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AS5147
14-Bit On-Axis Magnetic Rotary
Position Sensor with 11-Bit Binary
Incremental Pulse Count
General Description
The AS5147 is a high-resolution rotary position sensor for fast
absolute angle measurement over a full 360-degree range. This
new position sensor is equipped with a revolutionary
integrated dynamic angle error compensation (DAEC™) with
almost 0 latency.
The robust design of the device suppresses the influence of any
homogenous external stray magnetic field. A standard 4-wire
SPI serial interface allows a host microcontroller to read 14-bit
absolute angle position data from the AS5147 and to program
non-volatile settings without a dedicated programmer.
Incremental movements are indicated on a set of ABI signals
with a maximum resolution of 2048 steps / 512 pulses per
revolution. The resolution of the ABI signal is programmable to
1024 steps / 256 pulses per revolution.
Brushless DC (BLDC) motors are controlled through a standard
UVW commutation interface with a programmable number of
pole pairs from 1 to 7. The absolute angle position is also
provided as PWM-encoded output signal.
The AS5147 supports embedded self-diagnostics including
magnetic field strength too high, magnetic field strength too
low or lost magnet, and other related diagnostic features.
The product is defined as SEooC (Safety Element out of Context)
according ISO26262 including FMEDA, safety manual and third
party qualification.
The AS5147 is available as a single die in a compact 14-pin
TSSOP package.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-10] 2016-Apr-27
Page 1
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AS5147 − General Description
Key Benefits & Features
The benefits and features of AS5147, 14-Bit On-Axis Magnetic
Rotary Position Sensor with 11-Bit Binary Incremental Pulse
Count are listed below:
Figure 1:
Added Value of Using the AS5147
Benefits
Features
• Easy to use – saving costs on DSP
• DAEC™ Dynamic angle error compensation
• Good resolution for motor and position control
• 14-bit core resolution
• Versatile choice of the interface
• Independent output interfaces: SPI, ABI, UVW,
PWM
• No programmer needed (via SPI command)
• Zero position, configuration programmable
• Supports safety challenging applications
• Self-Diagnostics
• Lower system costs (no shielding)
• Immune to external stray field
Applications
The AS5147 has been designed to support BLDC motor
commutation for the most challenging automotive
applications (AEC-Q100 grade 0 automotive qualified) such as
electric power steering (EPS), transmission (gearbox, actuator),
pump, brake (actuator) and starter and alternator.
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
AS5147 Block Diagram
VDD3V3
AS5147
CSn
SCL
MISO
MOSI
Volatile Memory
SPI
VDD
OTP
LDO
ABI
Hall
Sensors
Analog
Front-End
A/D
AGC
ATAN
(CORDIC)
INTERPOLATOR
Dynamic Angle
Error
Compensation
UWV
A
B
I/PWM
U
V
W / PWM
PWM Decoder
Selectable
on I or W
GND
ams Datasheet
[v1-10] 2016-Apr-27
Page 3
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AS5147 − Pin Assignment
Pin Assignment
Figure 3:
TSSOP-14 Pin Assignment
I / PWM
CLK
GND
MISO
VDD3V
MOSI
TEST
AS5147
CSn
B
VDD
U
V
A
W / PWM
Figure 4:
Pin Description
Pin Number
Pin Name
1
CSn
Digital input
SPI chip select (active low)
2
CLK
Digital input
SPI clock
3
MISO
Digital output
SPI master data input, slave output
4
MOSI
Digital input
SPI master data output, slave input
5
Test
6
B
Digital output
Incremental signal B
7
A
Digital output
Incremental signal A
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Pin Type
Description
Test pin (connect to ground)
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Pin Assignment
Pin Number
Pin Name
Pin Type
Description
8
W/PWM
Digital output
Commutation signal W or PWM-encoded output
9
V
Digital output
Commutation signal V
10
U
Digital output
Commutation signal U
11
VDD
Power supply
5V power supply voltage for on-chip regulator
12
VDD3V3
Power supply
3.3V on-chip low-dropout (LDO) output. Requires an
external decoupling capacitor (1μF)
13
GND
Power supply
Ground
14
I
Digital output
Incremental signal I (index) or PWM
Note(s) and/or Footnote(s):
1. Floating state of a digital input is not allowed.
2. If SPI is not used, a Pull up resistor on CSn is required.
3. If SPI is not used, a Pull down resistor on CLK and MOSI is required.
4. If SPI is not used, the pin MISO can be left open.
5. If ABI, UVW or PWM is not used, the pins can be left open.
ams Datasheet
[v1-10] 2016-Apr-27
Page 5
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AS5147 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
VDD5
DC supply voltage at VDD pin
-0.3
7.0
V
VDD3
DC supply voltage at VDD3V3
pin
-0.3
5.0
V
VSS
DC supply voltage at GND pin
-0.3
0.3
V
Vin
Input pin voltage
VDD+0.3
V
Iscr
Input current
(latch-up immunity)
100
mA
AEC-Q100-004
ESD
Electrostatic discharge
kV
AEC-Q100-002
Pt
Total power dissipation
(all supplies and outputs)
Ta5V0
Ambient temperature 5V0
Ta3V3
TaProg
-100
±2
Note
150
mW
-40
150
°C
In the 5.0V power supply mode
only
Ambient temperature 3V3
-40
125
°C
In the 3.3V power supply mode
if NOISESET = 0
Programming temperature
5
45
°C
Programming @ room
temperature (25°C ± 20°C)
-55
150
°C
260
°C
85
%
Tstrg
Storage temperature
Tbody
Package body temperature
RHNC
Relative humidity
non-condensing
MSL
Moisture sensitivity level
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5
3
IPC/JEDEC J-STD-020
Represents a maximum floor
lifetime of 168h
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Figure 6:
Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VDD
Positive supply voltage
5.0V operation mode
4.5
5.0
5.5
V
VDD3V3
Positive supply voltage
3.3V operation mode;
only from -40 to
125°C
3.0
3.3
3.6
V
Positive supply voltage
3.3V operation mode;
only from -40 to
150°C (3V150°C Bit
has to be set)
3.2
3.4
3.6
V
Positive supply voltage
Supply voltage
required for
programming in 3.3V
operation
3.3
3.5
V
Regulated voltage
Voltage at VDD3V3
pin if VDD ≠ VDD3V3
3.2
3.6
V
15
mA
VDD3V3_150
VDD_Burn
VREG
3.4
IDD
Supply current
VIH
High-level input
voltage
VIL
Low-level input voltage
VOH
High-level output
voltage
VOL
Low-level output
voltage
VSS + 0.4
V
I_Out
Current on digital
output (ABI, UVW)
1
mA
I_Out_MISO
Current on digital
output MISO
4
mA
C_L
Capacitive load on
digital output
50
pf
ams Datasheet
[v1-10] 2016-Apr-27
0.7 × VDD
V
0.3 ×
VDD
VDD - 0.5
V
V
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AS5147 − Magnetic Characteristics
Magnetic Characteristics
Figure 7:
Magnetic Specifications
Symbol
Parameter
Conditions
Min
Max
Unit
Bz
Orthogonal magnetic field
strength, normal operating
mode
Required orthogonal component of the
magnetic field strength measured at the
die's surface along a circle of 1.1mm
35
70
mT
Note(s) and/or Footnote(s):
1. It is possible to operate the AS5147 below 35mT with reduced noise performance.
System Characteristics
Figure 8:
System Specifications
Symbol
RES
RES_ABI
Parameter
Conditions
Min
Core resolution
Resolution of the ABI
interface
Typ
Max
14
Programmable with
register setting
(ABIRES)
10
Units
bit
11
bit
INLOPT @ 25°C
Non-linearity, optimum
placement of the
magnet
±0.8
degree
INLOPT+TEMP
Non-linearity optimum
placement of the
magnet over the full
Temperature Range
±1
degree
INLDIS+TEMP
Non-linearity @
displacement of
magnet and
temperature -40°C to
150°C
Assuming N35H
Magnet
(D=8mm, H=3mm)
500μm displacement
in x and y
z-distance @ 2000μm
±1.2
degree
ONL
RMS output noise
(1 sigma). Not tested,
guaranteed by design.
Orthogonal
component for the
magnetic field within
the specified range
(Bz), NOISESET = 0
0.068
degree
ONH
RMS output noise
(1 sigma) on SPI, ABI
and UVW interfaces.
Not tested, guaranteed
by design.
Orthogonal
component for the
magnetic field within
the specified range
(Bz), NOISESET = 1
0.082
degree
Page 8
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Timing Characteristics
Symbol
Parameter
Max
Units
ON_PWM
RMS output noise
(1 sigma) on PWM
interface
Orthogonal
component for the
magnetic field within
the specified range
(Bz)
0.068
degree
tdelay
System propagation
delay –core
Reading angle via SPI
90
110
μs
tdelay_
Residual system
propagation delay after
dynamic angle error
correction.
At ABI, UVW and SPI
1.5
1.9
μs
Sampling rate
Refresh rate at SPI
202
247
ns
DAE1700
Dynamic angle error
At 1700 RPM constant
speed
0.02
degree
DAEmax
Dynamic angle error
At 14500 RPM
constant speed
0.18
degree
DAEacc
Dynamic angle error at
constant acceleration
(25krad/s²)
25k radians/s²
constant acceleration
0.175
degree
14500
RPM
DAEC
tsampl
MS
Conditions
Min
Typ
222
Maximum speed
Reference magnet: N35H, 8mm diameter; 3mm thickness
Timing Characteristics
Figure 9:
Timing Specifications
Symbol
tpon
Parameter
Power-on time
ams Datasheet
[v1-10] 2016-Apr-27
Conditions
Not tested, guaranteed by
design.
Time between
VDD > VDDMIN and the first
valid outcome
Min
Typ
Max
Units
10
ms
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AS5147 − Detailed Description
Detailed Description
The AS5147 is a Hall-effect magnetic sensor using a CMOS
technology. The Hall sensors convert the magnetic field
component perpendicular to the surface of the chip into a
voltage.
The signals from the Hall sensors are amplified and filtered by
the analog front-end (AFE) before being converted by the
analog-to-digital converter (ADC). The output of the ADC is
processed by the hardwired CORDIC (coordinate rotation
digital computer) block to compute the angle and magnitude
of the magnetic vector. The intensity of the magnetic field
(magnitude) is used by the automatic gain control (AGC) to
adjust the amplification level for compensation of the
temperature and magnetic field variations.
The AS5147 generates continuously the angle information,
which can be requested by the different interfaces of the device.
The internal 14-bit resolution is available by readout register
via the SPI interface. The resolution on the ABI output can be
programmed for 10 or 11 bits.
The Dynamic Angle Error Compensation block corrects the
calculated angle regarding latency, by using a linear prediction
calculation algorithm. At constant rotation speed the latency
time is internally compensated by the AS5147, reducing the
dynamic angle error at the SPI, ABI and UVW outputs. The
AS5147 allows selecting between a UVW output interface and
a PWM-encoded interface on the W pin.
At higher speeds, the interpolator fills in missing ABI pulses and
generates the UVW signals with no loss of resolution. The
non-volatile settings in the AS5147 can be programmed
through the SPI interface without any dedicated programmer.
Power Management
The AS5147 can be either powered from a 5.0V supply using the
on-chip low-dropout regulator or from a 3.3V voltage supply.
The LDO regulator is not intended to power any other loads,
and it needs a 1 μF capacitor to ground located close to the chip
for decoupling as shown in Figure 11.
In 3.3V operation, VDD and VDD3V3 must be tied together. In
this configuration, normal noise performance (ONL) is available
at reduced maximum temperature (125°C) by clearing
NOISESET to 0. When NOISESET is set to 1, the full temperature
range is available with reduced noise performance (ONH).
Page 10
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
Figure 10:
Temperature Range and Output Noise in 3.3V and 5.0V Mode
VDD (V)
NOISESET
Temperature Range (°C)
RMS Output Noise (degree)
5.0
0
-40 to 150
0.068
3.3
0
-40 to 125
0.068
3.3
1
-40 to 150
0.082
Figure 11:
5.0V and 3.3V Power Supply Options
5.0V Operation
4.5 - 5.5V
VDD
LDO
100nF
3.3V Operation
VDD3V3
3.0 – 3.6V
1µF
100nF
GND
VDD
VDD3V3
LDO
GND
AS5147
AS5147
After applying power to the chip, the power-on time (t pon) must
elapse before the AS5147 provides the first valid data.
Dynamic Angle Error Compensation
The AS5147 uses 4 integrated Hall sensors which produce a
voltage proportional to the orthogonal component of the
magnetic field to the die. These voltage signals are amplified,
filtered, and converted into the digital domain to allow the
CORDIC digital block to calculate the angle of the magnetic
vector. The propagation of these signals through the analog
front-end and digital back-end generates a fixed delay between
the time of measurement and the availability of the measured
angle at the outputs. This latency generates a dynamic angle
error represented by the product of the angular speed (ω)and
the system propagation delay (tdelay ):
(EQ1)
DAE = ω x tdelay
The dynamic angle compensation block calculates the current
magnet rotation speed (ω) and multiplies it with the system
propagation delay (t delay) to determine the correction angle to
reduce this error. At constant speed, the residual system
propagation delay is t delay_DAEC.
ams Datasheet
[v1-10] 2016-Apr-27
Page 11
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AS5147 − Detailed Description
The angle represented on the PWM interface is not
compensated by the Dynamic Angle Error Compensation
algorithm. It is also possible to disable the Dynamic Angle Error
Compensation with the DAECDIS setting. Disabling the
Dynamic Angle Error Compensation gives a noise benefit of
0.016 degree rms.This setting can be advantageous for low
speed (under 100 RPM) respectively static positioning
applications.
SPI Interface (slave)
The SPI interface is used by a host microcontroller (master) to
read or write the volatile memory as well as to program the
non-volatile OTP registers. The AS5147 SPI only supports slave
operation mode. It communicates at clock rates up to 10 MHz.
The AS5147 SPI uses mode=1 (CPOL=0, CPHA=1) to exchange
data. As shown in Figure 12, a data transfer starts with the
falling edge of CSn (SCL is low). The AS5147 samples MOSI data
on the falling edge of SCL. SPI commands are executed at the
end of the frame (rising edge of CSn). The bit order is MSB first.
Data is protected by parity.
SPI Timing
The AS5147 SPI timing is shown in Figure 12.
Figure 12:
SPI Timing Diagram
tXSSH
SS/
(Input)
tL
tsck
tsckH
tsckL
tH
SCK
(Input)
tMISO
tOZ
MISO
(Output)
data[15]
data[14]
data[0]
tOZ
tMOSI
MOSI
(Input)
Page 12
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data[15]
data[14]
data[0]
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
Figure 13:
SPI Timing
Parameter
Description
Min
tL
Time between CSn falling edge and CLK rising edge
350
ns
tclk
Serial clock period
100
ns
tclkL
Low period of serial clock
50
ns
tclkH
High period of serial clock
50
ns
tclk/2
ns
Time between last falling edge of CLK and rising
edge of CSn
tH
Max
Units
tCSn
High time of CSn between two transmissions
350
ns
tMOSI
Data input valid to falling clock edge
20
ns
tMISO
CLK edge to data output valid
51
ns
Release bus time after CS rising edge.
10
ns
tOZ
SPI Transaction
An SPI transaction consists of a 16-bit command frame followed
by a 16-bit data frame. Figure 14 shows the structure of the
command frame.
Figure 14:
SPI Command Frame
Bit
Name
15
PARC
Parity bit (even) calculated on the lower 15 bits of
command frame
14
R/W
0: Write
1: Read
13:0
ADDR
ams Datasheet
[v1-10] 2016-Apr-27
Description
Address to read or write
Page 13
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AS5147 − Detailed Description
To increase the reliability of communication over the SPI, an
even parity bit (PARC) must be generated and sent. A wrong
setting of the parity bit causes an parity bit error which is shown
the PARERR bit in the error flag register. The parity bit is
calculated from the lower 15 bits of the command frame. The
16-bit command consists of a register address and read/write
bit which indicates if the transaction is a read or write and the
parity bit. Figure 15 shows the read data frame.
Figure 15:
SPI Read Data Frame
Bit
Name
Description
15
PARD
Parity bit (even) calculated on the lower 15 bits of the read
data frame
14
EF
13:0
DATA
0: No command frame error command occurred
1: Error occurred
Data
The data is sent on the MISO pin. The parity bit PARD is
calculated by the AS5047D of the lower 15 bits of data frame. If
an error is detected in the previous SPI command frame, the EF
bit is set high. The SPI read is sampled on the rising edge of CSn
and the data is transmitted on MISO with the next read
command, as shown in Figure 16.
Figure 16:
SPI Read
CSn
MOSI
MISO
Page 14
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Command
Command
Command
Command
Read ADD[m]
Read ADD[n]
Read ADD[o]
Read ADD[p]
Data
Data
Data
DATA (ADD[m])
DATA (ADD[n])
DATA (ADD[o])
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
Figure 17:
SPI Write Data Frame
Bit
Name
Description
15
PARD
Parity bit (even)
14
0
Always low
13:0
DATA
Data
The parity bit PARD must be calculated from the lower 15 bit of
write data frame. In an SPI write transaction, the write command
frame is followed by a write data frame at MOSI. The write data
frame consists of the new content of register which address is
in the command frame.
During the new content is transmitted on MOSI by the write
data frame, the old content is send on MISO. At the next
command on MOSI the actual content of the register is
transmitted on MISO, as shown in Figure 18.
Figure 18:
SPI Write Transaction
CSn
Command
MOSI
Write ADD[n]
Data to write into ADD[n]
DATA (x)
Data content ADD[n]
MISO
ams Datasheet
[v1-10] 2016-Apr-27
DATA (ADD[n])
Command
Write ADD[m]
New Data content
of ADD[n]
DATA (x)
Data to write into ADD[m]
DATA (y)
Data content ADD[m]
DATA (ADD[m])
Command
Next
command
New Data content
of ADD[m]
DATA (y)
Page 15
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AS5147 − Detailed Description
Volatile Registers
The volatile registers are shown in Figure 19. Each register has
a 14-bit address.
Figure 19:
Volatile Register Table
Address
Name
Default
Description
0x0000
NOP
0x0000
No operation
0x0001
ERRFL
0x0000
Error register
0x0003
PROG
0x0000
Programming register
0x3FFC
DIAAGC
0x0180
Diagnostic and AGC
0x3FFD
MAG
0x0000
CORDIC magnitude
0x3FFE
ANGLEUNC
0x0000
Measured angle without dynamic angle
error compensation
0x3FFF
ANGLECOM
0x0000
Measured angle with dynamic angle error
compensation
Reading the NOP register is equivalent to a nop (no operation)
instruction for the AS5147.
Figure 20:
ERRFL (0x0001)
Name
Read/Write
Bit Position
Description
PARERR
R
2
Parity error
INVCOMM
R
1
Invalid command error: set to 1 by reading or writing
an invalid register address
FRERR
R
0
Framing error: is set to 1 when a non-compliant SPI
frame is detected
Reading the ERRFL register automatically clears its contents
(ERRFL=0x0000).
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
Figure 21:
PROG (0x0003)
Name
Read/Write
Bit Position
Description
PROGVER
R/W
6
Program verify: must be set to 1 for verifying the
correctness of the OTP programming
PROGOTP
R/W
3
Start OTP programming cycle
OTPREF
R/W
2
Refreshes the non-volatile memory content with the
OTP programmed content
PROGEN
R/W
0
Program OTP enable: enables reading / writing the OTP
memory
The PROG register is used for programming the OTP memory.
(See programming the zero position.)
Figure 22:
DIAAGC (0x3FFC)
Name
Read/Write
Bit Position
Description
MAGL
R
11
Diagnostics: Magnetic field strength too low; AGC=0xFF
MAGH
R
10
Diagnostics: Magnetic field strength too high; AGC=0x00
COF
R
9
Diagnostics: CORDIC overflow
LF
R
8
Diagnostics: Loops Finished
LF=0:internal offset loops not ready regulated
LF=1:internal offset loop finished
AGC
R
7:0
Automatic gain control value
Note(s) and/or Footnote(s):
1. LF = Loops Finished
Figure 23:
MAG (0x3FFD)
Name
Read/Write
Bit Position
CMAG
R
13:0
Name
Read/Write
Bit Position
CORDICANG
R
13:0
Description
CORDIC magnitude information
Figure 24:
ANGLE (0x3FFE)
ams Datasheet
[v1-10] 2016-Apr-27
Description
Angle information without dynamic angle error
compensation
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AS5147 − Detailed Description
Figure 25:
ANGLECOM (0x3FFF)
Name
Read/Write
Bit Position
DAECANG
R
13:0
Description
Angle information with dynamic angle error
compensation
Non-Volatile Registers (OTP)
The OTP (One-Time Programmable) memory is used to store the
absolute zero position of the sensor and the customer settings
permanently in the sensor IC.
SPI write/read access is possible several times for all
Non-Volatile Registers (soft write). Soft written register content
will be lost after a hardware reset.
The programming itself can be done just once. Therefore the
content of the Non-Volatile Registers is stored permanently in
the sensor. The register content is still present after a hardware
reset and cannot be overwritten.
For a correct function of the sensor the OTP programming is not
required. If no configuration or programming is done, the
Non-Volatile Registers are in default state 0x0000.
Figure 26:
Non-Volatile Register Table
Address
Name
Default
Description
0x0016
ZPOSM
0x0000
Zero position MSB
0x0017
ZPOSL
0x0000
Zero position LSB/ MAG diagnostic
0x0018
SETTINGS1
0x0001
Custom setting register 1
0x0019
SETTINGS2
0x0000
Custom setting register 2
0x001A
RED
0x0000
Redundancy register
Figure 27:
ZPOSM (0x0016)
Name
Read/Write/Program
Bit Position
ZPOSM
R/W/P
7:0
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Description
8 most significant bits of the zero position
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
Figure 28:
ZPOSL (0x0017)
Name
Read/Write/Program
Bit Position
Description
ZPOSL
R/W/P
5:0
6 least significant bits of the zero position
comp_l_error_en
R/W/P
6
This bit enables the contribution of MAGH
(Magnetic field strength too high) to the
error flag
comp_h_error_en
R/W/P
7
This bit enables the contribution of MAGL
(Magnetic field strength too low) to the
error flag
Figure 29:
SETTINGS1 (0x0018)
Name
Read/Write/Program
Bit Position
Description
IWIDTH
R/W/P
0
Width of the index pulse I
(0 = 3LSB, 1 = 1LSB)
NOISESET
R/W/P
1
Noise setting
DIR
R/W/P
2
Rotation direction
UVW_ABI
R/W/P
3
Defines the PWM Output
(0 = ABI is operating, W is used as PWM
1 = UVW is operating, I is used as PWM)
DAECDIS
R/W/P
4
Disable Dynamic Angle Error Compensation
(0 = DAE compensation ON, 1 = DAE
compensation OFF)
Dataselect
R/W/P
6
This bit defines which data can be read form
address 16383dec (3FFFhex).
0->DAECANG
1->CORDICANG
PWMon
R/W/P
7
Enables PWM (setting of UVW_ABI Bit necessary)
ams Datasheet
[v1-10] 2016-Apr-27
Page 19
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AS5147 − Detailed Description
Figure 30:
SETTINGS2 (0x0019)
Name
Read/Write/Program
Bit Position
Description
UVWPP
R/W/P
2:0
UVW number of pole pairs
(000 = 1, 001 = 2, 010 = 3, 011 = 4, 100 = 5, 101 = 6,
110 = 7, 111 = 7)
Hysteresis for 11 Bit ABI Resolution: (00=3LSB, 01=
2LSB,10=1LSB,11=no hysteresis)
Hysteresis for 10 Bit ABI Resolution: (00=2LSB, 01=
1LSB,10=no Hysteresis LSB,11=3LSB)
HYS
R/W/P
4:3
ABIRES
R/W/P
5
Resolution of ABI (0 = 11 bits, 1 = 10 -bits)
The hysteresis (Figure 35)is in terms of the chosen resolution
(11 bits vs. 10 bits). The ABIRES resolution does not affect the
UVW signals.
Figure 31:
RED (0x001A)
Name
Read/Write/
Program
REDUNDANCY
Page 20
Document Feedback
R/W/P
Bit
Position
Description
4:0
Redundancy bits addresses one bit in the nonvolatile
memory. If a non-successful OTP programing occurred, one
bit can be forced to 1. For more details please refer to the
application note
“AN5000 – AS5147_Redundancy_Bits”
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
ABI Incremental Interface
The AS5147 can send the angle position to the host
microcontroller through an incremental interface. This
interface is available simultaneously with the other interfaces.
By default, the incremental interface is set to work at the highest
resolution (11 bits), which corresponds to 2048 steps per
revolution or 512 pulses per revolution (ppr). This resolution
can be cut in half using the OTP bit ABIRES, which results in 1024
steps per revolution or 256 pulses per revolution.
The phase shift between the A and B signals indicates the
rotation direction: e.g. DIR-Bit = 0, clockwise (A leads, B follows)
or counterclockwise (B leads, A follows). The DIR bit can be used
to invert the sense of the rotation direction. During the start-up
time, after power on to the chip, all three ABI signals are high.
The IWIDTH setting programs the width of the index pulse from
3 LSB (default) to 1 LSB.
Figure 32:
ABI Signals at 11-Bit Resolution
A
B
I
Steps
N-7 N-6 N-5 N-4 N-3 N-2 N-1 0
1
2
3
Clockwise rotation
4
5
6
7
8
7
6
5
4
3
2
1
0 N-1 N-2 N-3 N-4
Counter-clockwise rotation
N = 2048 for 11-bit resolution, and N = 1024 for 10-bit
resolution.
The Figure 32 shows the ABI signal flow if the magnet rotates
in clockwise direction and counter-clockwise direction (DIR=0).
The rotation direction of the magnet is defined as clockwise
(DIR=0) when the view is from the topside of AS5147.
ams Datasheet
[v1-10] 2016-Apr-27
Page 21
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AS5147 − Detailed Description
UVW Commutation Interface
The AS5147 can emulate the UVW signals generated by the
three discrete Hall switches commonly used in BLDC motors.
The UVWPP field in the SETTINGS register selects the number
of pole pairs of the motor (from 1 to 7 pole pairs). The UVW
signals are generated with 14-bit resolution.
During the start-up time, after power on of the chip, the UVW
signals are low.
Figure 33:
UVW Signals
U
V
W
angle
0°
60°
120°
180°
240°
Clockwise rotation
300°
360°
360°
300°
240°
180°
120°
60°
0°
Counter-clockwise rotation
The Figure 33 shows the UVW signal flow if the magnet rotates
in clockwise direction and counter-clockwise direction (DIR=0).
The rotation direction of the magnet is defined as clockwise
(DIR=0) when the view is from the topside of AS5147. With the
bit DIR, it is possible to invert the rotation direction.
Page 22
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
PWM
The PWM can be enabled with the bit setting PWMon. The PWM
encoded signal is displayed on the pin W or the pin I. The bit
setting UVW_ABI defines which output is used as PWM. The
PWM output consists of a frame of 4119 PWM clock periods, as
shown in Figure 34. The PWM frame has the following sections:
• 12 PWM Clocks for INIT
• 4 PWM Clocks for Error detection
• 4095 PWM clock periods of data
• 8 PWM clock periods low
The angle is represented in the data part of the frame with 12-bit
resolution. One PWM clock period represents 0.088 degree and
has a typical duration of 444 ns.
If the embedded diagnostic of the AS5147 detects any error, the
PWM interface displays only 12 clock periods high
(0.3% duty-cycle). Respectively the 4 clocks for error detection
are forced to low.
Figure 34:
Pulse Width Modulation Encoded Signal
4 clock
12 clock periods periods
high
Error
detection
ams Datasheet
[v1-10] 2016-Apr-27
4089
4090
4091
4092
4093
4094
4095
Error
detection
1
2
3
4
5
6
7
8
INIT
frame
4095 clock periods
data
8 clock periods
low
time
Page 23
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AS5147 − Detailed Description
Hysteresis
The hysteresis can be programmed in the HYS bits of the
SETTINGS register. The hysteresis can be 1, 2, or 3 LSB bits, in
which the LSB is defined by the ABI resolution setting (ABIRES).
Figure 35:
Hysteresis Settings
HYS
HYSTERESIS with 11BIT ABI
Resolution
HYSTERESIS with 10BIT ABI
Resolution
00
3
2
01
2
1
10
1
0
11
0
3
Automatic Gain Control (AGC) and CORDIC
Magnitude
The AS5147 uses AGC to compensate for variations in the
magnetic field strength due to changes of temperature, air gap
between the chip and the magnet, and demagnetization of the
magnet. The automatic gain control value can be read in the
AGC field of the DIAAGC register. Within the specified input
magnetic field strength (Bz), the Automatic Gain Control keeps
the CORDIC magnitude value (MAG) constant. Below the
minimum input magnetic field strength, the CORDIC
magnitude decreases and the MAGL bit is set.
Diagnostic Features
The AS5147 supports embedded self-diagnostics.
MAGH: magnetic field strength too high, set if AGC = 0x00 . This
indicates the non-linearity error may be increased.
MAGL: magnetic field strength too low, set high if AGC = 0xFF.
This indicates the output noise of the measured angle may be
increased.
COF: CORDIC overflow. This indicates the measured angle is not
reliable.
LF: offset compensation completed. At power-up, an internal
offset compensation procedure is started, and this bit is set
when the procedure is completed.
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Detailed Description
LF Error / COF Error
In case of an LF or COF error, all outputs are changing into a safe
state:
SPI Output: Information in the DIAAGC (0x3FFC) register. The
angle information is still valid.
PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock
Periods = low. Additional there is no angle information valid
(all 4096 clock periods = low)
ABI Output: The state of ABI is frozen to ABI = 111
UVW Output: The state of UVW is frozen to UVW = 000
MAGH Error / MAGL Error
Default diagnostic setting for MAGH error /MAGL error:
In case of a MAGH error or MAGL error, there is no safe state on
the PWM,ABI or UVW outputs if comp_h_error_en is 0 and
comp_l_error_en is 0.
The error flags can be read out with the DIAAGC (0x3FFC)
register.
Enhanced diagnosis setting for MAGH error / MAGL error:
In case of a MAGH error or MAGL error, the PWM,ABI or UVW
outputs are going into a safe state if comp_h_error_en is 1 and
comp_l_error_en is 1. The device is operating with the
performance as explained.
SPI Output: Information in the DIAAGC (0x3FFC) register. The
angle information is still valid, if the MAGH or MAGL error flag
is on.
PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock
Periods = low. Additional there is no angle information valid (all
4096 clock periods = low)
ABI Output: The state of ABI is frozen to ABI = 111
UVW Output: The state of UVW is frozen to UVW = 000
Important: When comp_(h/l)_error_en is enabled a marginal
magnetic field input can cause toggling of MAGH or MAGL
which will lead to toggling of the ABI/UVW outputs between
operational mode and failure mode.
ams Datasheet
[v1-10] 2016-Apr-27
Page 25
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AS5147 − Application Information
Application Information
Burn and Verification of the OTP Memory
Step-by-step procedure to permanently program the
non-volatile memory (OTP):
Figure 36:
Minimum Programming Diagram for the AS5147 in 5 V Operation
5V operation
VDD during programming 4.5 – 5.5V
VDD
I
CSn
CLK
GND
MISO
Programmer
TEST
A
B
AS5147
MOSI
VDD3V
VDD
U
V
100nF
1μF
W
GND
Note(s) and/or Footnote(s):
1. In terms of EMC and for remote application, additional circuits are necessary.
Page 26
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Application Information
Figure 37:
Minimum Programming Diagram for the AS5147 in 3.3V Operation
3.3V operation
VDD during programming: 3.3V – 3.5V
VDD
I
CSn
GND
CLK
VDD3V
MOSI
TEST
Programmer
A
AS5147
MISO
B
VDD
U
V
100nF
W
GND
Note(s) and/or Footnote(s):
1. In terms of EMC and for remote application, additional circuits are necessary.
Figure 38:
Programming Parameter
Symbol
Parameter
Conditions
Min
TaProg
Programming
temperature
Programming @ Room
Temperature
(25°C ± 20°C)
5
VDD
Positive supply
voltage
5 V operation mode.
Supply voltage during
programming
4.5
VDD
Positive supply
voltage
3.3 V operation mode.
Supply voltage during
programming
3.3
IProg
Current for
programming
Max current during OTP burn
procedure
ams Datasheet
[v1-10] 2016-Apr-27
Typ
5
Max
Units
45
°C
5.5
V
3.5
V
100
mA
Page 27
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AS5147 − Application Information
The programming can either be performed in 5V operation
using the internal LDO (1uF on regulator output pin), or in 3V
Operation but using a supply voltage between 3.3V and 3.5V.
1.
Power on cycle
2. Write the SETTINGS1 and SETTINGS2 registers with the
Custom settings for this application
3. Place the magnet at the desired zero position
4. Read out the measured angle from the ANGLE register
5. Write ANGLE [5:0] into the ZPOSL register and ANGLE
[13:6] into the ZPOSM register
6. Read reg(0x0016) to reg(0x0019) → Read register step1
7. Comparison of written content (settings and angle) with
content of read register step1
8. If point 7 is correct, enable OTP read / write by setting
PROGEN = 1 in the PROG register
9. Start the OTP burn procedure by setting PROGOTP = 1
in the PROG register
10. Read the PROG register until it reads 0x0001
(Programming procedure complete)
11. Clear the memory content writing 0x00 in the whole
non-volatile memory
12. Set the PROGVER = 1 to set the Guard band for the guard
band test (1) .
13. Refresh the non-volatile memory content with the OTP
content by setting OTPREF = 1
14. Read reg(0x0016) to reg(0x0019) → Read register step2
15. Comparison of written content (settings and angle) with
content of read register step2.
Mandatory: guard band test
16. New power on cycle, if point 16 is correct. If point 16
fails, the test with the guard band test 1 was not
successful and the device is incorrectly programmed. A
reprogramming is not allowed!
17. Read reg(0x0016) to reg(0x0019) → Read register step3
18. Comparision of written content (settings and angle)
with content of read register step3.
19. If point 19 is correct, the programming was successful.
If point 19 fails, device is incorrectly programmed. A
reprogramming is not allowed.
1. Guard band test:
- Restricted to temperature range: 25 °C ± 20 °C
- Right after the programming procedure (max. 1 hour with same conditions 25°C ± 20 °C), same VDD voltage.
The guard band test is only for the verification of the burned OTP fuses during the programming sequence.
A use of the guard band in other cases is not allowed.
Page 28
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Application Information
Figure 39:
OTP Memory Burn and Verification Flowchart
Power on cycle
START
AS5147 settings
Write reg(0x0018)
Write reg(0x0019)
Write
Reg(0x0016)=0x00
Reg(0x0017)=0x00
Reg(0x0018=0x00
Reg(0x0019)=0x00
Clear memory
Set the magnet to
the zero position
Write
Reg(0x0003)=0x40
Set Guardband
Position of the magnet to
the zero position
Read ANGLE
Not correct
Read reg(0x3FFF)
Write Angle into ZPOSL
and ZPOSM
Write
Reg(0x0017(5:0))= reg(0x3FFF(5:0))
Reg(0x0016(7:0))= reg(0x3FFF(13:6))
Read Register step 1
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0019)
Write
Reg(0003)=0x04
Refresh memory with OTP content
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0016)
Read Register step 2
Comparison of written content (settings and
angle) with content of Read Register step 2
mandatory Guardband-Test
Verify 2
Not correct
correct
Comparison of written content
(settings and angle) with content
of Read Register step 1
YES
Verify 1
Power-on cycle
Guardbandtest fails.
Wrong programming.
Reprogramming not allowed
correct
Unlock OTParea for burning
(PROGEN=1)
Start OTP burning procedure
(PROGOTP=1)
Write
Reg(0x0003)=0x01
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0016)
Write
Reg(0x0003)=0x08
Verify 3
Read Register step 3
Comparison of written content (settings
and angle) with content of Read Register
step 3
Not correct
correct
Read OTP_CTRL
END
Correct
programming and
verification
Read
Reg(0x0003)
END
Wrong programming
Reprogramming not
allowed
NO
OTP burning procedure
complete if Reg(0x0003) =0x01
ams Datasheet
[v1-10] 2016-Apr-27
Reg(0x0003)=0x01
Page 29
Document Feedback
AS5147 − Application Information
Figure 40:
Minimum Circuit Diagram for the AS5147
4.5 – 5.5V
VDD
CSn
I
CLK
GND
MISO
MCU
TEST
A
AS5147
MOSI
VDD3V
B
VDD
U
V
100nF
1µF
W
GND
Note(s) and/or Footnote(s):
1. In terms of EMC and for remote application, additional circuits are necessary.
Page 30
Document Feedback
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Package Drawings & Markings
The axis of the magnet must be aligned over the center of the
package.
Package Drawings & Markings
Figure 41:
Package Outline Drawing
RoHS
Green
Symbol
Min
Nom
Max
Symbol
Min
Nom
Max
A
-
-
1.20
R
0.09
-
-
A1
0.05
-
0.15
R1
0.09
-
-
A2
0.80
1.00
1.05
S
0.20
-
-
b
0.19
-
0.30
Θ1
0º
-
8º
c
0.09
-
0.20
Θ2
-
12 REF
-
D
4.90
5.00
5.10
Θ3
-
12 REF
-
E
-
6.40 BSC
-
aaa
-
0.10
-
E1
4.30
4.40
4.50
bbb
-
0.10
-
e
-
0.65 BSC
-
ccc
-
0.05
-
L
0.45
0.60
0.75
ddd
-
0.20
-
L1
-
1.00 REF
-
N
14
Note(s) and/or Footnote(s):
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. All dimensions are in millimeters. Angles are in degrees.
3. N is the total number of terminals.
ams Datasheet
[v1-10] 2016-Apr-27
Page 31
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AS5147 − Package Drawings & Mark ings
Figure 42:
Package Marking
Figure 43:
Packaging Code
YY
Last two digits of the
current year
Page 32
Document Feedback
WW
Manufacturing week
M
Plant identifier
ZZ
Free choice /
traceability code
@
Sublot identifier
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Mechanical Data
Mechanical Data
Figure 44:
Angle Detection by Default (No Zero Position Programmed)
S
N
S
N
270 degree
S
AS5147
N
AS5147
180 degree
S
N
ams Datasheet
[v1-10] 2016-Apr-27
AS5147
90 degree
AS5147
AS5
147
0 degree
Page 33
Document Feedback
AS5147 − Mechanical Data
Figure 45:
Die Placement and Hall Array Position
ƒŽŽ”ƒ†‹—•
ɥŜɪɥɭʭɥŜɨɥɥ
ɪŜɩɥɥʭɥŜɩɪɬ
ɩŜɨɪɥʭɥŜɩɪɬ
ɥŜɭɰɫʭɥŜɨɬɥ
ɥŜɩɪɭʭɥŜɨɥɥ
Note(s) and/or Footnote(s):
1. Dimensions are in mm.
2. The Hall array center is located in the center of the IC package. Hall array radius is 1.1mm.
3. Die thickness is 203μm nominal.
Page 34
Document Feedback
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Ordering & Contact Information
Ordering & Contact Information
Figure 46:
Ordering Information
Ordering
Code
Package
Marking
Delivery Form
Delivery
Quantity
AS5147-HTST
TSSOP-14
AS5147
13” Tape & Reel in dry pack
4500 pcs/reel
AS5147-HTSM
TSSOP-14
AS5147
7” Tape & Reel in dry pack
500 pcs/reel
Online product information is available at:
www.ams.com/AS5147
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-10] 2016-Apr-27
Page 35
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AS5147 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-10] 2016-Apr-27
Page 37
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AS5147 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 38
Document Feedback
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Revision Information
Revision Information
Changes from 1-06 (2014-Oct-31) to current revision 1-10 (2016-Apr-27)
Page
1-06 (2014-Oct-31) to 1-07 (2015-Feb-17)
Added Notes under Figure 4
3
Updated Figure 9
8
Updated text under Detailed Description section
9
Updated text under Non-Volatile Registers (OTP) section
17
Updated Figure 31
19
Added Figure 45 and notes under it
32
1-07 (2015-Feb-17) to 1-08 (2015-Feb-18)
Updated Figure 9
8
1-08 (2015-Feb-18) to 1-09 (2015-Mar-18)
Updated notes below Figure 4
3
Updated text under Non-Volatile Registers (OTP) section
17
Updated PWM section
22
Updated notes below Figure 45
33
ams Datasheet
[v1-10] 2016-Apr-27
Page 39
Document Feedback
AS5147 − Revision Information
Changes from 1-06 (2014-Oct-31) to current revision 1-10 (2016-Apr-27)
Page
1-09 (2015-Mar-18) to 1-10 (2016-Apr-27)
Updated Figure 6
7
Updated text under Detailed Description
10
Updated text under Dynamic Angle Error Compensation
11
Updated Figure 12
12
Updated SPI Transaction section
13
Updated Figure 26
18
Updated Figure 28
19
Updated ABI Incremental Interface section
21
Updated Figure 33 and text under it
22
Updated Figure 34
23
Updated MAGH Error / MAGL Error section
25
Updated text under Figure 38
27
Updated Figure 39
29
Updated Figure 44
33
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 40
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ams Datasheet
[v1-10] 2016-Apr-27
AS5147 − Content Guide
Content Guide
ams Datasheet
[v1-10] 2016-Apr-27
1
2
2
3
General Description
Key Benefits & Features
Applications
Block Diagram
4
6
7
8
8
9
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
Magnetic Characteristics
System Characteristics
Timing Characteristics
10
11
12
13
13
14
17
19
22
23
24
25
25
25
26
26
Detailed Description
Power Management
Dynamic Angle Error Compensation
SPI Interface (Slave)
SPI Timing
SPI Transaction
Volatile Registers
Non-Volatile Registers (OTP)
ABI Incremental Interface
UVW Commutation Interface
PWM
Hysteresis
Automatic Gain Control (AGC) and CORDIC Magnitude
Diagnostic Features
LF Error / COF Error
MAGH Error / MAGL Error
27
27
Application Information
Burn and Verification of the OTP Memory
32
34
36
37
38
39
40
Package Drawings & Markings
Mechanical Data
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