Product Sheet

V i s h ay I n t e r t e c h n o l o g y, I n c .
Inductors - Wire Bondable, Spiral for RF Circuits
I
INNOVAT
AND TEC
O L OGY
RFLW
N
HN
RF INDUCTOR
O
19
62-2012
Vishay Electro-Films Wire Bondable
RF Spiral Inductor
Key Benefits
•
•
•
•
•
•
•
•
Wire bond assembly
Small size: 0.030 in. x 0.030 in. x 0.020 in. or 0.050 in. x 0.050 in. x 0.020 in.
Low DCR, high Q
Low parasitic capacitance, high SRF
Equivalent circuit model
S parameter files available for download
Available with or without silicon nitride passivation
Sample kits available
APPLICATIONS
• RF choking for DC biasing
• RF tuning circuits
• Lumped element filters
Resources
• Datasheet: RFLW 3N - http://www.vishay.com/doc?61057
• Datasheet: RFLW 5N - http://www.vishay.com/doc?61087
• For technical questions contact [email protected]
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
PRODUCT SHEET
1/2
VMN-PT0227-1202
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RFLW 3N
V i s h ay Vishay
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RFLW 3N
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Revision: 21-Apr-11
1
Notes
RF
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This document
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61057
For
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www.vishay.com/doc?91000
THE
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