T42 www.vishay.com Vishay Solid Tantalum Surface-Mount Capacitors TANTAMOUNT™, Low ESR, Hi-Rel COTS, Built-in-Fuse, Leadframeless Molded FEATURES • Individually fused multiple anode construction ensures fail-safe operation and graceful Available degradation in the event of failure • High-reliability design with reliability Available screening available • Surge current testing per MIL-PRF-55365 options available Available • Ultra-low ESR • Fuse characteristics: guaranteed fuse protection at 5 A, 10 ms • Fuse characteristics are optimized to ensure activation to protect against catastrophic failures while avoiding false triggering • Terminations: wraparound Sn / Pb, standard. 100 % tin available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PERFORMANCE CHARACTERISTICS Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Capacitance: 10 μF to 470 μF Capacitance Tolerance: ± 10 %, ± 20 % Voltage Rating: 16 VDC to 75 VDC Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details. ORDERING INFORMATION T42 M2 227 M 025 E S A TYPE CASE CODE CAPACITANCE CAPACITANCE TOLERANCE DC VOLTAGE RATING AT +85 °C TERMINATION / PACKAGING (available options are series dependent) RELIABILITY LEVEL SURGE CURRENT See Ratings and Case Codes table This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow. K = ± 10 % M = ± 20 % This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V) E = Sn / Pb solder / 7" (178 mm) reel L = Sn / Pb solder / 7" (178 mm), 1/2 reel C = 100 % tin / 7" (178 mm), reel H = 100 % tin / 7" (178 mm), 1/2 reel U = 100 % tin / 7" (178 mm), partial reel (100 pcs/reel) R = Sn / Pb 7" (178 mm), partial reel (100 pcs/reel) S = 40 h burn-in Z = nonestablished reliability A = 10 cycles at +25 °C B = 10 cycles at -55 °C / +85 °C Note • We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Low ESR solid tantalum chip capacitors allow delta ESR of 1.25 times the datasheet limits after mounting. Revision: 11-May-16 Document Number: 40165 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T42 www.vishay.com Vishay DIMENSIONS in inches [millimeters] Anode termination Anode polarity bar Cathode termination W H P1 P2 P1 L CASE CODE L W H P1 P2 (REF.) M2 0.319 ± 0.008 [8.1 ± 0.2] 0.276 ± 0.008 [7.0 ± 0.2] 0.177 max. [4.5 max.] 0.055 ± 0.019 [1.4 ± 0.5] 0.208 [5.3] RATINGS AND CASE CODES μF 16 V 20 V 25 V 35 V 50 V 63 V M2 (1) 10 15 M2 (1) 22 M2 (1) M2 (1) 33 47 M2 (1) 68 M2 (1) 100 M2 (1) M2 (1) 150 220 M2 330 470 75 V M2 M2 (1) (1) Note (1) Rating in development, contact factory for availability MARKING + + + VISHAY®T42 2 220μF-25V Polarity Family Vishay marking Revision: 11-May-16 Document Number: 40165 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T42 www.vishay.com Vishay STANDARD RATINGS CAPACITANCE (μF) CASE CODE PART NUMBER 470 M2 (1) T42M2477(1)016(2)(3)(4) MAX. DCL AT +25 °C (μA) MAX. ESR AT +25 °C 100 kHz (m) MAX. RIPPLE 100 kHz IRMS (A) 20 200 0.6 18 200 0.6 MAX. DF AT +25 °C (%) 16 VDC AT +85 °C; 10 VDC AT +125 °C 75.2 20 VDC AT +85 °C; 13 VDC AT +125 °C 330 M2 (1) T42M2337(1)020(2)(3)(4) 66.0 25 VDC AT +85 °C; 17 VDC AT +125 °C 150 M2 (1) T42M2157(1)025(2)(3)(4) 37.5 12 180 0.7 220 M2 T42M2227M025(2)(3)(4) 55.0 15 200 0.6 35 VDC AT +85 °C; 23 VDC AT +125 °C 47 M2 (1) T42M2476(1)035(2)(3)(4) 16.5 10 200 0.6 68 M2 (1) T42M2686(1)035(2)(3)(4) 23.8 10 200 0.6 100 M2 (1) T42M2107(1)035(2)(3)(4) 35.0 12 200 0.6 10 250 0.6 50 VDC AT +85 °C; 33 VDC AT +125 °C 33 M2 (1) T42M2336(1)050(2)(3)(4) 15 M2 (1) T42M2156(1)063(2)(3)(4) 9.5 8 500 0.4 22 M2 (1) T42M2226(1)063(2)(3)(4) 13.9 10 350 0.5 10 M2 (1) T42M2106(1)075(2)(3)(4) 8 600 0.4 16.5 63 VDC AT +85 °C; 42 VDC AT +125 °C 75 VDC AT +85 °C; 50 VDC AT +125 °C 7.5 Notes • Part number definitions: (1) Capacitance tolerance: K = 10 %, M = 20 % (2) Termination and packaging: C, E, H, L, U, R (3) Reliability level: S, Z (4) Surge current: A, B (1) Rating in development, contact factory for availability RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperatures below +85 °C) STANDARD CONDITIONS. FOR EXAMPLE: OUTPUT FILTERS Capacitor Voltage Rating Operating Voltage 16 10 20 12 25 15 35 24 50 28 63 37.8 75 45 SEVERE CONDITIONS. FOR EXAMPLE: INPUT FILTERS Revision: 11-May-16 Capacitor Voltage Rating Operating Voltage 16 8.0 20 10 25 12 35 15 50 24 63 32 75 37 Document Number: 40165 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T42 www.vishay.com Vishay CARRIER TAPE DIMENSIONS in inches [millimeters] TYPE CASE CODE TAPE WIDTH W (mm) P1 K0 max. B1 max. T42 M2 16 0.476 ± 0.004 [12.0 ± 0.1] 0.193 [4.9] 0.193 [8.6] STANDARD PACKAGING QUANTITY QUANTITY (PCS/REEL) CASE CODE 7" REEL 7" HALF REEL 7" PARTIAL REEL 320 160 100 M2 POWER DISSIPATION CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION (W) AT +25 °C IN FREE AIR M2 0.084 ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM PERFORMANCE CHARACTERISTICS Category temperature range -55 °C to +85 °C (to +125 °C with voltage derating) Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz Dissipation factor Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz. ESR Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz. Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Capacitance change by temperature +12 % max. (at +125 °C) +10 % max. (at +85 °C) -10 % max. (at -55 °C) For capacitance value > 300 μF +20 % max. (at +125 °C) +15 % max. (at +85 °C) -15 % max. (at -55 °C) Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at +25 °C 5 % of the DC rating at +85 °C Vishay does not recommend intentional or repetitive application of reverse voltage. Ripple current and Temperature derating For maximum permissible ripple current (IRMS) or / and voltage (VRMS) please refer to product datasheet and Guide to Application. If capacitors are to be used at temperatures above +25 °C, the permissible RMS ripple current or voltage shall be calculated using the derating factors: 1.0 at +25 °C 0.9 at +85 °C 0.4 at +125 °C Maximum operating voltage OPERATING TEMPERATURE +85 °C +125 °C RATED VOLTAGE (V) SURGE VOLTAGE(V) RATED VOLTAGE (V) SURGE VOLTAGE(V) 16 20 10 12 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40 50 (1) 60 33 40 63 76 42 50 75 90 50 60 Note (1) Capacitance values 15 μF and higher Revision: 11-May-16 Document Number: 40165 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T42 www.vishay.com Vishay TYPICAL LEAKAGE CURRENT FACTOR RANGE 100 Leakage Current Factor +125 °C 10 +85 °C +55 °C +25 °C 1.0 0 °C 0.1 -55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 Percent of Rated Voltage Notes • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table CAPACITOR PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Surge voltage 85 °C, 1000 successive test cycles at 1.3 of rated voltage in series with a 1 k resistor at the rate of 30 s ON, 30 s OFF, MIL-PRF-55365 Capacitance change Within ± 10 % of initial Dissipation factor Not to exceed initial Leakage current Not to exceed initial Within ± 10 % of initial Life test at +85 °C 2000 h application of rated voltage at 85 °C, MIL-STD-202 method 108 Capacitance change Leakage current Not to exceed 125 % of initial Life test at +125 °C 1000 h application of 2/3 rated voltage at 125 °C, MIL-STD-202 method 108 Capacitance change Within ± 20 % of initial Leakage current Not to exceed 125 % of initial ENVIRONMENTAL CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Moisture resistance MIL-STD-202, method 106, rated voltage. Capacitance change Thermal shock Revision: 11-May-16 Capacitors are subjected to 5 cycles MIL-STD-202 method 107 of the following: -55 °C (+ 0 °C, - 5 °C) for 30 min, then +25 °C (+ 10 °C, - 5 °C) for 5 min, then +125 °C (+ 3 °C, - 0 °C) for 30 min, then +25 °C (+ 10 °C, - 5 °C) for 5 min per Cap. 600 μF Within ± 10 % of initial Cap. > 600 μF Within ± 20 % of initial Dissipation factor Initial specified value or less Leakage current Initial specified value or less Capacitance change Cap. 600 μF Within ± 10 % of initial Cap. > 600 μF Within ± 20 % of initial Dissipation factor Initial specified value or less Leakage current Initial specified value or less Document Number: 40165 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T42 www.vishay.com Vishay MECHANICAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Shear test Apply a pressure load of 5 N for 10 s ± 1 s horizontally to the center of capacitor side body. AEC-Q200-006 There shall be no visual damage when viewed at 20 x magnification and the component shall meet the original electrical requirements. Vibration MIL-STD-202, method 204, condition D, 10 Hz to 2000 Hz, 20 g peak There shall be no mechanical or visual damage to capacitors post-conditioning. Shock (specified pulse) MIL-STD-202, method 213, condition I, 100 g peak Capacitance change Within ± 10 % of initial Dissipation factor Initial specified value or less Leakage current Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Resistance to soldering heat MIL-STD-202, method 210, condition J, except with only one heat cycle Capacitance change Within ± 10 % of initial Dissipation factor Initial specified value or less Leakage current Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Solderability MIL-STD-202, method 208, ANSI/J-STD-002, test B. Applies only to solder and tin plated terminations. Does not apply to gold terminations. All terminations shall exhibit a continuous solder coating free from defects for a minimum of 95 % of the critical area of any individual lead. Resistance to solvent MIL-STD-202, method 215 Marking has to remain legible, no degradation of encapsulation material. Revision: 11-May-16 Document Number: 40165 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague Guide for Leadframeless Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for today’s surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, and several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, and particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. Rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited during the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. The capacitance of any capacitor is determined by the surface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC Air or Vacuum Paper 1.0 2.0 to 6.0 Plastic 2.1 to 6.0 Mineral Oil 2.2 to 2.3 Silicone Oil 2.7 to 2.8 Quartz 3.8 to 4.4 Glass 4.8 to 8.0 Porcelain 5.1 to 5.9 Mica 5.4 to 8.7 THE BASICS OF TANTALUM CAPACITORS Aluminum Oxide Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dense, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve” metals and include titanium, zirconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two conducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Tantalum Pentoxide Revision: 09-Mar-16 e DIELECTRIC CONSTANT Ceramic 8.4 26 12 to 400K In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: eA C = ------t where C = capacitance e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. Document Number: 40115 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID ELECTROLYTE TANTALUM CAPACITORS Solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. The pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. The pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. Molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer and commercial electronics with the added feature of low cost. Surface mount designs of “Solid Tantalum” capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. Side Cathode Termination (-) Voltage Code Excluding 0402 (1005 metric) case size TANTALUM CAPACITORS FOR ALL DESIGN CONSIDERATIONS Solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. They will typically withstand up to about 10 % of the rated DC working voltage in a reverse direction. Also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. Vishay Sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. Vishay Sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. Data sheets covering the various types and styles of Vishay Sprague capacitors for consumer and entertainment electronics, industry, and military applications are available where detailed performance characteristics must be specified. Epoxy Resin Encapsulation Polarity Bar Marking Sintered Tantalum Pellet Side Anode Termination (+) MnO2/Carbon/ Silver Coating Bottom Cathode Termination (-) Silver Adhesive Epoxy Glass Reinforced Epoxy Resin Bottom Anode Termination (+) Fig. 1 - Leadframeless Molded Capacitors, All Types Revision: 09-Mar-16 Document Number: 40115 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TL8 298D 298W TR8 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Small size including 0603 and 0402 foot print FEATURES Ultra low profile Industrial grade Industrial grade, extended range Low ESR TEMPERATURE RANGE Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) CAPACITANCE RANGE 0.68 μF to 220 μF 0.68 μF to 330 μF 2.2 μF to 220 μF 1 μF to 330 μF 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V VOLTAGE RANGE CAPACITANCE TOLERANCE DISSIPATION FACTOR ± 20 %, ± 10 % 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 % CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B TERMINATION 100 % tin 100 % tin or gold plated SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TP8 TM8 DLA 11020 T42 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Built in fuse, double-stacked Small size including 0603 and 0402 foot print FEATURES High performance, automotive grade VOLTAGE RANGE CASE CODES TERMINATION Revision: 09-Mar-16 High reliability, ultra-low ESR 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V CAPACITANCE TOLERANCE DISSIPATION FACTOR High reliability, DLA approved Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) TEMPERATURE RANGE CAPACITANCE RANGE High reliability ± 20 %, ± 10 % 6 % to 30 % 6 % to 20 % 6 % to 8 % M, W, R, P, A, N, T, B K, M, W, R, P, A, N, T M, W, R, P, A, N, T 6 % to 15 % M2 100 % tin Tin / lead solder plated or 100 % tin Tin / lead solder plated or gold plated Tin / lead solder plated or 100 % tin Document Number: 40115 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape thickness Deformation between embossments 0.014 [0.35] max. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top cover tape B1 (max.) (6) 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.079 ± 0.002 0.069 ± 0.004 [2.0 ± 0.05] [1.75 ± 0.10] A0 K0 0.030 [0.75] min. (3) B0 W 0.030 [0.75] min. (4) Top cover tape For tape feeder 0.004 [0.10] max. reference only including draft. Concentric around B0 (5) F 20° Maximum component rotation (Side or front sectional view) Center lines of cavity P1 D1 (min.) for components (5) . 0.079 x 0.047 [2.0 x 1.2] and larger USER DIRECTION OF FEED Maximum cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line B0 A0 (Top view) Typical component center line 3.937 [100.0] 0.039 [1.0] max. Tape 0.039 [1.0] max. 0.9843 [250.0] Camber (Top view) Allowable camber to be 0.039/3.937 [1/100] Non-cumulative over 9.843 [250.0] Tape and Reel Specifications: all case sizes are available on plastic embossed tape per EIA-481. Standard reel diameter is 7" [178 mm]. Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 CASE CODE M (2) W R P A A0, Q B W9, S B0 TAPE SIZE 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 12 mm B1 (MAX.) (1) 0.075 [1.91] 0.112 [2.85] 0.098 [2.46] 0.108 [2.75] 0.153 [3.90] 0.157 [4.0] 0.126 [3.20] 0.181 [4.61] D1 (MIN.) 0.02 [0.5] 0.039 [1.0] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.02 [0.5] 0.039 [1.0] 0.029 [0.75] 0.059 [1.5] F 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.138 [3.5] 0.217 [5.5] K0 (MAX.) 0.043 [1.10] 0.053 [1.35] 0.066 [1.71] 0.054 [1.37] 0.078 [2.00] 0.049 [1.25] 0.087[2.22] 0.045 [1.15] 0.049 [1.25] P1 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] 0.157 [4.0] W 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.315 [8.0] 0.472 [12.0] Notes For reference only Packaging of M case in plastic tape is available per request (1) (2) Revision: 09-Mar-16 Document Number: 40115 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] N 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0] T 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0] Notes (1) For reference only CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42 CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1 W M2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0] Note (1) For reference only PAPER TAPE AND REEL PACKAGING in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 T P2 Ø D0 P0 [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 A0 Bottom cover tape F W B0 E2 Top cover tape P1 Cavity center lines Anode Cavity size (1) G Bottom cover tape USER FEED DIRECTION CASE TAPE SIZE SIZE A0 B0 D0 P0 P1 P2 E F W T K 8 mm 0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002 [0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.75 ± 0.05] M 8 mm 0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002 [1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1] [4.0 ± 0.1] [4.0 ± 0.1] [2.0 ± 0.05] [1.75 ± 0.1] [3.5 ± 0.05] [8.0 ± 0.2] [0.95 ± 0.05] Note (1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. Revision: 09-Mar-16 Document Number: 40115 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague RECOMMENDED REFLOW PROFILES TP tp Max. Ramp Up Rate = 3 °C/s Max. Ramp Down Rate = 6 °C/s TL Temperature TSmax. tL Preheat Area TSmin. tS 25 Time 25 °C to Peak Time PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY Temperature min. (TSmin.) 100 °C 150 °C Temperature max. (TSmax.) 150 °C 200 °C 60 s to 90 s 60 s to 150 s PREHEAT AND SOAK Time (tS) from (TSmin. to TSmax.) RAMP UP Ramp-up rate (TL to Tp) 3 °C/s maximum Liquidous temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) max. Time (tp) within 5 °C of the peak max. temperature 235 °C 260 °C 20 s 30 s RAMP DOWN Ramp-down rate (Tp to TL) 6 °C/s maximum Time from 25 °C to peak temperature 6 min maximum 8 min maximum Note • Capacitors should withstand reflow profile as per J-STD-020 standard PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE A (MIN.) B (NOM.) C (NOM.) D (NOM.) K 0.028 [0.70] 0.018 [0.45] 0.024 [0.60] 0.059 [1.50] M 0.039 [1.00] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00] R, W, W9, S 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] P 0.063 [1.60] 0.031 [0.80] 0.047 [1.20] 0.110 [2.80] A, Q, A0 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] B, B0, N, T 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] M2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0] Revision: 09-Mar-16 Document Number: 40115 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL LEAKAGE CURRENT FACTOR RANGE LEAKAGE CURRENT FACTOR 100 + 125 °C + 85 °C 10 + 55 °C + 25 °C 1.0 0 °C 0.1 - 55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED VOLTAGE Notes • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 100 100 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10 10 47 μF - 4 V 1 22 μF - 4 V 1 0.1 1 10 FREQUENCY, kHz 100 0.1 0.1 1000 1 100 1000 FREQUENCY, kHz “M” Case 1000 10 “M” Case 1000 IMPEDANCE ESR IMPEDANCE ESR 100 ESR/Z, Ω ESR/Z, Ω 100 10 4.7 μF - 10 V 10 1 10 μF - 6 V 1 0.1 Revision: 09-Mar-16 1 10 FREQUENCY, kHz 100 1000 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY “M” Case “M” Case 10 000 1000 IMPEDANCE ESR IMPEDANCE ESR 1000 ESR/Z, Ω ESR/Z, Ω 100 100 10 1 μF - 16 V 10 10 μF - 10 V 1 0.1 1 1 10 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz FREQUENCY, kHz “P” CASE “P” CASE 100.0 1000.0 IMPEDANCE IMPEDANCE ESR ESR 100.0 ESR/Z, Ω ESR/Z, Ω 10.0 10.0 1.0 1.0 4.7 μF - 25 V 33 μF - 10 V 0.1 0.1 0.1 0.1 1 10 100 1000 1 FREQUENCY, kHz 10 100 1000 FREQUENCY, kHz “P” CASE “P” CASE 10.0 100.0 IMPEDANCE ESR IMPEDANCE ESR ESR/Z, Ω ESR/Z, Ω 10.0 1.0 1.0 47 μF - 10 V 0.1 0.1 1 10 FREQUENCY, kHz Revision: 09-Mar-16 100 1000 220 μF - 4 V 0.1 0.1 1 10 100 1000 FREQUENCY, kHz Document Number: 40115 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Micro Guide www.vishay.com Vishay Sprague GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: I R MS = 2. P -----------R ESR where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: P V R MS = Z -----------R ESR or, from the formula: V RMS = I R MS x Z 2.1 2.2 3. 4. where, P= power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) RESR = the capacitor equivalent series resistance at the specified frequency Z= the capacitor impedance at the specified frequency The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at +25 °C. Reverse Voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at +25 °C, 5 % of the DC rating at +25 °C, 5 % of the DC rating at +85 °C, and 1 % of the DC rating at +125 °C. Temperature Derating: if these capacitors are to be operated at temperatures above +25 °C, the permissible RMS ripple current shall be calculated using the derating factors as shown: TEMPERATURE +25 °C +85 °C +125 °C 5. DERATING FACTOR 1.0 0.9 0.4 Power Dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent IRMS value be established when calculating permissible operating levels. (Power Dissipation calculated using +25 °C temperature rise.) Revision: 09-Mar-16 6. Printed Circuit Board Materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: the recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 7.2.1 Backward and Forward Compatibility: capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC / ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. Document Number: 40115 9 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000