IDT IDT70T9169L7PF

PRELIMINARY
HIGH-SPEED 2.5V
16/8K X 9 SYNCHRONOUS
PIPELINED
DUAL-PORT STATIC RAM
IDT70T9169/59L
Features
◆
◆
◆
◆
◆
◆
◆
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial:7.5/9/12ns (max.)
– Industrial: 9ns (max.)
Low-power operation
– IDT70T9169/59L
Active: 225mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either Port via
the FT/PIPE pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
◆
◆
◆
Full synchronous operation on both ports
– 4.0ns setup to clock and 0.5ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 7.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 12ns cycle time, 83MHz operation in Pipelined output mode
LVTTL- compatible, single 2.5V (±100mV) power supply
Industrial temperature range (–40°C to +85°C) is
available for 66MHz
Available in a 100-pin Thin Quad Flatpack (TQFP) and 100pin fine pitch Ball Grid Array (fpBGA) packages.
Functional Block Diagram
R/WR
OER
R/WL
OEL
CE0L
CE1L
FT/PIPEL
0/1
1
0
0
1
0/1
FT/PIPER
I/O0R - I/O8R
I/O0L - I/O8L
I/O
Control
I/O
Control
A13L(1)
A0L
CLKL
ADSL
CNTENL
CNTRSTL
CE0R
CE1R
1
0
0/1
1
0
0/1
A13R(1)
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A0R
CLKR
ADSR
CNTENR
CNTRSTR
5654 drw 01
NOTE:
1. A 13 is a NC for IDT70T9159.
JULY 2002
1
©2002 Integrated Device Technology, Inc.
DSC-5654/1
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Description
The IDT70T9169/59 is a high-speed 16/8K x 9 bit synchronous DualPort RAM. The memory array utilizes Dual-Port memory cells to allow
simultaneous access of any address from both ports. Registers on
control, data, and address inputs provide minimal setup and hold
times. The timing latitude provided by this approach allows systems
to be designed with very short cycle times.
With an input data register, the IDT70T9169/59 has been optimized for
applications having unidirectional or bidirectional data flow in bursts.
An automatic power down feature, controlled by CE0 and CE1, permits
the on-chip circuitry of each port to enter a very low standby power
mode. Fabricated using IDT’s CMOS high-performance technology,
these devices typically operate on only 225mW of power.
06/21/02
Index
NC
NC
A6L
A5L
A4L
A3L
A2L
A1L
A0L
CNTENL
CLKL
ADSL
Vss
Vss
ADSR
CLKR
CNTENR
A0R
A1R
A2R
A3R
A4R
A5R
A6R
NC
Pin Configurations(1,2,3,4)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
2
74
3
73
NC
NC
A7L
A8L
A9L
A10L
A11L
A12L
1
A13L(1)
NC
NC
NC
VDD
NC
NC
NC
NC
CE0L
CE1L
CNTRSTL
R/WL
OEL
FT/PIPEL
NC
NC
9
4
72
5
6
71
70
7
69
8
68
10
70T9169/59PF
PN100-1(5)
11
12
13
67
66
65
100-Pin TQFP
Top View(6)
64
63
14
62
15
61
60
16
17
59
58
18
19
20
57
56
21
55
22
54
23
53
24
52
Vss
I/O8L
I/O7L
I/O6L
I/O5L
I/O4L
I/O3L
I/O2L
Vss
I/O1L
I/O0L
VDD
Vss
I/O0R
I/O1R
I/O2R
VDD
I/O3R
I/O4R
I/O5R
I/O6R
I/O7R
I/O8R
NC
NC
51
25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NOTES:
1. A13 is a NC for IDT70T9159.
2. All VDD pins must be connected to power supply.
3. All VSS pins must be connected to ground supply.
4. Package body is approximately 14mm x 14mm x 1.4mm.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
2
6.42
NC
NC
A7R
A8R
A9R
A10R
A11R
A12R
A13R(1)
NC
NC
NC
Vss
NC
NC
NC
NC
CE0R
CE1R
CNTRSTR
R/WR
OER
FT/PIPER
Vss
NC
.
5654 drw 02
Preliminary
Industrial and Commercial Temperature Ranges
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Pin Configurations (con't.)(1,2,3,4)
70T9169/59BF
BF100(5)
100-Pin fpBGA
Top View(6)
06/21/02
A1
A6R
B1
A4R
C1
A3R
D1
A0R
E1
VSS
F1
VSS
G1
CNTENL
H1
A2L
J1
NC
K1
A6L
A2
A9R
B2
A5R
C2
NC
D2
CLKR
E2
ADS R
F2
CLKL
G2
NC
H2
A4L
J2
A7L
K2
A8L
A3
A4
A12R
B3
A8R
C3
NC
D3
A1R
E3
CNTENR
F3
A0L
G3
A5L
H3
A9L
J3
A10L
K3
A11L
NC
B4
A10R
C4
A7R
D4
A2R
E4
A1L
F4
A3L
G4
NC
K4
NC
B6
B5
NC
B7
NC
NC
C5
C6
NC
C7
A8
R/WR
B8
A9
VSS
B9
OER
C8
NC
C9
A10
NC
B10
I/O6R
C10
CE0R CE1R PL/FTR I/O7R I/O3R
NC
D6
D5
D7
D8
A11R A13R(1) CNTRSTR I/O8R
E6
E5
ADSL
VSS
F6
F5
VDD
VSS
G5
G6
NC
R/WL
H5
A13L(1)
J4
A7
VSS
VSS
A12L
H4
A6
A5
H6
NC
E7
I/O4R
F7
VDD
G7
NC
H7
NC
CE1L
J5
J6
NC
NC
K6
K5
VDD
VDD
J7
OEL
K7
CE0L
E8
I/O2R
F8
I/O2L
G8
I/O4L
H8
I/O7L
J8
VSS
D9
D10
I/O5R I/O1R
E9
I/O0R
F9
I/O1L
G9
VSS
H9
I/O6L
J9
VSS
E10
VDD
F10
I/O0L
G10
I/O3L
H10
I/O5L
J10
I/O8L
K8
K9
CNTRSTL
PL/FTL NC
K10
5654 drw 03
NOTES:
1. A 13 is a NC for IDT70T9159.
2. All V DD pins must be connected to power supply.
3. All V SS pins must be connected to ground supply.
4. Package body is approximately 10mm x 10mm x 1.4mm with 0.8mm ball pitch.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
6.42
3
,
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Pin Names
Left Port
Right Port
Names
CE0L, CE1L
CE0R, CE1R
Chip Enables
R/WL
R/WR
Read/Write Enable
OEL
OER
Output Enable
A0L - A13L(1)
A0R - A13R(1)
Address
I/O0L - I/O8L
I/O0R - I/O8R
Data Input/Output
CLKL
CLKR
Clock
ADSL
ADSR
Address Strobe
CNTENL
CNTENR
Counter Enable
CNTRSTL
CNTRSTR
Counter Reset
FT/PIPEL
FT/PIPER
Flow-Through/Pipeline
VDD
Power (2.5V)
VSS
Ground (0V)
5654 tbl 01
NOTE:
1. A13 is a NC for IDT70T9159.
Truth Table I—Read/Write and Enable Control(1,2,3)
OE
CLK
CE0
CE 1
R/W
I/O0-8
X
↑
H
X
X
High-Z
Deselected—Power Down
X
↑
X
L
X
High-Z
Deselected—Power Down
X
↑
L
H
L
DATAIN
Write
L
↑
L
H
H
DATAOUT
Read
H
X
L
H
X
High-Z
Mode
Outputs Disabled
5654 tbl 02
NOTES:
1. "H" = VIH, "L" = VIL, "X" = Don't Care.
2. ADS, CNTEN, CNTRST = X.
3. OE is an asynchronous input signal.
4
6.42
Preliminary
Industrial and Commercial Temperature Ranges
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Truth Table II—Address Counter Control(1,2)
External
Address
Previous
Internal
Address
Internal
Address
Used
CLK
An
X
An
↑
X
An
An + 1
X
An + 1
X
X
ADS
MODE
CNTEN
CNTRST
I/O(3)
L(4)
X
H
DI/O (n)
↑
H
L(5)
H
DI/O (n+1)
Counter Enabled—Internal Address generation
An + 1
↑
H
H
H
DI/O (n+1)
External Addre ss Blocked—Counter disab led (An + 1 reused)
A0
↑
X
(4)
DI/O(0)
X
L
External Address Used
Counter Reset to Address 0
5654 tbl 03
NOTES:
1. "H" = VIH, "L" = VIL, "X" = Don't Care.
2. CE0 and OE = VIL; CE1 and R/W = VIH.
3. Outputs configured in Flow-Through Output mode: if outputs are in Pipelined mode the data out will be delayed by one cycle.
4. ADS and CNTRST are independent of all other signals including CE0 and CE1.
5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0 and CE1.
Recommended Operating
Temperature and Supply Voltage
Grade
Sym bol
Ambient
Temperature(1)
GND
VDD
0OC to +70OC
0V
2.5V + 100mV
-40OC to +85OC
0V
2.5V + 100mV
Commercial
Industrial
Recommended DC Operating
Conditions
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
Parameter
Min.
Typ.
Max.
Unit
2.4
2.5
2.6
V
V DD
Sup p ly Vo ltag e
V SS
G ro und
0
0
0
V
V IH
Inp ut Hig h Vo ltag e
1.7
____
V DD+ 0.3V (2)
V
V IL
Inp ut Lo w Vo ltag e
-0.3 (1)
____
0.7
V
5654 tbl 04
NOTES:
1. VIL > -1.5V for pulse width less than 10 ns.
2. VTERM must not exceed VDD +0.3V.
Capacitance(1)
Absolute Maximum Ratings(1)
Symbol
VTERM(2)
Rating
Commercial
& Industrial
Unit
Terminal Voltage
with Respect to
GND
-0.5 to +3.6
V
(TA = +25°C, f = 1.0MHz)
Symbol
CIN
Temperature
Under Bias
-55 to +125
TSTG
Storage
Temperature
-65 to +150
IOUT
DC Output Current
o
COUT
C
Parameter
Input Capacitance
(3)
TBIAS
5654 tbl 05
Output Capacitance
Conditions(2)
Max.
Unit
VIN = 3dV
9
pF
V OUT = 3dV
10
pF
5654 tbl 07
50
o
C
mA
5654 tbl 06
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. VTERM must not exceed VDD + 0.3V for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > VDD + 0.3V.
NOTES:
1. These parameters are determined by device characterization, but are not
production tested.
2. 3dV references the interpolated capacitance when the input and output switch
from 0V to 3V or from 3V to 0V.
3. COUT also references C I/O.
6.42
5
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature Supply Voltage Range (VDD = 2.5V ± 100mV)
70T9169/59L
Symbol
|ILI|
|ILO|
Parameter
Test Conditions
Min.
Max.
Unit
Input Leakage Current(1)
VDD = 2.6V, VIN = 0V to VDD
___
5
µA
Output Leakage Current
CE = VIH or CE1 = VIL, VOUT = 0V to VDD
___
5
µA
0.4
V
___
V
VOL
Output Low Voltage
IOL = +2mA
___
VOH
Output High Voltage
IOH = -2mA
2.0
5654 tbl 08
NOTE:
1. At Vcc < 2.0V input leakages are undefined.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(3) (VDD = 2.5V ± 100mV)
70T9169/59L7
Com'l Only
Symbol
IDD
ISB1
ISB2
ISB3
ISB4
Parameter
Test Condition
Version
70T9169/59L9
Com'l & Ind
70T9169/59L12
Com'l Only
Typ.(4)
Max.
Typ.(4)
Max.
Typ.(4)
Max.
Unit
mA
Dynamic Operating
Current (Both
Ports Active)
CEL and CER= VIL,
Outputs Disabled,
f = fMAX(1)
COM'L
L
80
200
75
175
70
150
IND
L
____
____
75
220
____
____
Standby Current
(Both Ports - TTL
Level Inputs)
CEL = CER = VIH
COM'L
L
20
60
20
50
20
40
f = fMAX(1)
IND
L
____
____
20
70
____
____
Standby
Current (One
Port - TTL
Level Inputs)
CE"A" = VIL and
CE"B" = VIH(5)
Active Port Outputs
Disabled, f=fMAX(1)
COM'L
L
50
115
47
100
45
85
IND
L
____
____
47
190
____
____
Full Standby
Current (Both
Ports - CMOS
Level Inputs)
Both Ports CEL and
CER >VDD - 0.2V,
VIN > VDD - 0.2V or
VIN < 0.2V, f = 0(2)
COM'L
L
0.1
3.0
0.1
3.0
0.1
3.0
IND
L
____
____
0.1
3.0
____
____
Full Standby
Current (One
Port - CMOS
Level Inputs)
COM'L
CE"A" < 0.2V and
CE"B" > VDD - 0.2V(5)
IND
VIN > VDD - 0.2V or
VIN < 0.2V, Active Port,
Outputs Disabled, f = fMAX(1)
L
50
115
47
100
45
85
____
____
47
190
____
____
mA
mA
mA
mA
L
5654 tbl 09
NOTES:
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC , using "AC TEST CONDITIONS" at input
levels of GND to 2.5V.
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
4. VDD = 2.5V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 75mA (Typ).
5. CEX = V IL means CE 0X = V IL and CE1X = VIH
CEX = VIH means CE0X = VIH or CE1X = VIL
CEX < 0.2V means CE0X < 0.2V and CE1X > VDD - 0.2V
CEX > VDD - 0.2V means CE0X > VDD - 0.2V or CE1X < 0.2V
"X" represents "L" for left port or "R" for right port.
6
6.42
Preliminary
Industrial and Commercial Temperature Ranges
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
AC Test Conditions
Input Pulse Levels
GND to 2.5V
Input Rise/Fall Times
2ns Max.
Input Timing Reference Levels
1.25V
Output Reference Levels
1.25V
Output Load
Figures 1 and 2
5654 tbl 10
50Ω
50Ω
DATAOUT
,
1.25V
10pF / 5pF*
(Tester)
5654 drw 04
Figure 1. AC Output Test load.
and tOHZ ).
*(For tCKLZ, t CKHZ, t OLZ,
∆ tCD
(Typical, ns)
∆ Capacitance (pF) from AC Test Load
5654 drw 06
Figure 2. Typical Output Derating (Lumped Capacitive Load).
6.42
7
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature Range
(Read and Write Cycle Timing)(3) (VDD = 2.5V ± 100mV, TA = 0°C to +70°C)
Symbol
tCYC1
Parameter
Clock Cycle Time (Flow-Through)(2)
(2)
70T9169/59L7
Com'l Only
70T9169/59L9
Com'l & Ind
70T9169/59L12
Com'l Only
Min.
Max.
Min.
Max.
Min.
Max.
Unit
22
____
25
____
30
____
ns
ns
12
____
15
____
20
____
tCH1
(2)
Clock High Time (Flow-Through)
7.5
____
12
____
12
____
ns
tCL1
Clock Low Time (Flow-Through)(2)
7.5
____
12
____
12
____
ns
5
____
6
____
8
____
ns
5
____
6
____
8
____
ns
tCYC2
tCH2
tCL2
Clock Cycle Time (Pipelined)
(2)
Clock High Time (Pipelined)
(2)
Clock Low Time (Pipelined)
tR
Clock Rise Time
____
3
____
3
____
3
ns
tF
Clock Fall Time
____
3
____
3
____
3
ns
4
____
4
____
4
____
ns
1
____
1
____
ns
4
____
4
____
ns
ns
tSA
Address Setup Time
tHA
Address Hold Time
0
____
tSC
Chip Enable Setup Time
4
____
0
____
1
____
1
____
4
____
4
____
ns
1
____
1
____
ns
ns
tHC
Chip Enable Hold Time
tSB
Byte Enable Setup Time
4
____
tHB
Byte Enable Hold Time
0
____
4
____
4
____
4
____
1
____
1
____
ns
4
____
4
____
ns
1
____
1
____
ns
ns
tSW
R/W Setup Time
tHW
R/W Hold Time
0
____
tSD
Input Data Setup Time
4
____
0
____
4
____
4
____
4
____
1
____
1
____
ns
4
____
4
____
ns
1
____
1
____
ns
ns
tHD
Input Data Hold Time
tSAD
ADS Setup Time
tHAD
ADS Hold Time
0
____
tSCN
CNTEN Setup Time
4
____
tHCN
CNTEN Hold Time
0
____
tSRST
CNTRST Setup Time
4
____
4
____
4
____
tHRST
CNTRST Hold Time
0
____
1
____
1
____
ns
tOE
Output Enable to Data Valid
____
7.5
____
9
____
12
ns
2
____
2
____
2
____
ns
tOLZ
(1)
Output Enable to Output Low-Z
(1)
tOHZ
Output Enable to Output High-Z
tCD1
Clock to Data Valid (Flow-Through)(2)
tCD2
(2)
Clock to Data Valid (Pipelined)
1
7
1
7
1
7
ns
____
18
____
20
____
25
ns
____
7.5
____
9
____
12
ns
2
____
2
____
ns
2
9
2
9
ns
2
____
ns
tDC
Data Output Hold After Clock High
2
____
tCKHZ
Clock High to Output High-Z(1)
2
9
tCKLZ
(1)
2
____
2
____
Clock High to Output Low-Z
Port-to-Port Delay
tCWDD
Write Port Clock High to Read Data Delay
____
28
____
35
____
40
ns
tCCS
Clock-to-Clock Setup Time
____
10
____
15
____
15
ns
5654 tbl 11
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characterization, but is not production tested.
2. The Pipelined output parameters (tCYC2, t CD2) to either the Left or Right ports when FT/PIPE = VIH. Flow-Through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for
that port.
3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPER and FT/PIPEL.
8
6.42
Preliminary
Industrial and Commercial Temperature Ranges
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Timing Waveform of Read Cycle for Flow-Through Output
(FT/PIPE"X" = VIL)(3,6)
tCYC1
tCH1
tCL1
CLK
CE0
tSC
tHC
tSW
tHW
tSA
tHA
tSC
tHC
CE1
R/W
(5)
ADDRESS
An
An + 1
An + 2
tDC
tCD1
tCKHZ (1)
Qn
DATAOUT
Qn + 1
tCKLZ(1)
OE
An + 3
tOHZ
Qn + 2
(1)
tOLZ
tDC
(1)
(2)
tOE
5654 drw 07
Timing Waveform of Read Cycle for Pipelined Operation
(FT/PIPE"X" = VIH)(3,6)
tCYC2
tCH2
tCL2
CLK
CE0
tSC
tSC
tHC
tHC
(4)
CE1
R/W
tSW tHW
tSA
(5)
ADDRESS
tHA
An
An + 1
(1 Latency)
An + 2
tDC
tCD2
DATAOUT
Qn
tCKLZ
An + 3
Qn + 1
(1)
tOHZ
Qn + 2
(1)
tOLZ
(6)
(1)
(2)
OE
tOE
5654 drw 08
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.
3. ADS = VIL, CNTEN and CNTRST = VIH.
4. The output is disabled (High-Impedance state) by CE0 = VIH or CE1 = V IL following the next rising edge of the clock. Refer to Truth Table 1.
5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers
are for reference use only.
6. "X" here denotes Left or Right port. The diagram is with respect to that port.
6.42
9
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Timing Waveform of a Bank Select Pipelined Read(1,2)
tCH2
tCYC2
tCL2
CLK
tSA
A0
ADDRESS(B1)
CE0(B1)
tHA
tSC
tHC
tSC
tHC
tCD2
A0
tSC
tCD2
Q3
tCKLZ
(3)
tCKHZ (3)
tHA
A6
A5
A4
A3
A2
A1
tSC
CE0(B2)
tCKHZ
Q1
tDC
tDC
ADDRESS(B2)
(3)
tCD2
Q0
DATAOUT(B1)
tSA
A6
A5
A4
A3
A2
A1
tHC
tHC
tCKHZ (3)
tCD2
DATAOUT(B2)
tCKLZ
(3)
tCD2
Q2
tCKLZ
Q4
(3)
5654 drw 09
Timing Waveform of Write with Port-to-Port Flow-Through Read(4,5,7)
CLK "A"
tSW
tHW
tSA
tHA
R/W "A"
ADDRESS "A"
tSD
DATAIN "A"
NO
MATCH
MATCH
tHD
VALID
tCCS
(6)
CLK "B"
tCD1
R/W "B"
ADDRESS "B"
tSW
tHW
tSA
tHA
NO
MATCH
MATCH
tCWDD
(6)
tCD1
DATAOUT "B"
VALID
VALID
tDC
tDC
5654 drw 10
NOTES:
1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT70T9169/59 for this waveform, and are setup for depth expansion in this
example. ADDRESS(B1) = ADDRESS (B2) in this situation.
2. OE and ADS = VIL; CE 1(B1), CE1(B2) , R/W, CNTEN, and CNTRST = VIH.
3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
4. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.
5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.
6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD .
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. t CWDD does not apply in this case.
7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".
10
6.42
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)
tCYC2
tCH2
tCL2
CLK
CE0
tSC tHC
CE1
tSW tHW
R/W
(4)
ADDRESS
tSW tHW
An
tSA tHA
An +1
An + 2
An + 3
An + 2
An + 4
tSD tHD
DATAIN
Dn + 2
tCD2
(2)
tCKHZ
(1)
(1)
tCKLZ
tCD2
Qn + 3
Qn
DATAOUT
NOP(5)
READ
WRITE
READ
5654 drw 11
Timing Waveforn of Pipelined Read-to-Write-to-Read (OE Controlled)(3)
tCH2
tCYC2
tCL2
CLK
CE0
tSC tHC
CE1
tSW tHW
R/W
(4)
ADDRESS
tSW tHW
An
tSA tHA
An +1
An + 2
An + 3
An + 4
An + 5
tSD tHD
DATAIN
Dn + 2
tCD2
(2)
Dn + 3
tCKLZ(1)
tCD2
Qn
DATAOUT
Qn + 4
tOHZ(1)
OE
READ
WRITE
READ
5654 drw 12
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
3. CE 0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
6.42
11
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(3)
tCH1
tCYC1
tCL1
CLK
CE0
tSC
tHC
CE1
tSW tHW
R/W
tSW tHW
(4)
An
tSA tHA
ADDRESS
An +1
An + 2
An + 4
An + 3
An + 2
tSD tHD
DATAIN
Dn + 2
(2)
tCD1
tCD1
Qn
DATAOUT
tCD1
tCD1
Qn + 3
Qn + 1
tDC
tCKHZ
(5)
NOP
READ
(1)
(1)
tCKLZ
WRITE
tDC
READ
5654 drw 13
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(3)
tCYC1
tCH1
tCL1
CLK
CE0
tSC tHC
CE1
tSW tHW
R/W
tSW tHW
(4)
An
tSA tHA
ADDRESS
An + 2
An +1
An + 4
An + 5
tSD tHD
DATAIN
Dn + 2
(2)
An + 3
Dn + 3
tDC
tCD1
Qn
DATAOUT
tOE
tCD1
(1)
tOHZ
tCKLZ
(1)
tCD1
Qn + 4
tDC
OE
READ
WRITE
READ
5654 drw 14
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. Output state (High, Low, or High-impedance is determined by the previous cycle control signals.
3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
12
6.42
Preliminary
Industrial and Commercial Temperature Ranges
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Timing Waveform of Pipelined Read with Address Counter Advance(1)
tCH2
tCYC2
tCL2
CLK
tSA
ADDRESS
tHA
An
tSAD tHAD
ADS
tSAD tHAD
CNTEN
tSCN tHCN
tCD2
DATAOUT
Qx - 1(2)
Qn + 2(2)
Qn + 1
Qn
Qx
Qn + 3
tDC
READ
EXTERNAL
ADDRESS
READ
WITH
COUNTER
COUNTER
HOLD
READ WITH COUNTER
5654 drw 15
Timing Waveform of Flow-Through Read with Address Counter Advance(1)
tCH1
tCYC1
tCL1
CLK
tSA
ADDRESS
tHA
An
tSAD tHAD
ADS
tSAD tHAD
tSCN tHCN
CNTEN
tCD1
DATAOUT
Qx(2)
Qn
Qn + 1
Qn + 2
Qn + 3(2)
Qn + 4
tDC
READ
EXTERNAL
ADDRESS
READ WITH COUNTER
COUNTER
HOLD
READ
WITH
COUNTER
5654 drw 16
NOTES:
1. CE 0 and OE = VIL, CE1, R/W, and CNTRST = VIH.
2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output
remains constant for subsequent clocks.
6.42
13
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Address Counter Advance
(Flow-Through or Pipelined Outputs)(1)
tCH2
tCYC2
tCL2
CLK
tSA
tHA
An
ADDRESS
INTERNAL(3)
ADDRESS
An(7)
An + 2
An + 1
An + 4
An + 3
tSAD tHAD
ADS
CNTEN
tSD tHD
Dn + 1
Dn
DATAIN
WRITE
EXTERNAL
ADDRESS
Dn + 1
Dn + 4
Dn + 3
Dn + 2
WRITE
WRITE
WITH COUNTER COUNTER HOLD
WRITE WITH COUNTER
5654 drw 17
Timing Waveform of Counter Reset (Pipelined Outputs)(2)
tCH2
tCYC2
tCL2
CLK
tSA tHA
ADDRESS(4)
INTERNAL(3)
ADDRESS
An
Ax(6)
0
1
An + 2
An + 1
An + 1
An
tSW tHW
R/W
ADS
CNTEN
tSRST tHRST
CNTRST
tSD
tHD
D0
DATAIN
Qn
Q1
Q0
DATAOUT(5)
.
COUNTER(6)
RESET
WRITE
ADDRESS 0
READ
ADDRESS 0
READ
ADDRESS 1
READ
ADDRESS n
READ
ADDRESS n+1
5654 drw 18
NOTES:
1. CE0 and R/W = VIL; CE1 and CNTRST = VIH.
2. CE0 = VIL; CE1 = VIH.
3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH.
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle.
7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’ Address is written
to during this cycle.
14
6.42
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
A Functional Description
Depth and Width Expansion
The IDT70T9169/59 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold
times on address, data, and all critical control inputs. All internal
registers are clocked on the rising edge of the clock signal, however,
the self-timed internal write pulse is independent of the LOW to HIGH
transition of the clock signal.
An asynchronous output enable is provided to ease asynchronous
bus interfacing. Counter enable inputs are also provided to stall the
operation of the address counters for fast interleaved memory applications.
CE0 = VIH or CE1 = VIL for one clock cycle will power down the
internal circuitry to reduce static power consumption. Multiple chip
enables allow easier banking of multiple IDT70T9169/59's for depth
expansion configurations. When the Pipelined output mode is enabled, two
cycles are required to get valid data on the outputs.
The IDT70T9169/59 features dual chip enables (refer to Truth Table
I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip
enables in order to expand two devices in depth.
The IDT70T9169/59 can also be used in applications requiring
expanded width, as indicated in Figure 4. Since the banks are allocated
at the discretion of the user, the external controller can be set up to drive
the input signals for the various devices as required to allow for 18-bit
or wider applications.
A14/A13(1)
IDT70T9169/59
CE0
CE1
IDT70T9169/59
CE 1
VDD
VDD
Control Inputs
Control Inputs
IDT70T9169/59
CE 0
IDT70T9169/59
CE1
CE1
CE0
CE0
Control Inputs
Control Inputs
5654 drw 19
Figure 4. Depth and Width Expansion with IDT70T9169/59
NOTE:
1. A14 is for IDT70T9169, A13 is for IDT70T9159.
6.42
15
CNTRST
CLK
ADS
CNTEN
R/W
OE
IDT70T9169/59L
High-Speed 2.5V 16/8K x 9 Synchronous Pipelined Dual-Port Static RAM
Preliminary
Industrial and Commercial Temperature Ranges
Ordering Information
IDT XXXXX
Device
Type
A
99
A
A
Power
Speed
Package
Process/
Temperature
Range
Blank
I(1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
PF
BF
100-pin TQFP (PN100-1)
100-pin fpBGA (BF100)
7
9
12
Commercial Only
Commercial & Industrial Speed in nanoseconds
Commercial Only
L
Low Power
..
70T9169 144K (16K x 9-Bit) 2.5V Synchronous Dual-Port RAM
70T9159 72K (8K x 9-Bit) 2.5V Synchronous Dual-Port RAM
5654 drw 20
NOTE:
1. Contact your local sales office for Industrial temp range for other speeds, packages and powers.
Datasheet Document History
07/08/02:
Initial Public Release
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for SALES:
800-345-7015 or 408-727-611 6
fax: 408-492-8674
www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
16
6.42
for Tech Support:
831-754-4613
[email protected]