Reliability Report

AOS Semiconductor
Product Reliability Report
AOTF240L,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOTF240L. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOTF240L passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOTF240L uses Trench MOSFET technology that is uniquely optimized to provide the most
efficient high frequency switching performance. Power losses are minimized due to an extremely
low combination of RDS(ON) and Crss.
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOTF240L
Standard sub-micron
40V N-Channel MOSFET
TO220F
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
2
III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time Point
Total
Sample
size*
Number
of
Failures
Reference
Standard
MSL
Precondition
168hr 85°c/85%RH +
3 cycle reflow@260°c
(MSL 1)
-
3003 pcs
0
JESD22-A113
HTGB
Temp = 150°c ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hours
616 pcs
0
JESD22-A108
HTRB
Temp = 150°c ,
Vds=80% of Vdsmax
168 / 500 /
1000 hours
616 pcs
0
JESD22-A108
HAST
130 °c , 85%RH,
33.3 psi, Vds = 80% of
Vdsmax before arcing
(typically ≤42V)
96 hours
924 pcs
0
JESD22-A110
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hours
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
1155 pcs
0
JESD22-A104
*Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4.73
MTTF = 24115 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
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Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 4.73
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MTTF = 10 / FIT = 24115 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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