DATA SHEET SE2600S: 2.4 GHz WLAN Switch/Low-Noise Amplifier Front-End Applications • IEEE802.11b DSSS WLAN • IEEE802.11g/n OFDM WLAN • Embedded systems Features • Integrates an SP3T switch and LNA with bypass mode • Gain: 12 dB • Noise Figure: 1.8 dB • Bluetooth® path loss: 0.5 dB • Small WLCSP (11-bump, 1.07 x 1.05 x 0.38 mm) 250 μm ball pitch package (MSL1, 260 °C per JEDEC-J-STD-020) Figure 1. SE2600S Block Diagram Description The SE2600S is an integrated Front-End Module (FEM) with a Bluetooth port to complement WLAN chipsets with an integrated Power Amplifier (PA). The SE2600S integrates a Single-Pole, Triple-Throw (SP3T) switch and Low-Noise Amplifier (LNA) with a bypass mode in an ultracompact package. The device is capable of switching between WLAN receive, WLAN transmit, and Bluetooth. The SE2600S is provided in a small, 11-bump, 1.07 x 1.05 mm Wafer Level Chip Scale Package (WLCSP). A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. Figure 2. SE2600S Pinout – 11-Bump CSP (Top View, Bumps Down) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011 1 DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Table 1. SE2600S Signal Descriptions Pin # Name Description Pin # Name Description 1 TX WLAN transmit port 7 GND Ground 2 GND Ground 8 BT Bluetooth port 3 VON LNA control signal 9 VC1 BT switch control pin 4 RX WLAN receive port 10 RFC RF common port (antenna) 5 VDD Positive power supply voltage 11 VC3 Transmit switch control pin 6 VC2 Receive switch control pin Table 2. SE2600S Absolute Maximum Ratings Parameter Symbol Supply voltage VDD DC input on control pins Minimum Maximum Units 0 3.6 V –0.5 VDD + 0.5 V +27 dBm Transmit input power, RFC terminated in 50 Ω match PIN Operating temperature TA –40 +85 °C Storage temperature TSTG –40 +150 °C Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. The SE2600S ESD threshold level is 1000 VDC using Human Body Model (HBM) testing. Table 3. Recommended Operating Conditions Parameter Symbol Minimum Typical 3.3 Supply voltage VDD 2.7 Control voltage (relative to GND = 0 V) VCTL 0 Operating temperature TA Electrical and Mechanical Specifications The absolute maximum ratings of the SE2600S are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Tables 4 through 7. –40 +25 Maximum Units 3.6 V VDD V +85 °C The state of the SE2600S is determined by the logic provided in Table 8. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Table 4. SE2600S Electrical Specifications: DC Characteristics (Note 1) (VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted) Parameter Typical Max Units 10 13 mA 60 μA ICTL 20 μA BT port control current I C1 20 μA TX port control current I C3 20 μA Control voltage: High Low VIH VIL 3.6 0.3 V V LNA current Symbol IDD Test Condition Min High gain mode Bypass mode LNA control current 2.7 0 Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 5. SE2600S Electrical Specifications: AC Characteristics, Transmit (RFC to TX Port) (Note 1) (VC1 = VC2 = VON = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted) Parameter Frequency Symbol Test Condition f Min Typical 2.4 Max Units 2.5 GHz Insertion loss IL 0.5 0.7 dB Input return loss S11 –16 –14 dB Output return loss S22 –16 –14 dB Switch isolation Iso 1 dB Input Compression Point IP1dB Turn-on/turn-off time TON, TOFF VC3 = 0 V 23 dB +31 dBm 90/10% of final output power level 400 ns Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 6. SE2600S Electrical Specifications: AC Characteristics, Bluetooth (RFC to BT Port) (Note 1) (VC2 = VC3 = VON = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted) Parameter Symbol Max Units 2.5 GHz 0.5 0.7 dB S11 –16 –14 dB S22 –16 –14 dB Frequency f Insertion loss IL Input return loss, BT port Output return loss, BT port Switch isolation Iso 1 dB Input Compression Point IP1dB Turn-on/turn-off time TON, TOFF Test Condition Min Typical 2.4 VC1 = 0 V 25 dB +31 90/10% of final output power level dBm 400 ns Note 1: Performance is guaranteed only under the conditions listed in this Table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011 3 DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Table 7. SE2600S Electrical Specifications: Receive Characteristics (RFC to RX Port) (Note 1) (VC1 = VC3 = 0 V, VDD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units 2.5 GHz +13 dB Frequency f 2.4 Receive gain, LNA enabled S21 +11 +12 Receive gain, LNA bypassed S21_BYP –4 –3 Input return loss S11 –10 –8 dB Output return loss S22 –10 –8 dB Noise Figure NF 1.8 2.0 dB 1 dB Input Compression Point IP1dB Turn-on/turn-off time TON, TOFF –6 dB –5 dBm 90/10% of final output power level 400 ns Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 8. SE2600S Control Logic Mode Note: Path VC1 (Pin 9) VC2 (Pin 6) VC3 (Pin 11) VON (Pin 3) All off N/A 0 0 0 0 Transmit TX to RFC 0 0 1 0 Bluetooth RFC to BT 1 0 0 0 High gain (receive) RFC to RX 0 1 0 1 Bypass (receive) RFC to RX 0 1 0 0 “0” = 0 V to +0.3 V. “1” = +2.7 V to +3.6 V. Any state other than described in this Table places the switch into an undefined state. An undefined state will not damage the device. Evaluation Board Description Evaluation Board Losses The SE2600S Evaluation Board is used to test the performance of the SE2600S LNA FEM. An Evaluation Board schematic diagram is provided in Figure 3. Table 9 provides the Bill of Materials (BOM) list for Evaluation Board components. An assembly drawing for the Evaluation Board is shown in Figure 4. The board losses from the RF connectors of the Evaluation Board to the pins of the SE2600S are: RFC: 0.175 dB TX: 0.165 dB RX: 0.175 dB BT: 0.21 dB Evaluation Board Setup Procedure Step 1: Connect system ground to pin 1 of the J14 header. Step 2: Apply 3.3 V to pin 14 of the J14 header. Step 3: Select a path/mode according to the information in Table 8. For the J14 header pinout, refer to the Evaluation Board silkscreen and schematic in Figure 3. Package Dimensions The PCB layout footprint for the SE2600S is provided in Figure 5. Typical case markings are shown in Figure 6. Package dimensions for the 11-bump WLCSP are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. NOTE: In case only three controls are available from the application, (transmit, receive, and Bluetooth), connect the VC2 and VON signals together. In this configuration, the LNA is always “on” in receive mode (corresponding to high gain mode in Table 8). The LNA 3rd Order Input Intercept Point (IIP3) is > +5 dBm. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Package and Handling Information Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2600S is rated to Moisture Sensitivity Level 1 (MSL1) at 260 °C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design and SMT Assembly Guidelines for Wafer Level Chip Scale Packages, document number 201676. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Underfill Requirements low-stress seal that dissipates stress on solder joints and extends thermal cycling performance. Skyworks recommends the use of Loctite Hysol 4549 as an underfill material, which should be cured for 30 minutes at +165 °C. If the WLCSP is attached without an underfill, the circuit is more susceptible to mechanical damage. Damage can even occur if components in close proximity to the WLCSP are soldered or unsoldered on the substrate without evenly preheating the entire board and die. Mechanical damage to the solder joint between the board and die could result, which may impact electrical connectivity. Pad Coordinates The SE2600S pad coordinates are provided in Table 10 (also refer to the pinout diagram in Figure 2). The origin of the coordinates (i.e., X = 0, Y = 0) is located at the center of the SE2600S package. Sense is top view through package (PCB footprint). The assembly of a WLCSP onto an electrical substrate requires special handling and normally needs an underfill liquid epoxy mold compound. When fully cured, the underfill material forms a rigid, Figure 3. SE2600S Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011 5 DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Table 9. SE2600S Evaluation Board Bill of Materials (BOM) Component Value Size Manufacturer Manufacturer’s Part # Characteristics C7 1 nF 0402 Murata GRM155R71H102KA01 Multi-layer ceramic C8 10 pF 0402 Murata GRM1555C1H100JZ01 Multi-layer ceramic C11 2.2 μF 0603 Murata GRM188R71A225KE15D Monolithic ceramic J14 – 100 mil Samtec TSW-107-07-G-D 7x2 100 mil pin header R14, R15, R16, R17 100 kΩ 0402 Panasonic ERJ2GEJ104 Thick film chip resistor Table 10. SE2600S Bump Pad Coordinates Bump Coordinates Bump Number Bump Label X (μm) Y (μm) 1 TX –375 +375 2 GND –375 +125 3 VON –375 –375 4 RX –125 –375 5 VDD +125 –375 6 VC2 +375 –375 7 GND +375 –125 8 BT +375 +125 9 VC1 +375 +375 10 RFC +125 +375 11 VC3 –125 +375 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Figure 4. SE2600S Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011 7 DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Figure 5. SE2600S PCB Layout Footprint Figure 6. Typical Case Markings Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Figure 7. SE2600S 11-Bump WLCSP Package Dimensions Figure 8. SE2600S Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • November 2, 2011 9 DATA SHEET • SE2600S WLAN SWITCH/LNA FEM Ordering Information Model Name SE2600S LNA Front-End Manufacturing Part Number SE2600S-R Evaluation Board Part Number SE2600S-EK1 Copyright © 2011 Skyworks Solutions, Inc. All Rights Reserved. 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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201654C