TL8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, MICROTAN®, High CV Leadframeless Molded Low Profile FEATURES • Ultra-low profile: 0.8 mm to 1.0 mm in a variety of case sizes • Highest capacitance-voltage product in industry • Lead (Pb)free L-shaped terminations for superior board mounting • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PERFORMANCE CHARACTERISTICS www.vishay.com/doc?40169 Capacitance Tolerance: ± 10 % ± 20 % Voltage Range: 4 VDC to 25 VDC Capacitance Range: 0.68 μF to 220 μF Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) ORDERING INFORMATION TL8 A0 227 M 004 C TYPE CASE CODE CAPACITANCE CAPACITANCE TOLERANCE DC VOLTAGE RATING AT +85 °C TERMINATION / PACKAGING See Ratings and Case Codes table. This is expressed in pF. The first two digits are the significant figures. The third is the number of zeros to follow. M = ± 20 % K = ± 10 % This is expressed in V. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). C = 100 % tin 7" (178 mm) reel Note • Preferred tolerance and reel sizes are in bold. We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage substitutions will be marked with the higher voltage rating. DIMENSIONS in inches [millimeters] Anode Polarity Bar Anode Termination W C P1 Cathode Termination H L P1 P2 CASE CODE H (MAX.) L W P1 P2 (REF.) C W9 0.035 [0.9] 0.079 ± 0.008 [2.00 ± 0.20] 0.050 ± 0.008 [1.25 ± 0.20] 0.020 ± 0.004 [0.50 ± 0.10] 0.040 [1.00] 0.035 ± 0.004 [0.90 ± 0.10] A0 0.039 [1.0] 0.126 ± 0.008 [3.20 ± 0.20] 0.063 ± 0.008 [1.60 ± 0.20] 0.031 ± 0.004 [0.80 ± 0.10] 0.063 [1.60] 0.047 ± 0.004 [1.20 ± 0.10] B0 0.039 [1.0] 0.138 ± 0.008 [3.50 ± 0.20] 0.110 ± 0.008 [2.80 ± 0.20] 0.031 ± 0.004 [0.80 ± 0.20] 0.078 [1.95] 0.095 ± 0.004 [2.40 ± 0.10] Revision: 11-May-16 Document Number: 40156 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TL8 www.vishay.com Vishay Sprague RATINGS AND CASE CODES μF 4V 6.3 V 10 V 16 V 0.68 1.0 W9 1.5 W9 2.2 W9 W9 W9 3.3 W9 W9 4.7 W9 W9 20 V 25 V W9 W9 W9 W9 W9 W9 6.8 10 W9 15 W9 W9 W9 W9 W9 22 W9 W9 33 W9 W9 47 W9 B0 A0 68 100 A0 A0 150 220 A0 MARKING VOLTAGE CODE Wx-cases Polarity bar Voltage code Capacitance code Ae Ax-cases Polarity bar Voltage code EIA capacitance code (pF) J 107 Revision: 11-May-16 CAPACITANCE CODE V CODE CAP, μF CODE 2.5 e 0.68 w 4.0 G 1.0 A 6.3 J 2.2 J 10 A 3.3 N 16 C 4.7 S 20 D 6.8 W 25 E 10 35 V 15 e 50 T 22 j 33 n 47 s 33 20 68 w 2 100 A 150 E 220 J Mx-cases Polarity bar Voltage code E Bx-cases Polarity bar Capacitance Voltage Vishay marking Document Number: 40156 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TL8 www.vishay.com Vishay Sprague STANDARD RATINGS MAX. ESR AT +25 °C 100 kHz () MAX. RIPPLE 100 kHz IRMS (A) 8 5.0 0.084 0.9 15 4.0 0.094 TL8W9336M004C 2.6 30 4.0 0.094 TL8W9476M004C 3.8 40 7.5 0.068 TL8A0227M004C 88 80 7.0 0.089 MAX. DCL AT +25 °C (μA) CAPACITANCE (μF) CASE CODE 10 W9 TL8W9106(1)004C 0.5 22 W9 TL8W9226M004C 33 W9 47 W9 220 A0 PART NUMBER MAX. DF AT +25 °C 120 Hz (%) 4 VDC AT +40 °C; 2.5 VDC +85 °C; 1.6 VDC AT +125 °C 6.3 VDC AT +40 °C; 4.0 VDC +85 °C; 2.5 VDC AT +125 °C 2.2 W9 TL8W9225(1)6R3C 0.5 10 5.0 0.084 3.3 W9 TL8W9335(1)6R3C 0.5 8 6.0 0.076 4.7 W9 TL8W9475(1)6R3C 0.5 8 3.0 0.108 10 W9 TL8W9106(1)6R3C 0.6 8 5.0 0.084 15 W9 TL8W9156(1)6R3C 1.0 20 7.0 0.071 22 W9 TL8W9226M6R3C 2.8 20 5.5 0.080 33 W9 TL8W9336M6R3C 4.2 30 7.5 0.068 100 A0 TL8A0107M6R3C 6.3 30 1.1 0.220 10 VDC AT +40 °C; 6.3 VDC +85 °C; 4.0 VDC AT +125 °C 1.0 W9 TL8W9105(1)010C 0.5 6 12.0 0.054 1.5 W9 TL8W9155(1)010C 0.5 6 14.0 0.050 2.2 W9 TL8W9225(1)010C 0.5 10 10.0 0.059 3.3 W9 TL8W9335(1)010C 0.5 8 6.0 0.076 4.7 W9 TL8W9475(1)010C 0.5 6 5.0 0.084 10 W9 TL8W9106(1)010C 1.0 20 7.5 0.068 15 W9 TL8W9156M010C 1.5 30 7.5 0.068 22 W9 TL8W9226M010C 22 40 10.0 0.084 47 A0 TL8A0476M010C 15 30 5.0 0.105 100 A0 TL8A0107M010C 100 50 7.0 0.089 1.0 W9 TL8W9105(1)016C 0.5 6 12.0 0.054 2.2 W9 TL8W9225(1)016C 0.5 10 12.0 0.054 4.7 W9 TL8W9475M016C 0.8 12 12.0 0.054 0.68 W9 TL8W9684(1)020C 0.5 6 20.0 0.042 1.0 W9 TL8W9105(1)020C 0.5 6 10.0 0.059 33 B0 TL8B0336M020C 33 15 5.0 0.118 0.68 W9 TL8W9684(1)025C 0.5 6 20.0 0.042 1.0 W9 TL8W9105(1)025C 0.5 6 10.0 0.059 16 VDC AT +40 °C; 10 VDC +85 °C; 6.3 VDC AT +125 °C 20 VDC AT +40 °C; 13 VDC +85 °C; 8 VDC AT +125 °C 25 VDC AT +40 °C; 17 VDC +85 °C; 10 VDC AT +125 °C Note • Part number definition: (1) Capacitance tolerance: K = 10 %, M = 20 % Revision: 11-May-16 Document Number: 40156 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TL8 www.vishay.com Vishay Sprague STANDARD PACKAGING QUANTITY QUANTITY (pcs/reel) 7" REEL 2500 3000 3000 CASE CODE A0 W9 B0 RECOMMENDED VOLTAGE DERATING -55 °C TO +40 °C RATING RATED VOLTAGE (V) 4.0 6.3 10 16 20 25 +40 °C TO +85 °C RATING CATEGORY VOLTAGE (V) 2.5 4.0 6.3 10 13 17 +85 °C TO +125 °C RATING CATEGORY VOLTAGE (V) 1.6 2.5 4.0 6.3 8.0 10 VOLTAGE VS. TEMPERATURE RATING 120 RATED VOLTAGE (%) 100 80 100 % 100 % 80 % 80 % 100 % Rated range Recommended derating 80 % 63 % 60 40 % 50 % 40 TL8 recommended derating 33 % 20 0 - 55 0 + 40 TEMPERATURE (°C) + 85 + 125 POWER DISSIPATION CASE CODE A0 W9 B0 PRODUCT INFORMATION Micro Guide Pad Dimensions Packaging Dimensions Moisture Sensitivity Typical Performance Characteristics SELECTOR GUIDES Solid Tantalum Selector Guide Solid Tantalum Chip Capacitors FAQ Frequently Asked Questions Revision: 11-May-16 MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR 0.055 0.035 0.070 www.vishay.com/doc?40115 www.vishay.com/doc?40135 www.vishay.com/doc?40169 www.vishay.com/doc?49053 www.vishay.com/doc?40091 www.vishay.com/doc?40110 Document Number: 40156 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague Guide for Leadframeless Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for today’s surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, and several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, and particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. Rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited during the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. The capacitance of any capacitor is determined by the surface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC Air or Vacuum Paper 1.0 2.0 to 6.0 Plastic 2.1 to 6.0 Mineral Oil 2.2 to 2.3 Silicone Oil 2.7 to 2.8 Quartz 3.8 to 4.4 Glass 4.8 to 8.0 Porcelain 5.1 to 5.9 Mica 5.4 to 8.7 THE BASICS OF TANTALUM CAPACITORS Aluminum Oxide Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dense, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve” metals and include titanium, zirconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two conducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Tantalum Pentoxide Revision: 09-Mar-16 e DIELECTRIC CONSTANT Ceramic 8.4 26 12 to 400K In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: eA C = ------t where C = capacitance e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. Document Number: 40115 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID ELECTROLYTE TANTALUM CAPACITORS Solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. The pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. The pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. Molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer and commercial electronics with the added feature of low cost. Surface mount designs of “Solid Tantalum” capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. Side Cathode Termination (-) Voltage Code Excluding 0402 (1005 metric) case size TANTALUM CAPACITORS FOR ALL DESIGN CONSIDERATIONS Solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. They will typically withstand up to about 10 % of the rated DC working voltage in a reverse direction. Also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. Vishay Sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. Vishay Sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. Data sheets covering the various types and styles of Vishay Sprague capacitors for consumer and entertainment electronics, industry, and military applications are available where detailed performance characteristics must be specified. Epoxy Resin Encapsulation Polarity Bar Marking Sintered Tantalum Pellet Side Anode Termination (+) MnO2/Carbon/ Silver Coating Bottom Cathode Termination (-) Silver Adhesive Epoxy Glass Reinforced Epoxy Resin Bottom Anode Termination (+) Fig. 1 - Leadframeless Molded Capacitors, All Types Revision: 09-Mar-16 Document Number: 40115 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TL8 298D 298W TR8 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Small size including 0603 and 0402 foot print FEATURES Ultra low profile Industrial grade Industrial grade, extended range Low ESR TEMPERATURE RANGE Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) CAPACITANCE RANGE 0.68 μF to 220 μF 0.68 μF to 330 μF 2.2 μF to 220 μF 1 μF to 330 μF 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V VOLTAGE RANGE CAPACITANCE TOLERANCE DISSIPATION FACTOR ± 20 %, ± 10 % 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 % CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B TERMINATION 100 % tin 100 % tin or gold plated SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TP8 TM8 DLA 11020 T42 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Built in fuse, double-stacked Small size including 0603 and 0402 foot print FEATURES High performance, automotive grade VOLTAGE RANGE CASE CODES TERMINATION Revision: 09-Mar-16 High reliability, ultra-low ESR 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V CAPACITANCE TOLERANCE DISSIPATION FACTOR High reliability, DLA approved Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) TEMPERATURE RANGE CAPACITANCE RANGE High reliability ± 20 %, ± 10 % 6 % to 30 % 6 % to 20 % 6 % to 8 % M, W, R, P, A, N, T, B K, M, W, R, P, A, N, T M, W, R, P, A, N, T 6 % to 15 % M2 100 % tin Tin / lead solder plated or 100 % tin Tin / lead solder plated or gold plated Tin / lead solder plated or 100 % tin Document Number: 40115 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape thickness Deformation between embossments 0.014 [0.35] max. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top cover tape B1 (max.) (6) 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.079 ± 0.002 0.069 ± 0.004 [2.0 ± 0.05] [1.75 ± 0.10] A0 K0 0.030 [0.75] min. (3) B0 W 0.030 [0.75] min. (4) Top cover tape For tape feeder 0.004 [0.10] max. reference only including draft. Concentric around B0 (5) F 20° Maximum component rotation (Side or front sectional view) Center lines of cavity P1 D1 (min.) for components (5) . 0.079 x 0.047 [2.0 x 1.2] and larger USER DIRECTION OF FEED Maximum cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line B0 A0 (Top view) Typical component center line 3.937 [100.0] 0.039 [1.0] max. Tape 0.039 [1.0] max. 0.9843 [250.0] Camber (Top view) Allowable camber to be 0.039/3.937 [1/100] Non-cumulative over 9.843 [250.0] Tape and Reel Specifications: all case sizes are available on plastic embossed tape per EIA-481. Standard reel diameter is 7" [178 mm]. Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 CASE CODE M (2) W R P A A0, Q B W9, S B0 TAPE SIZE 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 12 mm B1 (MAX.) (1) 0.075 [1.91] 0.112 [2.85] 0.098 [2.46] 0.108 [2.75] 0.153 [3.90] 0.157 [4.0] 0.126 [3.20] 0.181 [4.61] D1 (MIN.) 0.02 [0.5] 0.039 [1.0] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.029 [0.75] 0.059 [1.5] F 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.217 [5.5] K0 (MAX.) 0.043 [1.10] 0.053 [1.35] 0.066 [1.71] 0.054 [1.37] 0.078 [2.00] 0.049 [1.25] 0.087[2.22] 0.045 [1.15] 0.049 [1.25] P1 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] W 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.472 [12.0] Notes For reference only Packaging of M case in plastic tape is available per request (1) (2) Revision: 09-Mar-16 Document Number: 40115 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] N 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0] T 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0] Notes (1) For reference only CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0] Note (1) For reference only PAPER TAPE AND REEL PACKAGING in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 T P2 Ø D0 P0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 A0 Bottom cover tape F W B0 E2 Top cover tape P1 Cavity center lines Anode Cavity size (1) G Bottom cover tape USER FEED DIRECTION CASE TAPE SIZE SIZE A0 B0 D0 P0 P1 P2 E F W T K 8 mm 0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002 [0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.75 ± 0.05] M 8 mm 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] Note (1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. Revision: 09-Mar-16 Document Number: 40115 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague RECOMMENDED REFLOW PROFILES TP tp Max. Ramp Up Rate = 3 °C/s Max. Ramp Down Rate = 6 °C/s TL Temperature TSmax. tL Preheat Area TSmin. tS 25 Time 25 °C to Peak Time PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY Temperature min. (TSmin.) 100 °C 150 °C Temperature max. (TSmax.) 150 °C 200 °C 60 s to 90 s 60 s to 150 s PREHEAT AND SOAK Time (tS) from (TSmin. to TSmax.) RAMP UP Ramp-up rate (TL to Tp) 3 °C/s maximum Liquidous temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) max. Time (tp) within 5 °C of the peak max. temperature 235 °C 260 °C 20 s 30 s RAMP DOWN Ramp-down rate (Tp to TL) 6 °C/s maximum Time from 25 °C to peak temperature 6 min maximum 8 min maximum Note • Capacitors should withstand reflow profile as per J-STD-020 standard PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.) K 0.028 [0.70] 0.018 [0.45] 0.024 [0.60] 0.059 [1.50] M 0.039 [1.00] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00] R, W, W9, S 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] P 0.063 [1.60] 0.031 [0.80] 0.047 [1.20] 0.110 [2.80] A, Q, A0 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] B, B0, N, T 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] M2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0] Revision: 09-Mar-16 Document Number: 40115 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL LEAKAGE CURRENT FACTOR RANGE LEAKAGE CURRENT FACTOR 100 + 125 °C + 85 °C 10 + 55 °C + 25 °C 1.0 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 100 100 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10 10 47 μF - 4 V 1 22 μF - 4 V 1 0.1 1 10 FREQUENCY, kHz 100 0.1 0.1 1000 1 100 1000 FREQUENCY, kHz “M” Case 1000 10 “M” Case 1000 IMPEDANCE ESR IMPEDANCE ESR 100 ESR/Z, Ω ESR/Z, Ω 100 10 4.7 μF - 10 V 10 1 10 μF - 6 V 1 0.1 Revision: 09-Mar-16 1 10 FREQUENCY, kHz 100 1000 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 10 000 1000 IMPEDANCE ESR IMPEDANCE ESR 1000 ESR/Z, Ω ESR/Z, Ω 100 100 10 1 μF - 16 V 10 10 μF - 10 V 1 0.1 1 1 10 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz FREQUENCY, kHz “P” CASE “P” CASE 100.0 1000.0 IMPEDANCE IMPEDANCE ESR ESR 100.0 ESR/Z, Ω ESR/Z, Ω 10.0 10.0 1.0 1.0 4.7 μF - 25 V 33 μF - 10 V 0.1 0.1 0.1 0.1 1 10 100 1000 1 FREQUENCY, kHz 10 100 1000 FREQUENCY, kHz “P” CASE “P” CASE 10.0 100.0 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10.0 1.0 1.0 47 μF - 10 V 0.1 0.1 1 10 FREQUENCY, kHz Revision: 09-Mar-16 100 1000 220 μF - 4 V 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: I R MS = 2. P -----------R ESR where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: P V R MS = Z -----------R ESR or, from the formula: V RMS = I R MS x Z 2.1 2.2 3. 4. where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency Z= the capacitor impedance at the specified frequency The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at +25 °C. Reverse Voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at +25 °C, 5 % of the DC rating at +25 °C, 5 % of the DC rating at +85 °C, and 1 % of the DC rating at +125 °C. Temperature Derating: if these capacitors are to be operated at temperatures above +25 °C, the permissible RMS ripple current shall be calculated using the derating factors as shown: TEMPERATURE +25 °C +85 °C +125 °C 5. DERATING FACTOR 1.0 0.9 0.4 Power Dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent IRMS value be established when calculating permissible operating levels. (Power Dissipation calculated using +25 °C temperature rise.) Revision: 09-Mar-16 6. Printed Circuit Board Materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: the recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 7.2.1 Backward and Forward Compatibility: capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC / ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. Document Number: 40115 9 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000