DESIGN GUIDE Version 1.0 | June 2016 Embedded Component Technology Design Guide Embedded Component Technology The future of electronics is tending towards higher reliability, more functionality and increasing miniaturisation. The efficient use of ever smaller housing volumes and tiny surfaces is gaining in importance. ECT (Embedded Component Technology) serves as a solution for reduced spaces. The fields of application range from the automotive industry to industrial electronics to medical technology and to sensor technology. In an embedding process, active or passive components are positioned in the stack up so that they are completely integrated into its construction. Würth Elektronik distinguishes between two manufacturing processes: ECT Microvia and ECT Flip-Chip. Indicators Below is an overview on the subject of “Embedded Component Technology” and practical tips for design: for the choice of technology comparison Availability of components Design Rules Technology The advantages of ECT at a glance: Miniaturisation Housing replacement Saving of assembly space on the exterior PCB layers Function Integrated Short Protection against environmental influences signal paths Protection Fully encapsulated and supported components against plagiarism Thermal management Indicators for the use of ECT Microvia Indicators for the use of ECT Flip-Chip Combination Active of active and passive components Highly reliable assembly and packaging technology Metallisation of contact area with copper or nickel-palladium 2 shielding Reliability www.we-online.com components, which were previously wire-bonded No passive components possible Active components with pitch < 250 µm Technology comparison ECT Microvia and ECT Flip-Chip ECT Microvia Version 1 ECT Microvia Version 2 ECT Flip-Chip 1 1 1 2 2 1.2 3 3 3 4 4 1.4 5 5 5 1 Cu foil as starting substrate 2 Assembly (face-down) on Cu foil with non-conductive adhesive (NCA) 3 1 2 Assembly (face-up) on core with conductive (ICA) or non-conductive adhesive (NCA) Multilayer lamination 4 Opening of the chip metallisation with laser 5 E lectrical connection between chip and PCB via copper metallisation process Structured core 3 Multilayer lamination 4 Opening of the chip metallisation with laser 1 Structured core with footprint for Flip-Chip 2 Flip-Chip assembly by means of ACA adhesive (anisotropic conductive adhesive) 3 Multilayer lamination 4 + 5 Depending on customer request, additional circuit board processes 5 Electrical connection between chip and PCB via copper metallisation process 3 Availability of components According to the customer´s requirements, the passive components with copper termination will be directly sourced through Würth Elektronik. Construction: 0402, thickness of 150 µm to 300 µm Resistors 150 µm Capacitors 300 µm 300 µm 150 µm Silicon chips with process-compatible metallisation are provided by customer. ECT Microvia metallisation on the pad NiPd metallisation on the pad ECT Flip-Chip Cu Wire-bonded Au stud-bumps Au bumps applied on wafer level ECT- Via 100 µm Design Rules ECT- Via ECT Microvia ECT Flip-Chip distance pad / pad ≥ 75 μm pad Ø 175 µm distance to next component ≥ 300 μm distance to next component ≥ 500 μm end Ø 70 μm dielectric thickness 20 - 25 μm component height ≥ 150 μm (< 150 μm on request) pad Ø 125 µm dielectric thickness ≥ 50 μm pitch ≥ 250 μm dielectric thickness ≥ 50 µm pad metallisation ≥ 6 μm Cu or ≥ 5 μm Ni + flash Pd embedded component ≤ 5 mm x 5 mm pitch ≥ 100 μm backside contact (Microvia or ICA) on request pad distance ≥ 50 µm pad / pad ≥ 50 µm ! For further information on the subject of embedding please visit our website at www.we-online.com/ect embedded flip-chip ≤ 5 mm x 5 mm adhesive ACA / NCA / ESC (encapsulated solder connection) ECT-Flip Chip Würth Elektronik GmbH & Co. KG · Circuit Board Technology · Salzstr. 21 · 74676 Niedernhall · Germany · Tel: +49 7940 946-0 · [email protected] 4 www.we-online.com component height ≥ 150 µm