ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS ©2012 Littelfuse, Inc 1 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS This guide was developed to help electronics designers navigate selection of appropriate TVS Diode Array circuit protection components for equipment interfaces such USB, HDMI, Ethernet, and keypad. This document includes consideration factors, example circuits, applicable standards, and recommended components. Table of Contents Introduction: ............................................................................................................................................................................ 3 TVS Diode Array (SPATM) Series Descriptions ....................................................................................................................... 4 General Purpose ESD Protection .......................................................................................................................................... 4 Low Capacitance ESD Protection ......................................................................................................................................... 7 Lightning Surge Protection ................................................................................................................................................... 9 EMI Filter Arrays with ESD Protection .................................................................................................................................. 11 TVS Diode Array Ordering Guide ........................................................................................................................................... 12 Application Specific Device Selection .................................................................................................................................... 14 USB1.1 ................................................................................................................................................................................ 14 USB2.0 ................................................................................................................................................................................ 15 USB3.0 (Two Device Solution) .............................................................................................................................................. 16 USB3.0 (Fully Integrated Solution) ........................................................................................................................................ 17 HDMI ................................................................................................................................................................................... 18 HDMI (includes protection for Ethernet and 5V power) ......................................................................................................... 19 Display Port.......................................................................................................................................................................... 20 DVI....................................................................................................................................................................................... 21 10/100/1000 Ethernet, Intra-building Lightning Immunity (GR-1089) ...................................................................................... 22 10/100/1000 Ethernet, Inter-building Lightning Immunity (GR-1089)...................................................................................... 23 10/100/1000 Ethernet, Tertiary Only Lightning Immunity (General) ....................................................................................... 24 10/100/1000 Ethernet (ESD only) .......................................................................................................................................... 25 eSATA ................................................................................................................................................................................. 26 1394a/b ................................................................................................................................................................................ 27 LVDS (Low Voltage Differential Signaling)............................................................................................................................. 28 Audio (Speaker/Microphone) ................................................................................................................................................ 29 Analog Video ........................................................................................................................................................................ 30 Keypad/Push Buttons ........................................................................................................................................................... 31 SIM Socket .......................................................................................................................................................................... 32 RS-232 ................................................................................................................................................................................. 33 RS-485 ................................................................................................................................................................................. 34 CAN Bus .............................................................................................................................................................................. 35 LCD and Camera Interfaces (Mobile) .................................................................................................................................... 36 Appendix A ............................................................................................................................................................................. 37 SPA Package Outlines ........................................................................................................................................................ 37 ©2012 Littelfuse, Inc 2 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Introduction: Designers of today’s electronic devices have demanded more functionality with greater flexibility and higher levels of user interaction. These circumstances have helped in driving the development of nanometer chipsets along with a multitude of user interfaces or ports. The confluence of these two has made electronic devices more susceptible to ESD and required the need for a more robust solution. ESD Standards: MIL-STD-883, Method 3015 Historically, analog and digital designers have been required to have ESD protection “on-chip” to protect the IC during manufacturing. The most commonly used ESD standard in the manufacturing environment is the MIL-STD-883, Method 3015 and it’s also referred to as the Human Body Model (HBM). This model discharges a 100pF capacitor through a 1500Ω resistor into the device under test. The table below points out the four test levels as defined in the standard. HBM Level Contact Discharge (kV) Peak Current (A) 1 ±0.5 0.33 2 ±1 0.67 3 ±2 1.33 4 ±4 2.67 Most all manufacturers require that their equipment pass Level 4, or ±8kV, as a minimum, however, some are looking for increased reliability and require that their devices pass a much higher level like ±15kV or ±30kV. Conclusions: The system level ESD test defined by the IEC produces a substantial increase in peak current compared to the military standard. If an IC is rated for 0.5kV per the MIL-STD and the equipment manufacturer tests this same IC at 8kV per the IEC specification, the chip will see nearly a 100 fold increase in peak current (i.e. 0.33A vs. 30A)! Ultimately, hardware or board designers must add supplementary ESD devices to protect these sensitive chipsets from the high level ESD threats seen in the field. Solutions: Littelfuse TVS Diode Arrays (SPATM Family) are an ideal choice for suppressing ESD as their speed and clamping levels are essential to protect today’s integrated circuits unlike the previous MLV, MOV, and polymer technologies. The SPATM portfolio offers a wide range of devices to suit the majority of application needs available in the market today, and this guide will steer the designer toward the appropriate ESD device for the particular application they’re trying to protect. Some of the applications discussed in this guide are: The maximum level required for a typical IC had been ±2kV up until 2007, but today that level has been drastically reduced to ±0.5kV. Obviously, this has helped chip designers save valuable silicon area for more functionality, but in turn, it has made the IC much more susceptible to damage from ESD. ● USB1.1/2.0/3.0 ● Analog Video ● HDMI ● SIM Sockets ● DisplayPort ● RS-232 ● DVI ● RS-485 ● 10/100/1000 Ethernet ● CAN Bus IEC61000-4-2 ● Esata ● Audio (Speaker/Microphone) Conversely, equipment manufacturers have traditionally used an ESD standard defined by the IEC (International Electrotechnical Commission) for system or application level testing. This model uses a 150pF capacitor which is discharged through a 330Ω resistor. The table below displays the four test levels as defined in the standard. ● 1394a/b ● Keypad/Push button ● LVDS ● LCD/Camera display interfaces IEC Level Contact Discharge (kV) Peak Current (A) Many of these applications can be found in electronic devices such as: ● PC’s ● MP3/PMP’s ● Portable Medical Devices ● PDA’s ● Digital Cameras 1 ±2 7.5 ● Set Top Boxes 2 ±4 15 ● LCD/PDP TV’s ● SIM/SD Cards 3 ±6 22.5 ● Portable Navigation Devices ● External Storage 4 ±8 30 ● Keyboards/Mouse ● Switches/Routers ● Mobile Handsets ● Smart Phone ©2012 Littelfuse, Inc 3 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Array (SPATM) Series Descriptions General Purpose ESD Protection Series SP05 Schematic (Example) ESD Level (Contact) ±30kV I/O Cap VR= 0V (@ Bias) 50pF (30pF @ 2.5V) VRWM 5.5V Lightning (tP=8/20μs) N/A Number of Channels Package Options 2 SOT23-3 SC70-3 3 SOT143 4 5 SP1001 SP1002 ±15kV ±8kV 12pF (8pF @ 2.5V) 6pF (5pF @ 2.5V) 5.5V 6V 2A SOT23-5 SC70-5 SOT23-6 SC70-6 6 MSOP-8 2 SC70-3 SOT553 4 SC70-5 SOT553 5 SC70-6 SOT563 1 SC70-3 2 SC70-5 2A SP1003 ±30kV 30pF (17pF @ 2.5V) 5V 7A 1 SOD723 SOD882 SP1004 ±8kV 6pF (5pF @ 1.5V) 6V 2A 4 SOT953 ©2012 Littelfuse, Inc 4 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions General Purpose ESD Protection (continued) ESD Level (Contact) I/O Cap VR= 0V (@ Bias) VRWM Lightning (tP=8/20μs) Number of Channels Package Options SP1005 ±30kV 30pF (23pF @ 2.5V) 6V 10A 1 0201 Flipchip SP1006 ±30kV 25pF (15pF @ 2.5V) 6V 5A 1 0201 μDFN-2 0.6x0.3mm SP1007 ±8kV 5pF (3.5pF @ 5V) 6V 2A 1 0201 Flipchip SP1010 ±8kV 6pF (3.5pF @ 2.5V) 6V 1A 4 μDFN-6 1.25x1.0mm SP1011 ±15kV 12pF (7pF @ 2.5V) 6V 2A 4 Series ©2012 Littelfuse, Inc Schematic (Example) μDFN-6 1.25x1.0mm 5 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions General Purpose ESD Protection (continued) ESD Level (Contact) I/O Cap VRWM Lightning (tP=8/20μs) Number of Channels Package Options SP720 ±4kV 3pF 30V or (±15V) 3A 14 SOIC-16 PDIP-16 SP721 ±4kV 3pF 30V or (±15V) 3A 6 SOIC-8 PDIP-8 SP723 ±8kV 5pF 30V or (±15V) 7A 6 SOIC-8 PDIP-8 SP724 ±8kV 3pF 20V or (±10V) 3A 4 SOT23-6 SP725 ±8kV 5pF 30V or (±15V) 14A 4 SOIC-8 Series ©2012 Littelfuse, Inc Schematic (Example) 6 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions Low Capacitance ESD Protection Series SP3001 SP3002 SP3003 SP3004 ©2012 Littelfuse, Inc Schematic (Example) ESD Level (Contact) I/O Cap VR= 1.65V VRWM Lightning (tP=8/20μs) Number of Channels Package Options ±8kV 0.65pF 6V 2.5A 4 SC70-6 4 SC70-6 SOT23-6 μDFN-6 1.6x1.6mm 2 SC70-5 SOT553 4 SC70-6 SOT563 MSOP-10 8 MSOP-10 4 SOT563 ±12kV ±8kV ±12kV 0.85pF 0.65pF 0.85pF 6V 6V 6V 4.5A 2.5A 4A 7 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions Low Capacitance ESD Protection (continued) ESD Level (Contact) I/O Cap VR= 0V VRWM Lightning (tP=8/20μs) Number of Channels Package Options SP3010 ±8kV 0.45pF 6V 3A 4 μDFN-10 2.5x1.0mm SP3011 ±8kV 0.40pF 6V 3A 6 μDFN-14 3.5x1.35mm SP3012 ±12kV 0.50pF 5V 4A 4 μDFN-10 2.5x1.0mm SP3021 (2012 release) ±8kV 0.50pF 5V 1A 1 SOD882 SP3031 (2012 release) ±10kV 0.80pF 5V 5A 1 SOD882 Series ©2012 Littelfuse, Inc Schematic (Example) 8 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions Lightning Surge Protection ESD Level (Contact) I/O Cap VR= 0V VRWM Lightning (tP=8/20μs) Number of Channels Package Options SP03-3.3 ±30kV 16pF (8pF I/O to I/O) 3.3V 150A 2 SOIC-8 SP03A-3.3 ±30kV 9pF (4.5pF I/O to I/O) 3.3V 150A 2 SOIC-8 SP03-6 ±30kV 16pF (8pF I/O to I/O) 6V 150A 2 SOIC-8 SPLV2.8 ±30kV 2pF 2.8V 40A 1 SOT23-3 SPLV2.8-4 ±30kV 2pF 2.8V 40A 4 SOIC-8 Series ©2012 Littelfuse, Inc Schematic (Example) 9 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions Lightning Surge Protection (continued) ESD Level (Contact) I/O Cap VR= 0V VRWM Lightning (tP=8/20μs) Number of Channels Package Options SP3050 ±20kV 2.4pF 6V 10A 4 SOT23-6 SP4040 ±30kV 5pF (2.5pF I/O to I/O) 3.3V 75A 2 SOIC-8 SP4060 ±30kV 4.4pF 2.5V 20A 8 MSOP-10 SP4061 ±30kV 3.5pF 2.5V 20A 4 µDFN-10 2.6x2.6mm SP4062 ±30kV 3.5pF 3.3V 20A 4 µDFN-10 2.6x2.6mm Series ©2012 Littelfuse, Inc Schematic (Example) 10 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Arrays (SPATM) Series Descriptions EMI Filter Arrays with ESD Protection Series SP6001 SP6002 SP6003 (not yet released) ©2012 Littelfuse, Inc Schematic (Example) ESD Level (Contact) ±30kV ±30kV ±15kV Line Cap (VR=2.5V) 24pF (CDIODE=12pF) 30pF (CDIODE=15pF) 14pF (CDIODE=7pF) VRWM 6V 6V 6V Attenuation ≥ -30dB @ 1GHz Number of Channels Package Options 4 μDFN-8 1.7x1.35mm 6 μDFN-12 2.5x1.35mm 8 μDFN-16 3.3x1.35mm 4 μDFN-8 1.7x1.35mm 6 μDFN-12 2.5x1.35mm 4 μDFN-8 1.7x1.35mm 6 μDFN-12 2.5x1.35mm ≥ -30dB @ 1GHz ≥ -20dB @ 1GHz 11 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Array Ordering Guide Series Number of Channels Package Orderable Part Number SOT23-3 SP0502BAHTG SC70-3 SP0502BAJTG SOT143 SP0503BAHTG SOT23-5 SP0504BAHTG SC70-5 SP0504BAJTG SOT23-6 SP0505BAHTG SC70-6 SP0505BAJTG MSOP-8 SP0506BAATG SC70-3 SP1001-02JTG SOT553 SP1001-02XTG SC70-5 SP1001-04JTG SOT553 SP1001-04XTG SC70-6 SP1001-05JTG SOT56 SP1001-05XTG 1 SC70-3 SP1002-01JTG 2 SC70-5 SP1002-02JTG SOD723 SP1003-01DTG SOD882 SP1003-01ETG 2 3 SP05 4 5 6 2 SP1001 4 5 SP1002 SP1003 1 SP1004 4 SOT953 SP1004-04VTG SP1005 1 0201 Flipchip SP1005-01WTG SP1006 1 0201 (μDFN-2,0.6x0.3mm) SP1006-01UTG SP1007 1 0201 Flipchip SP1007-01WTG SP1010 4 μDFN-6 (1.25x1.0mm) SP1010-04UTG SP1011 4 μDFN-6 (1.25x1.0mm) SP1011-04UTG SP3001 4 SC70-6 SP3001-04JTG SOT23-6 SP3002-04HTG SC70-6 SP3002-04JTG μDFN-6 (1.6x1.6mm) SP3002-04UTG SC70-5 SP3003-02JTG SOT553 SP3003-02XTG SC70-6 SP3003-04JTG SOT563 SP3003-04XTG MSOP-10 SP3003-04ATG 8 MSOP-10 SP3003-08ATG 4 SOT563 SP3004-04XTG SP3002 4 2 SP3003 SP3004 ©2012 Littelfuse, Inc 4 12 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS TVS Diode Array Ordering Guide (continued) Series Number of Channels Package Orderable Part Number SP3010 4 μDFN-10 (2.5x1.0mm) SP3010-04UTG SP3011 6 μDFN-14 (3.5x1.35mm) SP3011-06UTG SP3012 4 μDFN-10 (2.5x1.0mm) SP3012-04UTG SP3021 1 SOD882 SP3021-01ETG SP3031 1 SOD882 SP3031-01ETG SP3050 4 SOT23-6 SP3050-04HTG SP4040 2 SOIC-8 SP4040-02BTG SP4060 8 MSOP-10 SP4060-08ATG SP4061 4 μDFN-10 (2.6x2.6mm) SP4061-04UTG SP4062 4 μDFN-10 (2.6x2.6mm) SP4062-04UTG SP03-3.3 2 SOIC-8 SP03-3.3BTG SP03A-3.3 2 SOIC-8 SP03A-3.3BTG SP03-6 2 SOIC-8 SP03-6BTG SPLV2.8 1 SOT23-3 SPLV2.8HTG SPLV2.8-4 4 SOIC-8 SPLV2.8-4BTG 4 μDFN-8 (1.7x1.35mm) SP6001-04UTG-1 6 μDFN-12 (2.5x1.35mm) SP6001-06UTG-1 8 μDFN-16 (3.3x1.35mm) SP6001-08UTG-1 4 μDFN-8 (1.7x1.35mm) SP6002-04UTG-1 6 μDFN-12 (2.5x1.35mm) SP6002-06UTG-1 4 μDFN-8 (1.7x1.35mm) SP6003-04UTG-1 6 μDFN-12 (2.5x1.35mm) SP6003-06UTG-1 14 PDIP-16 SP720APP 14 SOIC-16 SP720AB*G 6 PDIP-8 SP721APP 6 SOIC-8 SP721AB*G 6 PDIP-8 SP723APP 6 SOIC-8 SP723AB*G SP724 4 SOT23-6 SP724AHTG SP725 4 SOIC-8 SP725AB*G SP6001 SP6002 SP6003 (not released) SP720 SP721 SP723 *Add “T” for Tape and Reel, otherwise parts are packed in tubes ©2012 Littelfuse, Inc 13 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection USB1.1 Considerations: ● Each port operates at either 1.5Mbps or 12Mbps (low and full speed respectively) • Parasitic capacitance should be taken into account although these relatively slow speeds can tolerate tens of picofarads ● Requires 2 channels of data line protection per port (i.e. D±) • A 4 channel device can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible • VBUS can be protected separately with a single channel device in an 0402 or 0201 form factor (0402 shown) Application Schematic: USB Controller USB Port VBUS D+ D+ DSP0502 Outside World IC SP1003 Case GND Signal GND Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging SP0502BAJTG ±30kV 30pF 2 5.5V SC70-3 SP1001-02XTG ±15kV 8pF 2 5.5V SOT553 SP1003-01ETG ±30kV 17pF 1 5.0V 0402 (SOD882) SP1003-01DTG ±30kV 17pF 1 5.0V 0402 (SOD723) SP1006-01UTG ±30kV 15pF 1 5.0V 0201 (µDFN-2) ©2012 Littelfuse, Inc 14 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection USB2.0 Considerations: ● Each port can operate up to 480Mbps • The high data rate requires a low capacitance device to preserve signal integrity ● Requires 2 channels of data line protection per port (i.e. D±) which can be done via array or discretely • A 4 channel device such as the SP3002-04 can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible • VBUS can be protected by connecting it to the VCC pin on the diode array or by using a separate single channel device like the SP1003 Application Schematic: USB Port USB Controller VBUS D+ DOutside World Optional IC SP3003 NC Case GND Signal GND USB Port USB Controller VBUS D DOutside World IC SP3031 (x2) *Package is shown as transparent Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3003-02XTG ±8kV 0.65pF 2 6V SOT553 SP3003-02JTG ±8kV 0.65pF 2 6V SC70-5 SP3031-01ETG (2012 release) ±10kV 0.80pF 1 5V SOD882 ©2012 Littelfuse, Inc 15 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection USB3.0 (Two Device Solution) Considerations: ● Each port depending upon what it’s connected to can operate: • Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX± • Up to 480Mbps on the legacy data pair, D± ● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±) ● Requires 2 channels of protection for the legacy D± data pair • VBUS can be protected by connecting it to the VCC pin on the SPA or by using a separate single channel device Application Schematic: USB Port USB Controller VBUS D+ DSP3003 Optional NC Outside World IC SSTX+ SSTXGND SP3012 SSRX+ SSRX*Package is shown as transparent Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3003-02XTG ±8kV 0.65pF 2 6V SOT553 SP3012-04UTG ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) ©2012 Littelfuse, Inc 16 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection USB3.0 (Fully Integrated Solution) Considerations: ● Each port depending upon what it’s connected to can operate: • Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX± • Up to 480Mbps on the legacy data pair, D± ● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±) and 2 channels of protection for the legacy D± data pair. The SP3011 shown below integrates all 6 channels of protection into a small form factor µDFN-14 package. Application Schematic: USB Port USB Controller VBUS SSTX+ Outside World SSTXIC SSRX+ SSRXGND SP3011 D+ D*Package is shown as transparent Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=0V # of Channels VRWM Packaging SP3011-06UTG ±8kV 0.40pF 6 6V μDFN-14 (3.5x1.35mm) ©2012 Littelfuse, Inc 17 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection HDMI Considerations: ● Each port has 3 differential pairs of data (i.e. D0±, D1±, D2±) plus a clock (CLK±) • For HDMI 1.1-1.2 the throughput is a total of 4.95Gbps (1.65Gbps per lane) • For HDMI 1.3-1.4 the throughput is a total of 10.2Gbps (3.4Gbps per lane) ● To maintain the differential impedance per the HDMI Compliance Test Specification (and consequently signal integrity) a very low capacitance device must be used ● To maintain the differential impedance the designer should avoid using 90º angles and vias • This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme ● Requires 12 channels of protection : 8 TMDS data pairs, SDA, SCL, CEC, and HPD Application Schematic: HDMI Port *Package is shown as transparent Chipset D2+ GND D2D1+ SP3010 GND D1D0+ GND Outside World D0CLK+ IC SP3010 GND CLKSDA SCL SP3010 CEC HPD Signal GND Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 (2.5x1.0mm) SP3012-04UTG) ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) ©2012 Littelfuse, Inc 18 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection HDMI (includes protection for Ethernet and 5V power) Considerations: ● Same as noted on previous page except the protection scheme below includes options for protecting additional Ethernet and 5V power pins. ● Other combinations exist such as using 2, 6 channel SP3011 devices along with 2, single channel discrete Application Schematic: HDMI Port *Package is shown as transparent Chipset D2+ GND D2D1+ SP3010 GND D1D0+ GND D0Outside World CLK+ IC SP3010 GND CLKSDA SCL SP3010 CEC HPD SP3021 ENET PWR SP1003 Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 (2.5x1.0mm) SP3012-04UTG) ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) SP3021-01ETG (2012 release) ±8kV 0.50pF 1 5V 0402 (SOD882) SP1003-01ETG (SP1003) ±30kV 17pF 1 6V 0402 (SOD882) ©2012 Littelfuse, Inc 19 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection Display Port Considerations: ● Each port has a main link which contains 4 differential pairs or lanes (i.e. ML0±, ML1±, ML2±, and ML3±) • The total throughput is 10.8Gbps or 2.7Gbps per lane • The clock signal is embedded in the lanes and does not exist separately as in HDMI • There is also an auxiliary channel (AUX±), hot plug detect (HPD), and power pin (PWR) as well. ● To maintain the differential impedance (and consequently signal integrity) a very low capacitance device must be used • To maintain the differential impedance the designer should avoid using 90º angles and vias • This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme ● Requires 12 channels of protection per port (ML0±, ML1±, ML2±, ML3±, AUX±, HPD, and PWR) Application Schematic: Display Port ML0+ Chipset *Package is shown as transparent GND ML0ML1+ SP3010 GND ML1ML2+ GND Outside World ML2ML3+ IC SP3010 GND ML3AUXGND AUX+ SP3010 HPD PWR Signal GND Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 (2.5x1.0mm) SP3012-04UTG ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) ©2012 Littelfuse, Inc 20 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection DVI Considerations: ● A DVI port may have single or dual link capability • Each link has 3 differential lanes of data (i.e. D0±, D1±, D2±) plus a clock (CLK±) • For single link, the maximum throughput can approach a total of 4.95Gbps or 1.65Gbps per lane • For dual link, the maximum throughput can approach a total of 8Gbps or 2.67Gbps per lane ● To maintain signal integrity a very low capacitance device must be used ● To maintain the differential impedance the designer should avoid using 90º angles and vias • This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme ● Requires 8 channels of protection per port (D0±, D1±, D2±, CLK±) Application Schematic: *Package is shown as transparent DVI Port D2+ DVI Chipset SP3003 GND D2D1+ VCC/NC GND Outside World D1- IC SP3003 D0+ GND D0CLK+ VCC/NC GND CLKCase GND Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3003-04ATG ±8kV 0.65pF 4 6V MSOP-10 SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 (2.5x1.0mm) ©2012 Littelfuse, Inc 21 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection 10/100/1000 Ethernet, Intra-building Lightning Immunity (GR-1089) Considerations: ● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps) • For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock • For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock • For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock • For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity ● The 4 data lines below (Tx± and Rx±) are being protected against intra-building (i.e. 100A, tP=2/10µs) lightning transients by a two-stage protection scheme ● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the remaining 2 data pair Application Schematic: RJ-45 Connector Ethernet PHY F1 J1 Tx+ F2 TxOutside World Rx+ F3 J8 RxF4 SP03A (x2) F1:F4 = 0461 1.25 TeleLink Fuse PHY GND SP3050 Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=0V # of Channels VRWM Packaging SP03A-xBTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8 SP03-3.3BTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V,6V SOIC-8 SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6 ©2012 Littelfuse, Inc 22 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection 10/100/1000 Ethernet, Inter-building Lightning Immunity (GR-1089) Considerations: ● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps) • For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock • For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock • For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock • For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity ● The 4 data lines below are being protected against inter-building (i.e. 500A, tP=2/10µs) lightning transients by a two-stage protection scheme. The 4 channel, SP4061 or SP4062 should be selected based on the operating voltage of the PHY. ● The standoff voltage of the SEP Series device will be dictated by the use of PoE. If PoE is present the SEP0640 should be used; otherwise, the SEP0080 is ok for non-PoE applications. Note: Higher voltage options are available for atypical PoE voltages. ● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the remaining 2 data pair Application Schematic: RJ-45 Connector F1 *Package is shown as transparent Ethernet PHY J1 Tx+ Tx- F2 Outside World SP4062 PHY GND F3 J8 Rx+ Rx- F4 Case GND SEP0xx (x2) F1:F4 = 0461 1.25 TeleLink Fuse Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=0V # of Channels VRWM Packaging SEP0080Q38CB ±30kV 400A See datasheet 2 6V QFN SEP0640Q38CB ±30kV 400A See datasheet 2 58V QFN SP4061-04UTG ±30kV 20A 3.5pF 4 2.5V µDFN-10 (2.6x2.6mm) SP4062-04UTG ±30kV 20A 3.5pF 4 3.3V µDFN-10 (2.6x2.6mm) ©2012 Littelfuse, Inc 23 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection 10/100/1000 Ethernet, Tertiary Only Lightning Immunity (General) Considerations: ● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps) • For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock • For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock • For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock • For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity ● Some designers choose to use a robust transformer in their design to act as the first line of protection against an incoming surge event. This is usually done to minimize the parasitic capacitance on the data line and to save on the cost of the primary protector ● Using such a technique will require a robust PHY side protection device and one such option is the SPLV2.8-4 shown below. It should be noted that this device will only provide differential protection between the data pairs. ● If longitudinal and differential protection are required, the SP3050-04HTG (with 2 I/O’s tied per line) or SP4060/SP4061/SP4062 can be considered as alternatives ● Protection for 100Mbps Ethernet (or Fast Ethernet) is shown below. For 1000Mbps (or 1GbE) interfaces two, SPLV2.8-4BTG are required Application Schematic: RJ-45 Connector Ethernet PHY J1 Tx+ TxRx+ Rx- Outside World Ethernet PHY SPLV2.8-4 J8 *Package is shown as transparent Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=0V # of Channels VRWM Packaging SPLV2.8-4BTG ±30kV 40A 2.0pF 4 2.8V SOIC-8 SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6 SP4060-08ATG ±30kV 20A 4.4pF 8 2.5V SP4061-04UTG ±30kV 20A 3.5pF 4 2.5V SP4062-04UTG ±30kV 20A 3.5pF 4 3.3V ©2012 Littelfuse, Inc MSOP-8 µDFN-10 (2.6x2.6mm) µDFN-10 (2.6x2.6mm) 24 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection 10/100/1000 Ethernet (ESD only) Considerations: ● Some Ethernet ports only need be protected for ESD and not for lightning induced transients • These are sometimes referred to as “2M” ports or 2 Meter ports that have very short CAT5 cable installations ● Parasitic capacitance should be taken into account especially for 1GbE ● The 4 data lines below (Tx± and Rx±) are being protected against ESD by a low capacitance SP3002 which is suitable for all Ethernet data rates • In fact, any low capacitance SP30xx device is suitable for any “ESD only” Ethernet application ● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme can be replicated or the 8 channel SP3003-08ATG can be used. Application Schematic: RJ-45 Connector Ethernet PHY J1 Tx+ TxOutside World Rx+ J8 Rx- NC Case GND Case GND SP3002 Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3002-04JTG ±12kV 4.5A 0.85pF 4 6V SC70-6 SP3003-04XTG ±8kV 2.5A 0.65pF 4 6V SOT563 SP3004-04XTG ±12kV 4A 0.85pF 4 6V SOT563 SP3003-08ATG ±8kV 2.5A 0.65pF 8 6V MSOP-10 ©2012 Littelfuse, Inc 25 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection eSATA Considerations: ● eSATA is a subset of the SATA protocol that uses 2 differential pairs for communication • Four lines need to be protected per port (i.e. TX± and RX±) • Currently eSATA is capable of running raw data rates of 1.5Gbps (Gen 1) and 3.0Gbps (Gen 2) ● These high bus speeds require very low capacitance devices to prevent signal degradation ● To maintain the line impedance the designer should avoid using 90º angles and vias Application Schematic: eSATA Port GND eSATA Interface TX+ *Package is shown as transparent TX- Outside World IC GND RX- SP3012 RX+ GND Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3012-04UTG ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 (2.5x1.0mm) SP3003-02XTG ±8kV 0.65pF 2 6V SOT553 SP3003-04JTG ±8kV 0.65pF 4 6V SC70-6 ©2012 Littelfuse, Inc 26 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection 1394a/b Considerations: ● 1394a (FireWire 400 or S400) was the original (1st generation) implementation • Allowed for two connectors, powered (6 pin) and unpowered (4 pin) • Data rates up to 400Mbps using 2 differential pair ● 1394b (FireWire 800 or S800) was the 2nd generation • Required a new 9 pin connector but was backwards compatible to S400 • Data rates up to 800Mbps using 2 differential pair ● 1394b also had provisions for 1600Mbps and 3200Mbps (or S1600 and S3200) • Uses same 9 pin connector as S800 ● S800, S1600, and S3200 require very low capacitance devices for the high speed data rates • Protection of 4 data lines is needed (i.e. TPB± and TPA±) and can be done with an array or with discrete low capacitance devices Application Schematic: *Package is shown as transparent 1394b Port 1394 Interface SP3003 TPBTPB+ TPATPA+ Outside World GNDS IC TPA Shield GND GND NC PWR GNDS Case GND TPB Shield GND Recommended SPA Devices: Ordering Number ESD Level (Contact) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3003-04ATG ±8kV 0.65pF 4 6V MSOP-10 SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10 SP3012-04UTG ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm) SP3021-01ETG (2012 release) ±8kV 0.50pF 1 5V SOD882 ©2012 Littelfuse, Inc 27 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection LVDS (Low Voltage Differential Signaling) Considerations: ● LVDS is a low noise, low-voltage signal scheme that uses a small current (typically 3.5mA) to generate a voltage drop across a 100Ω resistor to convey information or data • Data rates can vary per application but the ANSI/TIA/EIA-644-A standard recommends a maximum of 655Mbps ● The medium/high speed bus requires a low capacitance device in 1-6pF range (typically) • LVDS schemes will vary in terms of the total number of channels used • Protection of 8 data lines is shown below (i.e. CLK± and Ax±) Application Schematic: LVDS Controller LVDS Interface CLK+ CLKA0+ A0- Outside World IC A1+ A1A2+ A2- Signal GND Case GND SP4060 Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=0V # of Channels VRWM Packaging SP4060-08ATG ±30kV 20A 4.4pF 8 2.5V MSOP-10 SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6 SP4061-04UTG ±30kV 20A 3.5pF 4 2.5V µDFN-10 (2.6x2.6mm) ©2012 Littelfuse, Inc 28 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection Audio (Speaker/Microphone) Considerations: ● Audio ports typically have signals that swing above and below GND (i.e. ±2.5V) • If no DC bias is applied, a bidirectional protection device should be used as these devices will not clip the analog signal • Protection of 2 data lines is shown below (i.e. Left and Right) with an array and with discrete 0201s ● Some audio ports will bias the data bus so that the signal never swings below GND (i.e. 0-5V) • If a bias is applied, a unidirectional OR bidirectional protection device could be used as neither device would clip the analog signal • The SP1001-02XTG is a good option in this case (not shown for Left and Right but is listed below) Application Schematic: Audio Codec Audio Port Left Right Outside World IC Case GND SP1002-02 Audio Codec Audio Port Left Right Outside World IC Case GND SP1005 (x2) Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging SP1002-02JTG ±8kV 2A 5pF 2 6V SC70-5 SP1005-01WTG ±30kV 10A 23pF 1 6V 0201 Flipchip SP1001-02XTG ±15kV 2A 8pF 2 5.5V SOT553 ©2012 Littelfuse, Inc 29 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection Analog Video Considerations: ● Analog video ports typically have signals that swing above and below GND (i.e. ±2V) • A bidirectional protection device should be used as these devices will not clip the analog signal ● S-Video, Composite, and RF/Coaxial are a few of the common low-speed analog video signals in use today • Typical bus speeds will not exceed 5MHz so capacitance is not much of a concern • Protection of the three are shown below (Y, C, Video, and RF) Application Schematic: Video ADC Video Port Y Luminance C Chrominance Video Outside World Composite RF Coaxial IC SP1004 Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging SP1004-04VTG ±8kV 2A 4.5pF 4 6V SOT953 SP1002-02JTG ±8kV 2A 5pF 2 6V SC70-5 SP1005-01WTG ±30kV 10A 23pF 1 6V 0201 Flipchip SP1007-01WTG ±8kV 2A 3.5pF 1 6V 0201 Flipchip ©2012 Littelfuse, Inc 30 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection Keypad/Push Buttons Considerations: ● Keypads and push buttons on electronic devices are particularly susceptible to ESD due to constant human interaction • Most are DC switches that operate at less than 5V, and for most applications capacitance will not be a concern ● The number of ports will vary with the particular application, but as an example, 4 data lines are shown below (i.e.Px) ● For space constrained applications the SP1003 or SP1005 may be considered as they are 0402 and 0201 footprints, respectively Application Schematics: Keypads P1 P2 P3 Outside World IC P4 SP1006 (x4) Case GND Keypads I/O Controller P1 P2 Outside World P3 IC P4 SP1001 Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging SP1001-04XTG ±15kV 2A 8pF 4 6V SOT553 SP1003-01ETG ±30kV 7A 17pF 1 5V 0402 (SOD882) SP1005-01WTG ±30kV 10A 23pF 1 6V 0201 Flipchip SP1006-01UTG ±30kV 5A 15pF 1 6V 0201 (µDFN-2) ©2012 Littelfuse, Inc 31 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection SIM Socket Considerations: ● The SIM (Subscriber Identification Module) card has 3 data lines that are low-speed and low-voltage • Given the low speed of the signals, the capacitance will not be a concern ● The low-voltage signal lines are best protected by a device which has a low standoff voltage or VRWM ● Protection of the 3 data lines is shown below (i.e. CLK, DATA, and RESET) Application Schematics: SIM Controller SIM Socket VBUS DATA CLK Outside World RESET IC SP3002 Case GND GND Case GND Signal GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP3002-04UTG ±12kV 4.5A 0.85pF 4 6V μDFN-6 (1.6x1.6mm) SP1011-04UTG ±15kV 2A 7pF 4 6V μDFN-6 (1.25x1.0mm) SP1005-01WTG ±30kV 10A 23pF 1 6V 0201 Flipchip SP1006-01UTG ±30kV 5A 15pF 1 6V 0201 (µDFN-2) ©2012 Littelfuse, Inc 32 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection RS-232 Considerations: ● There are numerous implementations of RS-232 • Most involve 6 wires (as shown below) though some may only include 2, 3, or 5 wires • The maximum data rate is 20kbps • Typically bus voltages are bipolar and can swing as high as ±24V though most installations are limited to ±12V or even lower • For ±12V systems the SP72x Series is recommended and shown below ● Some implementations are a unipolar (i.e. 0-3.3V or 0-5V) or use bus voltages generally below 6V • In this event the SP1001 Series can be used for ESD protection or the SP03 Series could be used if lightning is the primary threat ● Every application should be evaluated thoroughly before using the recommended devices below Application Schematics: Controller RS-232 Port RD TD RTS Outside World IC CTS DSR DTR VBUS SP723 Case GND Case GND -V Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=1.65V # of Channels VRWM Packaging SP721ABTG ±4kV 3A 3pF 6 30V SOIC-8 SP723ABTG (±8kV 7A 5pF 6 30V SOIC-8 SP724AHTG ±8kV 3A 3pF 4 20V SOT23-6 SP725ABTG ±8kV 14A 5pF 4 30V SOIC-8 ©2012 Littelfuse, Inc 33 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection RS-485 Considerations: ● There are numerous implementations and applications of RS-485 • Most applications involve two wires (i.e. A and B) while a few are four wire (i.e. full duplex) • Depending on cable length, data rates can vary from 100kbps-10Mbps • Bus voltages can be unipolar (i.e. 0-6V) or bipolar (i.e. ±3V) and every application should be evaluated thoroughly before using the recommended devices below ● For a unipolar bus with a voltage ≤ 6V (MAX): • The SP1001 Series is shown for ESD protection only • The SP03 Series is shown for lightning/surge protection ● For differential protection between A and B, the GND connection can be removed from the schematics below ● For a bipolar bus with a maximum voltage swing of ±3V: • The SP1002 or SP1004 Series can be used ESD protection only • The SP03 Series (x2) can still be used for lightning/surge protection with one I/O tied to GND Application Schematic: RS-485 Port Receiver A Outside World B IC SP1001 Case GND RS-485 Port Receiver A Outside World IC B Case GND SP03 Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=2.5V/0V # of Channels VRWM Packaging SP1001-02JTG ±15kV 2A 8pF 2 6V SC70-3 SP03-xBTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V, 6V SOIC-8 SP03A-3.3BTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8 ©2012 Littelfuse, Inc 34 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection CAN Bus Considerations: ● There are numerous implementations and applications of a CAN bus • Most applications involve two wires (i.e. CANH and CANL) • Depending on cable length, data rates can vary from 10kbps-1Mbps • Most applications do not exceed 0-5V to transmit a Low/High signal, however, every application should be evaluated thoroughly before using the recommended devices below ● For the described application of unipolar bus with voltages between 0 and 5V: • The SP1001 Series is shown for ESD protection only • The SP03 Series is shown for lightning/surge protection ● For differential protection between CANH and CANL, the GND connection can be removed from the schematics below Application Schematic: CAN Port Transceiver CANH CANL Outside World IC SP1001 Case GND Transceiver CAN Port CANH Outside World IC CANL SP03 Case GND Recommended SPA Devices: Ordering Number ESD Level (Contact) Lightning (tP=8/20μs) I/O Capacitance @ VR=2.5V/0V # of Channels VRWM Packaging SP1001-02JTG ±15kV 2A 8pF 2 6V SC70-3 SP03-xBTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V, 6V SOIC-8 SP03A-3.3BTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8 ©2012 Littelfuse, Inc 35 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Application Specific Device Selection LCD and Camera Interfaces (Mobile) Considerations: ● LCD and camera interfaces in mobile devices are vulnerable to EMI from the cellular band • Frequencies between 800-3000MHz should be attenuated to prevent distortion on the display ● The pixel clocks vary depending upon the display size but the frequency will typically fall between 5-65MHz • This corresponds to data rates between 10-60Mbps and with these speeds line capacitances need to be considered • In the majority of applications line capacitances of 20-40pF will not cause signal integrity issues ● The protection schemes below for data lines Dx are only examples and will vary with the particular application Application Schematic: PCB Connector for LCD Display *Packages are shown as transparent Baseband SP6002-04 D1 D2 IC D3 D4 Camera Module Baseband SP6001-06 D1 D2 D3 IC D4 D5 D6 Recommended SPA Devices: Ordering Number ESD Level (Contact) Cut-off Frequency Line Capacitance @ VR=2.5V # of Channels VRWM Packaging SP6001-0xUTG-1 ±30kV 115MHz 24pF 4/6/8 6V μDFN-8/12/16 SP6002-0xUTG-1 ±30kV 100MHz 30pF 4/6 6V μDFN-8/12 SP6003-0xUTG-1 (not released yet) ±15kV 175MHz 14pF 4/6 6V μDFN-8/12 ©2012 Littelfuse, Inc 36 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Appendix A SPA Package Outlines PDIP-8 PDIP-16 SOIC-8 ©2012 Littelfuse, Inc 37 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) SOIC-16 MSOP-8 MSOP-10 ©2012 Littelfuse, Inc 38 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) SOT23-3 SOT143 SOT23-5 ©2012 Littelfuse, Inc 39 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) SOT23-6 SC70-3 SC70-5 ©2012 Littelfuse, Inc 40 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) SC70-6 SOT553 SOT563 ©2012 Littelfuse, Inc 41 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) SOT953 SOD723 SOD882 ©2012 Littelfuse, Inc 42 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) 0201 Flip chip (0.62x0.32) 0201 µDFN-2 (0.60x0.30) μDFN-6 (1.25x1.0) ©2012 Littelfuse, Inc 43 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) μDFN-6 (1.6x1.6) μDFN-8 (1.7x1.35) μDFN-10 (2.5x1.0) ©2012 Littelfuse, Inc 44 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS SPA Package Outlines (continued) μDFN-10 (2.6x2.6) μDFN-12 (2.5x1.35) μDFN-14 (3.5x1.35) ©2012 Littelfuse, Inc 45 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS Littelfuse, Inc. 8755 West Higgins Road O’Hare Plaza, Suite 500 Chicago, IL 60631 USA Phone: (773) 628-1000 [email protected] Authored by: Chad Marak Technical Marketing Manager Semiconductor Business Unit ©2012 Littelfuse, Inc 46 ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS ©2012 Littelfuse, Inc 47