TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip GENERAL DESCRIPTION Schematic Diagram AVX has combined the best electrical characteristics of its TransGuard® Transient Voltage Suppressors (TVS) and its Feedthru Capacitors into a single chip for state-of-the-art overvoltage circuit protection and EMI reduction over a broad range of frequencies. This unique combination of multilayer ceramic construction in a feedthru configuration gives the circuit designer a single 0805 chip that responds to transient events faster than any TVS device on the market today, and provides significant EMI attenuation when in the off-state. Automotive TransFeeds are designed for automotive applications and are AEC-Q 200 qualified. The reduction in parallel inductance, typical of the feedthru chip construction when compared to the construction of standard TVS or ceramic capacitor chips, gives the TransFeed product two very important electrical advantages: (1) faster “turn-on” time. Calculated response times of <200 pSec are not unusual with this device, and measured response times range from 200 – 250 pSec. The TransFeed “turn-on” characteristic is less than half that of an equivalent TransGuard® part — and TransGuards® clamp transient voltages faster than any other bipolar TVS solution such as diodes; (2) the second electrical advantage of lower parallel inductance, coupled with optimal series TYPICAL APPLICATIONS • Drive by Wire • Dimming Mirror Circuit • Filtering/protection on Microcontroller I/O lines • Filtering/protection on Interface I/O lines • Power Line Conditioning • Power Regulation • LCD Dashboard driver Where designers are concerned with both transient voltage protection and EMI attenuation, either due to the electrical performance of their circuits or due to required compliance to specific EMC regulations, the TransFeed product is an ideal choice. IN OUT Electrical Model IN LS RV LS C OUT RP RON LP inductance, is the enhanced attenuation characteristics of the TransFeed product. Not only is there significantly greater attenuation at a higher self-resonance frequency, but the roll-off characteristic becomes much flatter, resulting in EMI filtering over a much broader frequency spectrum. Typical applications include filtering/protection on Microcontroller I/O Lines, Interface I/O Lines, Power Line Conditioning and Power Regulation. GENERAL CHARACTERISTICS • Operting Teperature: -55°C to +125°C • Working Voltage: 5.6Vdc - 26Vdc • Case Size: 0805 • Energy Rating: 0.05 - 0.3J • Current: 15 - 120A • Max Feedthru Current: 0.2 - 1A FEATURES • Bi-directional TVS • Narrow band, high attenuation filter • EMI Filtering over broader frequency range • Fastest Response Time to ESD Strikes • AEC-Q 200 Qualified 89 TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip HOW TO ORDER 2 V Varistor AF 1 Automotive Feedthru Capacitor Chip Size 05 A Voltage Y 2 Varistor Clamping Voltage 05 = 5.6VDC 09 = 9.0VDC 14 = 14.0VDC 18 = 18.0VDC No. of Elements 2 = 0805 150 E D DC Resistance Packaging Code Pcs./Reel 1 = 0.150 Ohms 2 = 0.200 Ohms 3 = 0.250 Ohms 150 = 18V 200 = 22V 300 = 32V 400 = 42V 500 = 50V P D = 1,000 R = 4,000 T = 10,000 Energy Rating Capacitance Tolerance Feedthru Current X = 0.05J A = 0.1J C = 0.3J Y = +100/-50% D = 500 mA E = 750 mA F = 1.0 Amp Termination Finish P = Ni/Sn Alloy (Plated) TRANSFEED ELECTRICAL SPECIFICATIONS AVX Part Number Working Voltage (DC) Working Breakdown Clamping Maximum Voltage Voltage Voltage Leakage (AC) Current Transient Energy Rating Peak Current Rating Typical Cap DC Resistance Maximum Feedthru Current Jump Start Voltage V2AF105A150Y2E _ _ 5.6 4.0 8.5±20% 18 35 0.10 30 800 0.200 0.75 – V2AF105C150Y1F _ _ 5.6 4.0 8.5±20% 18 35 0.30 120 2500 0.150 1.00 – – V2AF109A200Y2E _ _ 9.0 6.4 12.7±15% 22 25 0.10 30 575 0.200 0.75 V2AF109C200Y1F _ _ 9.0 6.4 12.7±15% 22 25 0.30 120 1800 0.150 1.00 – V2AF114A300Y2E _ _ 14.0 10.0 18.5±12% 32 15 0.10 30 300 0.200 0.75 27.5 V2AF114C300Y1F _ _ 14.0 10.0 18.5±12% 32 15 0.30 120 900 0.150 1.00 27.5 V2AF118A400Y2E _ _ 18.0 13.0 25.5±10% 42 10 0.10 30 200 0.200 0.75 27.5 V2AF118C400Y1F _ _ 18.0 13.0 25.5±10% 42 10 0.30 120 500 0.150 1.00 27.5 V2AF118X500Y3D _ _ 18.0 13.0 25.5±10% 50 10 0.05 20 75 0.250 0.50 27.5 26.0 18.0 34.5±10% 60 10 0.3 80 250 0.2 0.75 27.5 V2AF126C600Y2E_ _ Termination Finish Code Packaging Code VW (DC) VW (AC) VB VB Tol VC IL 90 DC Working Voltage (V) AC Working Voltage (V) Typical Breakdown Voltage (V @ 1mADC) VB Tolerance is ± from Typical Value Clamping Voltage (V @ 1A 8x20μS ) Maximum Leakage Current at the Working Voltage (μA) ET IP Cap DCR IFT VJUMP Transient Energy Rating (J, 10x1000μS) Peak Current Rating (A, 8x20μS) Typical Capacitance (pF) @ 1MHz and 0.5 V DC Resistance (Ohms) Maximum Feedthru Current (A) Jump Start Voltage (V, 5 min) TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip DIMENSIONS L mm (inches) W 2.01 ± 0.20 1.25 ± 0.20 0805 (0.079 ± 0.008) (0.049 ± 0.008) T BW 1.143 Max. (0.045 Max.) BL EW X S 0.46 ± 0.10 0.18 + 0.25 -0.08 0.25 ± 0.13 1.02 ± 0.10 0.23 ± 0.05 (0.018 ± 0.004) (0.007 + 0.010 -0.003) (0.010 ± 0.005) (0.040 ± 0.004) (0.009 ± 0.002) L S X T BW CL BL W EW RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions) 0805 mm (inches) T P S W L C 3.45 (0.136) 0.51 (0.020) 0.76 (0.030) 1.27 (0.050) 1.02 (0.040) 0.46 (0.018) 4 Pad Layout T P P W S INPUT OUTPUT C L 91 TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS FEEDTHRU VARISTORS AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice for system designers with transient strike and broadband EMI/RFI concerns. Feedthru Varistors utilize a ZnO varistor material and the electrode pattern of a feedthru capacitor. This combination allows the package advantage of the feedthru and material advantages of the ZnO dielectric to be optimized. ZnO MLV Feedthrus exhibit electrical and physical advantages over standard ZnO MLVs. Among them are: 1. Faster Turn on Time 2. Broadband EMI attenuation 3. Small size (relative to discrete MLV and EMI filter schemes) The electrical model for a ZnO MLV and a ZnO Feedthru MLV are shown below. The key difference in the model for the Feedthru is a transformation in parallel to series inductance. The added series inductance helps lower the injected transient peak current (by 2πfL) resulting in an additional benefit of a lower clamping voltage. The lowered parallel inductance decreases the turn on time for the varistor to <250ps. Discrete MLV Model Discrete MLVF Model To Device Requiring Protection PCB Trace LS Solder Pad RV RV C LS Solder Pad LP To Device Requiring Protection C RP RP Ron Ron LP Solder Pad Solder Pad Where: Rv = Rp ≥ C = Ron = Lp = 92 Voltage Variable resistance (per VI curve) 1012 Ω defined by voltage rating and energy level turn on resistance parallel body inductance Where: Rv = Rp = Voltage Variable resistance (per VI curve) Body IR C Ron Lp Ls = = = = defined by voltage rating and energy level turn on resistance minimized parallel body inductance series body inductance TransFeed Automotive Series AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS MARKET SEGMENTS APPLICATIONS • EMI Suppression • Broadband I/O Filtering • Vcc Line Conditioning FEATURES • Small Size • Low ESR • Ultra-fast Response Time • Broad S21 Characteristics TYPICAL CIRCUITS REQUIRING TRANSIENT VOLTAGE PROTECTION AND EMI FILTERING • Computers • Automotive • Power Supplies • Multimedia Add-On Cards • Bar Code Scanners • Remote Terminals • Medical Instrumentation • Test Equipment • Transceivers • Cellular Phones / Pagers The following applications and schematic diagrams show where TransFeed TVS/ EMI filtering devices might be used: • System Board Level Interfaces: (Fig. 1) Digital to RF Analog to Digital Digital to Analog • Voltage Regulation (Fig. 2) • Power Conversion Circuits (Fig. 3) • GaAs FET Protection (Fig. 4) Fig. 1 – System Interface Fig. 2 – Voltage Regulators REGULATOR Sensor/Keyboard/ Touchscreen Input DIGITAL BOARD + RF BOARD By X Bus Fig. 3 – Power Conversion Circuits/Power Switching Circuits +3.3V MAIN POWER Sensor Input ANALOG BOARD POWER MANAGEMENT CHIP Display DIGITAL BOARD +3.3V INTERFACE CARD +5V +1.8V +12V Keyboard DIGITAL BOARD ASIC ANALOG BOARD Fig. 4 – GaAs FET Protection SPECIFICATION COMPARISON MLVF 0805 5ph <600nh <0.025Ω 100pf to 2.5nf see VI curves >0.25 x 1012Ω <250ps PARAMETER MLV 0805 Ls Lp typical N/A typical <1.5nh Ron C typical <0.1Ω typical 100pf to 5.5nf Rv Rp typical see VI curves typical >1 x 1012Ω Typical turn on time Typical frequency response OUTPUT INPUT <500ps A comparison table showing typical element parameters and resulting performance features for MLV and MLVF is shown above. Fig. 5 – Automotive TransFeed - Throttle by Wire THROTTLE DRIVE ACCELERATOR SENSOR ECU THROTTLE SENSOR 93