AOS Semiconductor Product Reliability Report AO4452, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO4452. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4452 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: TM The AO4452 is fabricated with SDMOS trench technology that combines excellent RDS(ON) with low gate charge. The result is outstanding efficiency with controlled switching behavior. This universal technology is well suited for PWM, load switching and general purpose applications. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO4452 Standard sub-micron Middle voltage N channel Package Type 8 lead SOIC Lead Frame Cu Die Attach Epoxy Bonding Wire Au & Cu Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO4452 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB - 29 lots 3575pcs 0 JESD22A113 Temp = 150 °c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 6 lots 30 lots 2 lots 2926pcs 0 JESD22A108 HTRB Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs (Note A*) 7 lots 27lots 77pcs / lot 2618pcs 0 JESD22A108 HAST 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs (Note A*) 16 lots 77pcs / lot 880pcs 0 JESD22A110 96 hrs (Note A*) 20 lots 55 pcs / lot 1100pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 29 lots 55 pcs / lot 1595pcs 0 JESD22A104 (Note A*) 55 pcs / lot Pressure Pot Temperature Cycle Standard Note A: The reliability data presents total of available family data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 1.41 MTTF = 81007 years The sample size presented in FIT rate calculation of AO4452 is total of the available family data up to the published date. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2 x (13x77x168+57x77x500+2x77x1000) x 258] = 1.41 9 8 MTTF = 10 / FIT = 7.10 x 10 hrs = 81007 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 K = Boltzmann’s constant, 8.617164 X 10-5eV / K