` AOS Semiconductor Product Reliability Report AON4703/AON4703L, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 10 Jan, 2006 1 This AOS product reliability report summarizes the qualification result for AON4703. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AON4703 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AON4703 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. A Schottky diode is provided to facilitate the implementation of a bidirectional blocking switch, or for DC-DC conversion applications. Standard Product AON4703 is Pb-free (meets ROHS & Sony 259 specifications). AON4703L is a Green Product ordering option. AON4703 and AON4703L are electrically identical. Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol MOSFET Schottky Units Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±8 V Continuous Drain Current TA=25°C -3.4 ID -2.7 Pulsed Drain Current IDM -15 Schottky reverse voltage VKA Continuous Forward Current TA=70°C TA=25°C TA=70°C A 1.9 IF TA=25°C Power Dissipation TA=70°C Junction and Storage Temperature Range 7 PD TJ, TSTG Parameter: Thermal Characteristics MOSFET Maximum Junction-toT ≤ 10s Ambient Maximum Junction-toSteadyAmbient State SteadyMaximum Junction-to-Lead State A 1.2 IFM Pulsed Forward Current V 20 Symbol RθJA RθJC 1.7 0.96 1.1 0.62 -55 to 150 -55 to 150 W °C Typ Max Units 51 75 °C/W 88 110 °C/W 28 35 °C/W 2 Thermal Characteristics Schottky Maximum Junction-toT ≤ 10s Ambient Maximum Junction-toSteadyAmbient State SteadyMaximum Junction-to-Lead State Symbol RθJA RθJC Typ Max Units 66 80 °C/W 95 130 °C/W 40 50 °C/W II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level AON4703 AON4703L (Green Compound) Standard sub-micron Standard sub-micron Low voltage P channel process Low voltage P channel process DFN 3X2 DFN 3X2 Copper with Ag spot Copper with Ag spot Ag epoxy Ag epoxy Au 2mils Au 2 mils Epoxy resin with silica filler Epoxy resin with silica filler 100/0 90/10 UL-94 V-0 UL-94 V-0 Ti / Ni / Ag Ti / Ni / Ag Up to Level 1 * Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AON4703 (Standard) & AON4703L (Green) Test Item Test Condition Time Point Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow @260°c Temp = 150°c , Vgs=100% of Vgsmax 0hr HTGB HTRB HAST Pressure Pot Temperature Cycle Temp = 150°c , Vds=80% of Vdsmax 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% -65°c to 150°c , air to air, Lot Attribution Number of Failures 1760 pcs 0 (Note B**) 6 lots 492 pcs 0 1000 hrs (Note A*) 77+5 pcs / lot 168 / 500 hrs 1000 hrs 6 lots 168 / 500 hrs 100 hrs 96 hrs 250 / 500 cycles Standard: 3 lots Green: 9 lots Total Sample size (Note A*) Standard: 3 lots Green: 7 lots (Note B**) Standard: 3 lots Green: 8 lots (Note B**) Standard: 2 lots Green: 9 lot (Note B**) 492 pcs 0 77+5 pcs / lot 550 pcs 0 50+5 pcs / lot 605 pcs 0 50+5 pcs / lot 605 pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AON4703 (Standard) & AON4703L (Green) Continued Internal Vision Cross-section X-ray DPA CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Die shear 150°c 0hr 10 10 0 Note A: The HTGB and HTRB reliability data presents total of available AON4703 and AON4703L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AON4703 and AON4703L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 16 MTTF = 7134 years In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AON4703). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (5×164) (168) (258) + 2 (164) (500) (258)] = 16 9 MTTF = 10 / FIT = 6.25 x 107hrs = 7134 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tjs = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tju =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV/K 4 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D 5