54F/74F32 Quad 2-Input OR Gate General Description Features This device contains four independent gates, each of which performs the logic OR function. Y Commercial Guaranteed 4000V minimum ESD protection Package Number Military Package Description N14A 14-Lead (0.300× Wide) Molded Dual-In-Line J14A 14-Lead Ceramic Dual-In-Line 74F32SC (Note 1) M14A 14-Lead (0.150× Wide) Molded Small Outline, JEDEC 74F32SJ (Note 1) M14D 14-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F32FM (Note 2) W14B 14-Lead Cerpack 54F32LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F32PC 54F32DM (Note 2) Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol Connection Diagrams IEEE/IEC Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9463–3 TL/F/9463 – 2 TL/F/9463 – 1 Unit Loading/Fan Out 54F/74F Pin Names Description An, Bn On Inputs Outputs U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL 1.0/1.0 50/33.3 20 mA/b0.6 mA b 1 mA/20 mA TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9463 RRD-B30M75/Printed in U. S. A. 54F/74F32 Quad 2-Input OR Gate December 1994 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEÉ Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 74F 10% VCC 74F 5% VCC VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC IIH Input HIGH Current IBVI Typ Units VCC Conditions Max 2.0 V Recognized as a HIGH Signal 0.8 V b 1.2 V Min IIN e b18 mA V Min IOH e b1 mA IOH e b1 mA IOH e b1 mA 0.5 0.5 V Min IOL e 20 mA IOL e 20 mA 54F 74F 20.0 5.0 mA Max VIN e 2.7V Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current VIN e 0.5V IOS Output Short-Circuit Current ICCH Power Supply Current ICCL Power Supply Current 2.5 2.5 2.7 4.75 Recognized as a LOW Signal b 0.6 mA Max b 150 mA Max VOUT e 0V 6.1 9.2 mA Max VO e HIGH 10.3 15.5 mA Max VO e LOW b 60 2 AC Electrical Characteristics Symbol tPLH tPHL Parameter Propagation Delay An, Bn to On 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max 3.0 3.0 4.2 4.0 5.6 5.3 3.0 2.5 7.5 7.5 3.0 3.0 6.6 6.3 Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 32 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reels Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 3 Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M14A 4 Physical Dimensions inches (millimeters) (Continued) 14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M14D 14-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N14A 5 54F/74F32 Quad 2-Input OR Gate Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.