Datasheet

AOZ8000
Ultra-Low Capacitance TVS Diode Array
General Description
Features
The AOZ8000 is a transient voltage suppressor array
designed to protect high speed data lines from ESD and
lightning.
●
This device incorporates eight surge rated, low capacitance steering diodes and a TVS in a single package.
During transient conditions, the steering diodes direct
the transient to either the positive side of the power
supply line or to ground. They may be used to meet the
ESD immunity requirements of IEC 61000-4-2, Level 4.
The TVS diodes provide effective suppression of ESD
voltages: ±15kV (air discharge) and ±8kV (contact
discharge).
The AOZ8000 comes in SOT-23, DFN-6, and SC-70
packages. They are compatible with both lead free and
SnPb assembly techniques. The small size, low capacitance and high ESD protection makes it ideal for protecting high speed video and data communication interfaces.
ESD protection for high-speed data lines:
– IEC 61000-4-2, level 4 (ESD) immunity test
– ±15kV (air discharge) and ±8kV (contact discharge)
– IEC 61000-4-5 (Lightning) 5A (8/20µs)
– Human Body Model (HBM) ±15kV
●
Small package saves board space
●
Low insertion loss
●
Protects four I/O lines
●
Low capacitance between I/O lines: 0.9pF
●
Low clamping voltage
●
Low operating voltage: 5.0V
Applications
●
USB 2.0 power and data line protection
●
Video graphics cards
●
Monitors and flat panel displays
●
Digital Video Interface (DVI)
●
10/100/1000 Ethernet
●
Notebook computers
Typical Application
USB Host
Controller
+5V
Downstream
Ports
VBUS
RT
D+
RT
DVBUS
GND
AOZ8000
+5V
VBUS
RT
D+
RT
DGND
Figure 1. 2 USB High Speed Ports
Rev. 2.4 July 2010
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Page 1 of 15
AOZ8000
Ordering Information
Part Number
Package
AOZ8000HIL
SC-70-6
AOZ8000DIL
DFN-6
AOZ8000CIL
SOT23-6
Environmental
RoHS Compliant
Green Prodcut
AOS Green Products (with “L” suffix) use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
CH1
1
6
CH4
VN
2
5
VP
CH2
3
4
CH3
CH1
1
6
CH4
VN
2
5
VP
CH2
3
4
CH3
SOT23-6/SC-70-6
DFN-6
(Top View)
(Top View)
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage the device.
Parameter
Rating
VP – VN
6V
Peak Pulse Current (IPP), tP = 8/20µs
5A
Peak Power Dissipation (8 x 20µs@ 25°C)
SC-70
DFN
SOT-23
60W
70W
60W
Storage Temperature (TS)
-65°C to +150°C
ESD Rating per IEC61000-4-2,
Contact(1)
±8kV
ESD Rating per IEC61000-4-2,
Air(1)
±15kV
Model(2)
±15kV
ESD Rating per Human Body
Notes:
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330Ω.
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100pF, RDischarge = 1.5kΩ.
Maximum Operating Ratings
Parameter
Rating
Junction Temperature (TJ)
Rev. 2.4 July 2010
-55°C to +125°C
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Page 2 of 15
AOZ8000
Electrical Characteristics
Symbol
VRWM
VBR
Parameter
Reverse Working Voltage
Conditions
Min.
Between pin 5 and 2(4)
(5)
Reverse Breakdown Voltage
IT = 1mA, between pins 5 and 2
IR
Reverse Leakage Current
VRWM = 5V, between pins 5 and 2
VF
Diode Forward Voltage
IF = 15mA
VCL
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 1A, tp = 100ns, any I/O pin to
Ground(3)(6)(8)
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 5A, tp = 100ns, any I/O pin to
Ground(3)(6)(8)
Channel Clamp Voltage
Positive Transients
Negative Transient
IPP = 12A, tp = 100ns, any I/O pin to
Ground(3)(6)(8)
Junction Capacitance
VR = 0V, f = 1MHz, any I/O pin to Ground(3)(6)
Cj
0.70
VR = 0V, f = 1MHz, between I/O pins
VR = 0V, f = 1MHz, any I/O pin to
Channel Input Capacitance
Matching
VR = 0V, f = 1MHz, between I/O
Max.
Units
5.5
V
6.6
(3)(6)
ΔCj
Typ.
Ground(3)(7)
pins(3)(6)
V
0.1
µA
1
V
10.0
-3.0
V
V
11
-6.0
V
V
15.0
-10.0
V
V
1.85
1.94
pF
0.9
0.94
pF
1.0
1.17
pF
0.03
pF
0.85
Notes:
3. These specifications are guaranteed by design.
4. The working peak reverse voltage, VRWM, should be equal to or greater than the DC or continuous peak operating voltage level.
5. VBR is measured at the pulse test current IT.
6. Measurements performed with no external capacitor on VP (pin 5 floating).
7. Measurements performed with VP biased to 3.3 Volts (pin 5 @ 3.3V).
8. Measurements performed using a 100ns Transmission Line Pulse (TLP) system.
Rev. 2.4 July 2010
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Page 3 of 15
AOZ8000
Typical Performance Characteristics
Clamping Voltage vs. Peak Pulse Current
Typical Variation of CIN vs VR
(tperiod = 100ns, tr = 1ns)
(f = 1MHz, T = 25°C)
16
Vp (Pin 5) = Float
1.75
Clamping Voltage, VCL (V)
Input Capacitance (pF)
2.00
1.50
1.25
1.00
Vp (Pin 5) = 3.3V
0.75
0.50
0.25
0.00
0.00
15
14
13
12
11
10
9
8
1.00
3.00
2.00
4.00
0
5.00
2
Input Voltage (V)
Forward Voltage vs. Forward Current
4
6
8
Peak Pulse Current, IPP (A)
12
I/O – Gnd Insertion Loss (S21) vs. Frequency
(tperiod = 100ns, tr = 1ns)
(Vp = 3.3V)
12
10
Insertion Loss (dB)
Forward Voltage (V)
10
8
6
4
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
2
0
2
4
6
8
10
12
1
10
I/O – I/O Insertion Loss (S21) vs. Frequency
1000
Analog Crosstalk (I/O–I/O) vs. Frequency
(Vp = Float)
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
20
Insertion Loss (dB)
Insertion Loss (dB)
100
Frequency (MHz)
Forward Current (A)
0
-20
-40
-60
-80
1
10
100
1000
10
100
1000
Frequency (MHz)
Frequency (MHz)
ESD Clamping
8kV Contact per IEC61000-4-2
Note: Data was taken with a 10X attenuator
Rev. 2.4 July 2010
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Page 4 of 15
AOZ8000
Application Information
The AOZ8000 TVS is design to protect four data lines
from fast damaging transient over-voltage by clamping it
to a reference. When the transient on a protected data
line exceed the reference voltage the steering diode is
forward bias thus, conducting the harmful ESD transient
away from the sensitive circuitry under protection.
PCB Layout Guidelines
Printed circuit board layout is the key to achieving the
highest level of surge immunity on power and data lines.
The location of the protection devices on the PCB is the
simplest and most important design rule to follow. The
AOZ8000 devices should be located as close as possible
to the noise source. The placement of the AOZ8000
devices should be used on all data and power lines that
enter or exit the PCB at the I/O connector. In most
systems, surge pulses occur on data and power lines
that enter the PCB through the I/O connector. Placing
the AOZ8000 devices as close as possible to the noise
source ensures that a surge voltage will be clamped
before the pulse can be coupled into adjacent PCB
traces. In addition, the PCB should use the shortest
possible traces. A short trace length equates to low
impedance, which ensures that the surge energy will be
dissipated by the AOZ8000 device. Long signal traces
will act as antennas to receive energy from fields that are
produced by the ESD pulse. By keeping line lengths as
short as possible, the efficiency of the line to act as an
antenna for ESD related fields is reduced. Minimize
interconnecting line lengths by placing devices with the
most interconnect as close together as possible. The
protection circuits should shunt the surge voltage to
either the reference or chassis ground. Shunting the
surge voltage directly to the IC’s signal ground can cause
ground bounce. The clamping performance of TVS
diodes on a single ground PCB can be improved by
minimizing the impedance with relatively short and wide
ground traces. The PCB layout and IC package parasitic
inductances can cause significant overshoot to the TVS’s
clamping voltage. The inductance of the PCB can be
reduced by using short trace lengths and multiple layers
Rev. 2.4 July 2010
with separate ground and power planes. One effective
method to minimize loop problems is to incorporate a
ground plane in the PCB design. The AOZ8000 ultra-low
capacitance TVS is designed to protect four high speed
data transmission lines from transient over-voltages by
clamping them to a fixed reference. The low inductance
and construction minimizes voltage overshoot during
high current surges. When the voltage on the protected
line exceeds the reference voltage the internal steering
diodes are forward biased, conducting the transient
current away from the sensitive circuitry.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
1. Place the TVS near the IO terminals or connectors to
restrict transient coupling.
2. Fill unused portions of the PCB with ground plane.
3. Minimize the path length between the TVS and the
protected line.
4. Minimize all conductive loops including power and
ground loops.
5. The ESD transient return path to ground should be
kept as short as possible.
6. Never run critical signals near board edges.
7. Use ground planes whenever possible.
8. Avoid running critical signal traces (clocks, resets,
etc.) near PCB edges.
9. Separate chassis ground traces from components
and signal traces by at least 4mm.
10. Keep the chassis ground trace length-to-width ratio
<5:1 to minimize inductance.
11. Protect all external connections with TVS diodes.
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Page 5 of 15
AOZ8000
VCC
Reset
Clock
I/O
GND
SIM
AOZ8000
SIM Card Port Connection
TPBIASx
1μ
56Ω
56Ω
IEEE 1394
Connector
TPAx+
IEEE 1394
PHY
TPAxTPBx+
TPBxGND
56Ω
5.1kΩ
56Ω
270p
AOZ8000
IEEE1394 Port Connection
AOZ8000
TRD0+
TRD0-
Ethernet
Controller
TRD1+
RJ45
Connector
TRD1TRD2+
TRD2TRD3+
TRD3-
AOZ8000
10/100 Ethernet Port Connection
Rev. 2.4 July 2010
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Page 6 of 15
AOZ8000
Package Dimensions, SC70-6L
D
Gauge Plane
0.15mm
e1
θ
L
E1
E
e
c
b
A2
A
.010mm
A1
Dimensions in millimeters
RECOMMENDED LAND PATTERN
1.95
0.65
0.35
0.65
UNIT: mm
Symbols
A
A1
A2
b
Min.
c
D
E
e
e1
0.08
1.85
1.80
E1
L
θ
1.1
0.26
0°
0.00
0.7
0.15
Nom.
—
—
0.9
—
Max.
1.10
0.10
1.00
0.30
—
0.22
2.10
2.15
2.30
2.40
0.65 BSC
1.30 BSC
1.30
0.36
4°
1.4
0.46
8°
Dimensions in inches
Symbols
A
A1
A2
b
Min.
0.00
0.028
0.006
c
D
E
e
e1
0.003
0.073
0.071
E1
L
θ
0.043
0.010
0°
Nom.
—
—
0.035
—
Max.
0.043
0.004
0.039
0.012
—
0.009
0.083 0.085
0.091 0.094
0.026 BSC
0.051 BSC
0.051
0.014
4°
0.055
0.018
8°
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 3 mils.
4. Die is facing up for mold and facing down for trim/form; i.e., reverse trim/form.
5. Dimension L is measured in gauge plane.
6. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Rev. 2.4 July 2010
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Page 7 of 15
AOZ8000
Tape and Reel Dimensions, SC70-6L
Carrier Tape
P1
D1
P2
T
E1
E2
E
B0
K0
A0
D0
P0
Feeding Direction
UNIT: mm
Package
SC-70, 6L
(8mm)
A0
2.40
±0.10
B0
2.40
±0.10
K0
1.19
±0.10
D0
1.00
Min.
D1
1.55
±0.05
E
8.00
±0.30
Reel
E1
1.75
±0.10
E2
3.50
±0.05
P0
4.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.05
T
0.25
±0.05
W1
S
G
N
M
K
V
R
H
W
W
N
Tape Size Reel Size
M
8mm
ø180
ø180.00 ø60.50 9.00
±0.30
±0.50
W1
11.40
±1.00
H
K
ø13.00
10.60
+0.50/-0.20
S
2.00
±0.50
G
ø9.00
R
5.00
V
18.00
Leader/Trailer and Orientation
Trailer Tape
300mm min. or
75 empty pockets
Rev. 2.4 July 2010
Components Tape
Orientation in Pocket
www.aosmd.com
Leader Tape
500mm min. or
125 empty pockets
Page 8 of 15
AOZ8000
Package Dimensions, SOT23-6L
Gauge Plane
D
e1
Seating Plane
0.25mm
c
L
E E1
θ1
e
b
A2
A
.010mm
A1
Dimensions in millimeters
RECOMMENDED LAND PATTERN
2.40
0.80
0.95
0.63
UNIT: mm
Dimensions in inches
Symbols
A
A1
A2
Min.
0.90
0.00
0.80
Nom.
—
—
1.10
Max.
1.25
0.15
1.20
Symbols
A
A1
A2
Min.
0.035
0.00
0.031
Nom.
—
—
0.043
Max.
0.049
0.006
0.047
b
c
D
E
E1
0.30
0.08
2.70
2.50
1.50
0.40
0.13
2.90
2.80
1.60
0.50
0.20
3.10
3.10
1.70
b
c
D
E
E1
0.012
0.003
0.106
0.098
0.059
0.016
0.005
0.114
0.110
0.063
0.020
0.008
0.122
0.122
0.067
e
e1
L
θ1
0.95 BSC
1.90 BSC
0.30
—
0.60
0°
—
8°
e
e1
L
θ1
0.037 BSC
0.075 BSC
0.012
—
0.024
0°
—
8°
Notes:
1. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils each.
2. Dimension “L” is measured in gauge plane.
3. Tolerance ±0.100mm (4 mil) unless otherwise specified.
4. Followed from JEDEC MO-178C & MO-193C.
6. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
Rev. 2.4 July 2010
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Page 9 of 15
AOZ8000
Tape and Reel Dimensions, SOT23-5&6L
Tape
P2
P1
D1
D0
E1
K0
E2
E
B0
A0
P0
Feeding Direction
Unit: mm
Package
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
SOT23-5/6L
LP
3.15
±0.10
3.20
±0.10
1.40
±0.10
1.50
±0.05
1.00
+0.10 / -0
8.00
±0.30
1.75
±0.10
3.50
±0.05
4.00
±0.10
4.00
±0.10
2.00
±0.05
0.23
±0.03
Reel
W1
S
K
R
M
N
J
H
Unit: mm
Tape Size
Reel Size
M
N
8mm
ø177.8
ø177.8
Max.
55.0
Min.
W1
H
8.4
13.0
+1.50 / -0.0 +0.5 / -0.2
S
K
R
J
1.5
Min
10.1
Min.
12.7
4.0
±0.1
Leader/Trailer and Orientation
Trailer Tape
300mm min.
Rev. 2.4 July 2010
Components Tape
Orientation in Pocket
www.aosmd.com
Leader Tape
500mm min.
Page 10 of 15
AOZ8000
Package Dimensions, DFN 2 x 2 (Page 1 of 3)
TOP VIEW
D
A
B
L2
E
Pin 1 Mark
1
L2
Detail D
SIDE VIEW
4x
A2
A
A1
A3
Detail C
C
Seating
Plane
BOTTOM VIEW
e
D4
6xb
1
E4
L
E2
See Detail A
6
See Detail C
D2
2x e
Rev. 2.4 July 2010
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Page 11 of 15
AOZ8000
Package Dimensions, DFN 2 x 2 (Page 2 of 3)
L1
Exposed Slug/Heat Sink
0.17
0.30
L2
B
Detail C
4xR
Exposed Metalized Feature
Edge of Plastic Body
Detail A
A1
Detail D
Datum A or B
Datum A or B
6x R1
6x R1
L
e/2
e
L2
Terminal Tip
Terminal Tip
e
Even Terminal Side
Odd Terminal Side
Detail B
RECOMMENDED LAND PATTERN
0.620
0.300
0.565
1.170
0.943
0.650
Unit: mm
Rev. 2.4 July 2010
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Page 12 of 15
AOZ8000
Package Dimensions, DFN 2 x 2 (Page 3 of 3)
Dimensions in millimeters
Dimensions in inches
Symbols
A
Min.
0.80
Nom.
0.90
Max.
1.00
Symbols
A
Min.
0.031
Nom.
0.035
Max.
0.039
A1
0.00
0.025
0.05
A1
0.000
0.001
0.002
A2
A3
b
0.65
0.15
0.18
0.70
0.20
0.20
0.75
0.25
0.28
A2
A3
b
0.026
0.006
0.007
0.028
0.008
0.008
0.030
0.010
0.011
D
2.0 BSC
D
0.079 BSC
E
e
E4
2.0 BSC
0.65 BSC
0.56
0.66
0.76
E
e
E4
0.079 BSC
0.026 BSC
0.022 0.026 0.030
E2
0.84
0.94
1.04
E2
0.033
0.037
0.041
D4
D2
L
0.21
0.52
0.20
0.31
0.62
0.29
0.41
0.72
0.45
D4
D2
L
0.008
0.020
0.008
0.012
0.024
0.011
0.016
0.028
0.018
—
—
0.125
0.075 REF
0.075 REF
L1
L2
R
R1
L1
L2
R
R1
—
—
—
—
0.005
0.003 REF
0.003 REF
R2
aaa
—
0.10
R2
aaa
—
0.004
bbb
ccc
ddd
eee
θ
0.10
0.10
0.05
0.08
10°
bbb
ccc
ddd
eee
θ
0.004
0.004
0.002
0.003
10°
0°
12°
0°
12°
Notes:
1. Dimensioning and tolerances conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. All angles are in degrees.
3. The terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1
are optional, but must be located within the zone indicated. The terminal #1 identifier may be a molded, marked, or metalized
feature.
4. Dimension b apply to metallized terminal and is measured between 0.15mm and 0.20mm from terminal tip.
5. Coplanarity applies to the exposed heat sink slug as well as the terminal.
6. Profile tolerance (aaa) will be applicable only to the plastic body, and not to the metallized fetures (such as terminal tips and tie bars.)
Metallized features may protrude a maximum of L2 from the plastic body profile.
7. Corners will be sharp unless otherwise specified with radius dimensions.
8. This feature applies to both ends of the package.
9. If L1 max. is not called out, the metalized feature will extend to the exposed pad. Thus, the 0.17mm gap does not apply.
Rev. 2.4 July 2010
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Page 13 of 15
AOZ8000
Tape and Reel Dimensions, DFN 2 x 2
Carrier Tape
P2
P1
D0
D1
E1
K0
E2
B0
T
E
A0
P0
Feeding Direction
UNIT: mm
Package
DFN 2x2
A0
2.25
±0.05
B0
2.25
±0.05
K0
D0
D1
E
E1
1.00
1.50
1.00
8.00
1.75
±0.05 +0.10/-0 +0.25/-0 +0.30/-0.10 ±0.10
Reel
E2
3.50
±0.05
P0
4.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.10
T
0.254
±0.02
W1
S
R
K
M
N
H
UNIT: mm
Tape Size Reel Size
M
8mm
ø180
ø180.00
±0.50
N
60.0
±0.50
W1
8.4
+1.5/-0.0
H
13.0
±0.20
S
1.5
Min.
K
13.5
Min.
R
3.0
±0.50
Leader / Trailer
& Orientation
Trailer Tape
300mm Min.
Rev. 2.4 July 2010
Components Tape
Orientation in Pocket
www.aosmd.com
Leader Tape
500mm Min.
Page 14 of 15
AOZ8000
Part Marking
AOZ8000HIL
(SOT-23)
(SC70-6)
ABOW
Part Number Code
Underscore Denotes
Green Product
LT
AOZ8000CIL
AWL
Assembly Lot Code
Part Number Code
Underscore Denotes
Green Product
Year & Week Code
Assembly Lot & Location Code
Week & Year Code
Option & Assembly Location Code
AOZ8000DIL
(DFN 2x2)
Part Number Code
Underscore Denotes Green Product
Assembly Location Code
AAOA
Option Code
YWLT
Year & Week Code
Assembly Lot Code
This datasheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
Rev. 2.4 July 2010
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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