AOS Semiconductor Product Reliability Report AO4413, rev E Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO4413. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4413 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO4413 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low gate charge with a 25V gate rating. This device is suitable for use as a load switch or in PWM applications. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO4413 Standard sub-micron 30V P-Channel MOSFET Package Type SO8 Lead Frame Cu Die Attach Ag epoxy Bonding Cu wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Note * based on information provided by assembler and mold compound supplier Process III. Result of Reliability Stress for AO4413 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c - HTGB Temp = 150 c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs Lot Attribution Total Sample size Number of Failures 33 lots 5489pcs 0 JESD22A113 1001pcs 0 JESD22A108 0 JESD22A108 1100pcs 0 JESD22A110 8 lot 5 lot (Note A*) Standard 77pcs / lot Temp = 150 c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs HAST 130c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs 20 lots Pressure Pot 121c, 29.7psi, RH=100% 96 hrs (Note A*) 24lots 55 pcs / lot 1848pcs 0 JESD22A102 Temperature Cycle -65c to 150c, air to air 250 / 500 cycles (Note A*) 33 lots 77 pcs / lot 2541pcs 0 JESD22A104 (Note A*) 77 pcs / lot HTRB 1001pcs 8 lot 5 lot (Note A*) 77pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3 MTTF = 44613 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO4413). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2 x (16x77x500 +10x77x1000) x 258] = 3 9 8 MTTF = 10 / FIT = 3.91 x 10 hrs = 44613 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K