PRELIMINARY DATASHEET ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER Description Features The ICS621 is a low skew, single input to four output, clock buffer. The device operates from a single 1.2 to 1.8 volt supply and has a 3.3 volt tolerant input, making it ideal for level translation. • • • • • • • • IDT makes many non-PLL and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact us for all of your clocking needs. Low skew outputs (150 ps) Packaged in 8-pin SOIC or 8-pin DFN (2x2mm) Available in RoHS 5 or RoHS 6 (lead-free) package Low power CMOS technology Operating Voltages of 1.2 V to 1.8 V Output Enable pin tri-states outputs 3.3 V tolerant input clock Industrial or commercial temperature ranges Block Diagram Q0 Q1 ICLK Q2 Q3 Output Enable IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 1 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Pin Assignment (8-pin SOIC) Pin Assignment (8-pin DFN) ICLK 1 8 OE Q1 2 7 VDD Q2 3 6 GND 4 5 Q4 Q3 ICLK 1 8 OE Q1 VDD Q2 GND Q3 4 5 Q4 Pin Descriptions Pin Pin Number Name Pin Type Pin Description 1 ICLK Input Clock Input. 3.3 V tolerant input. 2 Q1 Output Clock Output 1. 3 Q2 Output Clock Output 2. 4 Q3 Output Clock Output 3. 5 Q4 Output Clock Output 4. 6 GND Power Connect to ground. 7 VDD Power Connect to +1.2 V or +1.8 V. 8 OE Input Output Enable. Tri-states outputs when low. Connect to VDD for normal operation. External Components A minimum number of external components are required for proper operation. A decoupling capacitor of 0.01 µF should be connected between VDD on pin 7 and GND on pin 6, as close to the device as possible. A 33 Ω series terminating resistor may be used on each clock output if the trace is longer than 1 inch. To achieve the low output skew that the ICS621 is capable of, careful attention must be paid to board layout. Essentially, all four outputs must have identical terminations, identical loads and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30Ω series termination on one output (with 33Ω on the others) will cause at least 15 ps of skew. IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 2 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS621. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 5V Output Enable and All Outputs -0.5 V to VDD+0.5 V ICLK -0.5 V to 3.6 V (VDD > 0V) Ambient Operating Temperature (industrial) -40 to +85 °C Ambient Operating Temperature (commercial) 0 to +70 °C Storage Temperature -65 to +150°C Junction Temperature 125°C Soldering Temperature 260°C Recommended Operation Conditions Parameter Min. Ambient Operating Temperature (industrial) Ambient Operating Temperature (commercial) Power Supply Voltage (measured in respect to GND) IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 3 Typ. Max. Units -40 +85 °C 0 +70 °C 1.14 1.89 V ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER DC Electrical Characteristics VDD=1.2 V ±5%, Ambient temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Operating Voltage VDD Input High Voltage VIH Note 1, ICLK, OE Input Low Voltage VIL Note 1, ICLK, OE Output High Voltage VOH IOH = -2 mA Output Low Voltage VOL IOL = 2 mA Operating Supply Current IDD No load, 133 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS Min. Typ. Max. Units 1.14 1.26 V 0.65VDD VDD+0.3 V 0.35VDD V 0.75VDD V 0.25VDD ICLK, OE pin V TBD mA 20 Ω 5 pF ±20 mA Notes: 1. Nominal switching threshold is VDD/2 VDD=1.5 V ±5%, Ambient temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Operating Voltage VDD Input High Voltage VIH Note 1, ICLK, OE Input Low Voltage VIL Note 1, ICLK, OE Output High Voltage VOH IOH = -6 mA Output Low Voltage VOL IOL = 6 mA Operating Supply Current IDD No load, 133 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS Min. Typ. Max. Units 1.425 1.575 V 0.65VDD VDD+0.3 V 0.35VDD V 0.75VDD V 0.25VDD ICLK, OE pin V 25 mA 20 Ω 5 pF ±28 mA Notes: 1. Nominal switching threshold is VDD/2 VDD=1.8 V ±5%, Ambient temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Input High Voltage, ICLK VIH Note 1, ICLK, OE Input Low Voltage, ICLK VIL Note 1, ICLK, OE Output High Voltage VOH IOH = -8 mA Output Low Voltage VOL IOL = 8 mA Operating Supply Current IDD No load, 133 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS ICLK, OE pin Min. Typ. Max. Units 1.71 1.89 V 0.65VDD VDD+0.3 V 0.35VDD V 1.35 V 0.45 V 50 mA 20 Ω 5 pF ±50 mA Notes: 1. Nominal switching threshold is VDD/2 IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 4 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER AC Electrical Characteristics VDD = 1.2 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 100 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns 3 5 ns 0 ±150 ps Propagation Delay Note 1 Output to Output Skew Note 2 2.2 Rising edges at VDD/2 VDD = 1.5 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 166 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns 3 5 ns 0 ±150 ps Propagation Delay Note 1 Output to Output Skew Note 2 2.2 Rising edges at VDD/2 VDD = 1.8 V ±5%, Ambient Temperature -40 to +85°C or 0 to +70°C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 20% to 80%, Note 3 1.0 1.5 ns Output Fall Time tOF 80% to 20%, Note 3 1.0 1.5 ns 3 5 ns 0 ±150 ps Propagation Delay Note 1 Output to Output Skew Note 2 2.2 Rising edges at VDD/2 Notes: 1. With rail to rail input clock 2. Between any 2 outputs with equal loading. 3. Measured with a 15 pF load. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Symbol Conditions Min. Typ. Max. Units θJA Still air 150 °C/W θJA 1 m/s air flow 140 °C/W θJA 3 m/s air flow 120 °C/W 40 °C/W θJC Case Temperature Thermal Resistance Junction to Top of Case IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 120 ΨJT Still air 5 °C °C/W 20 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Package Outline and Package Dimensions (8-pin DFN 2x2mm, 0.5mm pitch) Package dimensions are kept current with JEDEC Publication No. 95, Symbol A A1 A3 b N ND NE D E e D2 E2 L aaa bbb ccc IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 6 Min Millimeters Max 0.80 1.00 0 0.05 0.20 Reference 0.20 0.30 8 4 0 2.00 BASIC 2.00 BASIC 0.50 BASIC 1.05 1.25 0.45 0.65 0.20 0.40 0.15 0.10 0.10 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters Inches* 8 Symbol E Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0.33 0.51 .013 .020 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0.25 0.50 .010 .020 L 0.40 1.27 .016 .050 α 0° 8° 0° 8° *For reference only. Controlling dimensions in mm. H INDEX AREA 1 2 D A h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER C 7 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature ICS621MI ICS621MIT ICS621MILF ICS621MILFT ICS621M ICS621MT ICS621MLF ICS621MLFT ICS621NLFT ICS621NILFT ICS621MI ICS621MI 621MILF 621MILF ICS621M ICS621M 621MLF 621MLF 621NLF 621NILF Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tape and Reel Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin DFN 8-pin DFN -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C 0 to +70°C -40 to +85°C Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 8 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Revision History Rev. Originator Date Description of Change A S. Sharma 06/08/06 New device/datasheet; Preliminary release. B S. Sharma 03/09/07 Removed Tape and Reel part number from DFN package ordering info. IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER 9 ICS621 REV B 030907 ICS621 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 408-284-4522 [email protected] Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA