Preliminary Datasheet RJK0354DSP Silicon N Channel Power MOS FET Power Switching REJ03G1661-0200 Rev.2.00 Apr 05, 2010 Features Capable of 4.5 V gate drive Low drive current High density mounting Low on-resistance RDS(on) = 5.4 m typ. (at VGS = 10 V) Pb-free Outline RENESAS Package code: PRSP0008DD-D (Package name: SOP-8<FP-8DAV>) 6 87 5 6 7 8 D D D D 5 12 1, 2, 3 Source 4 Gate 5, 6, 7, 8 Drain 4 G 34 S S S 1 2 3 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel to ambient thermal impedance Channel temperature Storage temperature Symbol VDSS VGSS ID Note1 ID(pulse) IDR IAP Note 2 EAR Note 2 Pch Note3 ch-a Note3 Tch Tstg Ratings 30 ±20 16 128 16 15 22.5 2.0 62.5 150 –55 to +150 Unit V V A A A A mJ W C/W C C Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tch = 25C, Rg 50 3. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s REJ03G1661-0200 Rev.2.00 Apr 05, 2010 Page 1 of 6 RJK0354DSP Preliminary Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Gate Resistance Total gate charge Gate to source charge Gate to drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDF trr Min 30 — — 1.2 — — — — — — — — — — — — — Typ — — — — 5.4 7.5 40 1740 335 110 4.4 12 4.3 2.5 7.4 3.6 56.4 Max — ± 0.1 1 2.5 7.0 10.5 — — — — — — — — — — — Unit V A A V m m S pF pF pF nC nC nC ns ns ns — — — 5.5 0.81 20 — 1.06 — ns V ns Test Conditions ID = 10 mA, VGS = 0 VGS = ±20 V, VDS = 0 VDS = 30 V, VGS = 0 VDS = 10 V, I D = 1 mA ID = 8 A, VGS = 10 V Note4 ID = 8 A, VGS = 4.5 V Note4 ID = 8 A, VDS = 10 V Note4 VDS = 10 V VGS = 0 f = 1 MHz VDD = 10 V VGS = 4.5 V ID = 16 A VGS = 10 V, ID = 8 A VDD 10 V RL = 1.25 Rg = 4.7 IF = 16 A, VGS = 0 Note4 IF = 16 A, VGS = 0 diF/ dt = 100 A/ s Notes: 4. Pulse test REJ03G1661-0200 Rev.2.00 Apr 05, 2010 Page 2 of 6 RJK0354DSP Preliminary Main Characteristics Maximum Safe Operation Area Power vs. Temperature Derating 3.0 500 Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW ≤ 10 s 100 Drain Current ID (A) Channel Dissipation Pch (W) 4.0 2.0 1.0 DC 10 1m s =1 Op 0 ms era ti PW on (P W N 1 Operation in < 1 ote 0s 5 this area is ) limited by RDS(on) 0.1 Ta = 25°C 1 shot Pulse 0 50 100 150 0.01 0.1 200 0.3 1 3 10 30 100 Drain to Source Voltage VDS (V) Ambient Temperature Ta (°C) Note 5 : When using the glass epoxy board (FR4 40x40x1.6 mm) Typical Transfer Characteristics Typical Output Characteristics 20 20 3.1 V Pulse Test Drain Current 12 ID (A) 3.0 V 16 8 2.8 V 4 16 VDS = 10 V Pulse Test 12 2.9 V Drain Current ID (A) 4.5 V 10 V 2.7 V 8 4 25°C Tc = 75°C –25°C VGS = 2.6 V 0 2 4 6 Drain to Source Voltage 8 0 10 120 80 ID = 10 A 40 5A 2A 0 4 8 12 Gate to Source Voltage REJ03G1661-0200 Rev.2.00 Apr 05, 2010 16 20 VGS (V) 3 4 5 VGS (V) Static Drain to Source on State Resistance vs. Drain Current Drain to Source on State Resistance RDS(on) (mΩ) Drain to Source Saturation Voltage VDS (on) (mV) Pulse Test 2 Gate to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage 160 1 100 Pulse Test 30 10 VGS = 4.5 V 10 V 3 1 1 3 10 30 Drain Current 100 ID 300 1000 (A) Page 3 of 6 Preliminary Static Drain to Source on State Resistance vs. Temperature Typical Capacitance vs. Drain to Source Voltage 20 10000 Pulse Test 3000 16 Capacitance C (pF) Static Drain to Source on State Resistance RDS(on) (mΩ) RJK0354DSP ID = 2 A, 5 A, 10 A 12 VGS = 4.5 V 8 10 V 4 0 –25 0 25 2 A, 5 A, 10 A 50 75 Case Temperature Tc 1000 10 0 (°C) 12 VDS 20 8 4 VDD = 25 V 10 V 0 0 10 20 Gate Charge 30 20 30 0 50 40 Qg (nc) 20 Reverse Drain Current IDR (A) VDD = 25 V 10 V VGS (V) 16 Gate to Source Voltage VDS (V) Drain to Source Voltage VGS 10 10 Reverse Drain Current vs. Source to Drain Voltage 40 30 VGS = 0 f = 1 MHz Drain to Source Voltage VDS (V) 20 ID = 16 A Crss 100 Dynamic Input Characteristics 50 Coss 300 30 100 125 150 Ciss 10 V 16 Pulse Test 5V 12 8 VGS = 0, –5 V 4 0 0.4 0.8 1.2 1.6 2.0 Source to Drain Voltage VSD (V) Repetitive Avalanche Energy EAR (mJ) Maximum Avalanche Energy vs. Channel Temperature Derating 50 IAP = 15 A VDD = 15 V duty < 0.1% Rg ≥ 50 Ω 40 30 20 10 0 25 50 75 100 125 150 Channel Temperature Tch (°C) REJ03G1661-0200 Rev.2.00 Apr 05, 2010 Page 4 of 6 RJK0354DSP Preliminary Normalized Transient Thermal Impedance γs (t) Normalized Transient Thermal Impedance vs. Pulse Width 10 D=1 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 e uls tp o sh θch – f(t) = γs (t) • θch – f θch – f = 85°C/W, Ta = 25°C When using the glass epoxy board (FR4 40 x 40 x 1.6 mm) 1 0.001 PDM D= PW T PW T 0.0001 10 μ 100 μ 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (s) Avalanche Test Circuit Avalanche Waveform EAR = L VDS Monitor 1 L • IAP2 • 2 VDSS VDSS – VDD IAP Monitor V(BR)DSS IAP Rg VDS VDD D. U. T ID Vin 15 V 0 VDD Switching Time Test Circuit Switching Time Waveform Vout Monitor Vin Monitor 90% D.U.T. Rg RL Vin Vout Vin 10 V 10% 10% VDS = 10 V 90% td(on) REJ03G1661-0200 Rev.2.00 Apr 05, 2010 10% tr 90% td(off) tf Page 5 of 6 RJK0354DSP Preliminary Package Dimensions JEITA Package Code P-SOP8-3.95 × 4.9-1.27 RENESAS Code PRSP0008DD-D Previous Code FP-8DAV MASS[Typ.] 0.085g F Package Name SOP-8 *1 D bp 1 c *2 E Index mark HE 5 8 4 Z Terminal cross section (Ni/Pd/Au plating) * 3 bp x M NOTE) 1. DIMENSIONS "*1(Nom)" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. e Reference Symbol D E A2 A1 A bp b1 c c1 A1 A L1 L y HE e x y Z L L1 Detail F Dimension in Millimeters Min Nom Max 4.90 5.3 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 5.80 6.10 6.20 1.27 0.25 0.1 0.75 0.40 0.60 1.27 1.08 Ordering Information Part No. RJK0354DSP-00-J0 Quantity 2500 pcs REJ03G1661-0200 Rev.2.00 Apr 05, 2010 Shipping Container Taping Page 6 of 6 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. 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