WICOP2 Z8Y15 Rev2.0(0)

Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
New Generation of WICOP
High-Power LED - Z8 Y15
SZ8-Y15-XX-XX (Cool, Neutral, Warm)
RoHS
Product Brief
Description
Features and Benefits
•
The WICOP2 series is designed for high
flux output applications with high current
operation capability.
•
Compact footprint(1.41x1.41mm)
enables system level cost saving
•
•
•
•
•
•
•
It incorporates state of the art SMD
design and low thermal resistant
material.
.
•
Designed for high current operation
Low Thermal Resistance
A wide CCT range of 2,600~7,000K
ANSI compliant Binning
RoHS compliant
Phosphor film directly attached to
chip surface
Key Applications
•
•
•
The WICOP2 is ideal light sources for
directional lighting applications such as
Spot Lights, various outdoor
applications, automotive lightings and
high performance torches .
Residential - Replacement lamps
Commercial/Industrial – Retail Display
Outdoor area - Flood/Street light, High Bay
Table 1. Product Selection Table
CCT
CRI
Part Number
Color
Min.
Max.
Min
SZ8-Y15-W0-C7
Cool White
4,700K
7,000K
70
SZ8-Y15-W0-C8
Cool White
4,700K
7,000K
80
SZ8-Y15-W0-C9
Cool White
4,700K
7,000K
90
SZ8-Y15-WN-C7
Neutral White
3,700K
4,700K
70
SZ8-Y15-WN-C8
Neutral White
3,700K
4,700K
80
SZ8-Y15-WN-C9
Neutral White
3,700K
4,700K
90
SZ8-Y15-WW-C7
Warm White
2,600K
3,700K
70
SZ8-Y15-WW-C8
Warm White
2,600K
3,700K
80
SZ8-Y15-WW-C9
Warm White
2,600K
3,700K
90
Rev2.0, Mar 22, 2016
1
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Table of Contents
Index
•
Product Brief
`
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
7
•
Color bin structure
12
•
Mechanical Dimensions
21
•
Material Structure
22
•
Reflow Soldering Characteristics
23
•
Emitter Tape & Reel Packaging
24
•
Handling of Silicone Resin for LEDs
26
•
Precaution For Use
27
•
Company Information
30
Rev2.0, Mar 22, 2016
2
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, IF = 350mA (CRI 70)
CCT [K] [1]
Min. Luminous Flux [2]
ФV [3] [lm]
Part Number
Min.
SZ8-Y15-W0-C7
SZ8-Y15-WN-C7
SZ8-Y15-WW-C7
4700
3700
2600
Max.
Min. Luminous Flux
ФV [3] [lm] @ 85 °C
[2]
Group
Flux
[lm]
@85 °C
Flux
[lm]
@25 °C
700mA
1.0A
W3
152
167
271
357
W2
142
156
254
335
W1
133
146
237
313
V3
125
137
223
294
W3
152
167
271
357
W2
142
156
254
335
W1
133
146
237
313
V3
125
137
223
294
V3
125
137
223
294
V2
116
128
208
274
V1
109
120
195
257
U3
102
112
182
240
7000
CRI [4],
Ra
Min.
70
4700
70
3700
70
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 2.0 on CRI measurements.
Rev2.0, Mar 22, 2016
3
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, IF = 350mA (CRI 80)
CCT [K] [1]
Min. Luminous Flux [2]
ФV [3] [lm]
Part Number
Min.
SZ8-Y15-W0-C8
SZ8-Y15-WN-C8
SZ8-Y15-WW-C8
4700
3700
2600
Max.
Min. Luminous Flux
ФV [3] [lm] @ 85 °C
[2]
Group
Flux
[lm]
@85 °C
Flux
[lm]
@25 °C
700mA
1.0A
W2
142
156
254
335
W1
133
146
237
313
V3
125
137
223
294
V2
116
128
208
274
W2
142
156
254
335
W1
133
146
237
313
V3
125
137
223
294
V2
116
128
208
274
V3
125
137
223
294
V2
116
128
208
274
V1
109
120
195
257
U3
102
112
182
240
7000
CRI [4],
Ra
Min.
80
4700
80
3700
80
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 2.0 on CRI measurements.
Rev2.0, Mar 22, 2016
4
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 2. Electro Optical Characteristics, IF = 350mA (CRI 90)
CCT [K] [1]
Min. Luminous Flux [2]
ФV [3] [lm]
Part Number
Min.
SZ8-Y15-W0-C9
SZ8-Y15-WN-C9
SZ8-Y15-WW-C9
4700
3700
2600
Max.
Min. Luminous Flux
ФV [3] [lm] @ 85 °C
[2]
Group
Flux
[lm]
@85 °C
Flux
[lm]
@25 °C
700mA
1.0A
V3
125
137
223
294
V2
116
128
208
274
V1
109
120
195
257
U3
102
112
182
240
V3
125
137
223
294
V2
116
128
208
274
V1
109
120
195
257
U3
102
112
182
240
V1
109
120
195
257
U3
102
112
182
240
U2
96
106
172
227
U1
89
98
160
211
7000
CRI [4],
Ra
Min.
90
4700
90
3700
90
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 2.0 on CRI measurements.
Rev2.0, Mar 22, 2016
5
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 3. Absolute Maximum Ratings
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current [1]
IF
-
-
1.0 [4]
1.2 [3]
A
Power Dissipation
PD
-
-
4.7
W
Junction Temperature
Tj
-
-
145
ºC
Operating Temperature
Topr
- 40
-
125
ºC
Storage Temperature
Tstg
- 40
-
125
ºC
Viewing angle
θ
Thermal resistance (J to S) [2]
140
degree
[3]
RθJ-S
6
7.5 [4]
-
ESD Sensitivity(HBM)
-
K/W
Class 2 JESD22-A114-E
Notes :
(1) At Junction Temperature 85℃ condition.
(2) RθJ-S is tested at 700mA.
(3) Using Metal PCB (Dielectric layer 5W/m·K and Cu pattern of 2oz).
(4) Using Metal PCB (Normal type).
•
Thermal resistance can be increased substantially depending on the heat sink design/operating
condition, and the maximum possible driving current will decrease accordingly.
Rev2.0, Mar 22, 2016
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Characteristics Graph
Fig 1. Color Spectrum
Cool white
Neutral white
Warm white
Relative Radiant Power [%]
100
80
60
40
20
0
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
Fig 2. Typical Spatial Distribution
110
Relative Luminous Intensity [%]
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement [degrees]
Rev2.0, Mar 22, 2016
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj=85℃
1.4
Forward Current [A]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, T j=85℃
160
Relative Luminous Flux [%]
140
120
100
80
60
40
20
0
0
100
200
300
400
500
600
700
800
900 1000 1100 1200
Forward Current [mA]
Rev2.0, Mar 22, 2016
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift
0.010
CIE X
CIE Y
0.008
0.006
0.004
0.002
0.000
-0.002
-0.004
-0.006
-0.008
0
100
200
300
400
500
600
700
800
900 1000 1100 1200
Forward Current [mA]
Fig 6. Junction Temp. vs. CIE X, Y Shift
0.008
CIE X
CIE Y
0.006
0.004
0.002
0.000
-0.002
-0.004
-0.006
-0.008
25
50
75
100
125
145
o
Junction Temperature [ C]
Rev2.0, Mar 22, 2016
9
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Characteristics Graph
Fig 7. Relative Light Output vs. Junction Temperature, IF=700mA
120
Relative luminous flux [%]
100
80
60
40
20
0
25
50
75
100
125
145
o
Junction Temperature [ C]
Fig 8. Relative Forward Voltage vs. Junction Temperature, IF=700mA
0.30
0.25
0.20
0.15
 VF
0.10
0.05
0.00
-0.05
-0.10
-0.15
25
50
75
100
125
145
o
Junction Temperature [ C]
Rev2.0, Mar 22, 2016
10
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Characteristics Graph
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=145℃, IF=1.2A
1400
Rth(j-a)=15℃/W
Maximum Current [mA]
1200
Rth(j-a)=20℃/W
Rth(j-a)=25℃/W
1000
800
600
400
200
0
0
20
40
60
80
100
120
o
Ambient Temperature [ C]
Rev2.0, Mar 22, 2016
11
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 4. Bin Code description, IF=700mA, Tj=85℃ (CRI 70)
Color
Chromaticity
Coordinate
Luminous Flux [lm]
Part Number
Bin Code
Min.
Max.
V3
223
237
W1
237
254
W2
254
271
W3
271
288
V3
223
237
W1
237
254
W2
254
271
W3
271
288
V2
208
223
V3
223
237
W1
237
254
W2
254
271
Typical Forward Voltage [VF] [1] *
Bin Code
Min.
Max.
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
Refer to page.
15
SZ8-Y15-W0-C7
Refer to page.
16~17
SZ8-Y15-WN-C7
Refer to page.
18~20
SZ8-Y15-WW-C7
Table 5. Luminous Flux rank distribution
Available Rank
CCT
CIE
Luminous Flux Rank
6,000 ~ 7,000K
A
U3
V1
V2
V3
W1
W2
W3
5,300 – 6,000K
B
U3
V1
V2
V3
W1
W2
W3
4,700 ~ 5,300K
C
U3
V1
V2
V3
W1
W2
W3
4,200 ~ 4,700K
D
U3
V1
V2
V3
W1
W2
W3
3,700 ~ 4,200K
E
U3
V1
V2
V3
W1
W2
W3
3,200 ~ 3,700K
F
U3
V1
V2
V3
W1
W2
W3
2,900 ~ 3,200K
G
U3
V1
V2
V3
W1
W2
W3
2,600 ~ 2,900K
H
U3
V1
V2
V3
W1
W2
W3
Notes :
(1) Tolerance is 0.06V on forward voltage measurements.
(2)
All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability, single color rank will not be orderable.
Rev2.0, Mar 22, 2016
12
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 4. Bin Code description, IF=700mA, Tj=85℃ (CRI 80)
Color
Chromaticity
Coordinate
Luminous Flux [lm]
Part Number
Bin Code
Min.
Max.
V2
208
223
V3
223
237
W1
237
254
W2
254
271
V2
208
223
V3
223
237
W1
237
254
W2
254
271
U3
182
195
V1
195
208
V2
208
223
V3
223
237
Typical Forward Voltage [VF] [1] *
Bin Code
Min.
Max.
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
Refer to page.
15
SZ8-Y15-W0-C8
Refer to page.
16~17
SZ8-Y15-WN-C8
Refer to page.
18~20
SZ8-Y15-WW-C8
Table 5. Luminous Flux rank distribution
Available Rank
CCT
CIE
Luminous Flux Rank
6,000 ~ 7,000K
A
U3
V1
V2
V3
W1
W2
W3
5,300 – 6,000K
B
U3
V1
V2
V3
W1
W2
W3
4,700 ~ 5,300K
C
U3
V1
V2
V3
W1
W2
W3
4,200 ~ 4,700K
D
U3
V1
V2
V3
W1
W2
W3
3,700 ~ 4,200K
E
U3
V1
V2
V3
W1
W2
W3
3,200 ~ 3,700K
F
U3
V1
V2
V3
W1
W2
W3
2,900 ~ 3,200K
G
U3
V1
V2
V3
W1
W2
W3
2,600 ~ 2,900K
H
U3
V1
V2
V3
W1
W2
W3
Notes :
(1) Tolerance is 0.06V on forward voltage measurements.
(2)
All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability, single color rank will not be orderable.
Rev2.0, Mar 22, 2016
13
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Performance Characteristics
Table 4. Bin Code description, IF=700mA, Tj=85℃ (CRI 90)
Color
Chromaticity
Coordinate
Luminous Flux [lm]
Part Number
Bin Code
Min.
Max.
U3
182
195
V1
195
208
V2
208
223
V3
223
237
U3
182
195
V1
195
208
V2
208
223
V3
223
237
U1
160
172
U2
172
182
U3
182
195
V1
195
208
Typical Forward Voltage [VF] [1] *
Bin Code
Min.
Max.
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
G
2.75
3.00
H
3.00
3.25
Refer to page.
15
SZ8-Y15-W0-C9
Refer to page.
16~17
SZ8-Y15-WN-C9
Refer to page.
18~20
SZ8-Y15-WW-C9
Table 5. Luminous Flux rank distribution
Available Rank
CCT
CIE
Luminous Flux Rank
6,000 ~ 7,000K
A
U1
U2
U3
V1
V2
V3
W1
5,300 – 6,000K
B
U1
U2
U3
V1
V2
V3
W1
4,700 ~ 5,300K
C
U1
U2
U3
V1
V2
V3
W1
4,200 ~ 4,700K
D
U1
U2
U3
V1
V2
V3
W1
3,700 ~ 4,200K
E
U1
U2
U3
V1
V2
V3
W1
3,200 ~ 3,700K
F
U1
U2
U3
V1
V2
V3
W1
2,900 ~ 3,200K
G
U1
U2
U3
V1
V2
V3
W1
2,600 ~ 2,900K
H
U1
U2
U3
V1
V2
V3
W1
Notes :
(1) Tolerance is 0.06V on forward voltage measurements.
(2)
All measurements were made under the standardized environment of Seoul Semiconductor
In order to ensure availability, single color rank will not be orderable.
Rev2.0, Mar 22, 2016
14
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj=85℃, IF=700mA
4700K
0.38
5000K
C1
5300K
CIE (y)
0.36
C0
5600K
B1
C2
B0
B3
C4
B2
B5
6000K
6500K
0.34
7000K
A3
A0
A2
0.32
A1
C3
C5
B4
A5
A4
0.30
0.30
0.32
0.34
0.36
CIE (x)
A0
A1
A2
A3
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3028
0.3304
0.3115
0.3393
0.3041
0.3240
0.3126
0.3324
0.3041
0.3240
0.3126
0.3324
0.3055
0.3177
0.3136
0.3256
0.3126
0.3324
0.3210
0.3408
0.3136
0.3256
0.3216
0.3334
0.3115
0.3393
0.3205
0.3481
0.3126
0.3324
0.3210
A4
A5
B0
0.3408
B1
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3055
0.3177
0.3136
0.3256
0.3207
0.3462
0.3292
0.3539
0.3068
0.3113
0.3146
0.3187
0.3212
0.3389
0.3293
0.3461
0.3146
0.3187
0.3221
0.3261
0.3293
0.3461
0.3373
0.3534
0.3136
0.3256
0.3216
0.3334
0.3292
0.3539
0.3376
B2
B3
B4
0.3616
B5
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3217
0.3316
0.3293
0.3384
0.3222
0.3243
0.3294
0.3306
0.3293
0.3384
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3369
C0
C1
C2
0.3451
C3
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3456
0.3601
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
0.3463
0.3687
0.3552
0.3760
0.3456
0.3601
0.3539
0.3669
C4
C5
CIE x
CIE y
CIE x
CIE y
0.3369
0.3451
0.3448
0.3514
0.3366
0.3369
0.3440
0.3428
0.3440
0.3428
0.3514
0.3487
0.3448
0.3514
0.3526
0.3578
Rev2.0, Mar 22, 2016
15
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Neutral White), Tj=85℃, IF=700mA
4200K
0.39
4500K
0.38
4700K
CIE Y
D41
D31
D21
D42
D11
0.37
D32
D22
D12
D43
D33
D23
0.36
D13
D44
D34
D24
D14
0.35
0.34
0.350
0.355
0.360
0.365
0.370
0.375
CIE X
D11
D21
D31
D41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3548
0.3736
0.3595
0.3770
0.3641
0.3804
0.3689
0.3839
0.3539
0.3668
0.3584
0.3701
0.3628
0.3733
0.3674
0.3767
0.3584
0.3701
0.3628
0.3733
0.3674
0.3767
0.3720
0.3800
0.3595
0.3770
0.3641
0.3804
0.3689
0.3839
0.3736
0.3874
D12
D22
D32
D42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3539
0.3668
0.3584
0.3701
0.3628
0.3733
0.3674
0.3767
0.3530
0.3601
0.3573
0.3632
0.3616
0.3663
0.3659
0.3694
0.3573
0.3632
0.3616
0.3663
0.3659
0.3694
0.3703
0.3726
0.3701
0.3628
0.3733
0.3674
0.3767
0.3720
0.3584
D13
D23
D33
0.3800
D43
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3530
0.3601
0.3573
0.3632
0.3616
0.3663
0.3659
0.3694
0.3520
0.3533
0.3562
0.3562
0.3603
0.3592
0.3645
0.3622
0.3562
0.3562
0.3603
0.3592
0.3645
0.3622
0.3687
0.3652
0.3573
0.3632
0.3616
0.3663
0.3659
0.3694
0.3703
0.3726
D14
D24
D34
D44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3520
0.3533
0.3562
0.3562
0.3603
0.3592
0.3645
0.3622
0.3511
0.3465
0.3551
0.3493
0.3590
0.3521
0.3630
0.3550
0.3551
0.3493
0.3590
0.3521
0.3630
0.3550
0.3670
0.3578
0.3562
0.3562
0.3603
0.3592
0.3645
0.3622
0.3687
0.3652
Rev2.0, Mar 22, 2016
16
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Neutral White), Tj=85℃, IF=700mA
0.41
3700K
0.40
E41
4000K
E31
4200K
0.39
E42
E21
E32
CIE Y
E11
E22
0.38
E12
E43
E33
E23
E13
0.37
E44
E34
E24
E14
0.36
0.35
0.36
0.37
0.38
0.39
0.40
CIE X
E11
E21
E31
E41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3736
0.3874
0.3804
0.3917
0.3871
0.3959
0.3939
0.4002
0.3720
0.3800
0.3784
0.3841
0.3849
0.3881
0.3914
0.3922
0.3784
0.3841
0.3849
0.3881
0.3914
0.3922
0.3979
0.3962
0.3804
0.3917
0.3871
0.3959
0.3939
0.4002
0.4006
0.4044
E12
E22
E32
E42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3720
0.3800
0.3784
0.3841
0.3849
0.3881
0.3914
0.3922
0.3703
0.3726
0.3765
0.3765
0.3828
0.3803
0.3890
0.3842
0.3765
0.3765
0.3828
0.3803
0.3890
0.3842
0.3952
0.3880
0.3841
0.3849
0.3881
0.3914
0.3922
0.3979
0.3784
E13
E23
E33
0.3962
E43
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3703
0.3726
0.3765
0.3765
0.3828
0.3803
0.3890
0.3842
0.3687
0.3652
0.3746
0.3689
0.3806
0.3725
0.3865
0.3762
0.3746
0.3689
0.3806
0.3725
0.3865
0.3762
0.3925
0.3798
0.3765
0.3765
0.3828
0.3803
0.3890
0.3842
0.3952
0.3880
E14
E24
E34
E44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3687
0.3652
0.3746
0.3689
0.3806
0.3725
0.3865
0.3762
0.3670
0.3578
0.3727
0.3613
0.3784
0.3647
0.3841
0.3682
0.3727
0.3613
0.3784
0.3647
0.3841
0.3682
0.3898
0.3716
0.3746
0.3689
0.3806
0.3725
0.3865
0.3762
0.3925
0.3798
Rev2.0, Mar 22, 2016
17
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm White), Tj=85℃, IF=700mA
0.42
3200K
3500K
0.41
3700K
CIE Y
0.40
F21
F11
F42
F32
F22
F43
F12
0.39
F41
F31
F33
F23
F44
F13
F34
0.38
F24
F14
0.37
0.39
0.40
0.41
0.42
0.43
CIE X
F11
F21
F31
F41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3996
0.4015
0.4071
0.4052
0.4146
0.4089
0.4223
0.4127
0.3969
0.3934
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.4261
0.4077
0.4071
0.4052
0.4146
0.4089
0.4223
0.4127
0.4299
0.4165
F12
F22
F32
F42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3969
0.3934
0.4042
0.3969
0.4114
0.4005
0.4187
0.4041
0.3943
0.3853
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4223
0.3990
0.3969
0.4114
0.4005
0.4187
0.4041
0.4261
0.4042
F13
F23
F33
0.4077
F43
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3943
0.3853
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.3916
0.3771
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.4185
0.3902
0.4012
0.3886
0.4082
0.3920
0.4152
0.3955
0.4223
0.3990
F14
F24
F34
F44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.3916
0.3771
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.3889
0.3690
0.3953
0.3721
0.4017
0.3751
0.4082
0.3783
0.3953
0.3721
0.4017
0.3751
0.4082
0.3783
0.4147
0.3814
0.3983
0.3803
0.4049
0.3836
0.4117
0.3869
0.4185
0.3902
Rev2.0, Mar 22, 2016
18
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm White), Tj=85℃, IF=700mA
0.43
2900K
3000K
3200K
0.42
G41
G31
G21
G11
G42
CIE Y
0.41
G32
G22
G12
G43
0.40
G23
G33
G13
0.39
G14
G24
G44
G34
0.38
0.41
0.42
0.43
0.44
0.45
0.46
CIE X
G11
G21
G31
G41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4299
0.4165
0.4364
0.4188
0.4430
0.4212
0.4496
0.4236
0.4261
0.4077
0.4324
0.4099
0.4387
0.4122
0.4451
0.4145
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4514
0.4168
0.4365
0.4189
0.4430
0.4212
0.4496
0.4236
0.4562
0.4260
G12
G22
G32
G42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4261
0.4077
0.4324
0.4100
0.4387
0.4122
0.4451
0.4145
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
0.4100
0.4387
0.4122
0.4451
0.4145
0.4515
0.4324
G13
G23
G33
0.4168
G43
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4223
0.3990
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4185
0.3902
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4243
0.3922
0.4302
0.3943
0.4361
0.3964
0.4420
0.3985
0.4284
0.4011
0.4345
0.4033
0.4406
0.4055
0.4468
0.4077
G14
G24
G34
G44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4243
0.3922
0.4302
0.3943
0.4302
0.3943
0.4361
0.3964
0.4203
0.3834
0.4259
0.3853
0.4259
0.3853
0.4316
0.3873
0.4147
0.3814
0.4203
0.3834
0.4316
0.3873
0.4373
0.3893
0.4185
0.3902
0.4243
0.3922
0.4361
0.3964
0.4420
0.3985
Rev2.0, Mar 22, 2016
19
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Color Bin Structure
CIE Chromaticity Diagram (Warm White), Tj=85℃, IF=700mA
0.44
0.43
2900K
CIE Y
H21
H11
0.42
H13
H24 H34
H41
H31
H42
H43
H33
H23
0.40
H14
H32
H22
H12
0.41
2600K
2700K
H44
0.39
0.38
0.43
0.44
0.45
0.46
0.47
0.48
CIE X
H11
H21
H31
H41
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4562
0.4260
0.4625
0.4275
0.4687
0.4289
0.4750
0.4304
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4225
0.4625
0.4275
0.4687
0.4289
0.4750
0.4304
0.4810
0.4319
H12
H22
H32
H42
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4515
0.4168
0.4575
0.4182
0.4636
0.4197
0.4697
0.4211
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
0.4182
0.4636
0.4197
0.4697
0.4211
0.4758
0.4575
H13
H23
H33
0.4225
H43
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4468
0.4077
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
0.4526
0.4090
0.4585
0.4104
0.4644
0.4118
0.4703
0.4132
H14
H24
H34
H44
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
CIE x
CIE y
0.4420
0.3985
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4373
0.3893
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4428
0.3906
0.4483
0.3919
0.4538
0.3932
0.4593
0.3944
0.4477
0.3998
0.4534
0.4012
0.4591
0.4025
0.4648
0.4038
Rev2.0, Mar 22, 2016
20
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Mechanical Dimensions
1,41
1,41
0,34
0,34
0,98
0,98
0,31
0,31
0,30,3
1,41
1,41
Cathode
0,91
0,91
< TOP >
< Bottom >
0,06
0,98
Cathode
0,25
0,25
0,405
0,405
0,34
0,06
0,91
< Side >
0,31
Anode
< Recommended Solder Pattern >
Anode
Cathode
< Inner circuit >
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
Rev2.0, Mar 22, 2016
21
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Material Structure
No.
List
Material
①
Encapsulation
Silicone, Phosphor
②
Chip Source
GaN ON SAPPHIRE
③
Solder-PAD
Metal (Au)
Rev2.0, Mar 22, 2016
22
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
150 °C
180 °C
80-120 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
217~220°C
80-100 seconds
Peak Temperature (Tp)
250~255℃
Time within 5°C of actual Peak
Temperature (tp)2
20-40 seconds
Ramp-down Rate
6 °C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Atmosphere
Nitrogen (O2<1000ppm)
Caution
(1) Reflow soldering is recommended not to be done more than two times. When 24 hours passed after
first soldering, following reflow soldering will make LEDs damaged.
(2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable,
LED`s characteristics should be carefully checked on before and after such repair.
(3) Do not put stress on the LEDs during heating.
(4) After reflow, do not clean PCB with either water or solvent.
SMT recommendation
(1) After reflow, Over 80% reflectance of PSR is recommended.  Tamura RPW-8000-xx
(2) Solder paste materials (SAC 305, No Cleaning Paste )  Senju M705-GRN360-KV
(3) We recommend TOV Test 1.8v~2.8v at 1uA (per LED)
(4) We recommend IR Test 0~1uA at -5V (per LED)
Rev2.0, Mar 22, 2016
23
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Emitter Tape & Reel Packaging
Size
A0 : 1.6±0.05
B0 : 1.6±0.05
K0 : 0.5±0.05
11.4±1.0
180
9±0.3
60
2
22
13
( Tolerance: ±0.2, Unit: mm )
Notes :
(1) Quantity : 1,500pcs/Reel
(empty slot possible in taping reel)
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover
tape is turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp
proof Package
Rev2.0, Mar 22, 2016
24
www.seoulsemicon.com
Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Packaging Information
Rev2.0, Mar 22, 2016
25
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) Do not use tweezers to pick up or handle WICOP2 LEDs.
A vacuum pick up should only be used.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is smaller than the LED’s
area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing.
(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(6) Avoid leaving fingerprints on silicone resin parts.
Rev2.0, Mar 22, 2016
26
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing LEDs in a dry box with a desiccant . The
recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 30℃ Humidity : less than RH60%
b. If the package has been opened more than 1 year (MSL 2) or the color of
the desiccant changes, components should be dried for 10-24hr at 65±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
Rev2.0, Mar 22, 2016
27
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Product Data Sheet
SZ8-Y15-XX-XX - High-power LED
Precaution for Use
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca
n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. T
he result can be a significant loss of light output from the fixture. Knowledge of the properties of the m
aterials selected to be used in the construction of fixtures can help prevent these issues.
(13) The slug is electrically isolated.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the rev
erse voltage is applied to LED, migration can be generated resulting in LED damage.
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
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Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
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Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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