Product Information
Allegro Part Numbering Guide
This document provides a guide to the part numbering codes
used by Allegro™ MicroSystems for general sales customer
orders. Current individual datasheets for specific parts
should be consulted before ordering. This guide should be
used for reference only and is not intended to be a complete
source and may be superseded by subsequent procedures.
Individual part numbers may deviate from the specifications
in this document. All possible combinations of device type,
operating temperature range, and package style are not
necessarily available.
Table of Contents
Complete Part Numbers Operating Temperature Ranges
Package Designators
Instructions (Finishing)
296085AN, Rev. 1
2
3
4
5
Complete Part Numbers
Complete Part Number Format
("A" initial character style, general product lines)
Instructions (Special Configuration)
Package Designation
AAA NNNN A AA AA [–]AA –A
Allegro Identifier (Device Family)
Device Type
Operating Temperature Range
Instructions (Packing Leadform)
Leadframe Plating
Allegro Identifier
Device Type
Operating Temperature Range
Package Designation
Instructions (Finishing)
Leadframe Plating
[A, and optional 1 to 2 letters]
[3 to 4 numbers] functional type
[1 letter] ambient temperature range
[1 or 2 letters] body configuration
Leadform/packing option, etc. Blank indicates
default configuration
["-" and 1 letter] nonlead (Pb-free) option
Complete Part Number Format
("U" initial character style, general product lines)
Instructions (Special Configuration)
Package Designation
UD A NNNN AA AA [–]AA –A
Allegro Identifier (Device Family)
Operating Temperature Range
Device Type
Instructions (Packing Leadform)
Leadframe Plating
Allegro Identifier
Operating Temperature Range
Device Type
Package Designation
Instructions (Finishing)
UD
[1 letter] ambient temperature range
[3 to 4 numbers] functional type
[1 or 2 letters] body configuration
Leadform/packing option, etc. Blank indicates
default configuration
["-" and 1 letter] nonlead (Pb-free) option
Leadframe Plating
Complete Part Number Format
(Sensed current range style, current sensor IC product lines)
Leadform Option
Instructions (Special Configuration)
Package Designation
ACS NNN A AA AA [–]AA [–NNNAA] –AAA [–A]
Allegro Identifier (Device Family)
Device Type
Operating Temperature Range
Instructions (Packing Leadform)
Current Sensing Range
Leadframe Plating
Allegro Identifier
Device Type
Operating Temperature Range
Package Designation
Instructions (Finishing)
Current Sensing Range
Leadform (75x series)
Leadframe Plating
296085AN, Rev. 1
ACS
[3 numbers] functional type
[1 letter] ambient temperature range
[1 or 2 letters] body configuration
Leadform/packing option, etc. Blank indicates default configuration
[3 numbers] optimal sensing amperage range
[1 letter] measurable sensing range multiplier. A: 1 × optimal, B: 2 × optimal, C: 3 × optimal
[1 letter] current direction measurable. B: bidirectional, U: unidirectional
[3 letters] PFF: formed signal leads, formed current terminals, PSF: formed signal leads,
straight current terminals, PSS: straight signal leads, straight current terminals
["-" and 1 letter] nonlead (Pb-free) option
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
Operating Temperature Ranges
Complete Part Number Format
("A" initial character style, general product lines)
Part Number Token
Descriptor
Operating Ambient Temperature Range
A
Commercial A
–10°C to 60°C
B
Extended Commercial B
–25°C to 75°C
C
Commercial C
0°C to 70°C
D
Commercial D
0°C to 50°C
E
Extended Automotive/Industrial E
–40°C to 85°C
F
Extended Automotive/Industrial F
–40°C to 95°C
G
Extended Industrial
–40°C to 105°C
K
Extended Industrial
–40°C to 125°C
–40°C to 135°C
–40°C to 150°C, when TJ (max) ≤ 150°C
L
Automotive
–40°C to 150°C
M
Extended Commercial M
–20°C to 105°C
–40°C to 160°C
P
Extended Automotive/Commercial P
S
Standard
X
Custom
–20°C to 85°C
Refer to datasheet for custom temperature range
Complete Part Number Format
("U" initial character style, general product lines)
Part Number Token
Descriptor
Operating Ambient Temperature Range
K
Extended Automotive/Industrial
–40°C to 125°C (typical)
N
Commercial/Industrial
–20°C to 85°C (typical)
Q
Automotive/Industrial
–40°C to 85°C (typical)
296085AN, Rev. 1
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
Package Designators
A – Dual in-line (MS-001, MS-010, MS-011)
B – Dual in-line with heat-sink semi-tabs (MS-001, MS-010)
CA – Current sensor device
CB – Current sensor device
CG – Chip scale device
EB – Square J-leaded chip carrier with 2 heat-sink semi-tabs (MS-018)
EC – Square leadless (exposed pad) 0.40 mm contact pitch, quad very-very-thin chip carrier (MO-220)
ED – Square J-leaded chip carrier with 4 heat-sink semi-tabs (MS-018)
EE – Square leadless (exposed pad) 0.50 mm contact pitch, dual ultra-thin chip carrier (MO-229)
EF – Current-sensing, leadless 1.27 mm pitch, dual very-thin chip carrier (MO-229)
EG – Rectangular leadless (exposed pad) 0.50 mm pitch, quad very-very-thin chip carrier (MO 220)
EH – Rectangular leadless (exposed pad) 0.50 mm pitch, dual very-very-thin chip carrier (MO 229)
EJ – Square leadless (exposed pad) 0.50 mm pitch, dual very-very-thin chip carrier (MO-229)
EK – Square leadless (exposed pad) 0.95 mm pitch, dual very-very-thin chip carrier (MO-229)
EL – Square leadless (exposed pad) 0.50 mm pitch, dual ultra-thin chip carrier (MO-229)
EM – Square leadless (exposed pad) 0.65 mm contact pitch DFN/SON (MO-229)
EP – Square J-leaded chip carrier (MO-047, MS-007, MS-018)
ES – Square leadless (exposed pad) 0.50 mm contact pitch, quad very-very-thin chip carrier (MO-220)
ET – Square leadless (exposed pad) 0.50 mm contact pitch, quad very-thin chip carrier (MO-220)
EU – Square leadless (exposed pad) 0.65 mm contact pitch, quad very-very-thin chip carrier (MO-220)
EV – Square leadless (exposed pad) 0.50 mm contact pitch, quad very-thin chip carrier (MO-220)
EW – Rect. leadless (exposed pad) 0.50 mm contact pitch, dual super-thin chip carrier (MO-229)
EX – Square leadless (exposed current loop) 0.50 mm contact pitch, quad very-very-thin chip carrier (MO-220)
JP – Low-profile QFP (exposed pad) (MS-026)
JS – Thin-profile QFP (exposed pad) (MS-026)
JU – Thin-profile QFP (MS-026)
K – Mini-SIP, four leads
KA – Mini-SIP, five leads
KB – Mini-SIP, three leads
KC – Mini-SIP, three leads
KE – Mini-SIP, four leads
KN – Mini-SIP, four leads
KT – Mini-SIP, four leads
L – Narrow-body SOIC (MS-012)
LA – Wide-body SOIC with internal sensed current path (MS-013)
LB – Wide-body SOIC with heat-sink semi-tabs (MS-013)
LC – Current Sensor, narrow-body SOIC (MS-012)
LD – TSSOP, 0.50 mm pitch (MO-153)
LE – TSSOP, 0.65 mm pitch (MO-153)
LF – QSOP 0.635 mm pitch
LG – TSSOP with heat-sink semitabs, 0.50 mm pitch
LH – Low-profile, three- or five-terminal surface mount (SOT23W)
LJ – Eight-lead narrow-body SOIC with exposed pad (MS-012)
LK – Narrow-body SOIC with 1 mm pin pitch
LN - Narrow-body SSOP with 1 mm pin pitch
LP – TSSOP (exposed pad), 0.65 mm pitch (MO-153)
LQ – QSOP, 0.80 mm pitch
LT – SOT, three leads (SOT89/TO-243AA)
LV – TSSOP (exposed pad), 0.50 mm pitch, 38 leads
LW – Wide-body SOIC (MS-013)
LY – Narrow-body TSSOP (exposed pad), 0.50 mm pitch
M – Eight-pin mini-DIP (MS-001BA)
OL – SOIC, 1.27 mm pitch, 8 leads
SA – SIP, 4 leads
SB – SIP, 4 leads
SD – SIP, 4 leads
SE – SIP, 4 leads
SG – SIP, 4 leads
SH – SIP, 4 leads
SJ – SIP, 4 leads
U – mini-SIP, 2 leads
UA – Three-lead, thin mini-SIP
UB – Two-lead, thin mini-SIP
296085AN, Rev. 1
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
Instructions (Finishing)
Package/Leadform
LC – Spread leadform
LF – Lead form per customer drawing
LT – Tape and reel
LX – Tape and reel
PFF – Plated, formed power leads, formed signal leads
PSF – Plated, straight power leads, formed signal leads
PSS – Plated, straight power leads, straight signal leads
TA – Tape and reel
TI – Tape and reel, straight leadform
TK – Tape and reel
TL – Horizontal-mount leadform, bulk
TN – Tape and reel: SE, SG, SH, and SJ packages
TR – Tape and reel
TS – Horizontal-mount leadform, tape and reel
Special Configuration
-I1, -I2, -I3 – Two-wire current level
-LN – Low on tooth
-LT – Low on tooth/TPOS
-R – Internal pull-up resistor
Leadframe Plating
-T – Matte tin
-P – Nickel Palladium-Gold
296085AN, Rev. 1
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
Revision History
Revision
Date
1
April 30, 2014
Change
Added UB package
Copyright ©2011-2014, Allegro MicroSystems, LLC
The information contained in this document does not constitute any representation, warranty, assurance, guaranty, or inducement by Allegro to the
customer with respect to the subject matter of this document. The information being provided does not guarantee that a process based on this information will be reliable, or that Allegro has explored all of the possible failure modes. It is the customer’s responsibility to do sufficient qualification
testing of the final product to insure that it is reliable and meets all design requirements.
For the latest version of this document, visit our website:
www.allegromicro.com
296085AN, Rev. 1
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6