LD-603 Series LED displays Flat displays LD-603 Series !External Dimensions (Units : mm) The LD-603 series were designed in response to the need for large, flat displays. These are two-chip, flat displays with high luminance. 15.0 0.6 Pin No.1 2 3 (2.5) (2.5) Pin No.1 6.7±0.5 (0.7) Cathode mark 0.6 5.6±0.2 0.3 6.8±0.2 8.0 !Features 1) 6.8×13.8mm planar emission from two chips connected in series. 2) High luminance, uniform planar emission 3) Thin outer casing, multiple units can be coupled together. 4) Four colors are available : red, orange, yellow and green. (1.8) 13.8±0.2 2 3 Tolerances are ±0.3 unless otherwise noted : !Selection guide Emitting color Type Red Orange Yellow Green LD-603VR LD-603DU ∗ LD-603YY ∗ LD-603MG ∗ Order-based production. !Absolute maximum ratings (Ta=25°C) Parameter Symbol Green LD-603MG Unit Power dissipation PD 120 120 120 150 mW Forward current Red LD-603VR Orange LD-603DU Yellow LD-603YY IF 20 20 20 25 mA Peak forward current IFP 60∗ 60∗ 60∗ 60∗ mA Reverse voltage VR 3 3 3 3 V Operating temperature Topr −25∼+75 ˚C Storage temperature Tstg −30∼+85 ˚C ∗ Pulse width 1ms duty 1 / 5 LD-603 Series LED displays !Electrical and optical characteristics (Ta=25°C) Parameter Red Symbol Conditions Orange Yellow Green Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Forward voltage VF IF=10mA − 4.0 5.6 − 4.0 5.6 − 4.2 5.6 − 4.2 5.6 V Reverse current IR VR=3V − − 10 − − 10 − − 10 − − 10 µA Peak wavelength λP IF=10mA − 650 − − 610 − − 585 − − 563 − nm Spectral line half width ∆λ IF=10mA − 40 − − 40 − − 40 − − 40 − nm Electrical and optical are guaranteed values per element. !Luminous intensity vs. wavelength Axial Luminous Intensity 1.0 0.8 Green Yellow Red Orange 0.6 0.4 0.2 0 500 550 600 650 700 750 Wavelength : λP (nm) !Luminous intensity Type Min. Typ. Max. Unit Red LD-603VR 1.4 4.0 − mcd Orange LD-603DU 2.2 6.3 − mcd Yellow LD-603YY 2.2 6.3 − mcd Green LD-603MG 2.2 6.3 − mcd Color Note 1: Measured at IF = 10mA Note 2: Current passes through 2 elements. !Operation notes When forming leads, the bend should be at least 2 mm from the base of the package. Solder after forming the leads, and ensure that the inside of the LED is not subjected to mechanical stress while it is hot.