CPC5608 5-Channel, Low Power, Transistor Array IC INTEGRATED CIRCUITS DIVISION Features Description • Extremely Low Static Current Draw from Power Supply • Two-State Control • Low-Voltage Operation (VCC = 2.5V) • Low Output Transistor Leakage • 8-Pin, 150mil SOIC-N Package The CPC5608 is a 5-channel, low-power transistor array IC with a simple 2-state logic control input. A logic-low input turns on the switches NC1, NC2, and NC3 while a logic high turns on the switches NO1 and NO2. Output transistors are capable of sinking 20mA in low output voltage (<7V) circuits. The IC features a supply voltage range of 2.5V to 5.5V and extremely low static supply bias current draw making it ideal for portable battery and on-hook telephony applications. In addition, the maximum output transistor leakage is a low 1A. Applications • Portable Battery Equipment • Telephony • Instrumentation The device logic input threshold is compatible with standard optocoupler output levels for isolation applications. CPC5608 Block Diagram 8 VCC 7 6 INPUT 2 5 4 GND NC1 1 3 Output NC1 NC2 NC3 NO1 NO2 Input = 0 On On On Off Off NC2 NC3 Ordering Information Part # CPC5608N CPC5608NTR Description 8-Pin SOIC-N Package, (50/tube) 8-Pin SOIC-N Package, Tape & Reel, (1000/Reel) NO1 NO2 Input = 1 Off Off Off On On On = Low Impedance Pb DS-CPC5608-R01 e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC5608 1.0 Specifications 1.1 Pin Description Pin # 1 2 3 4 5 6 7 8 Name VCC INPUT GND NO2 NO1 NC3 NC2 NC1 1.2 Absolute Maximum Ratings @ 25°C Description Supply Voltage Logic Input Ground Output, Active* with INPUT = 1 Output, Active* with INPUT = 1 Output, Active* with INPUT = 0 Output, Active* with INPUT = 0 Output, Active* with INPUT = 0 Parameter Operating Temperature Storage Temperature Positive Supply Voltage Max Power Dissipation Package Thermal Conduction (Estimate) Output Voltage (ONX) Min 0 -55 -0.5 - Max 70 +125 7 0.33 Unit °C °C V W - 165 °C/W -0.5 7 V * Active = Low Impedance Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.3 Electrical Characteristics Unless otherwise specified, minimum and maximum values are guaranteed by production testing requirements. Typical values are characteristic of the device and are the result of engineering evaluations. In addition, typical values are provided for informational purposes only and are not part of the testing requirements. All electrical specifications are provided for TA=25°C and 3.0V < VCC < 5.5V. 1.3.1 Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Logic "1" Voltage VCC = 2.8V, VCC = 3.5V VIH 2.4 - - V Logic "0" Voltage VCC = 2.8V, VCC = 3.5V VIL - - 0.8 V Logic "1" Current VCC = 3.5V, VIN = 2.4V IIH - 2.6 20 A Logic "0" Current VCC = 3.5V, VIN = 0.4V IIL - 0.4 2 A Output Leakage Current VCC = 3.0V, VSW = 6.0V Switch Off ILKG - 0.3 1 A Output Resistance VCC = 2.8V, VCC = 3.2V Switch On RON 5 10 15 Maximum Output Current VCC = 3.0V, VOUT = 2.0V Switch On IOUT 50 - - mA - VCC 2.5 3.0 5.5 V VCC = 5.5V, VIN = 0.0V, VIN = 5.5V ICC - 2 100 nA ton - 1 3 s toff - 1 3 s Input Parameters Output Parameters Power Supply Operational Range Quiescent Power Supply Current Timing Turn-On Time Turn-Off Time 2 VCC = 3.0V www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC5608 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC5608N MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC5608N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R01 e3 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC5608 MECHANICAL DIMENSIONS CPC5608N 1.270 REF (0.050) Pin 8 PCB Land Pattern 0.60 (0.024) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 5.40 (0.213) Pin 1 1.55 (0.061) 0.406 ± 0.076 (0.016 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 1.346 ± 0.076 (0.053 ± 0.003) 0.559 ± 0.254 (0.022 ± 0.010) 1.27 (0.050) Dimensions mm (inches) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) CPC5608N 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 4 Specification: DS-CPC5608-R01 ©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 7/31/2013