HA-2515 T U CT ROD RO DUC P E P T E E OL UT O B S U B S TI T 5 S 2 5 E -2 SIBL DataHA Sheet PO S ® May 2003 FN2893.5 12MHz, High Input Impedance, Operational Amplifier Features HA-2515 is a high performance operational amplifier which sets the standards for maximum slew rate, highest accuracy and widest bandwidths for internally compensated devices. In addition to excellent dynamic characteristics, this dielectrically isolated amplifier also offers low offset current and high input impedance. • Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns • Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V/µs The ±60V/µs slew rate and 250ns (0.1%) settling time of this amplifier is ideally suited for high speed D/A, A/D, and pulse amplification designs. HA-2515’s superior 12MHz gain bandwidth and 1000kHz power bandwidth is extremely useful in RF and video applications. For accurate signal conditioning this amplifier also provides 10nA offset current, coupled with 100MΩ input impedance, and offset trim capability. Pinout • Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . 1MHz • Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12MHz • High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 100MΩ • Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA • Internally Compensated for Unity Gain Stability Applications • Data Acquisition Systems • RF Amplifiers • Video Amplifiers • Signal Generators HA-2515 (PDIP) TOP VIEW • Pulse Amplification Part Number Information BAL 1 -IN 2 +IN 3 V- 4 + 1 8 COMP 7 V+ 6 OUT 5 BAL PART NUMBER HA3-2515-5 TEMP. RANGE (oC) 0 to 75 PACKAGE 8 Ld PDIP PKG. NO. E8.3 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HA-2515 Absolute Maximum Ratings Thermal Information Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 40V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) θJC (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . 120 N/A Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC Operating Conditions Temperature Range HA-2515-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. VSUPPLY = ±15V Electrical Specifications TEMP (oC) MIN TYP MAX UNITS Offset Voltage 25 - 5 10 mV Full - - 14 mV Offset Voltage Average Drift Full - 30 - µV/oC Bias Current 25 - 125 250 nA nA PARAMETER INPUT CHARACTERISTICS Full - - 500 25 - 20 50 nA Full - - 100 nA Input Resistance (Note 2) 25 40 100 - MΩ Common Mode Range Full ±10.0 - - V Large Signal Voltage Gain (Notes 3, 6) 25 7.5 15 - kV/V Full 5 - - kV/V Common Mode Rejection Ratio (Note 4) Full 74 90 - dB Gain Bandwidth Product (Note 5) 25 - 12 - MHz Output Voltage Swing (Note 3) Full ±10.0 ±12.0 - V Output Current (Note 6) 25 ±10 ±20 - mA Full Power Bandwidth (Notes 6, 11) 25 600 1000 - kHz 25 - 25 50 ns Offset Current TRANSFER CHARACTERISTICS OUTPUT CHARACTERISTICS TRANSIENT RESPONSE Rise Time (Notes 3, 7, 8, 9) Overshoot (Notes 3, 7, 8, 9) 25 - 25 50 % Slew Rate (Notes 3, 7, 9, 12) 25 ±40 ±60 - V/µs Settling Time to 0.1% (Notes 3, 7, 9, 12) 25 - 0.25 - µs POWER SUPPLY CHARACTERISTICS Supply Current 25 - 4 6 mA Power Supply Rejection Ratio (Note 10) Full 74 90 - dB NOTES: 2. This parameter value is based on design calculations. 3. RL = 2kΩ. 4. VCM = ±10V 5. AV >10. 6. VO = ±10V. 7. CL = 50pF. 8. VO = ±200mV. 9. See Transient Response Test Circuits and Waveforms. 10. ∆V = ±5V. 11. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = Slew Rate/2πVPEAK. 12. VOUT = ±5V. 2 HA-2515 Test Circuits and Waveforms +5V +200mV INPUT -5V +5V INPUT 0mV 75% OUTPUT OVERSHOOT ∆V 25% -5V ERROR BAND ±10mV FROM FINAL VALUE SLEW RATE = ∆V/∆t ∆t +200mV 90% OUTPUT 10% 0mV RISE TIME SETTLING TIME NOTE: Measured on both positive and negative transitions from 0V to +200mV and 0V to -200mV at the output. FIGURE 1. SLEW RATE AND SETTLING TIME FIGURE 2. TRANSIENT RESPONSE + IN OUT 2kΩ 50pF RL = 2kΩ, CL = 50pF Upper Trace: Input Lower Trace: Output FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE 2kΩ 2 3 FIGURE 4. VOLTAGE FOLLOWER PULSE RESPONSE 1µF V+ INPUT Vertical = 5V/Div. Horizontal = 200ns/Div. TA = 25oC, VS = ±15V + 7 0.01µF 6 4 OUTPUT V+ 1µF 50pF 20kΩ V- 5kΩ 0.01µF RT 2kΩ D G 5kΩ IN 2N4416 S BAL. SETTLING TIME TEST POINT V- 2kΩ CR1 OUT COMP CC CR2 NOTES: 13. AV = -1. 14. Feedback and summing resistor ratios should be 0.1% matched. 15. Clipping diodes CR1 and CR2 are optional. HP5082-2810 recommended. FIGURE 5. SETTLING TIME TEST CIRCUIT 3 NOTE: Tested offset adjustment range is IVOS + 1mVI minimum referred to output. Typical ranges are ±6mV with RT = 20kΩ. FIGURE 6. SUGGESTED VOS ADJUSTMENT AND COMPENSATION HOOK UP HA-2515 Schematic BAL R5 200 Q1 R2 2K R7 R10 1.8K 1.8K Q6 Q8 R11 2K Q7 C2 2.7pF Q9 C1 10pF Q15 R4 11.13K Q38 1.68K Q35 R25 Q29 Q30 Q31 Q36 Q32 4 Q39 1.68K Q17 Q18 R26 Q28 Q27 Q25 R20 3.0K Q23 Q22 Q24 R22 240Ω R14 30 Q19 R19 Q13 6.3K Q26 R23 3.0K Q33 OUT Q40 Q37 Q34 R13 30 Q14 Q12 +IN -IN Q16 Q11 Q4 COMP R12 1.1K Q10 Q5 R3 960 V+ R8 200 R6 R9 200 200 R1 4K Q2 Q3 BAL R18 1.48K R17 1.48K R16 1.48K Q20 Q21 R15 740 V- HA-2515 Typical Performance Curves 4.4 100 4.2 80 SUPPLY CURRENT (mA) BIAS CURRENT CURRENT (nA) 4.0 VSUPPLY = ±20V VSUPPLY = ±15V VSUPPLY = ±10V 3.8 3.6 60 40 20 OFFSET CURRENT 3.4 0 3.2 -50 -25 0 25 50 75 100 -20 125 -50 -25 TEMPERATURE (oC) FIGURE 7. POWER SUPPLY CURRENT vs TEMPERATURE 0 25 50 TEMPERATURE (oC) 75 100 125 FIGURE 8. INPUT BIAS AND OFFSET CURRENT vs TEMPERATURE 1.1 NORMALIZED PARAMETERS REFERRED TO VALUES AT 25oC 10 10K SOURCE RESISTANCE 0K SOURCE RESISTANCE 1.0 THERMAL NOISE OF 10K RESISTOR 1kHz 10kHz FREQUENCY (Hz) 100kHz BANDWIDTH 0.9 0 100 30 GAIN 60 60 PHASE 90 40 120 20 150 0 180 100 1K 10K 1M 100K FREQUENCY (Hz) 10M 100M FIGURE 11. OPEN LOOP GAIN AND PHASE RESPONSE 5 -50 -25 0 25 50 75 100 125 FIGURE 10. NORMALIZED AC PARAMETERS vs TEMPERATURE 1.1 PHASE (DEGREES) OPEN LOOP VOLTAGE GAIN (dB) SLEW RATE TEMPERATURE (oC) 120 -20 10 SLEW RATE 1.0 1MHz FIGURE 9. EQUIVALENT INPUT NOISE vs BANDWIDTH (WITH 10Hz HIGH PASS FILTER) 80 BANDWIDTH 0.8 0.1 100Hz NORMALIZED PARAMETERS REFERRED TO VALUES AT ±15V EQUIVALENT INPUT NOISE (µVRMS) 100 SLEW RATE 1.0 BANDWIDTH BANDWIDTH SLEW RATE 0.9 0.8 ±10 ±15 SUPPLY VOLTAGE (V) FIGURE 12. NORMALIZED AC PARAMETERS vs SUPPLY VOLTAGE AT 25oC ±20 HA-2515 Typical Performance Curves (Continued) 90 VSUPPLY = ±20V VSUPPLY = ±15V VSUPPLY = ±10V 100 0pF 30pF 100pF 80 85 GAIN (dB) OPEN LOOP VOLTAGE GAIN (dB) 120 60 40 20 80 300pF 1000pF 0 -20 10 75 100 1K 10K 100K FREQUENCY (Hz) 1M 10M -50 100M FIGURE 13. OPEN LOOP GAIN RESPONSE FOR VARIOUS VALUES OF CAPACITORS FROM COMPENSATION PIN TO GROUND TA = 25oC 30 VSUPPLY = ±15V 20 15 VSUPPLY = ±10V 10 5 0 10K 100K 1MEG 10MEG FREQUENCY (Hz) FIGURE 15. OUTPUT VOLTAGE SWING vs FREQUENCY 6 25 50 75 100 125 FIGURE 14. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE VSUPPLY = ±20V 25 0 TEMPERATURE (oC) 35 OUTPUT VOLTAGE SWING (VP-P) -25 HA-2515 Die Characteristics SUBSTRATE POTENTIAL (Powered Up): DIE DIMENSIONS: Unbiased 65 mils x 57 mils x 19 mils 1650µm x 1450µm x 483µm TRANSISTOR COUNT: METALLIZATION: 40 Type: Al, 1% Cu Thickness: 16kÅ ±2kÅ PROCESS: Bipolar Dielectric Isolation PASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12kÅ ±2kÅ Nitride Thickness: 3.5kÅ ±1.5kÅ Metallization Mask Layout HA-2515 +IN -IN BAL COMP V- V+ BAL OUT All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 7 HA-2515 FN Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL -B- -C- A2 SEATING PLANE D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MAX NOTES - 0.210 - 5.33 4 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 0.355 - D 0.355 0.400 9.01 D1 0.005 - 0.13 - 5 A L MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 10.16 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. eA 0.300 BSC 7.62 BSC 6 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. eB - 0.430 - 10.92 7 L 0.115 0.150 2.93 3.81 4 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 8 N 8 8 9 Rev. 0 12/93