54F/74F38 Quad Two-Input NAND Buffer (Open Collector) General Description This device contains four independent gates, each of which performs the logic NAND function. The open-collector outputs require external pull-up resistors for proper logical operation. Commercial Military Package Number Package Description N14E 14-Lead (0.300× Wide) Molded Dual-In-Line J14A 14-Lead Ceramic Dual-In-Line 74F38SC (Note 1) M14A 14-Lead (0.150× Wide) Molded Small Outline, JEDEC 74F38SJ (Note 1) M14D 14-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F38FM (Note 2) W14B 14-Lead Cerpack 54F38LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F38PC 54F38DM (Note 2) Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak IEEE/IEC TL/F/9465–3 Pin Assignment for LCC TL/F/9465 – 1 TL/F/9465 – 2 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9465 RRD-B30M75/Printed in U. S. A. 54F/74F38 Quad Two-Input NAND Buffer (Open Collector) December 1994 Unit Loading/Fan Out 54F/74F Pin Names Description An, Bn On Inputs Outputs U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL 1.0/2.0 OC*/106.6 (80) 20 mA/b1.2 mA OC*/64 mA (48 mA) *OC e Open Collector Function Table Inputs Output A B O L L H H L H L H H H H L H e HIGH Voltage Level L e LOW Voltage Level 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEÉ Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Typ Units VCC Conditions Max 2.0 V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal Input Clamp Diode Voltage b 1.2 V Min IIN e b18 mA VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.55 0.55 V Min IOL e 48 mA IOL e 64 mA IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 1.2 mA Max VIN e 0.5V IOHC Open Collector, Output OFF Leakage Test ICCH Power Supply Current ICCL Power Supply Current 4.75 250 mA Min VOUT e VCC 2.1 7.0 mA Max VO e HIGH 26.0 30.0 mA Max VO e LOW 3 AC Electrical Characteristics Symbol tPLH tPHL Parameter Propagation Delay An, Bn to On 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max 6.5 1.5 9.7 2.1 12.5 5.0 6.5 1.0 14.5 5.5 6.5 1.5 13.0 5.5 Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 38 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reels Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M14A 6 Physical Dimensions inches (millimeters) (Continued) 14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M14D 14-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N14A 7 54F/74F38 Quad Two-Input NAND Buffer (Open Collector) Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. 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