AS5247

AS5247
14-Bit Dual-Die On-Axis Magnetic
Rotary Position Sensor with 11-Bit
Binary Incremental Pulse Count
General Description
The AS5247 is a high-resolution redundant rotary position
sensor for fast absolute angle measurement over a full
360-degree range. This new position sensor is equipped with a
revolutionary integrated dynamic angle error compensation
(DAEC™) with almost 0 latency.
The robust design of the device suppresses the influence of any
homogenous external stray magnetic field. A standard 4-wire
SPI serial interface allows a host microcontroller to read 14-bit
absolute angle position data from the AS5247 and to program
non-volatile settings without a dedicated programmer.
Incremental movements are indicated on a set of ABI signals
with a maximum resolution of 2048 steps / 512 pulses per
revolution. The resolution of the ABI signal is programmable to
1024 steps / 256 pulses per revolution.
Brushless DC (BLDC) motors are controlled through a standard
UVW commutation interface with a programmable number of
pole pairs from 1 to 7. The absolute angle position is also
provided as PWM-encoded output signal
The AS5247 supports embedded self-diagnostics including
magnetic field strength too high, magnetic field strength too
low or lost magnet, and other related diagnostic features.
The AS5247 is available as a dual die in a compact MLF-40 7x7
package.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5247, 14-bit Dual-die On-Axis
Magnetic Rotary Position Sensor with 11-bit Binary Incremental
Pulse Count are listed below:
Figure 1:
Added Value of Using the AS5247
Benefits
Features
Easy to use – saving costs on DSP
DAEC™ Dynamic angle error compensation
Good resolution for motor & position control
14-bit core resolution
Versatile choice of the interface
Independent output interfaces: SPI, ABI, UVW, PWM
No programmer needed (via SPI command)
Zero position, configuration programmable
ams Datasheet
[v1-07] 2015-May-27
Page 1
Document Feedback
AS5247 − General Description
Benefits
Features
Supports safety-critical applications
Self-Diagnostics & redundancy
Lower system costs (no shielding)
Immune to external stray field
Applications
The AS5247 has been designed to support BLDC motor
commutation for the most challenging and safety-critical
automotive applications (AEC-Q100 grade 0 automotive
qualified) such as electric power steering (EPS), transmission
(gearbox, actuator), brake (actuator) and starter & alternator.
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
AS5247 Block Diagram
VDD3V3_T
VDD3V3_B
CSn_T
SCL_T
MISO_T
Volatile Memory
AS5247
SPI
OTP
MOSI_T
CSn_B
SCL_B
LDO
VDD_T
MISO_B
VDD_B
MOSI_B
Hall
Sensors
Analog
Front-End
ABI
A/D
ATAN
(CORDIC)
INTERPOLATOR
A_B
B_B
I_B/PWM_B
Dynamic Angle
Error
Compensation
UWV
U_T
V_T
W_T / PWM_T
PWM Decoder
Selectable
On I or W
U_B
V_B
W_B / PWM_B
AGC
GND_B
Page 2
Document Feedback
A_T
B_T
I_T/PWM_T
GND_T
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Pin Assignment
Pin Assignment
The suffix on the signal name indicates
which of the two internal chips is
connected to the pin
(T = top die, B = bottom die). The
package contains two identical chips,
and no pins are shared by both chips.
Figure 3:
MLF 40 Pin Assignment
AS5235
!"
!"
#""#
#""#
#""
#""
$
$
#
#
AS5247
Figure 4:
Pin Description
Pin Number
Pin Name
Pin Type
1
CSn_T
Digital Input
SPI chip select (active low)
2
CLK_B
Digital Input
SPI Clock
3
CLK_T
Digital Input
SPI Clock
4
MISO_B
Digital Output
SPI master data input, slave output
5
MISO_T
Digital Output
SPI master data input, slave output
6
MOSI_B
Digital Input
SPI master data output, slave input
7
MOSI_T
Digital Input
SPI master data output, slave input
8
Test_B
Test pin. Connected to ground
9
Test_T
Test pin. Connected to ground
10
A_B
Digital Output
Incremental signal A
11
A_T
Digital Output
Incremental signal A
12
B_B
Digital Output
Incremental Signal B
ams Datasheet
[v1-07] 2015-May-27
Pin Description
Page 3
Document Feedback
AS5247 − Pin Assignment
Pin Number
Pin Name
Pin Type
13
B_T
Digital Output
14
nc
Not connected
15
nc
Not connected
16
nc
Not connected
17
nc
Not connected
18
nc
Not connected
19
W_B/PWM_B
Digital Output
Commutation signal W or PWM encoded output
20
W_T/PWM_T
Digital Output
Commutation signal W or PWM encoded output
21
V_B
Digital Output
Commutation signal V
22
V_T
Digital Output
Commutation signal V
23
U_B
Digital Output
Commutation signal U
24
U_T
Digital Output
I/ Commutation signal U
25
VDD_B
Power Supply
5V power supply voltage for on-chip regulator
26
VDD_T
Power Supply
5V power supply voltage for on-chip regulator
27
VDD3V3_B
Power Supply
3.3V on-chip low-dropout (LDO) output.
Requires an external decoupling capacitor (1uF)
28
VDD3V3_T
Power Supply
3.3V on-chip low-dropout (LDO) output.
Requires an external decoupling capacitor (1uF)
29
GND_B
Power Supply
Ground
30
GND_T
Power Supply
Ground
31
I_B/PWM_B
Digital Output
Index signal or PWM encoded output
32
I_T/PWM_T
Digital Output
Index signal or PWM encoded output
33
n.c
34
n.c
Page 4
Document Feedback
Pin Description
Incremental Signal B
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Pin Assignment
Pin Number
Pin Name
35
n.c
36
n.c
37
n.c
38
n.c
39
n.c
40
CSn_B
Pin Type
Pin Description
SPI chip select (active low)
Note(s) and/or Footnote(s):
1. Floating state of a digital input is not allowed.
2. If SPI is not used, a Pull up resistor on CSn is required.
3. If SPI is not used, a Pull down resistor on CLK and MOSI is required.
4. If SPI is not used, the pin MISO can be left open.
5. If ABI, UVW or PWM is not used, the pins can be left open.
ams Datasheet
[v1-07] 2015-May-27
Page 5
Document Feedback
AS5247 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
DC supply voltage at VDD pin
VDD5
-0.3
7.0
V
DC supply voltage at VDD3V3 pin
VDD3
-0.3
5.0
V
DC supply voltage at GND pin
VSS
-0.3
0.3
V
Input pin voltage
Vin
VDD+0.3
V
Input current (latch-up immunity)
Iscr
100
mA
Norm:
AEC-Q100-004
Electrostatic discharge
ESD
kV
Norm:
AEC-Q100-002
Total power dissipation (all supplies
and outputs)
-100
±2
Pt
150
mW
Note
Ambient temperature 5V0
Ta5V0
-40
150
°C
In the 5.0V power
supply mode only
Ambient temperature 3V3
Ta3V3
-40
150
°C
In the 3.3V power
supply mode if
NOISESET=1
Programming temperature
TaProg
5
45
°C
Programming @
room temperature
(25°C ± 20°C)
Storage temperature
T_strg
-55
150
°C
Package body temperature
T_body
260
°C
85
%
Relative humidity non-condensing
RHNC
Moisture sensitivity level
MSL
Page 6
Document Feedback
5
3
Norm: IPC/JEDEC
J-STD-020
Represents a
maximum floor
lifetime of 168h
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Figure 6:
Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD
Positive supply
voltage
5.0V operation mode
4.5
5.0
5.5
V
VDD3V3
Positive supply
voltage
3.3V operation mode;
only from -40 to 125°C
3.0
3.3
3.6
V
VDD3V3_150
Positive supply
voltage
3.3V operation mode;
only from -40 to 150°C
(Noiseset Bit has to be
set)
3.0
3.3
3.6
V
VDD_Burn
Positive supply
voltage
Supply voltage
required for
programming in 3.3V
operation
3.3
3.5
V
Regulated
Voltage
Voltage at VDD3V3
pin if VDD ≠ VDD3V3
3.2
3.6
V
VporOFF
Internal POR-on
level
At power-on (VDD
rising from 0 to 5.0V)
2.47
2.83
V
VporOFF
Internal POR-off
level
At power-off (VDD
falling from 5.0 to 0V)
2.24
2.56
V
170
300
mV
15
mA
VREG
Vporh
Internal POR
hysteresis
IDD
Supply current
VIH
High-level input
voltage
VIL
Low-level input
voltage
Only for one die. Must
be multiplied by 2
3.4
0.7 × VDD
V
0.3 × VDD
V
VOH
High-level output
voltage
VOL
Low-level output
voltage
VSS + 0.4
V
I_Out
Current on digital
output
1
mA
C_L
Capacitive load
on digital output
50
pF
ams Datasheet
[v1-07] 2015-May-27
VDD - 0.5
Page 7
Document Feedback
AS5247 − Magnetic Characteristics
Magnetic Characteristics
Figure 7:
Magnetic Specifications
Symbol
Bz
Parameter
Orthogonal magnetic
field strength, normal
operating mode
Conditions
Min
Required orthogonal component of
the magnetic field strength measured
at the die's surface along a circle of
1.1mm
35
Typ
Max
Unit
70
mT
Note(s) and/or Footnote(s):
1. It is possible to operate the AS5247 below 35mT with reduced noise performance.
System Characteristics
Figure 8:
System Specifications
Symbol
RES
RES_ABI
INLOPT @ 25°C
Parameter
Conditions
Min
Core resolution
Resolution of the
ABI interface
Typ
Max
14
Programmable with
register setting
(ABIRES)
Non-linearity,
optimum placement
of the magnet
10
Units
bit
11
bit
±0.9
degree
Non-linearity @
displacement of
magnet and
temperature -40°C
to 150°C
Assuming N35H
Magnet
(D=8mm, H=3mm)
500um displacement
in x and y
z-distance @ 2000um
±1.4
degree
ONL
RMS output noise
(1 sigma)
Orthogonal
component for the
magnetic field within
the specified range
(Bz), NOISESET= 0
0.068
degree
ONH
RMS output noise
(1 sigma) on SPI, ABI
and UVW interfaces
Orthogonal
component for the
magnetic field within
the specified range
(Bz), NOISESET= 1
0.082
degree
INLDIS+TEMP
Page 8
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Timing Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
0.068
degree
RMS output noise
(1 sigma) on PWM
interface
Orthogonal
component for the
magnetic field within
the specified range
(Bz)
tdelay
System propagation
delay –core
Reading angle via SPI
90
110
μs
tdelay_
System propagation
delay after dynamic
angle error
correction.
At ABI and UVW
interfaces
1.5
1.9
μs
Sampling rate
Refresh rate at SPI
202
247
ns
DAE1700
Dynamic angle error
At 1700 RPM constant
speed
0.02
degree
DAEmax
Dynamic angle error
At 14500 RPM
constant speed
0.18
degree
DAEacc
Dynamic angle error
at constant
acceleration
(25krad/s²)
25k radians/s²
constant acceleration
0.175
degree
14500
RPM
ON_PWM
DAEC
tsampl
MS
222
Maximum speed
Reference magnet: N35H, 8mm diameter; 3mm thickness
Timing Characteristics
Figure 9:
Timing Specifications
Symbol
tpon
Parameter
Conditions
Power-on time
Not tested, guaranteed by
design. Time between
VDD > VDDporON and
the first valid outcome
ams Datasheet
[v1-07] 2015-May-27
Min
Typ
Max
Units
10
ms
Page 9
Document Feedback
AS5247 − Detailed Description
Detailed Description
The AS5547 is a Hall-effect magnetic sensor using a CMOS
lateral technology. The lateral Hall sensors convert the
magnetic field component perpendicular to the surface of the
chip into a voltage.
The signals from the Hall sensors are amplified and filtered by
the analog front-end (AFE) before being converted by the
analog-to-digital converter (ADC). The output of the ADC is
processed by the hardwired CORDIC (coordinate rotating
digital computer) block to compute the angle and magnitude
of the magnetic vector. The intensity of the magnetic field
(magnitude) is used by the automatic gain control (AGC) to
adjust the amplification level for compensation of the
temperature and magnetic field variations.
The internal 14-bit resolution is available by reading a register
through the SPI interface. The resolution on the ABI output can
be programmed for 10 or 11bits.
The Dynamic Angle Error Compensation block corrects the
calculated angle for latency using a linear prediction
calculation algorithm. At constant rotation speed the latency
time is internally compensated by the AS5247, reducing the
dynamic angle error at the SPI, ABI and UVW outputs. The
AS5247 allows selecting between a UVW / ABI output and a
PWM-encoded interface on the W-pin or the I-pin
At higher speeds, the interpolator fills in missing ABI pulses and
generates the UVW signals with no loss of resolution. The
non-volatile settings in the AS5247can be programmed
through the SPI interface without any dedicated programmer.
Power Management
The AS5247 can be either powered from a 5.0V supply using the
on-chip low-dropout regulator or from a 3.3V voltage supply.
The LDO regulator is not intended to power any other loads,
and it needs a 1 μF capacitor to ground located close to the chip
for decoupling as shown in Figure 11.
In 3.3V operation, VDD and VREG must be tied together. In this
configuration, normal noise performance (ONL) is available at
reduced maximum temperature (125°C) by clearing NOISESET
to 0. When NOISESET is set to 1, the full temperature range is
available with reduced noise performance (ONH).
Figure 10:
Temperature Range and Output Noise in 3.3V and 5.0V Mode
VDD (V)
NOISESET
Temperature Range (°C)
RMS Output Noise (degree)
5.0
0
-40 ~ 150
0.068
3.3
0
-40 ~ 125
0.068
3.3
1
-40 ~ 150
0.082
Page 10
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
Figure 11:
5.0V and 3.3V Power Supply Options
5.0V Operation
4.5 - 5.5V
VDD
LDO
100nF
3.3V Operation
VDD3V3
3.0 – 3.6V
1µF
100nF
GND
VDD
VDD3V3
LDO
GND
AS5247
AS5247
After applying power to the chip, the power-on time (tpon)
must elapse before the AS5247 provides the first valid data.
Dynamic Angle Error Compensation
The AS5247 uses 4 integrated Hall sensors on Bottom Die and
Top Die, which produce a voltage proportional to the
orthogonal component of the magnetic field to the die. These
voltage signals are amplified, filtered, and converted into the
digital domain to allow the CORDIC digital block to calculate
the angle of the magnetic vector. Propagation of these signals
through the analog front-end and digital back-end generates a
fixed delay between the time of measurement and the
availability of the measured angle at the outputs. This latency
generates a dynamic angle error represented by the product of
the angular speed ω and the system propagation delay (tdelay):
(EQ1)
DAE = ω x tdelay
The dynamic angle compensation block calculates the current
magnet rotation speed (ω) and multiplies it with the system
propagation delay (tdelay) to determine the correction angle
to reduce this error. At constant speed, the residual system
propagation delay is tdelay_ DAEC.
The angle represented on the PWM interface is not
compensated by the Dynamic Angle Error Compensation
algorithm. It is also possible to disable the Dynamic Angle Error
Compensation with the DAECDIS setting. Disabling the
Dynamic Angle Error Compensation gives a noise benefit of
0.016 degree rms. This setting can be advantageous for low
speed ( under 100 RPM) respectively static positioning
applications.
ams Datasheet
[v1-07] 2015-May-27
Page 11
Document Feedback
AS5247 − Detailed Description
SPI Interface (slave)
The SPI interface is used by a host microcontroller (master) to
read or write the volatile memory as well as to program the
non-volatile OTP registers. The AS5247 SPI only supports slave
operation mode. It communicates at clock rates up to 10 MHz.
The AS5247 SPI uses mode=1 (CPOL=0, CPHA=1) to exchange
data. As shown in Figure 12, a data transfer starts with the
falling edge of CSn (SCL is low). The AS5247 samples MOSI data
on the falling edge of SCL. SPI commands are executed at the
end of the frame (rising edge of CSn). The bit order is MSB first.
Data is protected by parity.
SPI Timing
The AS5247 SPI timing is shown in Figure 12.
Figure 12:
SPI Timing Diagram
tCSn
CSn
(Input)
tL
tclk
tclkH
tclkL
tH
CLK
(Input)
tMISO
tOZ
MISO
(Output)
Data[15]
Data[14]
Data[0]
tOZ
tMOSI
MOSI
(Input)
Page 12
Document Feedback
Data[15]
Data[14]
Data[0]
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
Figure 13:
SPI Timing
Parameter
Description
Min
tL
Time between CSn falling edge and CLK rising edge
350
ns
tclk
Serial clock period
100
ns
tclkL
Low period of serial clock
50
ns
tclkH
High period of serial clock
50
ns
tclk/2
ns
Time between last falling edge of CLK and rising
edge of CSn
tH
Max
Units
tCSn
High time of CSn between two transmissions
350
ns
tMOSI
Data input valid to falling clock edge
20
ns
tMISO
CLK edge to data output valid
51
ns
Release bus time after CS rising edge.
10
ns
tOZ
SPI Transaction
An SPI transaction consists of a 16-bit command frame followed
by a 16-bit data frame. Figure 14 shows the structure of the
command frame.
Figure 14:
SPI Command Frame
Bit
Name
Description
15
PARC
Parity bit (even) calculated on the command frame
14
R/W
0: Write
1: Read
13.:0
ADDR
Address to read or write
To increase the reliability of communication over the SPI, an
even parity bit (PARC) must be generated and sent. A wrong
setting of the parity bit causes the PARERR bit in the error flag
register to be set. The parity bit is calculated from the 16-bit
command frame. The 16-bit command specifies whether the
transaction is a read or a write and the address.
Figure 15 shows the read data frame.
ams Datasheet
[v1-07] 2015-May-27
Page 13
Document Feedback
AS5247 − Detailed Description
Figure 15:
SPI Read Data Frame
Bit
Name
15
PARD
14
EF
13:0
DATA
Description
Parity bit (even) for the data frame
0: No command frame error command occurred
1: Error occurred
Data
The data is sent on the MISO pin. The parity bit PARD is
calculated by the ASAS5247 for the 16-bit data frame. If an error
is detected in the previous SPI command frame, the EF bit is set
high. The SPI read is sampled on the rising edge of CSn and the
data is transmitted on MISO with the next read command, as
shown in Figure 16.
Figure 16:
SPI Read
CSn
MOSI
Command
Command
Command
Command
Read ADD[n]
Read ADD[k]
Read ADD[p]
Read ADD[m]
Data
Data
Data
Data ADD[n]
Data ADD[k]
Data ADD[p]
MISO
Figure 17:
SPI Write Data Frame
Bit
Name
15
PARC
14
0
13.:0
DATA
Description
Parity bit (even)
Always low
Data
The parity bit PARD must be calculated from the 16-bit data.
Page 14
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
In an SPI write transaction, the write command frame (e.g. Write
ADD[n]) is followed by a data frame (e.g. DATA [x]). In addition
to writing an address in the AS5247, a write command frame
causes the old contents of the addressed register (e.g. DATA [y])
to be sent on MISO in the following frame. This is followed by
the new contents of the addressed register (DATA [x]) as shown
in Figure 19).
Figure 18:
SPI Write Transaction
CSn
MOSI
MISO
ams Datasheet
[v1-07] 2015-May-27
Command
Data to write into ADD[n]
Command
Data to write into ADD[n]
Command
Write ADD[n]
DATA (x)
Write (ADDm)
DATA (y)
Next command
Data content of ADD[n]
New Data content
of ADD[n]
DATA (y)
DATA (x)
Data content of ADD[m]
DATA (p)
New Data content
of ADD[m]
DATA (y)
Page 15
Document Feedback
AS5247 − Detailed Description
Volatile Registers
The volatile registers are shown in Figure 19. Each register has
a 14-bit address.
Figure 19:
Volatile Register Table
Address
Name
Default
Description
0x0000
NOP
0x0000
No operation
0x0001
ERRFL
0x0000
Error register
0x0003
PROG
0x0000
Programming register
0x3FFC
DIAAGC
0x0180
Diagnostic and AGC
0x3FFD
MAG
0x0000
CORDIC magnitude
0x3FFE
ANGLEUNC
0x0000
Measured angle without dynamic angle
error compensation
0x3FFF
ANGLECOM
0x0000
Measured angle with dynamic angle error
compensation
Reading the NOP register is equivalent to a nop (no operation)
instruction for the AS5247.
Figure 20:
ERRFL (0x0001)
Name
Read/Write
Bit Position
Description
PARERR
R
2
Parity error
INVCOMM
R
1
Invalid command error: set to 1 by reading or
writing an invalid register address
FRERR
R
0
Framing error: is set to 1 when a
non-compliant SPI frame is detected
Reading the ERRFL register automatically clears its contents
(ERRFL=0x0000).
Page 16
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
Figure 21:
PROG (0x0003)
Name
Read/Write
Bit Position
Description
PROGVER
R/W
6
Program verify: must be set to 1 for
verifying the correctness of the OTP
programming
PROGOTP
R/W
3
Start OTP programming cycle
OTPREF
R/W
2
Refreshes the non-volatile memory
content with the OTP programmed content
PROGEN
R/W
0
Program OTP enable: enables
programming the entire OTP memory
The PROG register is used for programming the OTP memory.
(See programming the zero position.)
Figure 22:
DIAAGC (0x3FFC)
Name
Read/Write
Bit Position
Description
MAGL
R
11
Diagnostic: Magnetic field strength too low;
AGC=0xFF
MAGH
R
10
Diagnostic: Magnetic field strength too
high; AGC=0x00
COF
R
9
Diagnostic: CORDIC overflow
Diagnostics: Loops Finished
LF=0:internal offset loops not ready
regulated
LF=1:internal offset loop finished
LF
R
8
AGC
R
7:0
Name
Read/Write
Bit Position
CMAG
R
13:0
Automatic gain control value
Figure 23:
MAG (0x3FFD)
ams Datasheet
[v1-07] 2015-May-27
Description
CORDIC magnitude information
Page 17
Document Feedback
AS5247 − Detailed Description
Figure 24:
ANGLEUNC (0x3FFE)
Name
Read/Write
Bit Position
Description
CORDICANG
R
13:0
Angle information without dynamic angle
error compensation
Figure 25:
ANGLECOM (0x3FFF)
Name
Read/Write
Bit Position
Description
DAECANG
R
13:0
Angle information with dynamic angle error compensation.
Non-Volatile Registers (OTP)
The OTP (One-Time Programmable) memory is used to store the
absolute zero position of the sensor and the customer settings
permanently in the sensor IC. SPI write/read access is possible
several times for all Non-Volatile Registers (soft write). Soft
written register content will be lost after a hardware reset. The
programming itself can be done just once. Therefore the
content of the Non-Volatile Registers is stored permanently in
the sensor. The register content is still present after a hardware
reset and cannot be overwritten. For a correct function of the
sensor the OTP programming is not required. If no
configuration or programming is done, the Non-Volatile
Registers are in the default state 0x0000.
Figure 26:
Non-Volatile Register Table
Address
Name
Default
Description
0x0016
ZPOSM
0x0000
Zero position MSB
0x0017
ZPOSL
0x0000
Zero position LSB/MAG diagnostic
0x0018
SETTINGS1
0x0000
Custom setting register1
0x0019
SETTINGS2
0x0000
Custom setting register 2
0x001A
RED
0x0000
Redundancy register
Figure 27:
ZPOSM (0x0016)
Name
Read/Write/Program
Bit Position
ZPOSM
R/W/P
7:0
Page 18
Document Feedback
Description
8 most significant bits of the zero position
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
Figure 28:
ZPOSL (0x0017)
Name
Read/Write/Program
Bit Position
Description
ZPOSL
R/W/P
5:0
6 least significant bits of the zero position
comp_l_error_en
R/W/P
6
This bit enables the contribution of
MAGH (Magnetic field strength too high)
to the system_error
comp_h_error_en
R/W/P
7
This bit enables the contribution of MAGL
(Magnetic field strength too low) to the
system_error
Figure 29:
SETTINGS1 (0x0018)
Name
Read/Write/Program
Bit Position
Description
IWIDTH
R/W/P
0
Width of the index pulse I
(0 = 3LSB, 1 = 1LSB)
NOISESET
R/W/P
1
Noise setting
DIR
R/W/P
2
Rotation direction
UVW_ABI
R/W/P
3
Defines the PWM Output
(0 = ABI is operating, W is used as PWM
1 = UVW is operating, I is used as PWM)
DAECDIS
R/W/P
4
Disable Dynamic Angle Error
Compensation (0 = DAE compensation
on, 1 = DAE compensation off )
Dataselect
R/W/P
6
This bit defines which data can be read
form
address 16383dec (3FFFhex).
0 → DAECANG
1 → CORDICANG
PWMon
R/W/P
7
enables PWM (setting of UVW_ABI Bit
necessary)
Figure 30:
SETTINGS2 (0x0019)
Name
Read/Write/Program
Bit Position
UVWPP
R/W/P
2:0
ams Datasheet
[v1-07] 2015-May-27
Description
UVW number of pole pairs
(000=1, 001=2, 010=3, 011=4, 100=5,
101=6, 110=7,111=7)
Page 19
Document Feedback
AS5247 − Detailed Description
Name
Read/Write/Program
Bit Position
Description
HYS
R/W/P
4:3
Hysteresis
for 11 Bit ABI Resolution: (00=3LSB, 01=
2LSB,10=1LSB,11=no hysteresis)
for 10 Bit ABI Resolution: (00=2LSB, 01=
1LSB,10=no Hysteresis LSB,11=3LSB)
ABIRES
R/W/P
5
Resolution of ABI (0=11 bits, 1=10 bits)
The hysteresis is in terms of the chosen resolution
(11 bits vs. 10bits) The ABIRES resolution does not affect the
UVW signals.
Figure 31:
RED(0x001A)
Name
Redundancy
Read/Write/Program
R/W/P
Bit Position
4:0
Description
Redundancy bits. This field enables
with force to high one bit of the
Non-Volatile register map after a
non-successful burning. For more
details please refer to the application
note
“AN5000-AS5147_Redundancy_Bits”
ABI Incremental Interface
The AS5247 can send the angle position to the host
microcontroller through an incremental interface. This
interface is available simultaneously with the other interfaces.
By default, the incremental interface is set to work at the highest
resolution (11 bits), which corresponds to 2048 steps per
revolution or 512 pulses per revolution (ppr). This resolution
can be cut in half using the OTP bit ABIRES, which results in 1024
steps per revolution or 256 pulses per revolution.
The phase shift between the A and B signals indicates the
rotation direction: clockwise (B leads, A follows) or
counterclockwise (A leads, B follows) as viewed from above the
magnet and AS5247. The DIR bit can be used to invert the sense
of the rotation direction.
The IWIDTH setting programs the width of the index pulse
from3 LSB (default) to 1 LSB.
Page 20
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
Figure 32:
ABI Signals at 11 Bit Resolution
A
B
I
N-7 N-6 N-5 N-4 N-3 N-2 N-1 0
1
2
3
4
5
6
Clockwise rotation
7
8
7
6
5
4
3
2
1
0
N-1 N-2 N-3 N-4
Counter-clockwise rotation
Note(s) and/or Footnote(s):
1. N = 2048 for 11-bit resolution, and N = 1024 for 10-bit resolution.
The Figure 32 shows the ABI signal flow if the magnet rotates
in clockwise direction, placing the magnet on the top of the
AS5247 and looking at the magnet from the top. With the bit
DIR, it is possible to invert the rotation direction.
UVW Commutation Interface
The AS5247 can emulate the UVW signals generated by the
three discrete Hall switches commonly used in BLDC motors.
The UVWPP field in the SETTINGS register selects the number
of pole pairs of the motor (from 1 to 7 pole pairs). The UVW
signals are generated with 14-bit resolution.
During the start-up time, after power on of the chip, the UVW
signals are low.
ams Datasheet
[v1-07] 2015-May-27
Page 21
Document Feedback
AS5247 − Detailed Description
Figure 33:
UVW Signals
U
V
W
Electrical
Angle
0°
60°
120°
180°
240°
300°
360°
Figure 33 shows the UVW signals for a magnet rotating
clockwise, as viewed from above the magnet and the
AS5247.The DIR bit can be used to invert the sense of the
rotation direction.
Page 22
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
PWM
The PWM can be enabled with the bit setting PWMon. The PWM
encoded signal is displayed on the pin W or the pin I. The bit
setting UVW_ABI defines which output is used as PWM. The
PWM output consists of a frame of 4119 PWM clock periods, as
shown in Figure 34. The PWM frame has the following sections:
• 12 PWM Clocks for INIT
• 4 PWM Clocks for Error detection
• 4095 PWM clock periods of data
• 8 PWM clock periods low
The angle is represented in the data part of the frame with a
12-bit resolution. One PWM clock period represents 0.088
degree and has a typical duration of 444 ns.
If the embedded diagnostic of the AS5247 detects any error, the
PWM interface displays only 12 clock periods high
(0.3% duty-cycle). Respectively the 4 clocks for error detection
are forced to low.
4 clock
pulses
Error_n
ams Datasheet
[v1-07] 2015-May-27
4089
4090
4091
4092
4093
4094
4095
Error_n
12 clock
pulses
Init
1
2
3
4
5
6
7
8
Init
Figure 34:
Pulse Width Modulation Encoded Signal
data
8 clock pulse
low
time
Page 23
Document Feedback
AS5247 − Detailed Description
Hysteresis
The hysteresis can be programmed in the HYS bits of the
SETTINGS register. The hysteresis can be 1, 2, or 3 LSB bits, in
which the LSB is defined by the ABI resolution setting (ABIRES).
Figure 35:
Hysteresis Settings
HYS
HYSTERESIS with 11 Bit ABI
Resolution
HYSTERESIS with 10 Bit ABI
Resolution
00
3
2
01
2
1
10
1
0
11
0
3
Automatic Gain Control (AGC) and CORDIC
Magnitude
The AS5247 uses AGC to compensate for variations in the
magnetic field strength due to changes of temperature, air gap
between the chip and the magnet, and demagnetization of the
magnet. The automatic gain control value can be read in the
AGC field of the DIAAGC register. Within the specified input
magnetic field strength (Bz), the Automatic Gain Control works
in a closed loop and keeps the CORDIC magnitude value (MAG)
constant. Below the minimum input magnetic field strength,
the CORDIC magnitude decreases and the MAGL bit is set.
Diagnostic Features
The AS5247 supports embedded self-diagnostics.
MAGL: Magnetic field strength too high, set if AGC = 0x00 . This
indicates the non-linearity error may be increased.
MAGH: Magnetic field strength too low, set high if
AGC = 0xFF. This indicates the output noise of the measured
angle may be increased.
COF: CORDIC overflow. This indicates the measured angle is not
reliable.
LF: Offset compensation completed. At power-up, an internal
offset compensation procedure is started, and this bit is set
when the procedure is completed.
Full Redundancy for application with high safety requirements
Page 24
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Detailed Description
OCF Error / COF Error
In case of an OCF or COF error, all outputs are changing into a
safe state:
SPI Output: Information in the DIAAGC (0x3FFC) register. The
angle information is still valid.
PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock
Periods = low. Additional there is no angle information valid
(all 4096 clock periods = low)
ABI Output: The state of ABI is frozen to ABI = 111
UVW Output: The state of UVW is frozen to UVW = 000
MAGH Error /MAGL Error
Default diagnostic setting for MAGH error /MAGL error:
In case of a MAGH error or MAGL error, there is no safe state on
the PWM,ABI or UVW outputs if comp_h_error_en= 0 &
comp_h_error_en = 0. The device is operating with the
performance as explained.
The error flags can be read out with the DIAAGC (0x3FFC)
register.
Enhanced diagnosis setting for MAGH error / MAGL error:
In case of a MAGH error or MAGL error, the PWM,ABI or UVW
outputs are going into a safe state if comp_h_error_en= 1 &
comp_h_error_en = 1.
SPI Output: Information in the DIAAGC (0x3FFC) register. The
angle information is still valid, if the MAGH or MAGL error flag
is on.
PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock
Periods = low. Additional there is no angle information valid (all
4096 clock periods = low)
ABI Output: The state of ABI is frozen to ABI = 111
UVW Output: The state of UVW is frozen to UVW = 000
Important: When comp_(h/l)_error_en is enabled a marginal
magnetic field input can cause toggling of MAGH or MAGL
which will lead to toggling of the ABI/UVW outputs between
operational mode and failure mode.
ams Datasheet
[v1-07] 2015-May-27
Page 25
Document Feedback
AS5247 − Application Information
Application Information
Burn and Verification of the OTP Memory
Figure 36:
Minimum Programming Diagram for the AS5247 in 5V Operation
VDD during programming 4.5V to 5.5V
VDD1
CSn_T
CLK_T
MISO_T
VDD_T
MOSI_T
VDD_B
CSn_B
CLK_B
VDD3V3_T
MISO_B
VDD3V3_B
MOSI_B
AS5247
I/PWM_T
Programmer
TEST_B
A_T
U_T
B_T
V_T
I/PWM_B
W_T
A_B
U_B
B_B
1μF
TEST_T
100nF
V_B
W_B
GND_T
GND_B
GND
Note(s) and/or Footnote(s):
1. In terms of EMC and for remote application, additional circuits are necessary.
2. Diagram shows only the connection to Top Die of As5247. For programming of Bottom Die the following pins has to connect instead
of the connection in the drawing:
CSn_B, CLK_B, MISO_B, MOSI_B,GND_B,VDD_B, VDD3V3_B,TEST_B
Page 26
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Application Information
Figure 37:
Minimum Programming Diagram for the AS5247 in 3.3V Operation
VDD during programming 3.3V to 3.5V
VDD1
CSn_T
CLK_T
MISO_T
VDD_T
MOSI_T
VDD_B
CSn_B
CLK_B
VDD3V3_T
MISO_B
VDD3V3_B
MOSI_B
AS5247
I/PWM_T
Programmer
TEST_T
TEST_B
A_T
U_T
B_T
V_T
I/PWM_B
W_T
A_B
U_B
B_B
V_B
100nF
W_B
GND_T
GND_B
GND
Note(s) and/or Footnote(s):
1. In terms of EMC and for remote application, additional circuits are necessary.
2. Diagram shows only the connection to Top Die of As5247. For programming of Bottom Die the following pins has to connect instead
of the connection in the drawing:
CSn_B, CLK_B, MISO_B, MOSI_B,GND_B,VDD_B, VDD3V3_B,TEST_B
ams Datasheet
[v1-07] 2015-May-27
Page 27
Document Feedback
AS5247 − Application Information
Figure 38:
OTP Programming Parameters
Symbol
Parameter
Conditions
Min
TaProg
Programming
temperature
Programming @ Room
Temperature (25ºC ± 20ºC)
VDD
Positive supply
voltage
5V operation mode. Supply
voltage during programming
4.5
VDD
Positive supply
voltage
3.3V operation mode. Supply
voltage during programming
3.3
IProg
Current for
programming
Max current during OTP burn
procedure
Typ
5
5
Max
Units
45
ºC
5.5
V
3.5
V
100
mA
Step-by-step procedure to permanently program the
non-volatile memory (OTP):
The programming can either be performed in 5V operation
using the internal LDO (1uF on regulator output pin), or in 3V
Operation but using a supply voltage between 3.3V and 3.5V.
1.
Power on cycle
2. Write the SETTINGS1 and SETTINGS2 registers with the
Custom settings for this application
3. Position the magnet at the desired zero position
4. Read out the measured angle from the ANGLE register
5. Write ANGLE [5:0] into the ZPOSL register and ANGLE
[13:6] into the ZPOSM register
6. Read reg(0x0016) to reg(0x0019) → Read register step1
7. Comparison of written content (settings and angle) with
content of read register step1
8. If point 7 is correct, enable OTP read / write by setting
PROGEN = 1 in the PROG register
9. Start the OTP burn procedure by setting PROGOTP = 1
in the PROG register
10. Read the PROG register until it reads 0x0000
(Programming procedure complete)
11. Clear the memory content writing 0x00 in the whole
non-volatile memory
12. Enable OTP read / write by setting PROGEN = 1 in the
PROG register
13. Set the PROGVER = 1 to set the Guard band for the guard
band test.(1)
14. Refresh the non-volatile memory content with the OTP
content by setting OTPREF = 1
15. Read reg(0x0016) to reg(0x0019) → Read register step2
Page 28
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Application Information
16. Comparison of written content (settings and angle) with
content of read register step2.
Mandatory: guard band test
17. New power on cycle, if point 16 is correct. If point 16
fails, the test with the guard band test 1 was not
successful and the device is incorrectly programmed.
A reprogramming is not allowed!
18. Read reg(0x0016) to reg(0x0019) → Read register step3
19. Comparison of written content (settings and angle) with
content of read register step3.
20. If point 19 is correct, the programming was successful.
If point 19 fails, device is incorrectly programmed.
A reprogramming is not allowed .
21. Repeat point 1 to point 20 on the second die.
1. Guard band test:
- Restricted to temperature range: 25 °C ± 20 °C
- Right after the programming procedure (max. 1 hour with same
- Conditions 25°C ± 20 °C)
- Same VDD voltage
The guard band test is only for the verification of the burned OTP fuses during the programming sequence.
A use of the guard band in other cases is not allowed.
ams Datasheet
[v1-07] 2015-May-27
Page 29
Document Feedback
AS5247 − Application Information
Figure 39:
OTP Memory Burn and Verification Flowchart
Power on cycle
START
AS5247 settings
Write reg(0x0018)
Write reg(0x0019)
Position of the magnet to
the zero position
Read ANGLE
Write
Reg(0x0016)=0x00
Reg(0x0017)=0x00
Reg(0x0018=0x00
Reg(0x0019)=0x00
Clear memory
Write
Reg(0x0003)=0x08
Set the magnet to
the zero position
Unlock OTParea for read/write
(PROGEN=1)
Write
Reg(0x0003)=0x40
Write Angle into ZPOSL
and ZPOSM
Write
Reg(0x0017(5:0))= reg(0x3FFF(5:0))
Reg(0x0016(7:0))= reg(0x3FFF(13:6))
Read Register step 1
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0019)
Refresh memory with OTP
content
Write
Reg(0003)=0x04
Not correct
Read reg(0x3FFF)
Set Guardband
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0016)
Verify 2
Read Register step 2
Not correct
Comparison of written content (settings and
angle) with content of Read Register step 2
Mandatory Guardband-Test
YES
correct
Comparison of written content
(settings and angle) with content
of Read Register step 1
Verify 1
Power-on cycle
Guardbandtest fails.
Wrong programming.
Reprogramming not allowed
correct
Unlock OTParea for read/write
(PROGEN=1)
Write
Reg(0x0003)=0x01
Read
Reg(0x0016)
Reg(0x0017)
Reg(0x0018)
Reg(0x0016)
Start OTP burning procedure
(PROGOTP=1)
Write
Reg(0x0003)=0x08
Verify 3
Read Register step 3
Not correct
Comparison of written content
(settings and angle) with content
of Read Register step 3
correct
Read OTP_CTRL
END
Correct
programming and
verification
Read
Reg(0x0003)
END
Wrong programming
Reprogramming not
allowed
NO
OTP burning procedure
complete if Reg(0x0003) =0x00
Page 30
Document Feedback
Reg(0x0003)=0x00
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Application Information
This procedure has to be done twice, for the Top Die and for the
Bottom Die.
Figure 40:
Minimum Circuit Diagram for the AS5247
VDD2
CSn_T
100nF
VDD1
CLK_T
MISO_T
VDD_T
MOSI_T
VDD_B
GND1
100nF
4.5 – 5.5V
4.5 – 5.5V
GND2
VDD3V3_T
MISO_B
VDD3V3_B
MOSI_B
I/PWM_T
MCU
AS5247
TEST_T
TEST_B
A_T
U_T
B_T
V_T
I/PWM_B
W_T
A_B
U_B
B_B
1µF
CLK_B
1µF
CSn_B
V_B
W_B
GND_T
GND1
GND_B
GND2
GND1
GND2
Note(s) and/or Footnote(s):
1. This application block diagram is showing the AS5247 using in a full redundant application. Interms of EMC and for remote
application, additional protection circuit is necessary.
ams Datasheet
[v1-07] 2015-May-27
Page 31
Document Feedback
AS5247 − Package Drawings & Mark ings
Package Drawings & Markings
The axis of the magnet must be aligned over the center of the
package.
Figure 41:
Package Outline Drawing
RoHS
Symbol
Min
Nom
Max
Symbol
A
A1
A2
A3
L
L1
L2
Θ1
b
b1
D
E
0.80
0
-
0.90
0.01
0.65
0.20 REF
0.40
0.15
0.10
0.25
0.15
7.00 BSC
7.00 BSC
1.00
0.05
1.00
e
D1
E1
D2
E2
aaa
bbb
ccc
ddd
eee
fff
N
Page 32
Document Feedback
0.30
0.05
0.05
0º
0.20
0.10
0.50
0.25
0.15
14º
0.30
0.20
Min
4.20
4.20
-
Green
Nom
0.50 BSC
6.75 BSC
6.75 BSC
4.30
4.30
0.15
0.10
0.10
0.05
0.08
0.10
40
Max
4.40
4.40
-
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Package Drawings & Markings
Note(s) and/or Footnote(s):
1. Dimensions & Tolerancing conform to ASME Y14.5M-1994.
2. All Dimensions are in millimeters (angles in degrees).
3. Bilateral coplanarity zone applies to the exposed pad as well as the terminal.
4. Radius on terminal is optional.
5. N is the total number of terminals.
Figure 42:
Packaging Code
YY
Last two digits of the
manufacturing year
WW
V
Manufacturing week
Plant identifier
ZZ
Free choice /
traceability code
@
Sublot identifier
Figure 43:
Package Marking
AS5247 @
YYWWVZZ
ams Datasheet
[v1-07] 2015-May-27
Page 33
Document Feedback
AS5247 − Mechanical Data
Mechanical Data
Figure 44:
Angle Detection by Default (no zero position programmed)
IMPORTANT: Hall Array center is not in the
center of the MLF40 package! It is shifted
towards the lower pins (11 to 20) by
326μm!
Page 34
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Mechanical Data
Figure 45:
Die Placement and Hall Array Position
Note(s) and/or Footnote(s):
1. All dimensions in mm.
2. Die thickness 150μm nom.
3. Adhesive thickness 12μm nom.
4. Spacer thickness: 178μm typ.
ams Datasheet
[v1-07] 2015-May-27
Page 35
Document Feedback
AS5247 − Ordering & Contact Information
Ordering & Contact Information
Figure 46:
Ordering Information
Ordering
Code
Package
Marking
Delivery Form
Delivery
Quantity
AS5247-HMFT
MLF-40
AS5247
13’’ Tape&Reel in dry pack
4000
AS5247-HMFM
MLF-40
AS5247
7’’ Tape&Reel in dry pack
1000
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 36
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-07] 2015-May-27
Page 37
Document Feedback
AS5247 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 38
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-07] 2015-May-27
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 39
Document Feedback
AS5247 − Revision Information
Revision Information
Changes from 1-02 (2014-Jun-20) to current revision 1-07 (2015-May-27)
Page
1-02 (2014-Jun-20) to 1-03 (2015-Apr-23)
Content was updated to the latest ams design
Updated Figure 8
7
1-03 (2015-Apr-23) to 1-04 (2015-May-07)
Updated Figure 8
8
1-04 (2015-May-07) to 1-05 (2015-May-15)
Updated text under General Description
1
Updated Figure 3
3
Added notes under Figure 4
3
Updated Figure 6
7
Updated Figure 9
9
Updated Figure 12
12
Updated text under Non-Volatile Registers (OTP)
18
1-05 (2015-May-15) to 1-06 (2015-May-20)
Updated Figure 4
3
Updated Figure 42 and notes under it
35
1-06 (2015-May-20) to 1-07 (2015-May-27)
Updated Figure 13
13
Updated Figure 22
17
Updated text under PWM and Figure 34
23
Added Figure 36 and notes under it
26
Added Figure 37 and notes under it
27
Added Figure 38
28
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 40
Document Feedback
ams Datasheet
[v1-07] 2015-May-27
AS5247 − Content Guide
Content Guide
ams Datasheet
[v1-07] 2015-May-27
1
1
2
2
General Description
Key Benefits & Features
Applications
Block Diagram
3
6
7
8
8
9
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
Magnetic Characteristics
System Characteristics
Timing Characteristics
10
10
11
12
12
13
16
18
20
21
23
24
24
24
25
25
Detailed Description
Power Management
Dynamic Angle Error Compensation
SPI Interface (slave)
SPI Timing
SPI Transaction
Volatile Registers
Non-Volatile Registers (OTP)
ABI Incremental Interface
UVW Commutation Interface
PWM
Hysteresis
Automatic Gain Control (AGC) and CORDIC Magnitude
Diagnostic Features
OCF Error / COF Error
MAGH Error /MAGL Error
26
26
Application Information
Burn and Verification of the OTP Memory
32
34
36
37
38
39
40
Package Drawings & Markings
Mechanical Data
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 41
Document Feedback