Package Drawing Designator: L Type: 8-pin, narrow SOIC 4.90 ±0.10 8° 0° 8 0.25 0.17 3.90 ±0.10 6.00 ±0.20 NNNNNNN YYWW LLLLL 1.04 REF A 1 1 2 1.27 0.40 0.25 BSC SEATING PLANE GAUGE PLANE Branded Face 8X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 1.75 MAX 0.25 0.10 For Reference Only; not for tooling use (reference MS-012AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Rev.1 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: L Type: 14-pin, narrow SOIC 8.65 ±0.10 8° 0° 14 0.25 0.17 3.90 ±0.10 6.00 ±0.20 NNNNNNNNNNNN YYWW LLLLLLLLLLLL 1.04 REF A 1 1 2 1.27 0.40 0.25 BSC SEATING PLANE GAUGE PLANE Branded Face 14X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 1.75 MAX 0.25 0.10 For Reference Only; not for tooling use (reference MS-012AB) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Rev.1 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: L Type: 16-pin, narrow SOIC 9.90 ±0.10 8° 0° 16 0.25 0.17 3.90 ±0.10 6.00 ±0.20 NNNNNNNNNNNN YYWW LLLLLLLLLLLL 1.04 REF A 1 1 2 1.27 0.40 0.25 BSC SEATING PLANE GAUGE PLANE Branded Face 16X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 1.75 MAX 0.25 0.10 For Reference Only; not for tooling use (reference MS-012AC) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Rev.1 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LA Type: Wide SOIC with internally fused pins for current sensing path 10.30 ±0.20 8° 0° 16 0.33 0.20 7.50 ±0.10 NNNNNNNNNNN TTT-TTT LLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 16X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C 1.27 0.40 B Standard Branding Reference View 0.25 BSC N = Device part number T = Temperature range, package - amperage L = First 9 characters of lot number SEATING PLANE GAUGE PLANE 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LB Type: 16-pin, wide SOIC with internally fused pins for thermal dissipation 10.30 ±0.20 8° 0° 16 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNN YYWW LLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 16X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC C SEATING PLANE GAUGE PLANE N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Internal configuration of fused pins is device-dependent Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LB Type: 20-pin, wide SOIC with internally fused pins for thermal dissipation 12.80 ±0.20 8° 0° 20 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNN YYWW LLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 20X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC C SEATING PLANE GAUGE PLANE N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AC) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Internal configuration of fused pins is device-dependent Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LB Type: 24-pin, wide SOIC with internally fused pins for thermal dissipation 15.40 ±0.20 8° 0° 24 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNNNNN YYWW LLLLLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 24X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC SEATING PLANE GAUGE PLANE C N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AD) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Internal configuration of fused pins is device-dependent Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LB Type: 28-pin, wide SOIC with internally fused pins for thermal dissipation 17.90 ±0.20 8° 0° 28 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNNNNNNNN YYWW LLLLLLLLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 1.27 0.40 Branded Face 28X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC 0.25 BSC SEATING PLANE GAUGE PLANE C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AE) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Internal configuration of fused pins is device-dependent Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LC Type: Narrow SOIC with internally fused pins for current sensing path 4.90 ±0.10 8° 0° 8 0.25 0.17 3.90 ±0.10 6.00 ±0.20 NNNNNNN TPP-AAA LLLLL 1.04 REF A 1 1 2 1.27 0.40 0.25 BSC Branded Face 8X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C SEATING PLANE GAUGE PLANE B Standard Branding Reference View N = Device part number T = Device temperature range P = Package Designator A = Amperage L = Lot number Belly Brand = Country of Origin 1.75 MAX 0.25 0.10 For Reference Only; not for tooling use (reference MS-012AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LJ Type: Narrow SOIC with exposed thermal pad 4.90 ±0.10 8° 0° 8 0.25 0.17 C 2.41 NOM A 3.90 ±0.10 6.00 ±0.20 NNNNNNNN YYWW LLLLLL 1.04 REF 1 1 2 1.27 0.40 3.30 NOM 0.25 BSC SEATING PLANE GAUGE PLANE Branded Face 8X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 1.70 MAX 0.15 0.00 For Reference Only; not for tooling use (reference MS-012BA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion C Exposed thermal pad (bottom surface); dimensions may vary with device Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LW Type: 16-pin, wide SOIC 10.30 ±0.20 8° 0° 16 0.33 0.20 7.50 ±0.10 NNNNNNNNNN YYWW LLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 16X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC C SEATING PLANE GAUGE PLANE N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AA) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LW Type: 18-pin, wide SOIC 11.55 ±0.20 8° 0° 18 0.33 0.20 7.50 ±0.10 NNNNNNNNNN YYWW LLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 18X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC C SEATING PLANE GAUGE PLANE N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AB) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LW Type: 20-pin, wide SOIC 12.80 ±0.20 8° 0° 20 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNN YYWW LLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 20X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC C SEATING PLANE GAUGE PLANE N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AC) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LW Type: 24-pin, wide SOIC 15.40 ±0.20 8° 0° 24 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNNNNN YYWW LLLLLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 Branded Face 24X SEATING PLANE 0.10 C 0.51 0.31 B Standard Branding Reference View 1.27 0.40 1.27 BSC 0.25 BSC SEATING PLANE GAUGE PLANE C N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AD) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com Package Drawing Designator: LW Type: 28-pin, wide SOIC 17.90 ±0.20 8° 0° 28 0.33 0.20 7.50 ±0.10 NNNNNNNNNNNNNNNNNN YYWW LLLLLLLLLLLLLLLLLL 10.30 ±0.33 A 1 1.40 REF 1 2 1.27 0.40 Branded Face 28X SEATING PLANE 0.10 C 0.51 0.31 1.27 BSC 0.25 BSC SEATING PLANE GAUGE PLANE C B Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number 2.65 MAX 0.30 0.10 For Reference Only; not for tooling use (reference MS-013AE) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Branding scale and appearance at supplier discretion Copyright ©2009-2013, Allegro MicroSystems, LLC drawings are for reference only; not for tooling use. Refer to the individual datasheet for information on a specific product package. Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000 For the latest version of this document, visit our website: www.allegromicro.com