Product Data Sheet SAW8A32D – Acrich MJT 3528 Mid-Power LED - 3528 Series SAW8A32D (Cool, Neutral, Warm) RoHS Product Brief Description Features and Benefits • This White Colored surface-mount LED comes in standard package dimension. Package Size: 3.5x2.8x0.7mm • • • • It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. • The die is attached within the reflector cavity and the cavity is encapsulated by silicone. • Market Standard 3528 Package Size High Color Quality, CRI Min. 80 RoHS compliant Key Applications • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability. Interior lighting General lighting Indoor and outdoor displays Architectural / Decorative lighting Table 1. Product Selection Table CCT Part Number Color Min. Typ. Max. SAW8A32D Cool White 4700K 5600K 7000K SAW8A32D Neutral White 3700K 4000K 4700K SAW8A32D Warm White 2600K 3000K 3700K Rev1.1, Jun 20, 2016 1 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Color Bin Structure 11 • Mechanical Dimensions 16 • Recommended Solder Pad 17 • Reflow Soldering Characteristics 18 • Emitter Tape & Reel Packaging 19 • Product Nomenclature 21 • Handling of Silicone Resin for LEDs 22 • Precaution For Use 23 • Company Information 26 Rev1.1, Jun 20, 2016 2 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Product Nomenclature Table 2. Product Selection Guide, IF = 60mA, Tj = 25ºC, RH30% CCT (K) [1] Part Number Luminous Intensity [2] Luminous Flux [3] CRI IV (cd) ФV (lm) Ra RANK Typ. Min Max Min Max Min. K22 22.0 23.0 68.2 71.3 80 K23 23.0 24.0 71.3 74.4 80 K22 22.0 23.0 68.2 71.3 80 K23 23.0 24.0 71.3 74.4 80 K24 24.0 26.0 74.4 80.6 80 K22 22.0 23.0 68.2 71.3 80 K23 23.0 24.0 71.3 74.4 80 K24 24.0 26.0 74.4 80.6 80 K22 22.0 23.0 67.1 70.2 80 K23 23.0 24.0 70.2 73.2 80 K24 24.0 26.0 73.2 79.3 80 K22 22.0 23.0 67.1 70.2 80 K23 23.0 24.0 70.2 73.2 80 K24 24.0 26.0 73.2 79.3 80 K22 22.0 23.0 66.0 69.0 80 K23 23.0 24.0 69.0 72.0 80 K24 24.0 26.0 72.0 75.0 80 K22 22.0 23.0 66.0 69.0 80 K23 23.0 24.0 69.0 72.0 80 K22 22.0 23.0 66.0 69.0 80 K23 23.0 24.0 69.0 72.0 80 6500 5600 5000 4500 SAW8A32D 4000 3500 3000 2700 Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. (2) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. (3) The lumen table is only for reference. Rev1.1, Jun 20, 2016 3 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Performance Characteristics Table 3. Characteristics, IF=60mA, Tj= 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 60 120 mA Forward Voltage VF - 9.1 10.0 V Luminous Intensity[1] (2,700K)[2] Iv - 23.0 - cd CRI [3] Ra 80 83 90 Viewing Angle 2Θ1/2 - 120 - Deg. Storage Temperature Tstg - 40 - + 85 ºC Thermal resistance (J to S) [4] RθJ-S - 20 - ℃/W ESD Sensitivity(HBM) - 12 Table 4. Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 120 mA Power Dissipation PD 1.16 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ + 85 ºC Storage Temperature Tstg -40 ~ + 100 ºC Notes : (1) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. (2) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT 5% tolerance. (3) Tolerance is 2.0 on CRI measurements. (4) Thermal resistance is junction to Solder. (5) IFP conditions with pulse width ≤10ms and duty cycle ≤10% (6) The products are sensitive to static electricity and must be carefully taken when handling products • Calculated performance values are for reference only. • All measurements were made under the standardized environment of Seoul Semiconductor. Rev1.1, Jun 20, 2016 4 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 1. Color Spectrum, Tj = 25ºC, IF=60mA 2600~3700K 4700~7000K Relative Emission Intensity 1.0 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] Fig 2. Radiant Pattern, Tj = 25ºC, IF=60mA Relative Intensity (%) 100 80 60 40 20 0 -100 -75 -50 -25 0 25 50 75 100 Angle [Degree] Rev1.1, Jun 20, 2016 5 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC IF[A] 0.10 0.05 0.00 5 6 7 8 9 10 VF[V] Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC 1.8 Relative Luminous Intensity 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 Forward Current IF [mA] Rev1.1, Jun 20, 2016 6 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 5. Forward Current vs. CIE X,Y Shift, Tj = 25ºC (2600~3700K) 0.422 0.420 y 120mA 60mA 100mA 0.418 32mA 0.416 0.465 0.466 0.467 0.468 0.469 0.470 0.471 0.472 0.473 0.474 0.475 x (4700~7000K) 0.3650 0.3645 60mA 0.3640 32mA 100mA 0.3635 y 0.3630 0.3625 120mA 0.3620 0.3615 0.3610 0.3605 0.3600 0.350 0.351 0.352 0.353 0.354 0.355 x Rev1.1, Jun 20, 2016 7 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 6. Junction Temperature vs. Relative Luminous Intensity, IF=60mA 1.0 Relative Luminous Intensity 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Junction temperature Tj( C) Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=60mA 1.0 Relative Forward Voltage 0.8 0.6 0.4 0.2 0.0 30 45 60 75 90 105 120 O Junction temperature Tj( C) Rev1.1, Jun 20, 2016 8 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF=100mA (2600~3700K) 0.430 0.425 y 0.420 25 0.415 120 100 80 0.410 0.405 0.400 0.450 0.455 0.460 0.465 0.470 0.475 0.480 x (4700~7000K) 0.400 0.395 0.390 0.385 0.380 y 0.375 25 0.370 0.365 0.360 80 100 120 0.355 0.350 0.345 0.340 0.330 0.335 0.340 0.345 0.350 0.355 0.360 0.365 0.370 0.375 0.380 x Rev1.1, Jun 20, 2016 9 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Characteristics Graph Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃ Forward Current IF [mA] 150 100 50 0 -40 -20 0 20 40 60 80 100 O Ambient Temperature TA [ C] Rev1.1, Jun 20, 2016 10 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Color Bin Structure Table 5. Bin Code description, Tj=25℃, IF=60mA Luminous Intensity (cd) Part Number SAW8A32D Bin Code Min. Max. K22 22.0 K23 K24 Color Chromaticity Coordinate Typical Forward Voltage (V) Bin Code Min. Max. 23.0 F0 9.1 9.4 23.0 24.0 F1 9.4 9.7 24.0 26.0 F2 9.7 10.0 Available ranks Table 6. Intensity rank distribution CCT CIE IV Rank 6,000 ~ 7,000K A K22 K23 K24 5,300 – 6,000K B K22 K23 K24 4,700 ~ 5,300K C K22 K23 K24 4,200 ~ 4,700K D K22 K23 K24 3,700 ~ 4,200K E K22 K23 K24 3,200 ~ 3,700K F K22 K23 K24 2,900 ~ 3,200K G K22 K23 K24 2,600 ~ 2,900K H K22 K23 K24 *Notes : (1) Calculated performance values are for reference only. • All measurements were made under the standardized environment of Seoul Semiconductor. In order to ensure availability, single color rank will not be orderable. Rev1.1, Jun 20, 2016 11 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Color Bin Structure CIE Chromaticity Diagram Tj=25℃, IF=60mA CG CH CF CE CD CC CB CA *Notes : • Energy Star binning applied to all 2600~7000K. • Measurement Uncertainty of the Color Coordinates : ± 0.005 Rev1.1, Jun 20, 2016 12 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Color Bin Structure CIE Chromaticity Diagram Tj=25℃, IF=60mA 4700k 5000k CC22 5300k CC21 5600k CC11 CB22 6000k CC24 CB21 6500k CB11 CA22 CC23 CB24 7000k CA21 CA11 CA24 CB23 CA23 CA10 CA11 CA21 CA22 CA23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3087 0.3292 0.3080 0.3299 0.3028 0.3304 0.3115 0.3393 0.3048 0.3209 0.3162 0.3365 0.3166 0.3384 0.3115 0.3393 0.3205 0.3481 0.3131 0.3290 0.3171 0.3285 0.3178 0.3277 0.3131 0.3290 0.3213 0.3371 0.3146 0.3187 0.3101 0.3216 0.3098 0.3200 0.3048 0.3209 0.3131 0.3290 0.3068 0.3113 CA24 CB10 CB11 CB21 CB22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3131 0.3290 0.3257 0.3435 0.3252 0.3444 0.3207 0.3462 0.3292 0.3539 0.3213 0.3371 0.3328 0.3498 0.3333 0.3518 0.3292 0.3539 0.3376 0.3616 0.3221 0.3261 0.3326 0.3406 0.3331 0.3398 0.3293 0.3423 0.3371 0.3493 0.3146 0.3187 0.3260 0.3347 0.3256 0.3331 0.3215 0.3353 0.3293 0.3423 CB23 CB24 CC10 CC11 CC21 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3215 0.3353 0.3293 0.3423 0.3420 0.3579 0.3415 0.3588 0.3376 0.3616 0.3293 0.3423 0.3371 0.3493 0.3492 0.3637 0.3499 0.3657 0.3463 0.3687 0.3294 0.3306 0.3366 0.3369 0.3481 0.3536 0.3484 0.3524 0.3452 0.3557 0.3222 0.3243 0.3294 0.3306 0.3414 0.3483 0.3407 0.3461 0.3371 CC22 CC23 CC24 B24 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3463 0.3687 0.3371 0.3492 0.3451 0.3557 0.3551 0.3760 0.3451 0.3557 0.3532 0.3623 0.3532 0.3623 0.3440 0.3427 0.3514 0.3487 0.3451 0.3557 0.3366 0.3369 0.3440 0.3428 Rev1.1, Jun 20, 2016 13 0.3493 B24 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Color Bin Structure CIE Chromaticity Diagram Tj=25℃, IF=60mA 3700k 4000k CE22 4200k CE21 4500k CE11 CD22 4700k CE24 CD21 CE23 CD11 CD24 CD23 CD10 CD11 CD21 CD22 CD23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3589 0.3685 0.3560 0.3557 0.3528 0.3599 0.3641 0.3805 0.3530 0.3601 0.3665 0.3742 0.3580 0.3697 0.3548 0.3736 0.3736 0.3874 0.3616 0.3663 0.3637 0.3622 0.3681 0.3771 0.3641 0.3805 0.3703 0.3726 0.3590 0.3521 0.3573 0.3579 0.3645 0.3618 0.3616 0.3663 0.3616 0.3663 0.3511 0.3465 CD24 CE10 CE11 CE21 CE22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3616 0.3663 0.3764 0.3713 0.3746 0.3689 0.3703 0.3726 0.3828 0.3803 0.3703 0.3726 0.3793 0.3828 0.3784 0.3841 0.3736 0.3874 0.3871 0.3959 0.3670 0.3578 0.3890 0.3887 0.3914 0.3922 0.3871 0.3959 0.4006 0.4044 0.3590 0.3521 0.3854 0.3768 0.3865 0.3762 0.3828 0.3803 0.3952 0.3880 CE23 CE24 CIE X CIE Y CIE X CIE Y 0.3670 0.3578 0.3784 0.3647 0.3703 0.3726 0.3828 0.3803 0.3828 0.3803 0.3952 0.3880 0.3784 0.3647 0.3898 0.3716 Rev1.1, Jun 20, 2016 14 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Color Bin Structure CIE Chromaticity Diagram Tj=25℃, IF=60mA 2600k 2700k 2900k 3000k 3200k CH21 CH22 CG22 CG21 3500k CH11 CF22 3700k CG11 CF21 CH24 CH23 CG24 CF11 CG23 CF24 CF23 CF10 CF11 CF21 CF22 CF23 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4006 0.3829 0.3981 0.3800 0.3996 0.4015 0.4146 0.4089 0.3943 0.3853 0.4051 0.3954 0.4040 0.3966 0.4146 0.4089 0.4299 0.4165 0.4082 0.3920 0.4159 0.4007 0.4186 0.4037 0.4082 0.3920 0.4223 0.3990 0.4017 0.3751 0.4108 0.3878 0.4116 0.3865 0.3943 0.3853 0.4082 0.3920 0.3889 0.3690 CF24 CG10 CG11 CG21 CG22 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4082 0.3920 0.4267 0.3946 0.4243 0.3922 0.4299 0.4165 0.4430 0.4212 0.4223 0.3990 0.4328 0.4079 0.4324 0.4100 0.4430 0.4212 0.4562 0.4260 0.4147 0.3814 0.4422 0.4113 0.4451 0.4145 0.4345 0.4033 0.4468 0.4077 0.4017 0.3751 0.4355 0.3977 0.4361 0.3964 0.4223 0.3990 0.4345 0.4033 CG23 CG24 CH10 CH11 CH21 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4223 0.3990 0.4345 0.4033 0.4502 0.4020 0.4477 0.3998 0.4562 0.4260 0.4345 0.4033 0.4468 0.4077 0.4576 0.4158 0.4575 0.4182 0.4687 0.4289 0.4259 0.3853 0.4373 0.3893 0.4667 0.4180 0.4697 0.4211 0.4585 0.4104 0.4147 0.3814 0.4259 0.3853 0.4588 0.4041 0.4591 0.4025 0.4468 CH22 CH23 CH24 B24 CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.4687 0.4289 0.4468 0.4077 0.4585 0.4104 0.4813 0.4319 0.4585 0.4104 0.4703 0.4132 0.4703 0.4132 0.4483 0.3919 0.4593 0.3944 0.4585 0.4104 0.4373 0.3893 0.4483 0.3919 Rev1.1, Jun 20, 2016 15 0.4077 B24 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Mechanical Dimensions Bottom View Top View Cathode Mark Side View Circuit Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm Rev1.1, Jun 20, 2016 16 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only (4) Undefined tolerance is ±0.1mm (5) The appearance and specifications of the product may be changed for improvement without notice. Rev1.1, Jun 20, 2016 17 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Ts_max to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Ts_min) - Temperature Max (Ts_max) - Time (Ts_min to Ts_max) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution : (1) Reflow soldering is recommended not to be done more than two times In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev1.1, Jun 20, 2016 18 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Emitter Tape & Reel Packaging Notes : (1) Quantity : Max 4,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. (4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. Rev1.1, Jun 20, 2016 19 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box Rev1.1, Jun 20, 2016 20 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Product Nomenclature Table 7. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S X2 Top View LED series A X3 Color Specification W8 CRI 80 X4 Package series A A series X5X6 Characteristic code 32 X7 Version D Table 8. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.1, Jun 20, 2016 Lot Number 21 Value www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev1.1, Jun 20, 2016 22 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The maximum storage temperature range is 40℃ and a maximum humidity of RH90%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 30℃ Humidity : less than RH60% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. Rev1.1, Jun 20, 2016 23 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Precaution for Use (10) The appearance and specifications of the product may be modified for improvement without notice. (11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (13) Attaching LEDs, do not use adhesives that outgas organic vapor. (14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (15) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.1, Jun 20, 2016 24 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.1, Jun 20, 2016 25 www.seoulsemicon.com Product Data Sheet SAW8A32D – Acrich MJT 3528 Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.1, Jun 20, 2016 26 www.seoulsemicon.com