Package Drawing Designator: EC Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 4.00 ±0.15 N 1 2 1 A NNNN YYWW LLLLL 4.00 ±0.15 D Standard Branding Reference View N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number N+1X C SEATING PLANE 0.08 C 0.20 ±0.05 0.75 ±0.05 0.40 C For Reference Only (reference JEDEC MO-220) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals +0.15 0.40 –0.10 B D Branding scale and appearance at supplier discretion 2 1 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EE Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 2.00 ±0.15 N YYWW NN 2.00 ±0.15 A 1 1 2 D Standard Branding Reference View N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X C SEATING PLANE 0.08 C +0.05 0.55 –0.04 0.25 ±0.05 0.50 C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area 1 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) 2 C Coplanarity includes exposed thermal pad and terminals D Branding scale and appearance at supplier discretion 0.325 ±0.050 B N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EH Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 2.00 ±0.15 N YWW LLL NN 3.00 ±0.15 A 1 1 D 2 Standard Branding Reference View Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number N = Last two digits of device part number N+1X C SEATING PLANE 0.08 C 0.75 ±0.05 0.25 ±0.05 C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion 0.5 BSC A Terminal #1 mark area 1 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) 2 C Coplanarity includes exposed thermal pad and terminals 0.55 ±0.10 D Branding scale and appearance at supplier discretion B N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EJ Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 3.00 ±0.15 N NNNN YYWW LLLL 3.00 ±0.15 A 1 1 2 D Standard Branding Reference View L = Lot numver N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X C SEATING PLANE 0.08 C +0.05 0.25 –0.07 0.75 ±0.05 0.5 BSC C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area 1 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) 2 C Coplanarity includes exposed thermal pad and terminals D Branding scale and appearance at supplier discretion 0.40 ±0.10 B N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EK Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 3.00 ±0.15 N YWW LLLL NNN 3.00 ±0.15 A 1 D 2 1 Standard Branding Reference View L = Lot numver N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X D SEATING PLANE 0.08 C 0.45 0.30 0.75 ±0.05 0.95 C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area 2 1 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals D Branding scale and appearance at supplier discretion +0.15 0.40 –0.10 B N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EL Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 2.00 ±0.15 N YWW NN 2.00 ±0.15 A 1 1 2 D Standard Branding Reference View N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X C 0.50 ±0.05 0.08 C +0.07 0.25 –0.05 1.00 BSC C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area 0.40 ±0.05 1 SEATING PLANE 2 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals D Branding scale and appearance at supplier discretion B N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: ES Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 4.00 ±0.15 N 1 2 1 A NNNN YYWW LLLL 4.00 ±0.15 D Standard Branding Reference View L = Lot number N = Last two digits of device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X C SEATING PLANE 0.08 C 0.30 0.18 0.75 ±0.10 C For Reference Only (reference JEDEC MO-220) Dimensions in millimeters Exact case and lead configuration at supplier discretion 0.50 A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals 0.50 0.30 B D Branding scale and appearance at supplier discretion 2 1 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: ET Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 5.00 ±0.15 N 1 2 1 A NNNN YYWW LLLL 5.00 ±0.15 D N+1X C SEATING PLANE 0.08 C +0.05 0.25 –0.07 0.90 ±0.10 0.50 Standard Branding Reference View = Supplier emblem L = Lot identifier N = Device part number Y = Last two digits of year of manufacture W = Week of manufacture C For Reference Only (reference JEDEC MO-220) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals 0.73 MAX B D Branding scale and appearance at supplier discretion 2 1 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EU Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 4.00 ±0.15 N 1 1 A 2 NNNN YYWW LLLL 4.00 ±0.15 D N+1X C SEATING PLANE 0.08 C 0.35 0.25 Standard Branding Reference View L = Lot identifier N = Device part number Y = Last two digits of year of manufacture W = Week of manufacture C 0.95 ±0.05 0.65 For Reference Only (reference JEDEC MO-220) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals 0.65 0.45 D Branding scale and appearance at supplier discretion 2 B 1 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EV Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 7.00 ±0.15 N 1 2 1 A NNNN YYWW LLLL 7.00 ±0.15 D N+1X C SEATING PLANE 0.08 C 0.23 ±0.10 0.90 ±0.10 0.50 Standard Branding Reference View = Supplier emblem L = Lot identifier N = Device part number Y = Last two digits of year of manufacture W = Week of manufacture C For Reference Only (reference JEDEC MO-220) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals +0.10 0.40 –0.10 B D Branding scale and appearance at supplier discretion 2 1 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EW Type: DFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 1.50 ±0.15 NN YWW N 2.00 ±0.15 A 1 D 1 Standard Branding Reference View N = Device part number Y = Last two digits of year of manufacture W = Week of manufacture N+1X C SEATING PLANE 0.08 C 0.38 ±0.02 C For Reference Only (reference JEDEC MO-229) Dimensions in millimeters Exact case and lead configuration at supplier discretion A Terminal #1 mark area 0.50 BSC 0.25 ±0.05 1 B Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion) C Coplanarity includes exposed thermal pad and terminals D Branding scale and appearance at supplier discretion B +0.055 0.325 –0.045 1.25 ±0.05 N Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: EX Type: QFN Package type representative configuration. For contact count and device reference dimensions, refer to the datasheet for the individual device 3.00 BSC 12 1 A 2 3.00 BSC Branded Face 9X 1 C SEATING PLANE 0.08 C 0.50 BSC NNNN YYWW LLLL C 0.75 ±0.05 D +0.05 0.25 –0.07 1.79 0.40±0.10 B 0.20 Standard Branding Reference View N = Device part number Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number For reference only, not for tooling use (reference JEDEC MO-220WEED except for fused current path) Dimensions in millimeters Exact case and lead configuration at supplier discretion within limits shown 2 1 A Terminal #1 mark area 12 B Fused sensed current path C Coplanarity includes exposed current path and terminals D Branding scale and appearance at supplier discretion Copyright ©2012-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com