Reliability Report

AOS Semiconductor
Product Reliability Report
AOZ8809DI-05,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOZ8809DI-05.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOZ8809DI-05
passes AOS quality and reliability requirements. The released product will be categorized by the
process family and be routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOZ8809 is a transient voltage suppressor array designed to protect high speed data lines
such as HDMI, USB 3.0, MDDI, SATA, and Gigabit Ethernet from damaging ESD events.
This device incorporates eight surge rated, low capacitance steering diodes and a TVS in a single
package. During transient conditions, the steering diodes direct the transient to either the positive
side of the power supply line or to ground.
The AOZ8809 provides a typical line-to-line capacitance of 0.25 pF and low insertion loss up to 6
GHz providing greater signal integrity making it ideally suited for HDMI 1.3 or USB 3.0
applications , such as Digital TVs, DVD players, computing, set-top boxes and MDDI applications
in mobile computing devices.
The AOZ8809 comes in a RoHS compliant and Halogen Free 2.5 mm x 1.0 mm x 0.55 mm DFN10 package
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOZ8809DI-05
Standard sub-micron
Ultra-Low Capacitance TVS Diode
DFN2.5x1.0 10 Leads
Bare Cu
Ag Epoxy
Cu wire
Epoxy resin with silica filler
Up to Level 1
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III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time
Point
Total
Sample
size
Number
of
Failures
Reference
Standard
HTRB
Temp = 150°C ,
Vdd=80% of Vbrmax
168 / 500 /
1000
hours
924 pcs
0
JESD22-A108
MSL
Precondition
168hr 85°C/85%RH +
3 cycle reflow@260°C
(MSL 1)
-
2772 pcs
0
JESD22-A113
HAST
130°C , 85%RH,
33.3 psi,
Vdd = 80% of Vbrmax
96 hours
924 pcs
0
JESD22-A110
Autoclave
121°C , 29.7psia,
RH=100%
96 hours
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°C to 150°C ,
air to air,
250 / 500
cycles
924 pcs
0
JESD22-A104
Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 6.10
MTTF = 18700 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 6.10
9
MTTF = 10 / FIT = 18700 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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