RFLW 5N www.vishay.com Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" FEATURES • High frequency • Wire bond assembly • Small size: 0.050" x 0.050" x 0.020" • Low DCR, high Q • Low parasitic capacitance, high SRF • Equivalent circuit model enclosed • S parameter files available for download RFLW series of thin film spiral inductors on quartz are designed for RF circuits that require wire bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Measured S parameter files are also available upon request. • Sample kit available In many RF application, correct component selection is achieved through experimentation. To help designers during the design process, a sample kit of standard values is available. • RF choking for DC biasing Additional values and form factors available upon request. • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • RF tuning circuits • Lumped element filters STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Inductance Range (1) VALUE UNIT 0.018 to 0.150 μH Tolerance (2) ± 20 % Max. Power Handling (3) 125 mW Operating Temperature - 55 to + 125 °C Storage Temperature - 55 to + 125 °C Stability, 1000 h, + 125 °C, 125 mW 2.0 % max. R/R % ESD: AEC-Q200-002, component classification 5B (up to 16 kV) 5.0 % max. R/R % Notes (1) Custom values available upon request. See custom design section below. (2) Main source of value tolerance is due to variation in wire bonds. See “test fixture” section below. (3) Maximum rated power of 125 mW at 70 °C, linearly de-rated to zero at 125 °C. RF CHARACTERISTICS - TYPICAL VALUES PART NUMBER RFLW5N1800B RFLW5N5200B INDUCTANCE (nH) Q (UNITLESS) DCR () IN-CIRCUIT INDUCTANCE (4) (nH) 250 MHz 1000 MHz SRF (GHz) 250 MHz 1000 MHz 18 19 1.0 19 16 13 6 47 49 3.3 48 16 9 3.8 52 56 3.6 53 17 9 3.5 RFLW5N8000B 80 87 4.5 82 18 7 2.4 RFLW5N1000A 100 125 5.4 102 17 5 1.9 RFLW5N1200A 120 156 7.7 122 18 4 1.7 RFLW5N1500A 150 220 9.3 152 18 3 1.5 Note (4) Including the added inductance and resistance of typical bond wires at 250 MHz. See equivalent circuit section below. Revision: 17-Sep-13 Document Number: 61087 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RFLW 5N www.vishay.com Vishay Electro-Films DIMENSIONS in inches (millimeters) 0.050 Ø 0.006 0.050 0.006 0.022 0.002 0.022 LENGTH 0.050 (1.2) ± 0.003 0.006 WIDTH 0.050 (1.2) ± 0.003 0.002 THICKNESS 0.020 (0.5) ± 0.001 BOND PAD DIAMETER 6 (0.15) MECHANICAL SPECIFICATIONS Chip substrate material Conductor material Conductor thickness Bond pad diameter Quartz Gold 5 μm ± 20 % 0.006" GLOBAL PART NUMBER INFORMATION Global Part Number: RFLW5N1200AMNT0 Global Part Number Description: RFLW 50 x 50 NO PASS 120 nH 20 % T0 R F L W 5 N 1 MODEL SIZE PASSIVATION INDUCTANCE (nH) RFLW 3 = 30 x 30 5 = 50 x 50 S= Silicon nitride N= None First 4 digits are significant figures of capacitance 2 0 INDUCTANCE MULTIPLIER CODE C = 0.001 B = 0.01 A = 0.1 0 A TOLERANCE CODE M = 20 % L = 25 % M N SPECIAL N = None T 0 PACKAGING CODE WAFFLE WS = 100 min., 1 mult TAPE AND REEL T0 = 100 min., 100 mult T1 = 1000 min., 100 mult Ts = 100 min., 1 mult EQUIVALENT CIRCUIT The Inductor’s spiral trace presents a substantial amount of series resistance, and the close spacing of spiral turns present measurable amounts of stray capacitance that interact with the inductive characteristics. For accurate modeling of the RFLW component in-circuit performance, measured S parameter files are available upon request. Another useful tool commonly used to model the behavior of electronic components at high frequency is the equivalent circuit model. While the equivalent circuit model accurately predicts the reactive part of the total impedance, it fails to determine the real part of the response at high frequency. This is due to the fact that the model does not include skin and proximity effects that significantly increase the real part of the impedance as the frequency rises. Revision: 17-Sep-13 Document Number: 61087 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RFLW 5N www.vishay.com Vishay Electro-Films Bond Wire Rbw Spiral Inductor Lbw L L: Desire inductance R: Parasitic self resistance C: Parasitic shunt capacitance Rbw: Bond wire self resistance Lbw: Parasitic bond wire inductance R C Equivalent Circuit Model The equivalent circuit values are presented in the table below: EQUIVALENT CIRCUIT MODEL - TYPICAL VALUES INDUCTANCE (nH) L 18 47 52 80 100 120 150 DCR () R 1.0 2.8 3.0 3.9 4.7 6.3 7.7 SHUNT CAPACITANCE (fF) C 38 37 39 52 65 68 67 Rbw (1) () Lbw (nH) 1.4 1.4 1.4 1.4 1.4 1.4 1.4 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Note (1) Typical bond wires are approximated as being 1.25 mil in diameter gold, totaling a length of 3 mil. The resistance listed above includes the added effect of the bond wire adhesion to the circuit board and component. TEST FIXTURE The results presented in the datasheet were obtained by assembling the components onto a thin film test fixture using non-conducting epoxy and 1.25 mil diameter gold bond wires. Measurements were conducted using an HP 8753E network analyzer with cascade micro-tech air coplanar probes. The parasitic elements of the bond wires are a major contributor to the tolerance of the lower value components. We consider the following bond-wire geometry to be typical for the assembly of the RFLW pars: Side pad on inductor Center pad on inductor 20 mil Au bond wire pads, 20 mil2 RFLW 20 mil Alumina Test Board, 25 mil thick 10 mil Text Fixture Diagram Revision: 17-Sep-13 Document Number: 61087 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RFLW 5N www.vishay.com Vishay Electro-Films TYPICAL COMPONENT PERFORMANCE 350 300 Inductance (nH) 250 200 150 nH 120 nH 100 nH 80 nH 52 nH 47 nH 18 nH 150 100 50 0 10 100 1000 10 000 Frequency (MHz) Inductance vs. Frequency 22 17 Q (Unitless) 18 nH 12 47 nH 52 nH 7 80 nH 100 nH 2 120 nH 150 nH -3 10 100 1000 10 000 Frequency (MHz) Quality Factor vs. Frequency LAYOUT CONSIDERATIONS The RF spiral inductor is electrically connected to the circuit by wire bonds. All wire bonds add parasitic inductance and resistance, as shown in the schematic drawing above. It is important to note that setup variations might affect the performance of the component. Special care must be given to minimize these effects by careful design of the component host circuit board. The following aspects should be considered: • Bond wire length should be minimized. The bond wire added inductance can be roughly estimated at 0.75 nH per mil of 1.25 mil diameter gold wire. • Any ground plane directly under the component will increase the parasitic shunt capacitance. This will cause self resonance at lower frequencies. • The epoxy used to attach the component is the limiting factor in power handling. Applications that require high power handling are recommended to use high temperature epoxy and to insure adequate heat sinking. CUSTOM DESIGNED SPIRAL INDUCTORS Vishay EFI will custom design and measure additional values and form factors upon request. Typical inductance density is limited to: 110 nH/mm2 It is important to note, that both series resistance and SRF characteristics will degrade as inductance values approach the inductance density limit presented above. Revision: 17-Sep-13 Document Number: 61087 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000