V is h ay I n t e rt e c h n o l o g y, I n c . I INNOVAT AND TEC O L OGY M25SI N HN THIN FILM FUSE RESISTOR O 19 62-2012 Resistors - Medium- to Fast-Reacting Fuse Fusible Thin Film Chip Resistor Key Benefits • • • • • • Designed for overload protection at constant voltage Medium- to fast-reacting fuse Special protective top coat Flame-retardant Suitable for automatic high-speed insertion More cost-effective than a combination of glass fuse and resistor APPLICATIONS • • • • • Battery chargers Cordless phones DVD players Power supplies Circuit function testing Resources • Datasheet: M25SI - http://www.vishay.com/doc?20031 • For technical questions contact [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components PRODUCT SHEET 1/2 VMN-PT9022-1203 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V is h ay I n t e rt e c h n o l o g y, I n c . I INNOVAT AND TEC M25SI O L OGY M25SI N HN THIN FILM FUSE RESISTOR O 19 Vishay Draloric 62-2012 Fusible Thin Film Chip Fusible Thin Film ChipResistor Resistor • Metal film on high quality ceramic • Special protective top coat • Flame retardant • Sn solder contacts on Ni barrier layer • Fusible resistor for constant voltage • Automatic placement compatibility M25SI fusible thin film chip resistors are designed for overload protection in modern professional electronics. Typical applications include automotive, telecommunication and industrial equipment. • Compliant to RoHS directive 2011/65/EU METRIC SIZE INCH: 1206 METRIC: RR 3216M TECHNICAL SPECIFICATIONS DESCRIPTION M25SI Metric size RR 3216M 5 Ω to 3.9 kΩ Resistance range Resistance tolerance ±5% Temperature coefficient ± 100 ppm/K Climatic category (LCT/UCT/days) 55/125/56 Rated dissipation, P70 (1) 0.25 W Limiting element voltage, Umax. DC/ACRMS P x R Maximum permissible film temperature 125 °C Insulation voltage (1 min), Uins DC/ACpeak > 300 V ≤ 220 K/W Thermal resistance (2) > 109 Ω Insulation resistance ≤ 1 x 10-9 h-1 Failure rate E-Series 24 Notes (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. (2) Measuring conditions in accordance with EN 140401-801 • Marking: 3 digits • Tolerance 1 % on request • Beige top coat PULSE TEST DATA Pulse power (square pulse) Revision 17-Sep-09 Resistors - Medium- to Fast-Reacting Fuse FEATURES 0.9 W 0.3 W Pulse duration ti 100 µs 100 ms Pulse pause tp 100 ms 1s 105 105 < 0.1 % < 0.1 % Number of pulses Drift after pulse test Document Number: 20031 Revision: 17-Sep-09 PRODUCT SHEET For technical questions, contact: [email protected] 2/2 www.vishay.com 235 VMN-PT9022-1203 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000