AOS Semiconductor Product Reliability Report AON2701/AON2701L, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Jul 8, 2008 1 This AOS product reliability report summarizes the qualification result for AON2701. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AON2701 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AON2701/L uses advanced trench technology to provide excellent RDS(ON) and low gate charge. A Schottky diode is provided to facilitate the implementation of a bidirectional blocking switch, or for DC-DC conversion applications. AON2701 and AON2701L are electrically identical. -RoHS Compliant -AON2701L is Halogen Free Absolute Maximum Ratings TA=25°C unless otherwise noted Units Parameter Symbol MOSFET Schottky Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±8 V Continuous Drain Current TA=25°C -3 ID -2.3 Pulsed Drain Current IDM -15 Schottky reverse voltage VKA Continuous Forward Current A TA=70°C TA=70°C TA=25°C Power Dissipation TA=70°C Junction and Storage Temperature Range V 20 TA=25°C Pulsed Forward Current 2.5 IF 1.5 IFM 15 PD TJ, TSTG Parameter: Thermal Characteristics MOSFET Maximum Junction-toAmbient Maximum Junction-toAmbient A Symbol T ≤ 10s SteadyState RθJA A 1.5 1.45 0.95 0.92 -55 to 150 -55 to 150 W °C Typ Max Units 35 45 °C/W 65 85 °C/W 36 47 °C/W 67 87 °C/W Parameter: Thermal Characteristics Schottky Maximum Junction-toAmbient Maximum Junction-toAmbient T ≤ 10s SteadyState RθJA 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level AON2701 AON2701L (Green Compound) Standard sub-micron Low voltage P channel process DFN 2×2_6L Cu194, NiPdAu Ag epoxy Au 2mils Epoxy resin with silica filler 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Standard sub-micron Low voltage P channel process DFN 2×2_6L Cu194, NiPdAu Ag epoxy Au 2 mils Epoxy resin with silica filler 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AON2701 (Standard) & AON2701L (Green) Test Item Test Condition Time Point Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow @260°c Temp = 150°c , Vgs=100% of Vgsmax 0hr HTGB 168 / 500 hrs 1000 hrs HTRB Temp = 150°c , Vds=80% of Vdsmax 168 / 500 hrs 1000 hrs HAST Pressure Pot Temperature Cycle 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, 100%RH -65°c to 150°c , air to air Lot Attribution Standard: 2 lots Green: 3 lots (Note B**) 1 lot (Note A*) 1 lot 100 hrs (Note A*) Standard: 1 lots Green: 3 lots 96 hrs (Note B**) Standard: 2 lots Green: 3 lots 250 / 500 cycles (Note B**) Standard: 2 lots Green: 3 lot (Note B**) Total Sample size Number of Failures 1040 pcs 0 82 pcs 0 77+5 pcs / lot 82 pcs 0 77+5 pcs / lot 220 pcs 0 50+5 pcs / lot 410 pcs 0 77+5 pcs / lot 410 pcs 0 77+5 pcs / lot 3 III. Result of Reliability Stress for AON2701 (Standard) & AON2701 L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AON2701 and AON2701L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AON2701 and AON2701L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 128 MTTF = 891 years In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AON2701). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (164) (168) (258)] = 128 MTTF = 109 / FIT = 7.81 x 106hrs =891 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tjs = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tju =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV/K 4 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D 5