Webinar HDI Microvia Technology – Cost Aspects www.we-online.com HDI - Cost Aspects Seite 1 1 July, 2014 Agenda - Webinar HDI Microvia Technology – Cost Aspects • Reasons for the use of HDI technology • • • • Printed circuit board (PCB) size Number of layers Stack-up and complexity Other important cost influences – Design rules – Drilling costs – Microvia filling www.we-online.com HDI - Cost Aspects Seite 2 Stefan Keller Product Manager 1 July, 2014 HDI Microvia Technology – why? 1. Complexity of the components in particular BGA pitches 0.65 mm and less require HDI Pitch 0,8 mm / PTH Via Pad Ø 0.50 mm Microvia Design Rules: > HDI Design Guide and HDI webinars www.we-online.com/online-design-conference www.we-online.com HDI - Cost Aspects Seite 3 1 July, 2014 HDI Microvia Technology – why? 2. Reliability / Aspect Ratio ASR 6:1 – 8:1 (PCB thickness / Ø ) Minimum drill tool diameter 0.30 mm / 0.25 mm Final customer reliability requirements? IPC class 2 or IPC class 3 Cl. 3 ≥ 50 µm >> Often the better solution: HDI microvia instead of PTH Microvia ≈ 0.30 mm pad size / 0.10 mm Ø www.we-online.com HDI - Cost Aspects Seite 4 1 July, 2014 Produkte HDI Microvia Technology – why? 3. Miniaturisation Market requirements size of the device + PCB size Other examples: - embedded computer - medical technology - industrial cameras Other approaches / cost pressure: • double sided assembly on the whole surface • functional separation of top and bottom side • Smaller or one PCB instead of two www.we-online.com HDI - Cost Aspects Seite 5 1 July, 2014 Produkte HDI Microvia Technology – why? Survey: Why do you use HDI Technology? – – – – Multiple answers possible www.we-online.com HDI - Cost Aspects Seite 6 Routing Fine Pitch BGAs Higher reliability Miniaturisation in general Other reasons 1 July, 2014 Produkte HDI Microvia Technology – but: www.we-online.com HDI - Cost Aspects Seite 7 1 July, 2014 Produkte HDI – Cost Aspect PCB Size PCB size ≈ size of the device > could be essential for a successful product! Number of layers / stack-up Semi (FR4)- flex Printed resistors on innerlayers Microvia Buried Via Avoidance of PTH vias! HDI Technology Microvias + Buried Vias www.we-online.com HDI - Cost Aspects Seite 8 1 July, 2014 HDI – Cost Aspect PCB Size QFP 0.40 mm pitch Pad- 300 µm solder pad 200 µm max. 230 µm www.we-online.com HDI - Cost Aspects 0,400 mm pitch Seite 9 1 July, 2014 Produkte HDI – Cost Aspect Number of Layers BGA – pitch 0.80 mm 20 x 20 = 400 pins Design Study How many signal layers are needed? www.we-online.com HDI - Cost Aspects o With PTH – vias (only plated through hole vias) o With Microvias (HDI) Seite 10 1 July, 2014 Produkte HDI – Cost Aspect Number of Layers BGA – Pitch 0.80 mm 20 x 20 = 400 Pins Design Study Microvia PTH How many signal layers are needed? How many signal layers are needed? www.we-online.com HDI - Cost Aspects Seite 11 1 July, 2014 HDI – Cost Aspect Stack-up If the PCB size is fixed: Recommendation: stack-up only as complex as necessary - Number of layers Number of lamiations / pressing processes / manufacturing processes www.we-online.com HDI - Cost Aspects Seite 12 1 July, 2014 HDI – Cost Aspect Complexity HDI08 3 sequential pressings Costs 200 % 2 sequential pressings Single 175 % 150 % pressing Additional inner layer microvias 142 % Buried vias mech. drilled 120 % 115 % Laser drilling layer 1 to 3 2. 2. 1. 1. 2+4+2 2+4+2 100 % 1. 2. 2 + 4(6b) + 2 1 + 6b + 1 Inner layer microvias (staggered) 2 + 4b + 2 1. 2. 2. 1. 100 % 1+6+1 1. Complexity www.we-online.com HDI - Cost Aspects Seite 13 1 July, 2014 3. HDI – Cost Aspect Complexity HDI08 What are the costs for a 8-layer multilayer without microvias? 2 sequential Costs 200 % Single 142 % pressing Buried vias mech. drilled 120 % Laser drilling layer 1 to 3 2 + 4(6b) + 2 2. 1. 2. 1. 2+4+2 2+4+2 100 % Additional inner layer microvias 1 + 6b + 1 Inner layer microvias (staggered) 115 % 100 % 150 % pressings 1. 2. 2. 1. 90 - 95 % 1+6+1 ML08 1. 1. Complexity www.we-online.com HDI - Cost Aspects Seite 14 1 July, 2014 HDI – Cost Aspects Stack-up and Complexity HDI08_1 + 6 + 1 ML08 1. 1. + eurocard 100 x 160 mm / 200 boards 1000 boards: ≈ 0.50 € www.we-online.com HDI - Cost Aspects Seite 15 1 July, 2014 HDI – Cost Aspect Technology Microvias stacked Microvias 0,40 mm BGA pitch staggered Filling ? www.we-online.com HDI - Cost Aspects Seite 16 1 July, 2014 HDI – Cost Aspect Design Rules www.we-online.com HDI - Cost Aspects Seite 17 1 July, 2014 HDI – Cost Aspect Design Rules • BGA pitch ≤ 0.80 mm • 90 µm track width often uncritical • Fine line structures 75 µm usually only for 0.50 mm pitch BGAs absolutely necessary www.we-online.com HDI - Cost Aspects Seite 18 1 July, 2014 HDI – Cost Aspect Design Rules 0.50 mm pitch BGA 0,650 mm pitch 75 µm fine line structures in any case on the inner layers outer layers: different options BGA pad 350 µm track width 100 µm clearance solder mask 50 / 62,5 µm www.we-online.com HDI - Cost Aspects Seite 19 1 July, 2014 HDI – Cost Aspect Drilling Costs Costs Ø 200 µm (1 € / drill bit) Endurance: 1000 holes Frequency: 3 / s Ø 200 µm Ø 300 µm Ø 300 µm (0,60 € / drill bit) Endurance: 2000 holes Frequency: max. 8 / s fix costs laser drilling (Acquisition) fix costs mechanical drilling Microvia: Number of Holes www.we-online.com HDI - Cost Aspects Seite 20 Ø 125 µm (0,0 € / Microvia) Frequency: 150 – 180 / s 1 July, 2014 HDI – Cost Aspect Microvia Filling IPC-7095C: „max. 22% of the image diameter“ The appearance of voids depends on: Flux, solder paste Temperature profil ….. Extra charge!! Filling? Customer / EMS have to decide for themselves which variant could be used! www.we-online.com HDI - Cost Aspects Seite 21 1 July, 2014 HDI – other Cost Aspects High speed / signal integrity Version 1: PTH Version 2: Microvia / Buried Via HDI Technology instead of expensive high frequency material “open ended antennas” Made in Germany Technical advice and support, Product Management, local sales representatives and engineering Workshops Design Conferences www.we-online.com Impedance calculations DFM Design Rules HDI - Cost Aspects Stack-ups Metallurgic analyses Seite 22 1 July, 2014 HDI – Cost Aspects Summary • Components • Total complexity • Reliability requirements Determine which PCB Technology should be utilised • PCB size • Build-up • • Drilling costs Design Rules Are the determining cost factors and they could be decisively influenced by HDI technology The relationships should be considered Miniaturisation is really possible only with HDI technology www.we-online.com HDI - Cost Aspects Seite 23 1 July, 2014 Produkte HDI Cost Aspects www.we-online.com HDI - Cost Aspects Seite 24 1 July, 2014 Knowing the relationships - is a secret of success! We are looking forward to good cooperation! Stefan Keller Product Manager [email protected] www.we-online.com HDI - Cost Aspects Seite 25 1 July, 2014