Evaluation Kit

THAN0190_Rev.1.20_E
THCV233 / THCV234 Evaluation Kit
V-by-One®HS Single Link Evaluation Board
Parts Number: THEVA233-V2, THEVA234-V2
1.General Description
THEVA233-V2 and THEVA234-V2 boards are designed to evaluate THCV233 and THCV234 for
transmission of Video data. The supply voltage range are "3.0V to 3.6V" or "5V". THCV233 and
THCV234 are V-by-One®HS High-speed video data transmitter/receiver with bi-directional transceiver.
They convey not only video data (Main-Link), but also bi-directional system control data (Sub-Link) that
is driven by 2-wire serial interface. HOST CPU-side of Sub-Link is selectable on each device and the other
side of Sub-Link integrates I/O expander. THCV233-234 system is able to watch and control peripheral
devices via 2-wire serial interface or GPIOs. They also can report interrupt events caused by change of
GPIO inputs and internal state.
2. Features
Table 1 Main-Link Operation Mode and Spec
THCV233
Width
24bit
32bit
THCV234
24bit
32bit





Link
LVDS Clock Freq. *1
Si/So, Si/DDo
20MHz to 100MHz
Si/Do
40MHz to 100MHz
Si/So, Si/DDo
20MHz to 85MHz
Si/Do
40MHz to 85MHz
Si/So, Di/SSo
20MHz to 100MHz
Di/So
40MHz to 100MHz
Si/So, Di/SSo
20MHz to 85MHz
Di/So
40MHz to 85MHz
*1 This is typical value, please refer the datasheet for detail.
Si/So:Single-in/Single-out, Si/Do:Single-in/Dual-out
Si/DDo:Single-in/Distributed Dual-out
Di/So:Dual-in/Single-out, Di/SSo:Dual-in/Selected Single-out

LVDS Input Internal Termination
CORE 1.8v, LVDS 3.3v
Package: 48 pin QFN
EU RoHS Compliant
Main-Link

Data Width Selectable: 24/32 bit

Single/Dual Link Selectable

AC Coupling

Wide Frequency Range

CDR Requires no External Freq. Reference

Supports Spread Spectrum Clocking:
Up to 30kHz/0.5%(center spread)
Sub-Link

Driven by 2-wire Serial I/F
(Max. 400kbps)

GPIO Expander 233: 4pins / 234: 5pins
3. Overview
(a) THEVA233-V2 (Top Side)
(b) THEVA234-V2 (Top Side)
Figure 1 THEVA233-V2 and THEVA234-V2 Top Side View
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
1/16
Security E
THAN0190_Rev.1.20_E
(a) THEVA233-V2 (Bottom Side)
(b) THEVA234-V2 (Bottom Side)
Figure 2 THEVA233-V2 and THEVA234-V2 Bottom Side View
4. Power Supply Set Up
This chapter shows power supply condition.
Caution: Please check if there is no power-GND short on below red trace before supplying any power.
3.3V Power Supply to Each Board
Each evaluation board requires 3.3V power supply. Please use “CON1” connector typically.
(a)THEVA233-V2
(b)THEVA234-V2
Figure 3 Power Supply for Evaluation Board
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
2/16
Security E
THAN0190_Rev.1.20_E
Power Supply from / to Connector
3.3V power supply can be connected to CON2, CON3 and CON4 by using W1, W2 and W3 solder jumper.
THEVA233-V2
W1: Connect the 3.3V power supply with pin#13 and 14 of CON3.
W2: Connect the 3.3V power supply with pin#1 and 2 of CON2.
W3: Connect the 3.3V power supply with pin#18 and 19 of CON4.
W2
W1
(a)THEVA233-V2 (Top Side)
(b) THEVA233-V2 (Bottom Side)
Figure 4 THEVA233-V2 Power Supply from / to Each Connector
THEVA234-V2
W1: Connect the 3.3V power supply with pin#13 and 14 of CON3.
W2: Connect the 3.3V power supply with pin#1 and 2 of CON2
W3: Connect the 3.3V power supply with pin#18 and 19 of CON4.
(a)THEVA234-V2 (Top Side)
(b) THEVA234-V2 (Bottom Side)
Figure 5 THEVA234-V2 Power Supply from / to Each Connector
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
3/16
Security E
THAN0190_Rev.1.20_E
5. V-by-One®HS Input / Output Connector Select
V-by-One®HS input / output connector can be selected by using 0ohm resistors.
(1) 1mm Pitch Connector (Default Setting)
Please mount / unmount following 0ohm resistors to use 1mm pitch connector.
THEVA233-V2
THEVA234-V2
Mount
R5,R6,R9,R10,R11,R12,R13,R14
R2,R3,R4,R5,R7,R8,R9,R10
Unmount
R16,R17,R23,R26,R29,R30,R32,R33
R12,R13,R15,R16,R18,R19,R25,R31
(a)THEVA233-V2 (Top Side)
(b)THEVA234-V2 (Top Side)
Figure 6 Resistors Mounting for 1mm Pitch Connector
(2) 0.5mm Pitch Connector
Please mount / unmount following 0ohm resistors to use 0.5mm pitch connector.
Mount
THEVA233-V2
THEVA234-V2
Unmount
R5,R6,R9,R10,R11,R12,R13,R14
R16,R17,R23,R26,R29,R30,R32,R33
R15,R18,R27,R31,R34,R39
R2,R3,R4,R5,R7,R8,R9,R10
R12,R13,R15,R16,R18,R19,R25,R31
R11,R14,R17,R24,R32,R41
(a)THEVA233-V2 (Bottom Side)
(b)THEVA234-V2 (Bottom Side)
Figure 7 Resistors Mounting for 0.5mm Pitch Connector
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
4/16
Security E
THAN0190_Rev.1.20_E
(3) SMA connector
Please mount / unmount following 0ohm resistors to use SMA connector.
*HTPDN and LOCKN signals don’t have SMA connector input / output connection.
THEVA233-V2
THEVA234-V2
Mount
R23,R26,R29,R30,R32,R33
R15,R18,R27,R31,R34,R39
R44, R46, R47, R48
Unmount
R9,R10,R11,R12,R13,R14
R12, R15, R20, R23
Sub-Link inout
V-by-One®HS output
Figure 8 Resistors Mounting for SMA Connector
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
5/16
Security E
THAN0190_Rev.1.20_E
6. Function setting
Setting pin except ALNIN/GPIO[3] of each board is shown in yellow area of Figure 9. Pin#2 of each
3HEADER is connected to IC’s setting pin.
Each setting pin’s high or low setting can set by connecting pin#2 of 3HEADER and high level or low level.
Figure 9 Position of Function Setting Pin
(a)3HEADER Description
(b)High Level Setting
Figure 10 High / Low Setting Description
(c)Low Level Setting
ALNIN Setting
Setting of ALNIN/GPIO[3] pin is shown in yellow area of Figure11.Please connect HEADER when
ALNIN/GPIO[3] is set low. Please mount R35 and unmount R42 to set ALNIN/GPIO[3] high.
Figure 11 Setting ALIN
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
6/16
Security E
THAN0190_Rev.1.20_E
7. Clock Input from SMA Connector
THEVA233-V2 can also choose the LVDS clock input from SMA connector by using 0ohm resistors and
LVDS buffer. If you want to use SMA connector for clock input, please mount the 0ohm resistors, LVDS buffer
and so on.
Figure 12 LVDS Clock Input Connector Select
8. Status Indicate LED
The following table shows indicating status of each LED.
Table 2 LED Description
D1
D2
THEVA233-V2
THEVA234-V2
3.3V Power Supply Indicator
LOCKN Status Indicator
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
7/16
Security E
THAN0190_Rev.1.20_E
9. LOCKN Sharing and HTPDN Omission
LOCKN Sharing
LOCKN connection can be shared with V-by-One®HS trace. When you share the LOCKN signal, Please
mount 1k ohm resistors to share the LOCKN signal, and unmount the 0ohm resistors shown in Figure 13.
(a)THEVA233-V2(Top Side)
(b)THEVA234-V2(Top Side)
R13:Unmount
(c) THEVA233-V2 (Bottom Side)
(d) THEVA234-V2 (Bottom Side)
Figure 13 LOCKN Sharing
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
8/16
Security E
THAN0190_Rev.1.20_E
HTPDN Signal Omission
HTPDN signal can be omitted by using 1k ohm resistor. When you omit the HTPDN signal, please mount 1k
ohm resistor to pull down the HTPDN signal at transmitter side, and unmount the 0ohm resistors shown in
Figure 14. When the HTPDN omission using, HTPDN output from receiver side is open connection.
(a)THEVA233-V2 (Top Side)
(b)THEVA234-V2 (Top Side)
R12:Unmount
(c)THEVA233-V2 (Bottom Side)
(d)THEVA234-V2 (Bottom Side)
Figure 14 HTPDN Omission
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
9/16
Security E
THAN0190_Rev.1.20_E
10. Function
This chapter shows function setting of THEVA233-V2 and THEVA234-V2.
Table 3 THEVA233-V2 Function Setting Description
Silk
Pin Name
PDN_1
PDN[1]
PDN_0
PDN[0]
BET
BET
IOSEL
IOSEL
PRE
PRE
MODE_1
MODE[1]
MODE_0
MODE[0]
COL
COL
MSSEL
MSSEL
AIN_0
AIN[0]
AIN_1
AIN[1]
Function
For Sub-Link power down control (2-wire serial interface + Sub-Link)
H: Normal Operation, L: Power Down
For Main-Link power down control (LVDS-Rx + Main-Link)
H: Normal Operation, L: Power Down
Field-BET entry.
H : Field BET Operation, L : Normal Operation
HTPDN, LOCKN pin enable input for Main-Link.
H : HTPDN, LOCKN Pin Disable (GPIO[1:0] Enable)
L : HTPDN, LOCKN Pin Enable (GPIO[1:0] Disable)
When IOSEL inputs H, HTPDN and LOCKN state in THCV234 are
brought by Sub-Link.
Pre-Emphasis level select input for Main-Link.
H : 100%, L : 0%
Operation mode select input for Main-Link.
MODE[1:0] =LL : Single-in/Distribution Dual-out
=LH : Single-in/Single-out
=HL : Single-in/Dual-out
=HH : Reserved (Forbidden)
Data width setting for Main-Link.
H : 24bit, L : 32bit
Master-side/Slave-side selector for Sub-Link and 2-wire serial interface.
H : Sub-Link Slave Side (inside 2-wire serial I/F is master)
L : Sub-Link Master Side (inside 2-wire serial I/F is slave)
Sub-Link Master is connected to HOST MPU.
Forbid the same setting between THCV233 and THCV234.
Address setting for 2-wire serial interface.
When using 2-wire serial interface, it must be set the same value as
THCV234's one.
AIN[1:0] =LL : 7'b0001011
=LH : 7'b0110100
=HL : 7'b1110111
=HH : Reserved (Forbidden)
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
10/16
Security E
THAN0190_Rev.1.20_E
Table 4 THEVA234-V2 Function Setting Description
Silk
Pin Name
PDN_1
PDN[1]
PDN_0
PDN[0]
BET
BET
IOSEL
IOSEL
RS
RS
MODE_1
MODE[1]
MODE_0
MODE[0]
COL
COL
MSSEL
MSSEL
AIN_0
AIN[0]
AIN_1
AIN[1]
Function
For Sub-Link power down control (2-wire serial interface + Sub-Link)
H: Normal Operation, L: Power Down
For Main-Link power down control (LVDS-Rx + Main-Link)
H: Normal Operation, L: Power Down
Field-BET entry.
H : Field BET Operation, L : Normal Operation
HTPDN, LOCKN pin enable input for Main-Link.
H : HTPDN, LOCKN Pin Disable (GPIO[1:0] Enable)
L : HTPDN, LOCKN Pin Enable (GPIO[1:0] Disable)
When IOSEL inputs H, HTPDN and LOCKN state in THCV234 are
brought by Sub-Link.
LVDS output swing range select input.
H : Normal Swing (350mv@typ.)
L : Reduced Swing (200mv@typ.)
Latch select input under Field-BET operation
H : Latched Result, L : NOT Latched Result
Operation mode select input for Main-Link.
MODE[1:0] =LL : Dual-in/Selected single-out(Lane0)
=LH : Dual-in/Single-out
=HL : Dual-in/Selected single-out(Lane1)
=HH : Single-in/Single-out
Data width setting for Main-Link.
H : 24bit, L : 32bit
Master-side/Slave-side selector for Sub-Link and 2-wire serial
interface.
H : Sub-Link Slave Side (inside 2-wire serial I/F is master)
L : Sub-Link Master Side (inside 2-wire serial I/F is slave)
Sub-Link Master is connected to HOST MPU.
Forbid the same setting between THCV233 and THCV234.
Address setting for 2-wire serial interface.
When used 2-wire serial interface, it must be set the same value as
THCV233's one.
AIN[1:0] =LL : 7'b0001011
=LH : 7'b0110100
=HL : 7'b1110111
=HH : Reserved (Forbidden)
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
11/16
Security E
D
C
B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
GND
GND
1
SMA103-T16(NC)
GND
PDN_1 2
VDD3.3
GND
R19
10kΩ(NC)
R21
10kΩ(NC)
R24
10kΩ(NC)
R25
10kΩ(NC)
SMA3
1 R28 0Ω(NC)
VDD3.3
TLAN
TLAP
TLBN
TLBP
TLCN
TLCP
TLCLKN
TLCLKP
TLDN
TLDP
TLEN
TLEP
W2
Solder Jumper
VDD3.3
52271-3069(NC)
CON2
C7
10uF
GND
GND
2
GND
VCC
1
2
A
GND
SML-310MT
D1
150Ω
Header1
PDN_0 2
2
4
GND
R20
R22
C8
10uF
Header2
BET
3HEAD(NC)
2
I2C_PULLUP
CLK0P
CLK0N
R44
0Ω
R47
0Ω
I2C_PULLUP
GND
3HEAD(NC)
SDA
SCL
IC3
16
EN1
1Y
15
EN2
1Z
14
EN3
2Y
13
VCC
2Z
12
GND
3Y
11
A
3Z
10
NC
4Y
9
EN4
4Z
SN65LVDS105D(NC)
1
2
3
4
5
6
7
8
1
3
R1
1
3
INPUT
1
GND GND
2
TLCLKN
TLCLKP
5
6
7
8
GND
GND
GND
GND
Header3
IOSEL
3HEAD(NC)
2
Header 4X2A(NC)
1
2
3
4
P2
0Ω(NC)
0Ω(NC)
TLAN
TLAP
TLBN
TLBP
TLCN
TLCP
TLCLKN
TLCLKP
TLDN
TLDP
TLEN
TLEP
VDD1.8
Header4
PRE
3HEAD(NC)
3
49
37
38
39
40
41
42
43
44
45
46
47
48
2
0Ω
0Ω(NC)
0Ω(NC)
0Ω(NC)
LAVDH
EXPGND
TLATLA+
TLBTLB+
TLCTLC+
TLCLKTLCLK+
TLDTLD+
TLETLE+
LAVDH
GND
C4
10uF
LAVDH
Header5
L5
4
Inductor
MPZ1608R471A
R43
R46
R48
R50
MODE_1 2
3HEAD(NC)
Inductor
MPZ1608R471A
L4
ALNIN/GPIO_3
INT/GPIO_2
HTPDN/GPIO_1
LOCKN/GPIO_0
Bottom Side
IC1
C9
10uF
GND
1
3
R40 0Ω
R41 0Ω
OUTPUT
3
uPC2918BT
1
3
GND
C5
10uF
IC2
THCV233
4
Header6
MODE_0 2
3HEAD(NC)
ALNIN/GPIO_3_H
INT/GPIO_2_H
HTPDN/GPIO_1_H
LOCKN/GPIO_0_H
L6
Header7
COL
3HEAD(NC)
5
6
7
8
24
23
22
21
20
19
18
17
16
15
14
13
2
CMN_PULLUP
0.1uF
0.1uF
GND
5
Header8
MSSEL 2
R42
R45
R49
R51
Header9
AIN_0 2
3HEAD(NC)
ALNIN/GPIO_3_S
INT/GPIO_2_S
LOCKN/GPIO_0_S
HTPDN/GPIO_1_S
C21
C22
CPVDL
0Ω(NC)
R8
R30 0Ω(NC) TX1P_A
R32 0Ω(NC) TCMN_A
R33 0Ω(NC) TCMP_A
TX1P_C
TCMN_C
TCMP_C
6
AIN_1 2
Header10
Header11
3HEAD(NC)
Date:
File:
A3
Size
CON4
R11
R12
R13
R14
TX1N_C
TX1P_C
TCMN_C
TCMP_C
TCMN_A
TX1P_A
TX1N_A
TX0P_A
TX0N_A
R10
7
2015/03/05
\\..\THCV233.SchDoc
Number
R9
TX0P_C
TX0N_C
LOCKN/GPIO_0R6
HTPDN/GPIO_1 R5
GND
C2
10uF
CPVDL
TCMP_A
GND CN-FFC(0.5)19PD(NC)
THEVA233-V2
R29 0Ω(NC) TX1N_A
TX1N_C
Title
R26 0Ω(NC) TX0P_A
TX0P_C
Bottom Side
R23 0Ω(NC) TX0N_A
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
VDD3.3
GND
D2
SML-310MT
150Ω
R2
L2
Inductor
MPZ1608R471A
W3
Solder Jumper
TX0N_C
LOCKN/GPIO_0R17 0Ω(NC)
3HEAD(NC)
GND
0Ω
0Ω(NC)
0Ω(NC)
0Ω(NC)
GND
U1
SSM3K16FS
7
VDD1.8
VDD3.3
CAVDL
C1
10uF
GND
HTPDN/GPIO_1 R16 0Ω(NC)
TX1N_C
TX1P_C
TX0N_C
TX0P_C
1kΩ(NC)
R7
10kΩ
10kΩ
TCMN_C
TCMP_C
0.1uF
0.1uF
C15
C16
C17 0.1uF
C18 0.1uF
0.1uF
0.1uF
C13
C14
L1
Inductor
MPZ1608R471A
VDD1.8
R4
VDD
6
R3
GND
TX1N
TX1P
C3
10uF
GND
LAVDH
TX0N
TX0P
HTPDN/GPIO_1
LOCKN/GPIO_0
C12 0.1uF
CAVDL
Header 4(NC)
3HEAD(NC)
1
2
3
4
C6
10uF
L3
Inductor
MPZ1608R471A
VDD1.8
CMN_PULLUP
GND
5
Header 4X2A(NC)
P3
1
2
3
4
P1
VDD
HTPDN/GPIO[1]
LOCKN/GPIO[0]
CAVDL
CAGND
TX0N
TX0P
CAGND
TX1N
TX1P
CAGND
CAVDL
CPVDL
VDD
Inductor
MPZ1608R471A
VDD3.3
I2C_PULLUP
MSSEL
VDD3.3
1
3
LAVDH
LAGND
COL
ALNIN/GPIO[3]
INT/GPIO[2]
VSS
VDD
SDA
SCL
TCMP
TCMN
MSSEL
C19 0.1uF
1
2
COL
3
ALNIN/GPIO_3 4
INT/GPIO_2
5
6
C20 0.1uF
7
SDA
8
SCL
9
10
11
12
1
3
282836-2(NC)
CON1
1
3
0.1uF
C11
AIN_1
AIN_0
MODE_1
MODE_0
LAVDH
LAGND
AIN[1]
AIN[0]
MODE[1]
MODE[0]
VDD
PRE
IOSEL
BET
PDN[1]
PDN[0]
36
35
34
33
32
31
30
29
28
27
26
25
C10 0.1uF
PRE
IOSEL
BET
PDN_1
PDN_0
VDD3.3
1
3
VDD3.3
1
3
R35 0Ω(NC)
R36 0Ω(NC)
R37 0Ω(NC)
R38 0Ω(NC)
3
1
3
2
1
3
R15
0Ω(NC)
R18
0Ω(NC)
SMA2
1
SMA4
1
SMA5
1
SMA6
1
SMA7
1
Sheet 1 of 1
Drawn By:
8
1.00
GND
Revision
SMA103-T16(NC)
R39
0Ω(NC)
SMA103-T16(NC)
R34
0Ω(NC)
SMA103-T16(NC)
R31
0Ω(NC)
SMA103-T16(NC)
R27
0Ω(NC)
SMA103-T16(NC)
CON3
B
A
D
C
52271-1469(NC)
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SMA1
1
GND
SMA103-T16(NC)
0Ω
0Ω
0Ω
0Ω
0Ω
0Ω
0Ω
0Ω
W1
Solder Jumper
VDD3.3
8
2
2
2
2
12/16
2
Copyright(C) 2015 THine Electronics, Inc.
2
1
THAN0190_Rev.1.20_E
11. Schematic
Figure 15 THEVA233-V2 Schematic
THine Electronics, Inc.
Security E
D
C
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
PDN_1 2
VDD3.3
RCMP_A
RCMN_A
RX1P_A
RX1N_A
RX0P_A
RX0N_A
GND
Header1
0Ω
0Ω
0Ω
0Ω
0Ω
R4
R5
R7
R8
R9
R10
4
GND
CON4
RCMP_C
RCMN_C
RX1P_C
RX1N_C
RX0P_C
RX0N_C
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BET
2
Header2
2
IOSEL
3HEAD(NC)
Header3
RCMP_A R31
RCMN_A R25
RX1P_A R19
2
Header4
3
RS
3HEAD(NC)
Bottom Side
GND
0Ω(NC) RX0P_C
RX0P_A R16
2
Header5
MODE_1 2
3HEAD(NC)
0Ω(NC) RCMP_C
0Ω(NC) RCMN_C
0Ω(NC) RX1P_C
0Ω(NC) RX1N_C
0Ω(NC) RX0N_C
0Ω(NC) LOCKN/GPIO_0
Header6
4
MODE_0 2
3HEAD(NC)
GND
Header7
COL
3HEAD(NC)
EXPGND
HTPDN/GPIO[1]
LOCKN/GPIO[0]
CAGND
RX0N
RX0P
CAVDL
CAGND
RX1N
RX1P
CAGND
CAVDL
BET
2
Header8
C6
10uF
L3
IC2
THCV234
5
Header9
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
AIN_0 2
3HEAD(NC)
GND
R33
R35
R38
R40
R43
6
6
7
8
9
10
GND
Header 5(NC)
1
2
3
4
5
Date:
File:
A3
Size
Title
L2
1
2
3
4
DGLOCK/GPIO_4_H
ALNOUT/GPIO_3_H
INT/GPIO_2_H
HTPDN/GPIO_1_H
LOCKN/GPIO_0_H
Number
7
2015/03/05
\\..\THCV234.SchDoc
R34
R36
R37
R39
R42
52271-3069(NC)
CON2
8
Sheet 1 of 1
Drawn By:
8
Revision
DGLOCK/GPIO_4
ALNOUT/GPIO_3
INT/GPIO_2
HTPDN/GPIO_1
LOCKN/GPIO_0
1.00
0Ω
SDA
0Ω
SCL
I2C_PULLUP
GND
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
R22
R23
I2C_PULLUP
GND
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
VDD3.3
W1
Solder Jumper
RLAN
RLAP
RLBN
RLBP
RLCN
RLCP
RLCLKN
RLCLKP
RLDN
RLDP
RLEN
RLEP
Header 4X2A(NC)
GND
5
GND
6
GND
7
GND
8
P1
CPVDL
C2
10uF
GND
Inductor
MPZ1608R471A
VDD1.8
7
THEVA234-V2
CAVDL
C1
10uF
Header 5X2A(NC)
P3
1
2
3
4
5
P2
RLAN
RLAP
RLBN
RLBP
RLCN
RLCP
RLCLKN
RLCLKP
RLDN
RLDP
RLEN
RLEP
3HEAD(NC)
Header11
L1
Inductor
MPZ1608R471A
VDD1.8
DGLOCK/GPIO_4_S
ALNOUT/GPIO_3_S
INT/GPIO_2_S
HTPDN/GPIO_1_S
LOCKN/GPIO_0_S
AIN_1 2
Header10
24
23
22
21
20
19
18
17
16
15
14
13
LAVDH
CMN_PULLUP
3HEAD(NC)
VDD
6
LAVDH
RLARLA+
RLBRLB+
RLCRLC+
RLCLKRLCLK+
RLDRLD+
RLERLE+
GND
C3
10uF
GND
Inductor
MPZ1608R471A
VDD1.8
CMN_PULLUP
GND
MSSEL 2
3HEAD(NC)
C20 0.1uF
C21 0.1uF
VDD
49
HTPDN/GPIO_1 37
LOCKN/GPIO_0 38
39
RX0N
40
RX0P
41
C14 0.1uF
42
43
RX1N
44
RX1P
45
46
C17 0.1uF
47
BET
48
CAVDL
VDD
L6
5
Inductor
MPZ1608R471A
VDD3.3
I2C_PULLUP
C5
10uF
GND
Inductor
MPZ1608R471A
L5
RCMN_C
RCMP_C
C15 0.1uF
C16 0.1uF
RX1N_C
RX1P_C
0Ω(NC) HTPDN/GPIO_1
R6
1kΩ(NC)
C12 0.1uF
C13 0.1uF
RX0N_C
RX0P_C
R13
RX1N_A R18
LAVDH
C4
10uF
GND
Inductor
MPZ1608R471A
L4
R12
VDD1.8
RX0N_A R15
W3
Solder Jumper
VDD3.3
LOCKN/GPIO_0
IC1
C9
10uF
GND
HTPDN/GPIO_1
C8
10uF
CN-FFC(0.5)19PD(NC)
3HEAD(NC)
0Ω
0Ω
R3
0Ω
R2
PDN_0 2
3HEAD(NC)
SMA103-T16(NC)
SMA6
1 R41
SMA103-T16(NC)
SMA5
1 R32
SMA103-T16(NC)
SMA4
1 R24
SMA103-T16(NC)
0Ω(NC)
SMA103-T16(NC)
SMA3
1 R17
1
0Ω(NC)
GND
SMA103-T16(NC)
SMA2
1 R14
GND
14
13
12
11
10
9
8
7
6
5
4
3
2
1
GND
SML-310MT
D1
150Ω
W2
Solder Jumper
VDD3.3
52271-1469(NC)
CON3
SMA1
1 R11
2
2
2
2
2
2
B
GND
2
GND
VCC
1
GND
C7
10uF
1
3
R1
1
3
A
1
3
INPUT
1
GND GND
2
OUTPUT
3
uPC2918BT
1
3
VDD3.3
1
3
282836-2(NC)
CON1
1
3
4
1
3
VDD3.3
1
3
VDD3.3
1
3
1
3
36 DGLOCK/GPIO_4
35
PDN_0
34
PDN_1
33
IOSEL
32
RS
31
C10 0.1uF
30
MODE_0
29
MODE_1
28
AIN_0
27
AIN_1
26
25
C11 0.1uF
DGLOCK/GPIO[4]
PDN[0]
PDN[1]
IOSEL
RS
VDD
MODE[0]
MODE[1]
AIN[0]
AIN[1]
LAGND
LAVDH
MSSEL
RCMN
RCMP
SCL
SDA
VDD
VSS
INT/GPIO[2]
ALNOUT/GPIO[3]
COL
LAGND
LAVDH
MSSEL
1
2
3
SCL
4
SDA
5
C18 0.1uF
6
7
INT/GPIO_2
8
ALNOUT/GPIO_3 9
COL
10
11
C19 0.1uF
12
R28
R29
R30
R26
R27
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
0Ω(NC)
3
2
1
3
13/16
0Ω(NC)
0Ω(NC)
Copyright(C) 2015 THine Electronics, Inc.
R20
R21
1
D
C
B
A
THAN0190_Rev.1.20_E
Figure 16 THEVA234-V2 Schematic
THine Electronics, Inc.
Security E
THAN0190_Rev.1.20_E
12. Bills of Materials
Table 5 THEVA233-V2 BOM
TYPE
Capacitor
Value / Part No.
10uF
Capacitor
0.1uF
Connector
Connector
Connector
Connector
Connector
SMA103-T16(NC)
52271-3069(NC)
CN-FFC(0.5)19PD(NC)
52271-1469(NC)
282836-2(NC)
Header
3HEAD(NC)
Header
Header
IC
IC
IC
IC
Inductor
LED0
Resistor
Resistor
Resistor
Resistor
Resistor
Header 4(NC)
Header 4X2A(NC)
SN65LVDS105D(NC)
THCV233
uPC2918BT
SSM3K16FS
MPZ1608R471A
SML-310MT
150Ω
150Ω
10kΩ(NC)
10kΩ
1kΩ(NC)
Resistor
0Ω(NC)
Resistor
0Ω
Package
2012
SPEC
16V
Reference No.
C1, C2, C3, C4, C5, C6, C7, C8, C9
C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21,
1005
16V
C22
1.6mm
PCB End Jack SMA1, SMA2, SMA3, SMA4, SMA5, SMA6, SMA7
1mm_pitch
30pin
CON2
0.5mm_pitch
19pin
CON4
1mm_pitch
14pin
CON3
5mm_pitch
2pin
CON1
Header1, Header2, Header3, Header4, Header5, Header6,
2.54mm_pitch
--Header7, Header8, Header9, Header10, Header11
2.54mm_pitch
--P3
2.54mm_pitch
--P1, P2
TSSOP
4V
IC3
QFN48
--IC2
SC-63
1A
IC1
SSM
RON15Ω
U1
1608
1.2A
L1, L2, L3, L4, L5, L6
1608
GREEN
D1, D2
1005
0.1W
R1
1005
0.1W
R2
1005
0.1W
R19, R21, R24, R25
1005
0.1W
R3, R4
1005
0.1W
R7
R8, R15, R16, R17, R18, R20, R22, R23, R26, R27, R28, R29,
1005
0.1W
R30, R31, R32, R33, R34, R35, R36, R37, R38, R39, R45, R46,
R48, R49, R50, R51
R5, R6, R9, R10, R11, R12, R13, R14, R40, R41, R42, R43, R44,
1005
0.1W
R47
Q'ty Note
9
13
7
1
1
1
1
11
1
2
1
1
1
1
6
2
1
1
4
2
1
29
14
Table 6 THEVA234-V2 BOM
TYPE
Capacitor
Capacitor
Connector
Connector
Connector
Connector
Connector
Value / Part No.
10uF
0.1uF
282836-2(NC)
52271-3069(NC)
52271-1469(NC)
CN-FFC(0.5)19PD(NC)
SMA103-T16(NC)
Package
2012
1005
5mm_pitch
1mm_pitch
1mm_pitch
0.5mm_pitch
1.6mm
SPEC
16V
16V
2pin
30pin
14pin
19pin
PCB End Jack
Header
3HEAD(NC)
2.54mm_pitch
---
Header
Header
Header
IC
IC
Inductor
LED0
Resistor
Resistor
Resistor
Header 4X2A(NC)
Header 5X2A(NC)
Header 5(NC)
uPC2918BT
THCV234
MPZ1608R471A
SML-310MT
150Ω
0Ω
1kΩ(NC)
2.54mm_pitch
2.54mm_pitch
2.54mm_pitch
SC-63
QFN48
1608
1608
1005
1005
1005
------1A
--1.2A
GREEN
0.1W
1A
0.1W
Resistor
0Ω(NC)
1005
1A
Reference No.
C1, C2, C3, C4, C5, C6, C7, C8, C9
C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21
CON1
CON2
CON3
CON4
SMA1, SMA2, SMA3, SMA4, SMA5, SMA6
Header1, Header2, Header3, Header4, Header5, Header6,
Header7, Header8, Header9, Header10, Header11
P1
P2
P3
IC1
IC2
L1, L2, L3, L4, L5, L6
D1
R1
R2, R3, R4, R5, R7, R8, R9, R10, R22, R23
R6
R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R24,
R25, R26, R27, R28, R29, R30, R31, R32, R33, R34, R35, R36,
R37, R38, R39, R40, R41, R42, R43
Q'ty Note
9
12
1
1
1
1
6
11
1
1
1
1
1
6
1
1
10
1
31
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
14/16
Security E
THAN0190_Rev.1.20_E
13. Set Items
Table 7 Set Items
TYPE
Part No.
DC Connector
282836-2
FFC Connector for V-by-One®HS Link
52271-1469
FFC 14pin 1mm pitch for V-by-One®HS Link
98267-0299
Pin Header
---
It’s possible to mount these parts on this board and use.
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
15/16
Security E
THAN0190_Rev.1.20_E
14. Notices and Requests
Please kindly read, understand and accept this “Notices and Requests” before using this product.
For the Material:
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always
apply to design of respective customers. THine Electronics, Inc. (“THine”) is not responsible for
possible errors and omissions in this material. Please note if the errors or omissions should be found in
this material, THine may not be able to correct them immediately.
3. This material contains THine’s copyright, know-how or other proprietary. Copying or disclosing of the
contents of this material to any third party without THine’s prior permission is strictly prohibited.
For the Product:
1. This product is solely designed for evaluation purpose, and other purposes including mass production
and distribution are not intended.
2. This product has been solely manufactured for electric design engineers but not for end-users.
3. This product is not radiation-tolerant product.
4. This product is presumed to be used for general electric device, not for applications which require
extremely high-reliability/safety (including medical device concerned with critical care, aerospace
device, or nuclear power control device). Also, when using this product for any device concerned with
control and/or safety of transportation mean, traffic signal device, or other various types of safety
device, such use must be after applying appropriate measures to the product.
5. This product has been designed with the utmost care to accomplish the purpose of evaluation of IC
products manufactured by THine Electronics, Inc., however, THine MAKES NO WARRANTIES OR
REPRESENTATIONS WITH REGARD TO ANY PERFORMANCE OR FUNCTION OF THIS
PRODUCT IN ANY CIRCUMSTANCE.
6. This product has been manufactured with the utmost care in quality control and product reliability,
however, there may be faults or defects with a low but fixed probability, as inevitable phenomenon
concerned with semiconductor manufacturing processes. Therefore, Customers are encouraged to have
sufficiently redundant or error-preventive design applied to the use of the product so as not to have
THine’s product cause any social or public damage. Replacement of the product is only available in
case of obvious defects of mount devices at the point of unpacking the product. Neither replacement
nor failure analysis of the product is available in any other case of defects with the product and/or the
product’s components.
7. Customers are asked, if required, to judge by themselves on whether this product falls under the
category of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
8. Please Note that if infringement of any third party’s industrial ownership should occur by using this
product, THine will be exempted from any responsibility unless it directly relates to the production
process or functions of the product.
9. Developing, designing and manufacturing of Customers’ own products, equipments or system by using
of this product is strictly prohibited in any way.
THine Electronics, Inc.
[email protected]
THine Electronics, Inc.
Copyright(C) 2015 THine Electronics, Inc.
16/16
Security E