AD ADG408BCHIPS

LC2MOS 4-/8-Channel
High Performance Analog Multiplexers
ADG408/ADG409
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
44 V supply maximum ratings
VSS to VDD analog signal range
Low on resistance (100 Ω maximum)
Low power (ISUPPLY < 75 μA)
Fast switching
Break-before-make switching action
Plug-in replacement for DG408/DG409
ADG408
ADG409
S1
S1A
DA
S4A
D
S1B
DB
S8
1-OF-8
DECODER
Audio and video routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems
1-OF-4
DECODER
A0 A1 A2 EN
A0
A1
EN
00027-001
APPLICATIONS
S4B
Figure 1.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG408/ADG409 are monolithic CMOS analog multiplexers
comprising eight single channels and four differential channels,
respectively. The ADG408 switches one of eight inputs to a
common output as determined by the 3-bit binary address lines
A0, A1, and A2. The ADG409 switches one of four differential
inputs to a common differential output, as determined by the
2-bit binary address lines A0 and A1. An EN input on both devices
is used to enable or disable the device. When the device is disabled,
all channels are switched off.
1.
Extended Signal Range. The ADG408/ADG409 are
fabricated on an enhanced LC2MOS process, giving an
increased signal range that extends to the supply rails.
2.
Low Power Dissipation.
3.
Low RON.
4.
Single-Supply Operation. For applications where the
analog signal is unipolar, the ADG408/ADG409 can be
operated from a single rail power supply. The parts are
fully specified with a single 12 V power supply and remain
functional with single supplies as low as 5 V.
The ADG408/ADG409 are designed on an enhanced LC2MOS
process that provides low power dissipation yet gives high
switching speed and low on resistance. Each channel conducts
equally well in both directions when on and has an input signal
range that extends to the supplies. In the off condition, signal
levels up to the supplies are blocked. All channels exhibit breakbefore-make switching action, preventing momentary shorting
when switching channels. Inherent in the design is low
charge injection for minimum transients when switching the
digital inputs.
The ADG408/ADG409 are improved replacements for the
DG408/DG409 analog multiplexers.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
ADG408/ADG409
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................6
Applications....................................................................................... 1
ESD Caution...................................................................................6
Functional Block Diagrams............................................................. 1
Pin Configurations and Function Descriptions ............................7
General Description ......................................................................... 1
Typical Performance Characteristics ..............................................8
Product Highlights ........................................................................... 1
Test Circuits..................................................................................... 11
Revision History ............................................................................... 2
Terminology .................................................................................... 13
Specifications..................................................................................... 3
Outline Dimensions ....................................................................... 14
Dual Supply ................................................................................... 3
Ordering Guide .......................................................................... 16
Single Supply ................................................................................. 4
REVISION HISTORY
10/06—Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to Table 3............................................................................ 6
Inserted Table 4 and Table 5............................................................ 7
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 15
3/03—Rev. A to Rev. B
Changes to Ordering Guide .............................................................4
Updated Outline Dimensions....................................................... 11
2/01—Revision 0: Initial Version
Rev. C | Page 2 of 16
ADG408/ADG409
SPECIFICATIONS
DUAL SUPPLY
VDD = 15 V, VSS = −15 V, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
RON
∆RON
LEAKAGE CURRENTS
Source Off Leakage IS (OFF)
Drain Off Leakage ID (OFF)
ADG408
ADG409
Channel On Leakage ID, IS (ON)
ADG408
ADG409
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS 1
tTRANSITION
B Version
−40ºC to
+25ºC
+85ºC
T Version
−55ºC to
+25ºC
+125ºC
VSS to VDD
40
100
15
125
±0.5
VSS to VDD
Unit
V
Ω typ
Ω max
Ω max
Test Conditions/Comments
40
100
15
125
±50
±0.5
±50
nA max
±1
±1
±100
±50
±1
±1
±100
±50
nA max
nA max
±1
±1
±100
±50
±1
±1
±100
±50
nA max
nA max
2.4
0.8
V min
V max
±10
μA max
pF typ
VIN = 0 or VDD
f = 1 MHz
120
250
10
ns typ
ns max
ns min
125
225
65
150
RL = 300 Ω, CL = 35 pF;
VS1 = ±10 V, VS8 = m 10 V; see Figure 22
RL = 300 Ω, CL = 35 pF;
VS = 5 V; see Figure 23
RL = 300 Ω CL = 35 pF;
VS = 5 V; see Figure 24
RL = 300 Ω, CL = 35 pF;
VS = 5 V; see Figure 24
VS = 0 V, RS = 0 Ω, CL = 10 nF; see Figure 25
RL = 1 kΩ, f = 100 kHz;
VEN = 0 V; see Figure 26
RL = 1 kΩ, f = 100 kHz; see Figure 27
f = 1 MHz
f = 1 MHz
VD = ±10 V, IS = −10 mA
VD = +10 V, −10 V
VD = ±10 V, VS = m 10 V; see Figure 19
VD = ±10 V; VS = m 10 V; see Figure 20
VS = VD = ±10 V; see Figure 21
2.4
0.8
±10
8
tOPEN
10
tON (EN)
85
150
8
120
250
10
Charge Injection
OFF Isolation
20
−75
20
−75
ns typ
ns max
ns typ
ns max
pC typ
dB typ
Channel-to-Channel Crosstalk
CS (OFF)
CD (OFF)
ADG408
ADG409
CD, CS (ON)
ADG408
ADG409
85
11
85
11
dB typ
pF typ
40
20
40
20
pF typ
pF typ
54
34
54
34
pF typ
pF typ
tOFF (EN)
125
225
65
150
10
85
150
f = 1 MHz
Rev. C | Page 3 of 16
ADG408/ADG409
Parameter
POWER REQUIREMENTS
IDD
B Version
−40ºC to
+85ºC
+25ºC
1
5
1
5
ISS
IDD
1
T Version
−55ºC to
+125ºC
+25ºC
100
200
1
5
1
5
100
200
500
500
Unit
Test Conditions/Comments
μA typ
μA max
μA typ
μA max
μA typ
μA max
VIN = 0 V, VEN = 0 V
VIN = 0 V, VEN = 2.4 V
Guaranteed by design, not subject to production test.
SINGLE SUPPLY
VDD = 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
RON
LEAKAGE CURRENTS
Source Off Leakage IS (OFF)
Drain Off Leakage ID (OFF)
ADG408
ADG409
Channel On Leakage ID, IS (ON)
ADG408
ADG409
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS 1
tTRANSITION
tOPEN
B Version
−40ºC to
+25ºC +85ºC
T Version
−55ºC to
+25°C
+125ºC
0 to VDD
90
0 to VDD
90
Unit
Test Conditions/Comments
V
Ω typ
VD = 3 V, 10 V, IS = –1 mA
±0.5
±50
±0.5
±50
nA max
±1
±1
±100
±50
±1
±1
±100
±50
nA max
nA max
±1
±1
±100
±50
±1
±1
±100
±50
nA max
nA max
2.4
0.8
V min
V max
±10
VD = 8 V/0 V, VS = 0 V/8 V; see Figure 19
VD = 8 V/0 V, VS = 0 V/8 V; see Figure 20
VS = VD = 8 V/0 V; see Figure 21
2.4
0.8
8
±10
8
μA max
pF typ
VIN = 0 or VDD
f = 1 MHz
130
130
ns typ
10
10
ns typ
RL = 300 Ω, CL = 35 pF;
VS1 = 8 V/0 V, VS8 = 0 V/8 V; see Figure 22
RL = 300 Ω, CL = 35 pF;
tON (EN)
140
140
ns typ
tOFF (EN)
60
60
ns typ
Charge Injection
Off Isolation
5
–75
5
–75
pC typ
dB typ
Rev. C | Page 4 of 16
VS = 5 V; see Figure 23
RL = 300 Ω CL = 35 pF;
VS = 5 V; see Figure 24
RL = 300 Ω, CL = 35 pF;
VS = 5 V; see Figure 24
VS = 0 V, RS = 0Ω, CL = 10 nF; see Figure 25
RL = 1 kΩ f = 100 kHz;
VEN = 0 V; see Figure 26
ADG408/ADG409
Parameter
Channel-to-Channel Crosstalk
CS (OFF)
CD (OFF)
ADG408
ADG409
CD, CS (ON)
ADG408
ADG409
POWER REQUIREMENTS
IDD
IDD
1
B Version
−40ºC to
+25ºC +85ºC
85
11
T Version
−55ºC to
+125ºC
+25°C
85
11
Unit
dB typ
pF typ
40
20
40
20
pF typ
pF typ
54
34
54
34
pF typ
pF typ
Test Conditions/Comments
RL = 1 kΩ, f = 100 kHz; see Figure 27
f = 1 MHz
f = 1 MHz
f = 1 MHz
1
5
100
200
500
1
5
100
200
500
Guaranteed by design, not subject to production test.
Rev. C | Page 5 of 16
μA typ
μA max
μA typ
μA max
VIN = 0 V, VEN = 0 V
VIN = 0 V, VEN = 2.4 V
ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog, Digital Inputs
Continuous Current, S or D
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
Operating Temperature Range
Industrial (B Version)
Extended (T Version)
Storage Temperature Range
Junction Temperature
CERDIP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
(10 sec)
PDIP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
(10 sec)
TSSOP Package, Power Dissipation
θJA, Thermal Impedance
θJC, Thermal Impedance
SOIC Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
44 V
−0.3 V to +32 V
+0.3 V to −32 V
VSS − 2 V to VDD + 2 V or 20 mA,
whichever occurs first
20 mA
40 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
−40° C to +85°C
−55° C to +125°C
−65° C to +150°C
150°C
900 mW
76°C/W
300°C
470 mW
117°C/W
260°C
450 mW
155°C/W
50°C/W
600 mW
77°C/W
215°C
220°C
Rev. C | Page 6 of 16
ADG408/ADG409
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
16 A1
EN 2
VSS 3
ADG408
14 GND
TOP VIEW 13 VDD
S2 5 (Not to Scale) 12 S5
S3 6
11 S6
S4 7
10 S7
D 8
9
S8
00027-002
S1 4
15 A2
A0
1
16
A1
EN
2
15
GND
VSS
3
S1A
4
S2A
5
S3A
6
11
S3B
S4A
7
10
S4B
DA
8
9
DB
ADG409
VDD
TOP VIEW
(Not to Scale) 13 S1B
12 S2B
14
00027-003
A0 1
Figure 2. ADG408 Pin Configuration
Figure 3. ADG409 Pin Configuration
Table 4. ADG408 Pin Function Descriptions
Table 5. ADG409 Pin Function Descriptions
Pin
No.
1
2
Mnemonic
A0
EN
Pin
No.
1
2
Mnemonic
A0
EN
3
VSS
3
VSS
4
S1
4
S1A
5
S2
5
S2A
6
S3
6
S3A
7
S4
7
S4A
8
D
8
DA
9
S8
9
DB
10
S7
10
S4B
11
S6
11
S3B
12
S5
12
S2B
13
14
15
16
VDD
GND
A2
A1
13
S1B
14
15
16
VDD
GND
A1
Description
Logic Control Input.
Active High Digital Input. When low, the
device is disabled and all switches are off.
When high, Ax logic inputs determine on
switches.
Most Negative Power Supply Potential in
Dual Supplies. In single-supply applications,
it can be connected to ground.
Source Terminal 1. Can be an input or
an output.
Source Terminal 2. Can be an input or
an output.
Source Terminal 3. Can be an input or
an output.
Source Terminal 4. Can be an input or
an output.
Drain Terminal. Can be an input or an
output.
Source Terminal 8. Can be an input or
an output.
Source Terminal 7. Can be an input or
an output.
Source Terminal 6. Can be an input or
an output.
Source Terminal 5. Can be an input or
an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Table 6. ADG408 Truth Table
A2
X
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
Description
Logic Control Input.
Active High Digital Input. When low, the
device is disabled and all switches are off.
When high, Ax logic inputs determine on
switches.
Most Negative Power Supply Potential in
Dual Supplies. In single-supply applications,
it can be connected to ground.
Source Terminal 1A. Can be an input or
an output.
Source Terminal 2A. Can be an input or
an output.
Source Terminal 3A. Can be an input or
an output.
Source Terminal 4A. Can be an input or
an output.
Drain Terminal A. Can be an input or an
output.
Drain Terminal B. Can be an input or an
output.
Source Terminal 4B. Can be an input or
an output.
Source Terminal 3B. Can be an input or
an output.
Source Terminal 2B. Can be an input or
an output.
Source Terminal 1B. Can be an input or
an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Table 7. ADG409 Truth Table
ON SWITCH
NONE
1
2
3
4
5
6
7
8
A1
X
0
0
1
1
Rev. C | Page 7 of 16
A0
X
0
1
0
1
EN
0
1
1
1
1
ON SWITCH
PAIR
NONE
1
2
3
4
ADG408/ADG409
TYPICAL PERFORMANCE CHARACTERISTICS
120
180
TA = 25°C
TA = 25°C
160
VDD = +5V
VSS = –5V
100
VDD = 5V
VSS = 0V
140
RON (Ω)
80
VDD = +10V
VSS = –10V
RON (Ω)
VDD = +12V
VSS = –12V
60
120
VDD = 12V
VSS = 0V
VDD = 10V
VSS = 0V
100
80
VDD = +15V
VSS = –15V
–10
–5
0
VD [VS] (V)
5
10
15
40
00027-004
20
–15
130
VDD = +15V
VSS = –15V
9
12
15
VDD = 12V
VSS = 0V
120
110
70
RON (Ω)
RON (Ω)
6
Figure 7. RON as a Function of VD (VS): Single-Supply Voltage
80
125°C
60
85°C
50
100
125°C
90
85°C
80
25°C
30
–15
–10
70
–5
0
5
10
15
VD [VS] (V)
60
00027-005
40
Figure 5. RON as a Function of VD (VS) for Different Temperatures
25°C
0
2
4
6
VD [VS] (V)
8
10
12
Figure 8. RON as a Function of VD (VS) for Different Temperature
0.2
0.04
TA = 25°C
VDD = +15V
VSS = –15V
TA = 25°C
VDD = 12V
VSS = 0V
LEAKAGE CURRENT (nA)
0.02
0.1
IS (OFF)
0
ID (OFF)
ID (ON)
–0.1
ID (ON)
0
ID (OFF)
IS (OFF)
–0.02
–0.2
–15
–10
–5
0
VD [VS] (V)
5
10
15
Figure 6. Leakage Currents as a Function of VD (VS)
–0.06
0
2
4
6
VD [VS] (V)
8
10
Figure 9. Leakage Currents as a Function of VD (VS)
Rev. C | Page 8 of 16
12
00027-009
–0.04
00027-006
LEAKAGE CURRENT (nA)
3
00027-008
90
0
VD [VS] (V)
Figure 4. RON as a Function of VD (VS): Dual-Supply Voltage
100
VDD = 15V
VSS = 0V
60
00027-007
40
ADG408/ADG409
120
140
VDD = 12V
VSS = 0V
VDD = +15V
VSS = –15V
120
TIME (ns)
TIME (ns)
80
tON (EN)
60
1
3
5
7
80
60
9
11
13
15
VIN (V)
40
00027-010
20
100
tOFF (EN)
40
tON (EN)
tOFF (EN)
1
3
5
7
VIN (V)
9
11
13
00027-013
tTRANSITION
100
tTRANSITION
Figure 13. Switching Time vs. VIN (Single Supply)
Figure 10. Switching Time vs. VIN (Bipolar Supply)
400
300
VIN = 5V
VIN = 5V
300
200
TIME (ns)
tON (EN)
200
tTRANSITION
tON (EN)
100
100
5
7
9
11
VSUPPLY (V)
13
15
0
00027-011
0
tOFF (EN)
tOFF (EN)
±5
Figure 11. Switching Time vs. Single Supply
±7
±9
±11
VSUPPLY (V)
±13
±15
00027-014
TIME (ns)
tTRANSITION
Figure 14. Switching Time vs. Bipolar Supply
10k
10k
VDD = +15V
VSS = –15V
VDD = +15V
VSS = –15V
ISS (µA)
100
1k
EN = 2.4V
10
EN = 0V
EN = 2.4V
0
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
Figure 12. Positive Supply Current vs. Switching Frequency
–10
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
Figure 15. Negative Supply Current vs. Switching Frequency
Rev. C | Page 9 of 16
00027-015
EN = 0V
100
00027-012
IDD (µA)
1k
ADG408/ADG409
110
110
VDD = +15V
VSS = –15V
VDD = +15V
VSS = –15V
100
CROSSTALK (dB)
90
90
80
80
70
1k
10k
100k
FREQUENCY (Hz)
1M
Figure 16. Off Isolation vs. Frequency
60
1k
10k
100k
FREQUENCY (Hz)
Figure 17. Crosstalk vs. Frequency
Rev. C | Page 10 of 16
1M
00027-017
70
00027-016
OFF ISOLATION (dB)
100
ADG408/ADG409
TEST CIRCUITS
IDS
S1
VSS
VDD
VSS
S2
D
S8
D
GND
VS
RON = V1/IDS
Figure 20. ID (OFF)
VDD
VSS
VDD
VSS
VDD
VSS
VDD
VSS
S1
A
VS
S2
D
S8
0.8V
GND
VD
EN
ID (ON)
GND
VS
Figure 19. IS (OFF)
50%
EN
A
2.4V
VD
Figure 21. ID (ON)
3V
ADDRESS
DRIVE (VIN)
D
S8
00027-019
IS (OFF)
A
VD
Figure 18. On Resistance
S1
ID (OFF)
0.8V
00027-018
VS
EN
00027-021
S
00027-020
V1
VDD
50%
tr < 20ns
tf < 20ns
VDD
VSS
VDD
VSS
A0
0V
VIN
S1
A1
50Ω
A2
tTRANSITION
VS1
S2–S7
tTRANSITION
VS8
S8
ADG4081
90%
2.4V
OUTPUT
OUTPUT
D
EN
300Ω
GND
35pF
00027-022
90%
1SIMILAR CONNECTION FOR ADG409.
Figure 22. Switching Time of Multiplexer, tTRANSlTlON
3V
ADDRESS
DRIVE (VIN)
VDD
VSS
VDD
VSS
A0
VIN
0V
S1
A1
50Ω
VS
S2–S7
A2
S8
80%
ADG4081
80%
OUTPUT
2.4V
OUTPUT
D
EN
GND
300Ω
35pF
1SIMILAR CONNECTION FOR ADG409.
Figure 23. Break-Before-Make Delay, tOPEN
Rev. C | Page 11 of 16
00027-023
tOPEN
ADG408/ADG409
3V
50%
VSS
VDD
VSS
A0
50%
S1
A1
0V
A2
tON (EN)
ADG4081
tOFF (EN)
0.9VO
0.9VO
OUTPUT
OUTPUT
D
EN
VIN
VS
S2–S8
50Ω
1SIMILAR
35pF
300Ω
GND
00027-024
ENABLE
DRIVE (VIN)
VDD
CONNECTION FOR ADG409.
Figure 24. Enable Delay, tON (EN), tOFF (EN)
3V
VDD
VSS
VDD
VSS
A0
A1
VIN
A2
ADG4081
VOUT
RS
ΔVOUT
S
D
VOUT
EN
VS
QINJ = CL × ΔVOUT
CL
10nF
GND
1SIMILAR
00027-025
VIN
CONNECTION FOR ADG409.
Figure 25. Charge Injection
VDD
VSS
VDD
VSS
A1
ADG408
A2
VOUT
D
S1
0V
VSS
EN
2.4V
ADG408
D
S1
VOUT
1kΩ
1kΩ
S8
1kΩ
S2
S8
EN
GND
OFF ISOLATION = 20 log VOUT/VIN
VS
00027-026
VS
VDD
GND
CROSSTALK = 20 log VOUT/VIN
Figure 27. Channel-to-Channel Crosstalk
Figure 26. Off Isolation
Rev. C | Page 12 of 16
00027-027
A2
VSS
A0
A0
A1
VDD
ADG408/ADG409
TERMINOLOGY
RON
Ohmic resistance between D and S.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
ΔRON
Difference between the RON of any two channels.
IS (OFF)
Source leakage current when the switch is off.
tOPEN
Off time measured between the 80% point of both switches
when switching from one address state to another.
ID (OFF)
Drain leakage current when the switch is off.
VINL
Maximum input voltage for Logic 0.
ID, IS (ON)
Channel leakage current when the switch is on.
VINH
Minimum input voltage for Logic 1.
VD (VS)
Analog voltage on Terminal D and Terminal S.
IINL (IINH)
Input current of the digital input.
CS (OFF)
Channel input capacitance for off condition.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
CD (OFF)
Channel output capacitance for off condition.
Off Isolation
A measure of unwanted signal coupling through an off channel.
CD, CS (ON)
On switch capacitance.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
CIN
Digital input capacitance.
tON (EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
IDD
Positive supply current.
ISS
Negative supply current.
Rev. C | Page 13 of 16
ADG408/ADG409
OUTLINE DIMENSIONS
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
16
9
1
8
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
PIN 1
0.100 (2.54)
BSC
0.060 (1.52)
MAX
0.210
(5.33)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
PLANE
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.005 (0.13)
MIN
0.430 (10.92)
MAX
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
COMPLIANT TO JEDEC STANDARDS MS-001-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 28. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches and (millimeters)
0.005 (0.13) MIN
0.098 (2.49) MAX
16
9
1
PIN 1
8
0.310 (7.87)
0.220 (5.59)
0.100 (2.54) BSC
0.840 (21.34) MAX
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.320 (8.13)
0.290 (7.37)
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
SEATING
0.070 (1.78) PLANE
0.030 (0.76)
15°
0°
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 29. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
Rev. C | Page 14 of 16
ADG408/ADG409
10.00 (0.3937)
9.80 (0.3858)
4.00 (0.1575)
3.80 (0.1496)
16
9
1
8
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
6.20 (0.2441)
5.80 (0.2283)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
× 45°
0.25 (0.0098)
8°
0.51 (0.0201) SEATING
0.25 (0.0098) 0° 1.27 (0.0500)
PLANE
0.31 (0.0122)
0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 30. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.65
BSC
0.30
0.19
COPLANARITY
0.10
0.20
0.09
SEATING
PLANE
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Rev. C | Page 15 of 16
0.75
0.60
0.45
ADG408/ADG409
ORDERING GUIDE
Model
ADG408BN
ADG408BNZ 1
ADG408BR
ADG408BR-REEL
ADG408BR-REEL7
ADG408BRU
ADG408BRU-REEL
ADG408BRU-REEL7
ADG408BRUZ1
ADG408BRUZ-REEL1
ADG408BRUZ-REEL71
ADG408BRZ1
ADG408BRZ-REEL1
ADG408BRZ-REEL71
ADG408TQ
ADG408BCHIPS
ADG409BN
ADG409BNZ1
ADG409BR
ADG409BR-REEL
ADG409BR-REEL7
ADG409BRU
ADG409BRU-REEL
ADG409BRU-REEL7
ADG409BRUZ1
ADG409BRUZ-REEL1
ADG409BRUZ-REEL71
ADG409BRZ1
ADG409BRZ-REEL1
ADG409BRZ-REEL71
ADG409TQ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
Package Description
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Ceramic Dual In-Line Package [CERDIP]
DIE
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Ceramic Dual In-Line Package [CERDIP]
Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00027-0-10/06(C)
Rev. C | Page 16 of 16
Package Option
N-16
N-16
R-16
R-16
R-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
Q-16
N-16
N-16
R-16
R-16
R-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
Q-16