Z-Power LED X10490 Technical Data Sheet Specification SSC-PTR202-IXO SSC Drawn Customer Approval Approval Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet [ Contents ] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Soldering profile 5. Outline dimension 6. Packing 7. Reel packing structure 8. Precaution for use Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet SSC-PTR202-IXO Description -Surface-mounted and leadless chip Photo transistor -Tape and Reel packing SSC-PTR202-IX0 Features • 3.0 X 1.5 X 1.4 mm • Clear inner lens type • Peak sensitive wavelength: : 800nm -Increases the life time of battery Applications •Cellular phone’s keypad lightning •Other decoration lighting Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Features • Package :3.0 ×1.5 ×1.4mm • Inner lens type • Peak sensitivity Wavelength : 800 ㎚ 2. Absolute maximum ratings (Ta=25℃) Parameter Symbol Rating Unit Collector-Emitter Voltage VCEO 30 V Emitter-Collector Voltage VECO 5 V Collector Current IC 30 mA Collector Power Dissipation PC 100 mW Operation Temperature Topr -40 ~ 85 ℃ Storage Temperature Tstg -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10 3. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min Typ Max Unit Light Current IC VCE=10V, E=1000 lux 1.0 2.5 - mA Collector dark current ICEO VCE=5V - - 100 nA Saturated voltage between collector & emitter VCE(Sat) IC=2㎃ E=1000 lux 0.4 V Peak sensitive wave length λp - - 800 - nm Spectral efficiency λ - 350 - 1100 nm Response (Rise time) Tr - 15 - ㎲ Response (Fall time) Tf VCE=5V, IC=1㎃, RC=1000Ω - 15 - ㎲ *2 The luminous intensity IV is measured at the peak of the spatialpattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv±10 %, λD±2 nm, VF±0.1 V) Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Soldering profile Reflow Soldering Conditions/ Profile (1) Lead Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 240℃max. for 5 seconds max. (2) Lead-Free Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 265℃max. for 10 seconds max. (3) Hand Soldering Condition •Not more than 3 seconds @MAX280℃, under Soldering iron. [Note] In case the soldered products are reused in soldering process, we don’tRev. 0.00 guarantee the products. April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Outline Dimensions 6. Packing (1) Quantity: 3,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Reel Packing Structure Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Precaution for Use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5℃~30℃Humidity : 60%HR max. (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40℃Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 60±5℃. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80±5℃or 12Hr at 100±5℃. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such aswater, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDsare illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDsmust be stored to maintain a clean atmosphere. If the LEDsare stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDsmust be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice. Rev. 0.00 April 2009 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00)