum oxide Tantalum pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 to 6.0 2.1 to 6.0 2.2 to 2.3 2.7 to 2.8 3.8 to 4.4 4.8 to 8.0 5.1 to 5.9 5.4 to 8.7 8.4 26 12 to 400K In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: where eA C = ------t C = capacitance e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. Document Number: 40076 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay SOLID ELECTROLYTE POLYMER TANTALUM CAPACITORS Solid electrolyte polymer capacitors utilize sintered tantalum pellets as anodes. Tantalum pentoxide dielectric layer is formed on the entire surface of anode, which is further impregnated with highly conductive polymer as cathode system. The conductive polymer layer is then coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the capacitor element and the outer termination (lead frame or other). Molded chip polymer tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for variety of applications in electronic devices. Usage of conductive polymer cathode system provides very low equivalent series resistance (ESR), which makes the capacitors particularly suitable for high frequency applications. TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T55 Epoxy encapsulation Silver adhesive Anode polarity bar Solderable cathode termination Polymer / carbon / silver coating Solderable anode termination Sintered tantalum pellet Lead frame welded to Ta wire TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T58 Rating / marking Encapsulation Side cathode termination (-) Anode polarity bar Silver adhesive epoxy Bottom cathode termination (-) Copper pad Side anode termination (+) Glass reinforced epoxy resin substrate Polymer / carbon / silver coating Conductive strip Sintered tantalum pellet Anode wire Revision: 18-May-16 Bottom anode termination (+) Document Number: 40076 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T52 Encapsulation Side cathode termination (-) Anode polarity marking Silver adhesive epoxy Bottom cathode termination (-) Side anode termination (+) Silver plated copper substrate Sintered tantalum pellet Polymer / carbon / silver coating Conductive strip Insulation adhesive epoxy TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T54 / T59 Top / bottom cathode termination (-) Encapsulation Side cathode termination (-) Anode polarity marking Silver adhesive epoxy Top / bottom anode termination (+) Non-conductive adhesive epoxy Conductive strip Glass reinforced epoxy substrate Side anode termination (+) Sintered tantalum pellet Top / bottom cathode termination (-) Polymer / carbon / silver coating Top / bottom anode termination (+) Revision: 18-May-16 Document Number: 40076 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay SOLID TANTALUM CAPACITORS - MOLDED CASE SERIES T55 PRODUCT IMAGE VPolyTanTM, molded case, high performance polymer High performance -55 °C to +105 °C 3.3 μF to 680 μF 2.5 V to 35 V ± 20 % 0.1 CV 8 % to 10 % 15 m to 500 m J, P, A, T, B, V, D Cases J, P: 100 % tin Case A: 100 % tin or Ni/Pd/Au Cases T, B, V, D: Ni/Pd/Au TYPE FEATURES TEMPERATURE RANGE CAPACITANCE RANGE VOLTAGE RANGE CAPACITANCE TOLERANCE LEAKAGE CURRENT DISSIPATION FACTOR ESR CASE SIZES TERMINATION FINISH SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED CASE SERIES T52 T58 T59 T54 vPolyTanTM solid tantalum surface mount chip capacitors, leadframeless molded polymer type vPolyTanTM solid tantalum surface mount chip capacitors, leadframeless molded polymer type vPolyTanTM solid tantalum surface mount chip capacitors, leadframeless molded polymer type Low profile -55 °C to +105 °C (above 85 °C, voltage derating is required) Small case size -55 °C to +105 °C (above 85 °C, voltage derating is required) Multianode -55 °C to +105 °C (above 85 °C, voltage derating is required) vPolyTanTM solid tantalum surface mount chip capacitors, leadframeless molded polymer type, commercial off-the-shelf (COTS) Hi-rel COTS, multianode -55 °C to +105 °C (above 85 °C, voltage derating is required) 330 μF to 2200 μF 1 μF to 330 μF 10 μF to 470 μF 10 μF to 470 μF 6.3 V to 16 V 4 V to 35 V 16 V to 75 V 16 V to 75 V ± 10 %, ± 20 % ± 20 % ± 10 %, ± 20 % ± 20 % PRODUCT IMAGE TYPE FEATURES TEMPERATURE RANGE CAPACITANCE RANGE VOLTAGE RANGE CAPACITANCE TOLERANCE LEAKAGE CURRENT DISSIPATION FACTOR ESR CASE SIZES TERMINATION Revision: 18-May-16 0.1 CV 10 % 8 % to 14 % 10 % 10 % 25 m to 55 m 90 m to 500 m MM, M0, W0, W9, A0, AA, B0, BB 100 % tin 25 m to 100 m 25 m to 100 m E1, M1 EE EE 100 % tin / lead Document Number: 40076 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay MOLDED CAPACITORS, T55 TYPE PLASTIC TAPE AND REEL PACKAGING DIMENSIONS in millimeters E A B C Label D W TAPE WIDTH A+0/-3 B+1/0 C ± 0.2 D ± 0.5 E ± 0.5 W ± 0.3 8 12 Ø 180 Ø 60 Ø 13 Ø 21 2.0 9.0 13.0 Note • A reel diameter of 330 mm is also applicable. PLASTIC TAPE SIZE DIMENSIONS in millimeters Pocket Perforation E Ø 1.5 + 0.10 F B W A P1 t Direction of tape flow 4.0 ± 0.1 2.0 ± 0.1 Inserting direction Perforation Marking side (upper) Mounting terminal side (lower) Symbol: R CASE CODE J P A T B V D A ± 0.2 1.0 1.4 1.9 3.1 3.1 4.8 4.8 B ± 0.2 1.8 2.2 3.5 3.8 3.8 7.7 7.7 W ± 0.3 8.0 8.0 8.0 8.0 8.0 12.0 12.0 F ± 0.1 3.5 3.5 3.5 3.5 3.5 5.5 5.5 E ± 0.1 1.75 1.75 1.75 1.75 1.75 1.75 1.75 P1 ± 0.1 4.0 4.0 4.0 4.0 4.0 8.0 8.0 tmax. 1.3 1.6 2.5 1.7 2.5 2.6 3.4 Note • A reel diameter of 330 mm is also applicable. Revision: 18-May-16 Document Number: 40076 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay LEADFRAMELESS MOLDED CAPACITORS, ALL TYPES PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape thickness Deformation between embossments 0.014 [0.35] max. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top cover tape B1 (max.) (6) 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.079 ± 0.002 0.069 ± 0.004 [2.0 ± 0.05] [1.75 ± 0.10] A0 K0 0.030 [0.75] min. (3) B0 0.030 [0.75] min. (4) Top cover tape For tape feeder 0.004 [0.10] max. reference only including draft. Concentric around B0 (5) F W 20° Maximum component rotation (Side or front sectional view) Center lines of cavity P1 D1 (min.) for components (5) . 0.079 x 0.047 [2.0 x 1.2] and larger USER DIRECTION OF FEED Maximum cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line B0 A0 (Top view) Typical component center line 3.937 [100.0] 0.039 [1.0] max. Tape 0.039 [1.0] max. 0.9843 [250.0] Camber (Top view) Allowable camber to be 0.039/3.937 [1/100] Non-cumulative over 9.843 [250.0] Tape and Reel Specifications: all case sizes are available on plastic embossed tape per EIA-481. Standard reel diameter is 7" [178 mm]. Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 Revision: 18-May-16 Document Number: 40076 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay CARRIER TAPE DIMENSIONS in inches [millimeters] CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F E1 K0 (MAX.) P1 W 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] TBD MM (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] M0 TBD M1 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 ± 0.002 [5.5 ± 0.05] 0.094 [2.39] 0.315 ± 0.04 [8.0 ± 1.0] 0.472 + 0.012 / - 0.004 [12.0 + 0.3 / - 0.10] W9 8 mm 0.126 [3.20] 0.030 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0] W0 8 mm 0.126 [3.20] 0.030 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0] A0 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0] AA 8 mm 0.154 [3.90] 0.039 [1.0] 0.138 [3.5] 0.079 [2.00] 0.157 [4.0] 0.315 [8.0] B0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0] BB 8 mm 0.157 [4.0] 0.039 [1.0] 0.138 [3.5] 0.087 [2.22] 0.157 [4.0] 0.315 [8.0] EE 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 ± 0.002 [5.5 ± 0.05] 0.175 [4.44] 0.315 ± 0.04 [8.0 ±1.0] 0.472 + 0.012 / - 0.004 [12.0 + 0.3 / - 0.10] Notes (1) For reference only. (2) Standard packaging of MM case is with paper tape. Plastic tape is available per request. PAPER TAPE AND REEL PACKAGING DIMENSIONS in inches [millimeters] T Ø D0 P2 P0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 A0 Bottom cover tape F W B0 E2 Top cover tape P1 Cavity center lines Anode Cavity size (1) G Bottom cover tape USER FEED DIRECTION CASE TAPE SIZE SIZE MM 8 mm A0 B0 D0 P0 P1 P2 E F W T 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] Note (1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. Revision: 18-May-16 Document Number: 40076 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay PACKING AND STORAGE Polymer capacitors meet moisture sensitivity level rating (MSL) of 3 as specified in IPC/JEDEC® J-STD-020 and are dry packaged in moisture barrier bags (MBB) per J-STD-033. Level 3 specifies a floor life (out of bag) of 168 hours at 30 °C maximum and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MBB with fresh desiccant. A moisture strip (humidity indicator card) is included in the bag to assure dryness. To remove excess moisture, capacitors can be dried at 40 °C (standard “dry box” conditions). For detailed recommendations please refer to J-STD-033. RECOMMENDED REFLOW PROFILES TP tp Max. ramp up rate = 3 °C/s Max. ramp down rate = 6 °C/s TL Temperature TSmax. tL Preheat area TSmin. tS 25 Time 25 °C to peak Time PROFILE FEATURE PREHEAT AND SOAK Temperature min. (TSmin.) Temperature max. (TSmax.) Time (tS) from (TSmin. to TSmax.) RAMP UP Ramp-up rate (TL to Tp) Liquidus temperature (TL) Time (tL) maintained above TL Peak package body temperature (Tp) max. Time (tp) within 5 °C of the peak max. temperature RAMP DOWN Ramp-down rate (Tp to TL) Time from 25 °C to peak temperature SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY 100 °C 150 °C 60 s to 120 s 150 °C 200 °C 60 s to 120 s 3 °C/s maximum 183 °C 217 °C 60 s to 150 s Depends on type and case - see table below 20 s 5s 6 °C/s maximum 6 min maximum 8 min maximum PEAK PACKAGE BODY TEMPERATURE (Tp) MAXIMUM TYPE CASE CODE T55 T52 T58 T59 T54 J, P, A, T, B, V, D E1, M1 MM, M0, W9, W0, A0, AA, B0, BB EE EE PEAK PACKAGE BODY TEMPERATURE (TP) MAX. SnPb EUTECTIC ASSEMBLY n/a 220 °C LEAD (Pb)-FREE ASSEMBLY 260 °C 260 °C 260 °C 250 °C 250 °C Notes • T52, T55, and T58 capacitors are process sensitive. PSL classification to JEDEC J-STD-075: R4G • T54 capacitors with 100 % tin termination and T59 capacitors are process sensitive. PSL classification to JEDEC J-STD-075: R6G Revision: 18-May-16 Document Number: 40076 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay MOLDED CAPACITORS, T55 TYPE PAD DIMENSIONS in millimeters L X Capacitor Pattern Y W G Z CAPACITOR SIZE PAD DIMENSIONS CASE / DIMENSIONS L W G (max.) Z (min.) X (min.) Y (Ref.) J 1.6 0.8 0.7 2.5 1.0 0.9 P 2.0 1.25 0.5 2.6 1.2 1.05 A 3.2 1.6 1.1 3.8 1.5 1.35 T/B 3.5 2.8 1.4 4.1 2.7 1.35 V/D 7.3 4.3 4.1 8.2 2.9 2.05 LEADFRAMELESS MOLDED CAPACITORS, ALL TYPES PAD DIMENSIONS in inches [millimeters] B D C A TYPE CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.) E1 0.209 [5.30] 0.098 [2.5] 0.169 [4.3] 0.366 [9.3] M1 0.276 [7.00] 0.098 [2.5] 0.169 [4.3] 0.366 [9.3] MM / M0 0.039 [1.00] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00] W0 / W9 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] AA / A0 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] BB / B0 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] EE 0.209 [5.30] 0.098 [2.5] 0.169 [4.3] 0.366 [9.3] T52 T58 T59 / T54 Revision: 18-May-16 Document Number: 40076 9 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Polymer Guide www.vishay.com Vishay GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: I R MS = Reverse Voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at +25 °C, 5 % of the DC rating at +25 °C, 5 % of the DC rating at +85 °C, and 1 % of the DC rating at +105 °C. 5. Mounting Precautions: 5.1 Limit Pressure on Capacitor Installation with Mounter: pressure must not exceed 4.9 N with a tool end diameter of 1.5 mm when applied to the capacitors using an absorber, centering tweezers, or similar (maximum permitted pressurization time: 5 s). An excessively low absorber setting position would result in not only the application of undue force to the capacitors but capacitor and other component scattering, circuit board wiring breakage, and / or cracking as well, particularly when the capacitors are mounted together with other chips having a height of 1 mm or less. P -----------R ESR where, P= 4. power dissipation in W at +45 °C as given in the tables in the product datasheets. RESR = the capacitor equivalent series resistance at the specified frequency. 2. AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: P V R MS = Z -----------R ESR or, from the formula: V RMS = I R MS x Z where, P= power dissipation in W at +45 °C as given in the tables in the product datasheets. RESR = The capacitor equivalent series resistance at the specified frequency. Z= 2.1 The capacitor impedance at the specified frequency. The tantalum capacitors must be used in such a condition that the sum of the working voltage and ripple voltage peak values does not exceed the rated voltage as shown in figure below. Voltage Ripple voltage Rated voltage Operating voltage Working voltage Time (s) 3. Temperature Derating: power dissipation is affected by the heat sinking capability of the mounting surface. If these capacitors are to be operated at temperatures above +45 °C, the permissible ripple current (or voltage) shall be calculated using the derating coefficient as shown in the table below: 5.2 Flux Selection 5.2.1 Select a flux that contains a minimum of chlorine and amine. 5.2.2 After flux use, the chlorine and amine in the flux remain must be removed. 5.3 Cleaning After Mounting: the following solvents are usable when cleaning the capacitors after mounting. Never use a highly active solvent. • Halogen organic solvent (HCFC225, etc.) • Alcoholic solvent (IPA, ethanol, etc.) • Petroleum solvent, alkali saponifying agent, water, etc. Circuit board cleaning must be conducted at a temperature of not higher than 50 °C and for an immersion time of not longer than 30 minutes. When an ultrasonic cleaning method is used, cleaning must be conducted at a frequency of 48 kHz or lower, at an vibrator output of 0.02 W/cm3, at a temperature of not higher than 40 °C, and for a time of 5 minutes or shorter. Notes • Care must be exercised in cleaning process so that the mounted capacitor will not come into contact with any cleaned object or the like or will not get rubbed by a stiff brush or similar. If such precautions are not taken particularly when the ultrasonic cleaning method is employed, terminal breakage may occur. • When performing ultrasonic cleaning under conditions other than stated above, conduct adequate advance checkout. MAXIMUM RIPPLE CURRENT TEMPERATURE DERATING FACTOR 45 °C 1.0 55 °C 0.8 85 °C 0.6 105 °C 0.4 Revision: 18-May-16 Document Number: 40076 10 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000