Reliability Report

AOS Semiconductor
Product Reliability Report
AOZ8318, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOZ8318. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOZ8318 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOZ8318 is a transient voltage suppressor array designed to protect high speed data lines
from ESD and lightning.
This AOZ8318 incorporates eight surge rated, low capacitance steering diodes and a TVS in a
single package. During transient conditions, the steering diodes direct the transient to either the
positive side of the power supply line or to ground.
The AOZ8318 comes in a Halogen Free and RoHS compliant DFN-10 2.6 mm x 2.6 mm package
and is rated over a -40 °C to +85 °C ambient temperature range. The AOZ8318 is compatible
with both lead free and SnPb assembly techniques. The small size, low capacitance and high
ESD protection makes the AOZ8318 ideal for protecting high speed video and data
communication interfaces.
Detailed information refers to the datasheet on website.
.
II. Package and Die Information:
AOZ8318
Product ID
Package Type
DFN2.6X2.6 10L
Lead Frame
Cu
Die attach material
Ag Epoxy
Bonding
Au wire
MSL(moisture sensitive level)
Up to Level 1
2
III. Reliability Stress Test Summary and Results:
Test Condition
Test
Point
Total
Sample size
Number of
Failures
Standard
HTRB
Vdd= 80% Vbrmax.
Temp = 150°C
168 / 500
1000 hours
924 pcs
0
JESD22-A108
MSL
Precondition
168hr 85°C / 85%RH +
3 cycle reflow@260°C
(MSL 1)
-
3234 pcs
0
JESD22-A113
Temperature
Cycle
-65 °C to +150 °C,
air to air
250 / 500
cycles
924 pcs
0
JESD22-A104
Autoclave
121°C, 29.7psi,
RH= 100%
96 hours
924 pcs
0
JESD22-A102
HAST
130°C, 85%RH,
33.3 psi,
Vdd= 80% Vbrmax.
96 hours
693 pcs
0
JESD22-A110
HTSL
Temp = 150°C
1000 hrs
693 pcs
0
JESD22-A103
Test Item
Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 5.09
MTTF = 22440 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product. Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion device hours.
Failure Rate = 5.09
MTTF = 22440 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence
interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
3
130 deg C
150 deg C
2.59
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