NTC SMD Thermistors With Nickel Barrier Termination NB 12 - NB 20 Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. They are widely used for temperature compensation but can also achieve temperature control of printed circuits. A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. NB 12 IEC SIZE : 0805 Types NB 20 IEC SIZE : 1206 2 (.079) ± 0.3 (.012) 3.2 (.126) ± 0.4 (.016) 1.25 (.049) ± 0.2 (.008) DIMENSIONS: 1.6 (.063) ± 0.25 (.010) 0.5 (.020) ... 1.3 (.051) millimeters (inches) 0.5 (.020) ... 1.5 (.059) 0.2 (.008) min 0.2 (.008) min Terminations 0.2 (.008) min 0.2 (.008) min Nickel Barrier Marking On packaging only Climatic category 40/125/56 Operating temperature -55°C to +150°C Tolerance on Rn (25°C) ±5%, ±10%, ±20% Maximum dissipation at 25°C Thermal dissipation factor Thermal time constant 0.12 W 0.24 W 2 mW/°C 4 mW/°C 5s 7s Resistance - Temperature characteristics: pages 29 to 33. APPLICATIONS • • • • • • • • • LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems Temperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits HOW TO ORDER 12 NB 20 K0 0103 M BA Type Material Code K (See tables page 13) Resistance 10,000 Ω Tolerance M (±20%) J (±5%) K (±10%) Suffix: Packaging – –: Bulk BA: Plastic tape (180mm diam. reel) BE: Plastic tape (1/2 reel) BC: Plastic tape (330mm diam. reel) BB: Cardboard tape (180mm diam. reel) BF: Cardboard tape (1/2 reel) BD: Cardboard tape (330mm diam. reel) NTC SMD Thermistors With Nickel Barrier Termination NB 12 – NB 20 TABLE OF VALUES NB 12 IEC SIZE : 0805 Types Rn at 25°C (Ω) Material Code NB 20 IEC SIZE : 1206 B (K) (⌬B/B (1) ± 5% (2) ± 3% ) ␣ at 25°C (%/°C) NB 12 KC 0 180 NB 12 KC 0 220 NB 12 KC 0 270 NB 12 KC 0 330 NB 12 KC 0 390 NB 12 KC 0 470 NB 12 KC 0 560 NB 12 KC 0 680 NB 12 KC 0 820 NB 12 KC 0 101 18 22 27 33 39 47 56 68 82 100 NB 12 MC 0 121 NB 12 MC 0 151 NB 12 MC 0 181 NB 12 MC 0 221 NB 12 MC 0 271 NB 12 MC 0 331 NB 12 MC 0 391 NB 12 MC 0 471 NB 12 MC 0 561 NB 12 MC 0 681 NB 12 MC 0 821 NB 12 MC 0 102 NB 12 MC 0 122 NB 12 MC 0 152 NB 12 MC 0 182 NB 12 MC 0 222 NB 12 MC 0 272 NB 12 MC 0 332 120 150 180 220 270 330 390 470 560 680 820 1,000 1,200 1,500 1,800 2,200 2,700 3,300 NB 12 J 0 0332 NB 12 J 0 0392 NB 12 J 0 0472 NB 12 J 0 0562 3,300 3,900 4,700 5,600 NB 12 K 0 0682 NB 12 K 0 0822 NB 12 K 0 0103 6,800 8,200 10,000 K 3630 ± 3% – 4.0 NB 12 L 0 0123 NB 12 L 0 0153 12,000 15,000 L 3790 ± 3% – 4.2 NB 12 M 0 0183 NB 12 M 0 0223 NB 12 M 0 0273 NB 12 M 0 0333 18,000 22,000 27,000 33,000 M 3950 ± 3% – 4.4 NB 12 N 0 0393 NB 12 N 0 0473 NB 12 N 0 0563 39,000 47,000 56,000 N 4080 ± 3% – 4.6 NB 12 L 2 0683 68,000 L2 3805 ± 3% – 4.1 NB 12 N 5 0683 NB 12 N 5 0823 68,000 82,000 N5 4160 ± 3% – 4.7 NB 12 P 0 0104 100,000 P 4220 ± 3% – 4.7 NB 12 SC 0104 100,000 SC 4500 ± 3% – 4.8 NB 12 P 0 0124 NB 12 P 0 0154 NB 12 P 0 0184 120,000 150,000 180,000 P 4220 ± 3% – 4.7 NB 12 Q 0 0224 NB 12 Q 0 0274 220,000 270,000 Q 4300 ± 3% – 4.7 NB 12 R 0 0105 1,000,000 R 4400 ± 3% – 4.8 KC MC J 3470 ± 5% 3910 ± 3% 3480 ± 3% – 3.9 – 4.4 – 3.9 Types Rn at 25°C (Ω) Material Code B (K) (⌬B/B (1) ± 5% (2) ± 3% ) ␣ at 25°C (%/°C) NB 20 MC 0 221 NB 20 MC 0 102 220 1,000 MC MC 3910 ± 3% 3910 ± 3% – 4.4 – 4.4 NB 20 J 0 0472 NB 20 J 0 0562 NB 20 J 0 0682 4,700 5,600 6,800 J 3480 ± 3% – 3.9 NB 20 J 5 0822 8,200 J5 3480 ± 3% – 3.9 NB 20 K 0 0103 NB 20 K 0 0123 10,000 12,000 K 3630 ± 3% – 4.0 NB 20 L 0 0153 NB 20 L 0 0183 NB 20 L 0 0223 15,000 18,000 22,000 L 3790 ± 3% – 4.2 NB 20 M 0 0273 NB 20 M 0 0333 NB 20 M 0 0393 NB 20 M 0 0473 27,000 33,000 39,000 47,000 M 3950 ± 3% – 4.4 NB 20 N 0 0563 NB 20 N 0 0683 NB 20 N 0 0823 56,000 68,000 82,000 N 4080 ± 3% – 4.6 NB 20 N 5 0104 100,000 N5 4160 ± 3% – 4.7 NB 20 P 0 0124 NB 20 P 0 0154 NB 20 P 0 0184 NB 20 P 0 0224 120,000 150,000 180,000 220,000 P 4220 ± 3% – 4.7 NB 20 Q 0 0274 NB 20 Q 0 0334 NB 20 Q 0 0394 NB 20 Q 0 0474 NB 20 Q 0 0564 270,000 330,000 390,000 470,000 560,000 Q 4300 ± 3% – 4.7 NB 20 R 0 0684 NB 20 R 0 0824 NB 20 R 0 0105 680,000 820,000 1,000,000 R 4400 ± 3% – 4.8 13 NTC SMD Thermistors With Nickel Barrier Termination NB 21 Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. They are widely used for temperature compensation but can also achieve temperature control of printed circuits. A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. NB 21 IEC SIZE : 0603 Types 1.6 (.063) 0.2 (.008) 0.8 (.031) ±0.2 (.008) DIMENSIONS: millimeters (inches) 0.8 (.031) ±0.2 (.008) 0.2 (.008) min 0.2 (.008) min Terminations Nickel Barrier Marking On packaging only Climatic category 40/125/56 Operating temperature -55°C to +150°C Tolerance on Rn (25°C) ±5%, ±10%, ±20% Maximum dissipation at 25°C 0.07 W Thermal dissipation factor 1 mW/°C Thermal time constant 4s Resistance - Temperature characteristics: pages 29 to 33. APPLICATIONS • • • • • • • • • LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems Temperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits HOW TO ORDER 14 NB 21 K0 0103 M BB Type Material Code K (See tables page 15) Resistance 10,000 Ω Tolerance M (±20%) J (±5%) K (±10%) Suffix: Packaging – –: Bulk BB: Cardboard tape (180mm diam. reel) BF: Cardboard tape (1/2 reel) BD: Cardboard tape (330mm diam. reel) NTC SMD Thermistors With Nickel Barrier Termination NB 21 TABLE OF VALUES NB 21 IEC SIZE : 0603 Types NB 21 KC 0 470 NB 21 KC 0 101 NB 21 KC 0 471 Rn at 25°C (Ω) Material Code 47 100 470 KC NB 21 MC 0 102 1,000 NB 21 J 0 0472 4,700 NB 21 J 5 0682 NB 21 J 5 0103 B (K) (⌬B/B (1) ± 5% (2) ± 3% ) ␣ at 25°C (%/°C) 3470 ± 5% – 3.9 MC 3910 ± 3% – 4.4 J 3480 ± 3% – 3.9 6,800 10,000 J5 3480 ± 3% 3480 ± 3% – 3.9 – 3.9 NB 21 K 0 0103 NB 21 K 0 0153 10,000 15,000 K 3630 ± 3% – 4.0 NB 21 L 0 0223 22,000 L 3790 ± 3% – 4.2 NB 21 M 0 0333 NB 21 M 0 0473 33,000 47,000 M 3950 ± 3% – 4.4 NB 21 L 2 0683 68,000 L2 3805 ± 3% – 4.1 NB 21 N 0 0683 68,000 N 4080 ± 3% – 4.6 NB 21 N 5 0104 100,000 N5 4160 ± 3% – 4.7 NB 21 P 0 0154 150,000 P 4220 ± 3% – 4.7 NB 21 Q 0 0334 NB 21 Q 0 0474 330,000 470,000 Q 4300 ± 3% – 4.7 15 Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION (.008) Hole ⭋1 (.039) +0.2 -0 Cover Tape Max 3° The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. 5.5 (.217) ±0.2 (.008) Max 3° 30μ ± 5μ T K Designation Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Symbol W T P0 D0 Distance Distance (center to center) Distance (center to center) Sizes of the NC 12 (0805) cavities E F P2 A0 B0 K Value 8 0.4 max. 4 1.5 -0 1.75 3.5 2 1.5 2.4 1.4 max. NC 20 (1206) A0 B0 K 1.95 3.55 1.5 max. A1 B1 B0 F R = 0.3 (.012) Max. Super 8 Plastic Tape Packaging: D0 P2 E P0 Max 3° Max 3° A0 Direction of unreeling Tolerance ±0.2 ±0.1 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) ±0.1 ±0.1 K ±0.1 (size is adjustable) (K = t1 +0.2) +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NC - NB 12 NC 20 - NB 20 16 Suffix BA BE BA BE Qty Per Reel 4000 2000 3000 1500 W Upper side Bottom side Packaging for Automatic Insertion NTC Chip Thermistors / NC/NB Series AUTOMATIC INSERTION 8mm Paper Tape Packaging: 10 PITCHES CUMULATIVE TOLERANCE ON TAPE 0.20mm (0.008) P0 The mechanical and dimensional reel characteristics are in accordance with the IEC publication 286-3. BOTTOM COVER TAPE D0 T P2 E1 TOP COVER TAPE F W E2 B0 G T1 T1 Designation Tape width Tape thickness Pitch of the sprocket holes Diameter of the sprocket holes Symbol W T P0 Value 8 1.1 max. 4 1.5 -0/+0.1 1.75 3.5 2 0.10 max. 6.25 min. 0.75 min. 4 2 D0 Distance Distance (center to center) Distance (center to center) Cover tape thickness Distance Distance Component pitch 0805/0603 0402 CAVITY SIZE SEE NOTE 1 A0 CENTER LINES OF CAVITY E1 F P2 T1 E2 G P1 P1 User Direction of Feed Tolerance -.0.1/+0.3 ±0.1 ±0.1 ±0.1 ±0.05 ±0.05 ±0.1 ±0.1 +0 ø180 (7.09) - 2 (.079) + 0.15 (.006) Reel ø 62 (2.44) ± 1.5 (.059) Direction of unreeling ø 12.75 (.502) - 0 Reel according to ISO/DIS 3639-2 8.4 (.331) 14.4 (.567) max. +0.15 (.006) Upper side Bottom side + 0.5 (.020) ø 20.5 (.087) - 0 QUANTITY PER REEL Type NB - NC 12 NB 21 Suffix BB BF Qty Per Reel 4000 2000 17 Surface Mounting Guide Chip Thermistor – Application Notes Wave STORAGE 300 Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. Preheat Solder Temp. SOLDERABILITY / LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. P/N Termination Type AgPdPt Nickel Barrier NC NB Solder Tin/Lead 60/40 60/40 Solder Temp ºC 260 ± 5 260 ± 5 T 200 230ºC to 250ºC 150 100 50 0 Immersion Time Seconds 15 max 30 ± 1 NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. Natural Cooling 250 1 to 2 min 3 sec. max (Preheat chips before soldering) T/maximum 150°C a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. Reflow 300 D2 RECOMMENDED SOLDERING PAD LAYOUT Natural Cooling Preheat Solder Temp. 250 Dimensions in mm (inches) 220ºC to 250ºC 150 100 Case Size 1min 1min P/N 0603 NB21 0805 NB12 1206 NB20 10 sec. max (Minimize soldering time) Temperature °C D5 REFLOW SOLDERING 0 D1 D2 D3 D4 D5 2.30 (.091) 3.00 (.118) 4.00 (.157) 0.80 (.031) 1.00 (.039) 1.00 (.039) 0.70 (.028) 1.00 (.039) 2.00 (.079) 0.80 (0.31) 1.00 (.039) 1.00 (.039) 0.75 (.030) 1.25 (.049) 2.50 (.098) WAVE SOLDERING 50 100 150 • Pre-heating: 150°C ±15°C / 60-90s • Max. Peak Gradient: 2.5°C/s • Peak Temperature: 245°C ±5°C • Time at >230°C: 40s Max. 18 D3 D4 200 50 300 250 200 150 100 50 0 0 D1 200 250 Time (s) 300 Case Size P/N 0603 NB21 0805 NB12 1206 NB20 D1 D2 D3 D4 D5 3.10 (.122) 4.00 (.157) 5.00 (.197) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.70 (.028) 1.00 (.039) 2.00 (.079) 1.20 (.047) 1.50 (.059) 1.50 (.059) 0.75 (.030) 1.25 (.049) 1.60 (.063)