CPC7557 Diode Bridge INTEGRATED CIRCUITS DIVISION Bridge Characteristics Parameter Description Rating Units Reverse Voltage 100 V Forward Current 240 mArms The CPC7557N is an integrated diode bridge built on IXYS Integrated Circuits Division’s High Voltage SOI technology. Features • Monolithic Construction • Surface Mount Package Ordering Information Applications • Telecommunications Protection Clamp • High Voltage Multiplexer/Switch Pb Part Description CPC7557N 8-Pin SOIC in Tubes (100/Tube) CPC7557NTR 8-Pin SOIC Tape & Reel (2000/Reel) e3 CPC7557N Diagram A/B + B/A - DS-CPC7557-R04 www.ixysic.com 1 CPC7557 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Package Pinout - 1.2 Pin Description 1 8 B N/C N/C + Name Description 1 N/C 2 N/C No Connection N/C 3 N/C No Connection 4 + Positive Bridge Output 5 A Input A 6 N/C No Connection 7 N/C No Connection 8 B A 5 4 Pin# Negative Bridge Output Input B 1.3 Absolute Maximum Ratings Unless Otherwise Specified all electrical ratings are at 25C Parameter Reverse Voltage Diode Forward Current (Average) Diode Forward Surge Current Fusing Current ESD, Human Body Model Junction Temperature 1 Storage Temperature 1 Symbol Minimum Maximum Units VRRM - 120 V IF - 250 mArms IFSM - 2 A I2t - 0.02 A2s - - 3 kV TJ - +150 C TSTG -65 +150 C Derate package for PDISS 120C/W. Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R04 www.ixysic.com 2 CPC7557 INTEGRATED CIRCUITS DIVISION 1.4 Recommended Operating Conditions Parameter Symbol Minimum Maximum Units Diode Forward Current (Average) IF - 240 mArms Reverse Voltage VR - 100 V Operating Temperature Range TA -40 +125 C Thermal Impedance JA 120 - C/W 1.5 General Conditions Unless otherwise noted, all electrical specifications are listed for TA=25C. Typical values are characteristic of the device at 25C and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. 1.6 DC Electrical Characteristics Parameter Conditions Symbol Minimum Typical Maximum Units - IF - - 240 mArms 0.83 0.91 0.97 1 1.3 1.49 - - 1 A Forward Current IF = 40mA Diode Forward Voltage Drop VF IF = 250mA VR=100V Reverse Voltage Leakage Current IR V 1.7 AC Electrical Characteristics Parameter Conditions Symbol Minimum Typical Maximum Units V+ V = 0V Measured from VA to VB CAB - 4.4 12 pF VA = VB Measured from V+ to V C+/ - 8.3 20 pF V+ V = 0V Measured from VA to V+/- and VB to V+/- CA/+, CA/, CB/+, CB/ - 8.5 12 pF Input Zero Bias Capacitance Output Zero Bias Capacitance Bridge Zero Bias Capacitance 2 Typical Performance Data 2.4 2.2 2.0 IF=40mA 1.8 1.6 1.4 1.2 1.0 -40 3 1.6 IF=250mA 2.6 Diode Forward Voltage (V) Diode Forward Voltage (V) 2.8 Diode Forward Voltage (VF) vs. Temperature Diode Reverse Breakdown Voltage (VRRM) vs. Temperature Reverse Breakdown Voltage (V) Bridge Forward Voltage (VF) vs. Temperature IF=250mA 1.4 1.2 1.0 0.8 IF=40mA 0.6 0.4 0.2 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) www.ixysic.com 80 100 152 150 148 146 144 142 140 138 -40 -20 0 20 40 60 Temperature (ºC) 80 100 R04 CPC7557 INTEGRATED CIRCUITS DIVISION 3 Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC7557N MSL 1 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC7557N 260C for 30 seconds 3.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 4 CPC7557 INTEGRATED CIRCUITS DIVISION 3.5 8-Pin SOIC Package Dimensions 1.270 REF (0.050) Pin 8 PCB Land Pattern 0.60 (0.024) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 5.40 (0.213) Pin 1 1.55 (0.061) 0.406 ± 0.076 (0.016 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 0.559 ± 0.254 (0.022 ± 0.010) 1.346 ± 0.076 (0.053 ± 0.003) 1.27 (0.050) Dimensions mm (inches) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 3.6 Tape & Reel Dimensions 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC7557-R04 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/18/2012 5 www.ixysic.com R04