IDT IDT71128S20Y

IDT71128
CMOS Static RAM
1 Meg (256K x 4-Bit)
Revolutionary Pinout
Features
Description
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The IDT71128 is a 1,048,576-bit high-speed static RAM
organized as 256K x 4. It is fabricated using IDT’s high-performance, high-reliability CMOS technology. This state-of-the-art
technology, combined with innovative circuit design techniques,
provides a cost-effective solution for high-speed memory needs.
The JEDEC centerpower/GND pinout reduces noise generation
and improves system performance.
The IDT71128 has an output enable pin which operates as fast
as 6ns, with address access times as fast as 12ns available. All
bidirectional inputs and outputs of the IDT71128 are TTL-compatible and operation is from a single 5V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for
operation.
The IDT71128 is packaged in a 32-pin 400 mil Plastic SOJ.
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256K x 4 advanced high-speed CMOS static RAM
JEDEC revolutionary pinout (center power/GND) for
reduced noise.
Equal access and cycle times
— Commercial and Industrial: 12/15/20ns
One Chip Select plus one Output Enable pin
Bidirectional inputs and outputs directly
TTL-compatible
Low power consumption via chip deselect
Available in a 32-pin 400 mil Plastic SOJ.
Functional Block Diagram
A0
1,048,576-BIT
ADDRESS
MEMORY
DECODER
ARRAY
.
A17
I/O0 - I/O3
CS
WE
OE
4
4
I/O CONTROL
CONTROL
LOGIC
3483 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-3483/09
IDT71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Absolute Maximum Ratings(1)
Pin Configuration
NC
A0
A1
A2
A3
CS
I/O0
VCC
GND
I/O1
WE
A4
A5
A6
A7
NC
1
32
2
31
3
30
4
29
5
28
6 SO32-3 27
7
26
8
25
24
9
23
10
22
11
21
12
13
20
14
19
15
18
16
17
SOJ
Top View
Symbol
A17
A16
A15
A14
A13
OE
I/O3
GND
VCC
I/O2
A12
A11
A10
A9
A8
NC
VTERM
Rating
(2)
Value
Terminal Voltage with
Respect to GND
-0.5 to +7.0
Operating Temperature
TA
Unit
(2)
V
0 to +70
o
C
TBIAS
Temperature
Under Bias
-55 to +125
o
TSTG
Storage
Temperature
-55 to +125
o
PT
Power Dissipation
1.25
W
IOUT
DC Output Current
50
mA
C
C
3483 tbl 02
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. VTERM must not exceed Vcc + 0.5V.
3483 drw 02
Capacitance
(TA = +25°C, f = 1.0MHz, SOJ package)
Truth Table(1,2)
CS
OE
WE
I/O
L
L
H
DATAOUT
Read Data
L
X
L
DATAIN
Write Data
L
H
H
High-Z
Output Disabled
H
X
X
High-Z
Deselected - Standby (I SB)
VHC(3)
X
X
High-Z
Deselected - Standby (I SB1)
NOTES:
1. H = VIH, L = VIL, x = Don't care.
2. VLC = 0.2V, VHC = VCC -0.2V.
3. Other inputs ≥VHC or ≤VLC.
Parameter(1)
Symbol
Function
CIN
Input Capacitance
CI/O
I/O Capacitance
Conditions
Max.
Unit
VIN = 3dV
8
pF
VOUT = 3dV
8
pF
3483 tbl 03
NOTE:
1. This parameter is guaranteed by device characterization, but is not production tested.
Recommended Operating
Temperature and Supply Voltage
3483 tbl 01
Grade
Temperature
GND
VCC
Commercial
0°C to +70°C
0V
5.0V ± 10%
Industrial
–40°C to +85°C
0V
5.0V ± 10%
3483 tbl 04
Recommended DC Operating
Conditions
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
VIH
VIL
Input High Voltage
Input Low Voltage
Min.
Typ.
Max.
Unit
4.5
5.0
5.5
V
0
0
0
V
2.2
____
VCC +0.5
V
____
0.8
(1)
-0.5
NOTE:
1. VIL (min.) = –1.5V for pulse width less than 10ns, once per cycle.
6.42
2
V
3483 tbl 05
IDT 71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
DC Electrical Characteristics
(VCC = 5.0V ± 10%, Commercial and Industrial Temperature Ranges)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
5
µA
|ILI|
Input Leakage Current
VCC = Max., VIN = GND to VCC
___
|I LO|
Output Leakage Current
VCC = Max., CS = VIH, VOUT = GND to VCC
___
5
µA
VOL
Output Low Voltage
IOL = 8mA, VCC = Min.
___
0.4
V
2.4
___
V
Output High Voltage
VOH
IOH = -4mA, VCC = Min.
3483 tbl 06
DC Electrical Characteristics(1)
(VCC = 5.0V ± 10%, VLC = 0.2V, VHC = VCC - 0.2V)
71128S12
Symbol
Parameter
71128S15
71128S20
Com'l.
Ind.
Com'l.
Ind.
Com'l.
Ind.
Unit
ICC
Dynamic Operating Current
CS < VIL, Outputs Open, VCC = Max., f = fMAX(2)
155
155
150
150
145
145
mA
ISB
Standby Power Supply Current (TTL Level)
CS > VIH, Outputs Open, VCC = Max., f = fMAX(2)
40
40
40
40
40
40
mA
ISB1
Full Standby Power Supply Current (CMOS Level)
CS > VHC, Outputs Open, VCC = Max., f = 0(2)
VIN < VLC or VIN > VHC
10
10
10
10
10
10
mA
3483 tbl 07
NOTES:
1. All values are maximum guaranteed values.
2. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.
AC Test Conditions
GND to 3.0V
Input Pulse Levels
Input Rise/Fall Times
3ns
Input Timing Reference Levels
1.5V
Output Reference Levels
1.5V
See Figure 1 and 2
AC Test Load
3483 tbl 08
AC Test Loads
5V
5V
480Ω
480Ω
DATA OUT
DATA OUT
30pF
5pF*
255Ω
255Ω
3483 drw 04
3483 drw 03
*Including jig and scope capacitance.
Figure 1. AC Test Load
Figure 2. AC Test Load
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)
6.42
3
IDT71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VCC = 5.0V ± 10%, Commercial and Industrial Temperature Ranges)
71128S12
Symbol
Parameter
71128S15
71128S20
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Read Cycle Time
12
____
15
____
20
____
ns
Address Access Time
____
12
____
15
____
20
ns
Chip Select Access Time
____
12
____
15
____
20
ns
3
____
3
____
3
____
ns
0
READ CYCLE
tRC
tAA
tACS
tCLZ (1)
Chip Select to Output in Low-Z
tCHZ(1)
Chip Deselect to Output in High-Z
tOE
0
7
0
8
ns
6
____
7
____
8
ns
Output Enable to Output in Low-Z
0
____
0
____
0
____
ns
Output Disable to Output in High-Z
0
5
0
5
0
7
ns
4
____
4
____
4
____
ns
0
____
0
____
0
____
ns
Chip Deselect to Power-Down Time
____
12
____
15
____
20
ns
Write Cycle Time
12
____
15
____
20
____
ns
10
____
12
____
15
____
ns
10
____
12
____
15
____
ns
0
____
0
____
0
____
ns
10
____
12
____
15
____
ns
0
____
0
____
0
____
ns
7
____
8
____
9
____
ns
0
____
0
____
0
____
ns
3
____
4
____
ns
0
5
0
8
ns
Output Enable to Output Valid
tOLZ
(1)
tOHZ (1)
tOH
tPU
6
____
Output Hold from Address Change
(1)
tPD(1)
Chip Select to Power-Up Time
WRITE CYCLE
tWC
Address Valid to End of Write
tAW
Chip Select to End of Write
tCW
Address Set-up Time
tAS
Write Pulse Width
tWP
Write Recovery Time
tWR
Data Valid to End-of-Write
tDW
Data Hold Time
tDH
(1)
tOW
Output active from End-of-Write
3
____
tWHZ(1)
Write Enable to Output in High-Z
0
5
NOTE:
1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested.
6.42
4
3483 tbl 09
IDT 71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Timing Waveform of Read Cycle No. 1(1)
tRC
ADDRESS
tAA
OE
tOE
CS
tOLZ
tCLZ
DATAOUT
VCC SUPPLY ICC
CURRENT ISB
(5)
(5)
tACS
(3)
tCHZ
HIGH IMPEDANCE
(5)
tOHZ (5)
DATAOUT VALID
tPD
tPU
3483 drw 05
Timing Waveform of Read Cycle No. 2 (1, 2, 4)
tRC
ADDRESS
tAA
tOH
DATAOUT
tOH
DATAOUT VALID
PREVIOUS DATAOUT VALID
3483 drw 06
NOTES:
1. WE is HIGH for Read Cycle.
2. Device is continuously selected, CS is LOW.
3. Address must be valid prior to or coincident with the later of CS transition LOW; otherwise tAA is the limiting parameter.
4. OE is LOW.
5. Transition is measured ±200mV from steady state.
6.42
5
IDT71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1, 2, 4)
tWC
ADDRESS
tAW
CS
tWP (2)
tAS
tWR
WE
tWHZ
DATAOUT
(5)
tOW
tCHZ
(5)
HIGH IMPEDANCE
(3)
tDW
DATAIN
(5)
(3)
tDH
DATAIN VALID
3483 drw 07
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1, 4)
tWC
ADDRESS
tAW
CS
tAS
tWR
tCW
WE
tDW
DATAIN
tDH
DATAIN VALID
3483 drw 08
NOTES:
1. A write occurs during the overlap of a LOW CS and a LOW WE.
2. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be placed
on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is the specified tWP.
3. During this period, I/O pins are in the output state, and input signals must not be applied.
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS must be active during the tCW write period.
5. Transition is measured ±200mV from steady state.
6.42
6
IDT 71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Ordering Information
IDT
71128
S
XX
Device
Type
Power
Speed
X
Package
X
Process/
Temperature
Range
Blank
I
Commercial (0°C to +70°C)
Industrial (–40°C to +85°C)
Y
400-mil SOJ (SO32-3)
12
15
20
Speed in nanoseconds
3483 drw 09
6.42
7
IDT71128 CMOS Static RAM
1 Meg (256K x 4-bit) Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Datasheet Document History
8/5/99
8/13/99
9/30/99
2/18/00
3/14/00
8/09/00
02/01/01
Pg. 3
Pg. 4
Pg. 6
Pg. 8
Pg. 1, 3, 4, 7
Pg. 3
Pg. 3
Updated to new format
Removed military entries from DC table
Removed Note 1, renumbered notes and footnotes
Removed Note 1, renumbered notes and footnotes
Added Datasheet Document History
Added 12ns, 15ns, and 20ns industrial temperature speed grade offerings
Revise ISB for Industrial Temperature offerings to meet commerical specifications
Revised ISB to accomidate speed functionality
Not recommended for new designs
Removed "Not recommended for new designs"
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www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
6.42
8
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